Taconic TSM-DS3 High-Frequency PCB | Double-Sided RF Boards with Immersion Gold | China Manufacturer
Multilayer PcB, any layer HDI PCB
| Type | High-frequency PCB+ Printed Circuit Board+panelized of 2 kinds PCBs |
| End product | |
| Materia | Taconic TSM-DS3-0200-CLH/CLH |
| Number of layer | 1L |
| Board Thickness | 0.55mm |
| single size | 62.56*121mm/1PCS |
| Surface finish | ENIG |
| inner copper thickness | / |
| outer copper thickness | 35um |
| color of solder mask | / |
| silkscreen color | white(GTO,GBO) |
| via treatment | / |
| density of mechanical drilling hole | / |
| density of laser drilling hole | / |
| min via size | / |
| min line width/space | / |
| aperture ratio | / |
| pressing times | / |
| drilling times | / |
| PN | B0100804A |
Design and Product Features
Taconic TSM DS3 PCB – solution high performance PCB projects.
In the intricate world of PCB design, the quest for the perfect laminate material can be a daunting task. At Rich Full Joy, we understand this struggle intimately, and that's why we're excited to introduce you to the Taconic TSM - DS3M – a revolutionary solution that's set to transform your high - performance PCB projects.
Break Free from the Ordinary: Ditch FR4 and Embrace Innovation
Tired of the limitations of traditional FR4 materials? It's time to think outside the box. The Taconic TSM - DS3M offers a host of advantages that make it an ideal choice for applications where reliability, thermal stability, and high - frequency performance are non - negotiable.
Industry - Leading Low - Loss Core
The TSM - DS3M is a trend - setting, thermally stable low - loss core. With a Df of just 0.0011 at 10GHz, it outperforms many materials on the market. Manufactured with the same consistency and predictability as RF4 (glass - reinforced epoxies), it's a cut above the rest. But what truly sets it apart is its unique ceramic - filled composition, boasting a glass fiber content of less than 5%. This makes it a top contender for fabricating large - format, complicated multilayer boards, rivaling the performance of epoxies.
Ideal for High - Power Applications
When it comes to high - power applications, heat management is crucial. The TSM - DS3M is engineered with a low CTE (Coefficient of Thermal Expansion), ensuring that the dielectric material effectively conducts heat away from other heat sources in your PCB design. This not only enhances the overall performance but also extends the lifespan of your components.
Taconic TSM-DS3 High-Frequency PCB | RF & Microwave PCB Manufacturer
High-Frequency PCB SpecificationsPCB
Material: Taconic TSM-DS3-0200-CLH/CLH：Taconic TSM-DS3-0200-CLH/CLH
Layers: Double-sided
Surface Treatment: Immersion Gold：
Thickness: Customizable
Applications: RF, microwave, telecommunications：
Taconic TSM-DS3 High-Frequency PCB< Key Features
1.Low dielectric constant and loss tangent
2.Excellent thermal stability
3.Superior signal integrity
4.High reliability for demanding environments，
5.Industry - Leading Performance: Boasting an industry - leading PDF of 0.0011 at 10GHz, it sets the standard for high - frequency performance.
6.Military - Grade Reliability: Its low Z - axis expansion makes it perfect for military applications where reliability in extreme conditions is essential.
7.High Thermal Conductivity: With a thermal conductivity of 0.65 W/M*K, it excels in heat management.
8.Low Fiberglass Content: The low (~5%) fiberglass content contributes to its unique properties.
9.Exceptional Dimensional Stability: Its dimensional stability rivals that of epoxy, ensuring your PCB stays in top shape.
10.Versatile Board Fabrication: Allows for the fabrication of large - format, high - layer - count printed wiring boards with ease.
11.Consistent and Predictable Yields: Builds complicated printed wiring boards with consistent and predictable yields.
12.Stable Temperature Performance: Maintains a stable temperature DK of ±0.25% (-30°C to 120°C), ensuring reliable operation across a wide temperature range.
