High-Frequency PCB with Rogers RO4003C | Multi-Layer Back Drilling Boards | China Manufacturer
Multilayer PcB, any layer HDI PCB
| Type | High-frequency PCB | Back drilling | resin plug hole | panelized of 2 kinds PCBs |
| Materia | Regular Substrates RO4003C |
| Number of layer | 4L |
| Board Thickness | 0.7mm |
| Single size | 73.41*55mm/2PCS |
| Surface finish | ENIG |
| Inner copper thickness | 35um |
| Outer copper thickness | 35um |
| Color of solder mask | green(GTS，GBS) |
| Silkscreen color | white(GTO,GBO) |
| Via treatment | resin plug hole |
| Density of mechanical drilling hole | 15W/㎡ |
| Density of laser drilling hole | / |
| Min via size | 0.3mm |
| Min line width/space | 10/10mil |
| Aperture ratio | 3mil |
| Pressing times | 1 time |
| Drilling times | 2 time |
| PN | B0490066A |
High-Frequency PCB Specifications and Key Features
Challenges in High-Frequency PCB Manufacturing
Despite its numerous advantages, high-frequency PCB production involves several manufacturing challenges:
1 .Material Processing Complexity
PTFE-based materials require specialized handling, including plasma etching and surface roughening, due to their low adhesion properties.
2 .Precise Drilling and Via Processing
Laser drilling must be precisely controlled to prevent misalignment or damage to the substrate.
Back drilling depth must be carefully calibrated to remove stub effects while maintaining structural integrity.
3 .Thermal Expansion and Warpage Control
High-frequency materials often have different Coefficient of Thermal Expansion (CTE) values, causing potential delamination issues.
Hybrid PCBs (FR4 + Rogers) require tight process control to prevent warpage during reflow soldering.
4. High Manufacturing Costs3.4
Specialized materials (Rogers/PTFE) are significantly more expensive than FR4.
Advanced techniques (microvias, back drilling, resin plug via filling) increase fabrication complexity and costs.
Special Fabrication Techniques for Microblind Holes in High-Frequency PCBs
1. What Are Microblind Holes?
Microblind holes are laser-drilled vias used in HDI high-frequency PCBs
✅ Enable high-speed signal transmission
✅ Support multilayer high-frequency PCB designs
✅ Reduce electromagnetic interference (EMI)
2. Key Challenges in Microblind Hole Fabrication
Drilling Accuracy – High-frequency PCBs require ±10µm tolerance for microblind holes to avoid impedance mismatches.
Hole Plating Quality – Electroless copper plating must ensure uniform conductivity without defects.
Blind Via Reliability – Filling vias with conductive paste or resin prevents voids and improves signal integrity.
3. Microblind Hole Fabrication Steps
✔ Step 1: Laser Drilling – Precision laser drilling creates high-density microvias with controlled aspect ratios.
✔ Step 2: Plasma Cleaning – Removes residue to ensure clean via walls.
✔ Step 3: Electroless Copper Deposition – Ensures proper conductivity for signal transmission.
✔ Step 4: Via Plugging & Filling – Resin or conductive material is applied to reinforce the vias.
Why Choose Us for High-Frequency PCB Manufacturing?
✅ 20+ Years of Experience – Specializing in RF, microwave, and high-frequency PCB solutions.
✅ Advanced Manufacturing Capabilities – Precision back drilling, microblind vias, and hybrid PCB stack-up.
✅ High-Performance Materials – Expertise in Rogers, PTFE, and hybrid PCB fabrication.
✅ Stringent Quality Control – 100% impedance control, X-ray inspection, AOI testing.
✅ Custom Solutions & Fast Prototyping – Tailored high-frequency PCB designs for aerospace, 5G, and medical applications.
Frequently Asked Questions (FAQs) About High-Frequency PCBs
1. What is a high-frequency PCB?
A high-frequency PCB is specifically designed for the transmission of high-frequency electronic signals. It is commonly used in RF (radio frequency) and microwave applications, where signal integrity and minimal signal loss are critical. These PCBs are engineered to handle high-frequency signals, often above 500 MHz, with minimal attenuation.
2. What are the key applications for high-frequency PCBs?
High-frequency PCBs are widely used in industries such as:
Telecommunications: 5G base stations, antennas, and mobile devices.
Aerospace & Defense: Satellite communication, radar systems, and avionics.
Medical Devices: High-precision medical equipment requiring high-speed signal processing.
Automotive: Radar systems for autonomous vehicles, advanced driver-assistance systems (ADAS).
IoT: Industrial IoT applications that require high-frequency signal transmission.IoT ：
3. What is the role of back drilling in high-frequency PCB?
Back drilling is a process used to remove the unnecessary portion of through vias that can cause signal degradation. By removing excess copper from the via barrel, back drilling ensures that the signal paths remain uninterrupted, improving overall signal integrity and reducing signal reflection.
