Yiziphi izinhlobo zama-PCB e-IC Substrate atholakalayo?
Ngokusho kwezinto ezibonakalayo, ingahlukaniswa ibe yi: Eqinile, eguquguqukayo, eyobumba, e-polyimide, e-BT, njll.
Ngokusho kobuchwepheshe, ingahlukaniswa ibe yi: BGA, CSP, FC, MCM, njll.
Yiziphi izinhlelo zokusebenza ze-Ic Substrate?
Umkhiqizi we-BGA substrates
Iphathwa ngesandla, Iselula, Inethiwekhi
Ifoni ehlakaniphile, ama-electronics abathengi kanye ne-DTV
I-CPU, i-GPU kanye ne-Chipset yohlelo lokusebenza lwe-PC
I-CPU, i-GPU ye-Game Console (isb. i-X-Box, i-PS3, i-Wii…)
Isilawuli se-DTV Chip, Isilawuli se-Blu-Ray Chip
Isicelo sengqalasizinda (isb. Inethiwekhi, Isiteshi Sesisekelo…)
Ama-ASIC
Ibhendi ye-Digital Baseband
Ukuphathwa Kwamandla
Iprosesa Yezithombe
Isilawuli se-Multimedia
Iprosesa Yohlelo Lokusebenza
Ikhadi lememori lemikhiqizo ye-3C (isb. Iselula/i-DSC/i-PDA/i-GPS/i-Pocket PC/i-Notebook)
I-CPU Esebenza Kakhulu
Amadivayisi e-GPU, ASIC
Ideskithophu / Iseva
Ukuxhumana
Yiziphi izinhlelo zokusebenza ze-CSP Package Substrate?
Imemori, i-analog, ama-ASIC, i-Logic, amadivayisi e-RF,
Incwadi Yokubhala, Incwadi Engaphansi, Amakhompyutha Omuntu Siqu,
I-GPS, i-PDA, uhlelo lokuxhumana olungenantambo
Yiziphi izinzuzo zokusebenzisa i-PCB ye-substrate yesekethe ehlanganisiwe?
Ama-substrate esekethe ahlanganisiwe Ama-PCB ahlinzeka ngokusebenza kahle kukagesi okuhle kakhulu ngesikhala sebhodi esinciphile, okuvumela ukuhlanganiswa kwama-IC amaningi ebhodini lesekethe elilodwa. Ama-substrate esekethe ahlanganisiwe Ama-PCB nawo anezici zokusebenza okuthuthukisiwe kokushisa ngenxa ye-dielectric constant yawo ephansi, okuholela ekuthembekeni okungcono kanye nemijikelezo yokuphila emide. Ama-substrate esekethe ahlanganisiwe Ama-PCB anezakhiwo zikagesi ezinhle kakhulu, kufaka phakathi izici zemvamisa ephezulu, kanye nokuncipha okuncane kwesignali kanye namazinga okuxoxa.
Yiziphi izinkinga zokusebenzisa i-IC Substrate PCB?
Ama-substrate e-IC adinga ubuchwepheshe obukhulu kanye nekhono ukuze akhiwe, njengoba aqukethe izendlalelo eziningana zezintambo eziyinkimbinkimbi, izingxenye, kanye namaphakheji e-IC.
Ngaphezu kwalokho, ama-substrate e-IC avame ukubiza kakhulu ukuwakhiqiza ngenxa yobunzima bawo.
Okokugcina, ama-substrate e-IC nawo asengozini yokwehluleka ngenxa yobukhulu bawo obuncane kanye nezintambo eziyinkimbinkimbi.
Uyini umehluko phakathi kwe-IC Substrate PCB kanye ne-PCB ejwayelekile?
Ama-PCB e-IC substrate ahlukile kuma-PCB ajwayelekile ngoba aklanyelwe ngqo ukusekela ama-IC chips kanye nezingxenye ezifakwe i-IC. Ngokuphathelene nesici sokukhiqiza i-PCB, ukukhiqizwa kwe-IC Substrate kunzima kakhulu kune-PCB ejwayelekile ngenxa yokubhoboza kwayo okuphezulu kanye nokulandelela.
Ingabe i-IC Substrate PCB ingasetshenziswa ukwenza i-prototyping?
Yebo, i-PCB ye-substrate yephakheji ye-IC ingasetshenziswa ukwenza i-prototyping.
Iyini i-PBGA Package Substrate Application?
I-ASIC, i-DSP kanye neMemori, ama-Gate Arrays,
Ama-Microprocessor / Abalawuli / Ihluzo
Ama-Chipset nama-Peripheral e-PC
Amaphrosesa Ezithombe
Amabhokisi Okusetha Okuphezulu
Ama-Game Consoles
I-Gigabit Ethernet
Yiziphi izinkinga ekukhiqizweni kwebhodi le-IC substrate?
Inselele enkulu kakhulu ukubhoboza okuphezulu kakhulu njenge-0.1 mm blind vias kanye ne-hrilled vias, i-stacked micro via ivame kakhulu ekukhiqizweni kwe-integrated circuit substrate PCBs. Futhi isikhala sokulandelela nobubanzi kungaba kuncane njengo-0.025 mm. Ngakho-ke kubaluleke kakhulu ukuthola amafektri e-IC substrate athembekile ohlobo olunjalo lwamabhodi esifunda aphrintiwe.