13.Resistive Foil Compatibility: Seamlessly integrates with resistive foils for added design flexibility.
Understanding Taconic TSM-DS3 PCB the Material: Thermal Coefficient and More
The thermal coefficient of the dielectric constant (T, K) is an important aspect of the TSM - DS3M. The dielectric values obtained from different test approaches can vary. The TSM - DS3M typically shows a T, K of - 11 ppm/°C (-55 to 150 degree Centigrade) under the IPC - 650 2.5.5.6 test method. Molecular vibrations and interactions, which increase with temperature, can cause the dielectric constant (Dk) to rise. However, the TSM - DS3M's unique composition helps mitigate this effect, ensuring stable performance.
Typical Values at a Glance
| Property | Test Method | Unit | Value |
| Dielectric Constant (Dk) at 10GHz | IPC - 650 2.5.5.5.1 (Modified) | 2.94 | |
| T, K (-55 to 150 degrees Celsius) | IPC - 650 2.5.5.6 | ppm/°C | -11 |
| Dissipation Factor (Df) at 10GHz | IPC - 650 2.5.5.5.1 (Modified) | 0.0011 | |
| Dielectric Breakdown | IPC - 650 2.5.6 (ASTM D 149) | kV | 47.5 |
| Dielectric Strength | ASTM D 149 (Through Plane) | V/mil | 548 |
| Arc Resistance | IPC - 650 2.5.1 | Seconds | 226 |
| Moisture Absorption | IPC - 650 2.6.2.1 | % | 0.07 |
| Flexural Strength (Machine Direction - MD) | ASTM D 790/ IPC - 650 2.4.4 | psi | 11811 |
| Flexural Strength (Cross Direction - CD) | ASTM D 790/ IPC - 650 2.4.4 | psi | 7512 |
| Tensile Strength (Machine Direction - MD) | ASTM D 3039/IPC - 650 2.4.19 | psi | 7030 |
| Tensile Strength (Cross Direction - CD) | ASTM D 3039/IPC - 650 2.4.19 | psi | 3830 |
| Elongation at Break (Machine Direction - MD) | ASTM D 3039/IPC - 650 2.4.19 | % | 1.6 |
| Elongation at Break (Cross Direction - CD) | ASTM D 3039/IPC - 650 2.4.19 | % | 1.5 |
| Young's Modulus (Machine Direction - MD) | ASTM D 3039/IPC - 650 2.4.19 | psi | 973000 |
| Young's Modulus (Cross Direction - CD) | ASTM D 3039/IPC - 650 2.4.19 | psi | 984000 |
| Poisson's Ratio (Machine Direction - MD) | ASTM D 3039/IPC - 650 2.4.19 | 0.24 | |
| Poisson's Ratio (Cross Direction - CD) | ASTM D 3039/IPC - 650 2.4.19 | 0.2 | |
| Comprehensive Modulus | ASTM D 695 (23°C) | psi | 310,000 |
| Flexural Modulus (Machine Direction - MD) | ASTM D 790/IPC - 650 2.4.4 | kpsi | 1860 |
| Flexural Modulus (Cross Direction - CD) | ASTM D 790/ |
Aspects to Consider for Storage, Handling, and Lamination
Storage
Proper storage is key to maintaining the integrity of the TSM - DS3M. At Rich Full Joy, we recommend storing it flat in a clean area at room temperature. Placing it between stiffeners helps prevent layer bending, and using soft slip sheets keeps debris and dust at bay. The storage conditions directly impact the shelf - life of the laminate.
Handling
Due to its unique composition, handling the TSM - DS3M requires care. Avoid mechanical scrubbing and refrain from picking up the panel horizontally by its edges. Also, take precautions to prevent contaminant deposits on the copper or material and avoid stacking panels. Post - etching, it's crucial to avoid mechanically abrading the PTFE surface.
Layer Preparation
When preparing the layers for lamination, acclimatization and scaling are essential steps. During lamination, strictly follow our set guidelines to ensure a high - quality, fully - functional TSM - DS3M PCB.