4. What are resin plug holes?
Resin plug holes are used in PCBs to fill and seal vias with resin, enhancing the board’s mechanical strength and improving the reliability of the soldering process. This technique prevents the vias from causing soldering defects, ensuring the robustness of the PCB in high-frequency applications.
5. What are panelized PCBs, and how do they improve production efficiency?
Panelized PCBs are multiple smaller PCBs that are grouped together on a single larger board for manufacturing efficiency. This method reduces material waste and improves the throughput during production, making it ideal for high-volume manufacturing of PCBs for large-scale applications.
6. What are the advantages of using RO4003C material?RO4003C is a high-frequency laminate material with low dielectric loss, making it ideal for microwave and RF applications. It provides excellent signal integrity, thermal stability, and low insertion loss, ensuring high performance in communication systems and other high-frequency applications.
7. What is the minimum hole size and line width for this PCB?7.
The minimum via size is 0.3mm, and the minimum line width/space is 10/10mil. These precise specifications allow for the creation of highly detailed and dense circuit designs while maintaining signal integrity and reliability.
8. How is the PCB's surface treated for high-frequency applications?
The surface of this PCB is treated with ENIG (Electroless Nickel Immersion Gold), which provides excellent corrosion resistance, good solderability, and high reliability in high-frequency applications. ENIG treatment ensures stable performance in harsh environments.
9. What is the importance of using microblind hole technology in high-frequency PCBs?
Microblind hole technology is used in high-frequency PCBs to create very small vias that are partially drilled and blind-ended. These holes are essential for creating densely packed circuits in high-performance applications, reducing the overall PCB size while maintaining optimal signal routing.
10. What are the key challenges in manufacturing high-frequency PCBs?
The primary challenges in manufacturing high-frequency PCBs include:
Signal Integrity: Maintaining the quality of high-frequency signals over long distances and through complex circuit paths.
Material Handling: Using the right materials (such as RO4003C) to minimize losses and maintain signal performance.
Precision Drilling: Ensuring accurate hole placement and size to avoid signal degradation and electrical failures.
Applications of High-Frequency PCBs
1.Wireless Communication: High - frequency boards are crucial in wireless communication devices such as smartphones, base stations, and Wi - Fi routers. They enable high - speed data transmission and reception. In Chinese:
2.Satellite Communication: In satellite communication systems, our high - frequency boards ensure reliable signal transmission over long distances. The low - loss properties of Rogers RO4003C are especially beneficial in this application. In Chinese:
3.Radar Systems: Radar systems rely on high - frequency boards for accurate target detection and tracking. The 4 - layer structure and 0.7mm thickness of our boards contribute to the precise functioning of radar components. In Chinese:
4.Medical Equipment: Some medical imaging devices, like MRI machines, use high - frequency boards for signal processing. The stable performance of our boards helps in obtaining clear and accurate medical images. In Chinese:
5.Aerospace Applications: In aerospace, high - frequency boards are used in avionics systems. They need to withstand harsh environmental conditions, and the quality construction of our boards makes them suitable for such demanding applications. In Chinese:
1.Automotive Radar: With the development of autonomous driving, automotive radar systems are becoming more important. High - frequency boards play a key role in these radar systems, enabling features like collision avoidance. In Chinese:
2.Industrial Control: In industrial control systems, high - frequency boards are used for high - speed data communication between different components. The 3:1 aperture ratio and resin - filled vias of our boards ensure reliable data transfer. In Chinese:
3.Test and Measurement Equipment: Test and measurement equipment, such as oscilloscopes and spectrum analyzers, require high - frequency boards for accurate signal analysis. Our high - quality boards contribute to the precision of these instruments. In Chinese:
4.Military Applications: Military communication and surveillance systems often use high - frequency boards. The strict quality control and performance of our boards meet the high - standard requirements of military applications. In Chinese:
5.Consumer Electronics: In addition to smartphones, other consumer electronics like smart TVs and gaming consoles also use high - frequency boards for better wireless connectivity and signal processing. Our boards' features make them suitable for these applications. In Chinese:
6.IoT Devices: Internet of Things (IoT) devices, which are becoming increasingly popular, rely on high - frequency boards for efficient communication. Our boards can support the growing demand for high - speed data transfer in IoT applications. In Chinese:
High-frequency PCBs are critical for advanced applications in telecommunications, aerospace, radar, and automotive electronics. Their manufacturing involves specialized materials, precise drilling, microblind hole fabrication, and back drilling to ensure optimal signal integrity and high-speed performance.
If you are looking for high-quality, precision-manufactured high-frequency PCBs, contact us today for custom solutions that meet your specific application needs.
Expanded Applications of High-Frequency Hybrid PCBs