FAQ – Taconic TSM-DS3 High-Frequency PCB
1️⃣ What is Taconic TSM-DS3 PCB used for?
✔ It is primarily used in 5G networks, radar, aerospace, automotive radar, and satellite communication applications due to its superior RF performance.
2️⃣ What are the advantages of Taconic TSM-DS3 material?
✔ It offers low dielectric loss, high thermal conductivity, excellent mechanical stability, and minimal signal attenuation, making it ideal for high-frequency applications.
3️⃣ Why is ENIG surface finish used for high-frequency PCBs?
✔ ENIG (Electroless Nickel Immersion Gold) provides superior oxidation resistance, enhanced solderability, and extended PCB lifespan, making it a preferred choice for RF applications.
4️⃣ What is the typical layer count for Taconic TSM-DS3 PCBs?
✔ The most common configurations include single-layer, double-layer, and multilayer RF PCB designs, depending on customer requirements.
5️⃣ How does Taconic TSM-DS3 compare to Rogers materials?
✔ Taconic TSM-DS3 provides similar low-loss characteristics as Rogers RO4350B and RO4003C, but offers enhanced thermal stability and a more cost-effective solution.
6️⃣ What is the maximum frequency supported by Taconic TSM-DS3 PCB?
✔ It supports GHz-range frequencies, making it suitable for millimeter-wave (mmWave) applications in 5G, radar, and satellite systems.
7️⃣ Can Taconic TSM-DS3 PCBs be customized?
✔ Yes! We provide custom designs, including different layer counts, stack-ups, impedance control, and special surface finishes.
8️⃣ What are the typical thickness options for Taconic TSM-DS3?
✔ Taconic TSM-DS3 is available in multiple thicknesses, including 0.2mm, 0.5mm, 1.0mm, and custom thicknesses based on project needs.
9️⃣ Does your factory offer fast turnaround for Taconic TSM-DS3 PCBs?
✔ Yes, we provide rapid prototyping and mass production with short lead times to meet tight project deadlines.
How do I order Taconic TSM-DS3 high-frequency PCBs?
✔ Contact us directly for custom quotes, design consultations, and bulk order discounts.
Application Areas of Taconic TSM-DS3 High-Frequency PCBs
5G Base Stations & mmWave Networks – Ensures high-speed data transmission and low signal loss in next-gen wireless communication.
Automotive Radar Systems – Essential for ADAS (Advanced Driver Assistance Systems) and self-driving vehicle technology.
Satellite Communication – Supports Ku-band, Ka-band, and other high-frequency satellite link applications.
Military & Aerospace Electronics – Used in radar, avionics, and electronic warfare systems for mission-critical applications.
RFID & IoT Devices – Optimized for high-frequency RFID tags and IoT wireless connectivity.
Medical Imaging Systems – Enables high-precision MRI and ultrasound signal processing.
Microwave Antennas & Filters – Key material for microwave components in RF and microwave systems.
Industrial & Scientific Equipment – Used in high-frequency sensors, testing instruments, and spectrum analyzers.
High-Speed Data Transmission Systems – Ensures signal integrity for optical transceivers and high-speed Ethernet.
PCB Prototyping & Research – Preferred for high-frequency circuit testing and advanced RF design labs.
At Rich Full Joy, we're not just offering a product; we're providing a comprehensive solution. Our team of experts is well - versed in the intricacies of the Taconic TSM - DS3M. We can guide you through every step of the design process, from material selection to final product realization. With our state - of - the - art facilities and rigorous quality control measures, you can trust us to deliver top - notch PCBs that meet and exceed your expectations. The Rich Full Joy Advantage
If you're looking to take your PCB design to the next level, the Taconic TSM - DS3M from Rich Full Joy is the way to go. Its unrivaled performance, versatility, and reliability make it the perfect choice for high - end applications. Don't miss out on this opportunity to revolutionize your projects. Contact us today and let's embark on a journey of innovation together.
Expanded Applications of High-Frequency Hybrid PCBs
