Yintoni i-BGA Assembly?
I-BGA assembly ibhekisa kwinkqubo yokufaka i-Ball Grid Array (BGA) kwi-PCB kusetyenziswa indlela yokufakela i-reflow soldering. I-BGA yinxalenye exhonywe phezu komhlaba esebenzisa uluhlu lweebhola ze-solder zokudibanisa umbane. Njengoko ibhodi yesekethe idlula kwi-oven ye-solder reflow, ezi bhola ze-solder ziyanyibilika, zenze unxibelelwano lombane.
Inkcazo ye-BGA
I-BGA: I-Ball Grid Array
Udidi lwe-BGA
I-PBGA: iplastiki yeBGA egqunywe ngeplastiki yeBGA
I-CBGA: I-BGA yokupakisha i-BGA yeseramikhi
I-CCGA: Ikholamu yeseramikhi ye-BGA intsika yeseramikhi
I-BGA ipakishwe ngendlela eyiyo
I-TBGA: iteyiphu ye-BGA enekholamu yegridi yebhola
Amanyathelo okuhlanganisa i-BGA
Inkqubo yokuhlanganisa i-BGA idla ngokubandakanya la manyathelo alandelayo:
Ukulungiswa kwePCB: I-PCB ilungiswa ngokufaka i-solder paste kwii-pads apho i-BGA iza kufakelwa khona. I-solder paste ngumxube wee-solder alloy particles kunye ne-flux, enceda kwinkqubo yokunyibilikisa.
Ukubekwa kwee-BGA: Ii-BGA, eziqulathe itshiphu yesekethe edibeneyo eneebhola ze-solder ezantsi, zifakwa kwi-PCB elungisiweyo. Oku kwenziwa kusetyenziswa oomatshini bokukhetha nokubeka okanye ezinye izixhobo zokuhlanganisa.
Ukunyibilika kwakhona kwe-soldering: I-PCB edibeneyo ene-BGAs ezibekiweyo idluliselwa kwi-oven ephinde yaguqulwa. I-oven ephinde yaguqulwa ifudumeza i-PCB kubushushu obuthile obunyibilikisa intlama ye-solder, nto leyo ebangela ukuba iibhola ze-solder ze-BGAs ziphinde zakhiwe kwaye zenze unxibelelwano lombane nee-PCB pads.
Ukupholisa nokuhlola: Emva kwenkqubo yokuphinda kufakwe i-solder, i-PCB iyapholiswa ukuze iqinise amalungu e-solder. Emva koko ihlolwa ukuba ayinazo naziphi na iziphene, ezinje ngokungalungelelani, ii-shorts, okanye uqhagamshelo oluvulekileyo. Ukuhlolwa okuzenzakalelayo kwe-optical (AOI) okanye ukuhlolwa kwe-X-ray kungasetyenziselwa le njongo.
Iinkqubo zeSibini: Ngokuxhomekeke kwiimfuno ezithile, iinkqubo ezongezelelweyo ezifana nokucoca, ukuvavanya, kunye nokufaka i-conformal coating zingenziwa emva kokuhlanganiswa kwe-BGA ukuqinisekisa ukuthembeka kunye nomgangatho wemveliso egqityiweyo.
Iingenelo ze-BGA Assembly
I-BGA Ball Grid Array
I-EBGA 680L
I-LBGA 160L
I-PBGA 217L yePlastiki yeGridi yeBhola yePlastiki
I-SBGA 192L
I-TSBGA 680L
I-CLCC
I-CNR
I-CPGA Ceramic Pin Grid Array
Iphakheji ye-DIP Dual Inline
Ithebhu ye-DIP
I-FBGA
1. Indawo encinci
Ukupakisha kwe-BGA kuqulathe itshiphu, ii-interconnects, i-substrate encinci, kunye nesigqubuthelo se-encapsulation. Zimbalwa izinto eziveziweyo kwaye iphakheji inenani elincinci leepini. Ukuphakama kwetshiphu iyonke kwi-PCB kunokuba ngaphantsi kwe-1.2 millimeters.
2. Ukuqina
Ukupakisha kwe-BGA kuqinile kakhulu. Ngokungafaniyo ne-QFP ene-pitch ye-20mil, i-BGA ayinazo iiphini ezinokugoba okanye ziqhekeke. Ngokubanzi, ukususwa kwe-BGA kufuna ukusetyenziswa kwesikhululo sokuhlaziya i-BGA kumaqondo obushushu aphezulu.
3. Ukungena kunye nomthamo ophantsi we-parasitic
Ngeepini ezimfutshane kunye nokuphakama okuphantsi kwendibano, ukupakisha kwe-BGA kubonisa ukungasebenzi kakuhle kwe-parasitic kunye ne-capacitance, nto leyo ekhokelela ekusebenzeni kakuhle kombane.
4. Ukwanda kwendawo yokugcina izinto
Xa kuthelekiswa nezinye iintlobo zokupakisha, ukupakisha kwe-BGA kunesinye kwisithathu kuphela somthamo kwaye malunga ne-1.2 indawo yetshiphusi. Iimveliso zememori kunye nokusebenza ezisebenzisa ukupakisha kwe-BGA zinokufikelela kulwandiso olungaphezulu kwe-2.1 kumthamo wokugcina kunye nesantya sokusebenza.
5. Uzinzo oluphezulu
Ngenxa yokwandiswa ngokuthe ngqo kweepini ukusuka embindini wetshiphusi kwiphakheji ye-BGA, iindlela zokudlulisela iimpawu ezahlukeneyo ziyafinyezwa ngokufanelekileyo, nto leyo enciphisa ukuncitshiswa kwesignali kwaye iphucula isantya sempendulo kunye nokukwazi ukulwa nokuphazamiseka. Oku kuphucula uzinzo lwemveliso.
6. Ukusasaza ubushushu kakuhle
I-BGA inika ukusebenza okugqwesileyo kokusasaza ubushushu, apho ubushushu be-chip busondela kubushushu obuqhelekileyo ngexesha lokusebenza.
7. Ilungele ukuphinda usetyenzwe
Iiphini zephakheji ye-BGA zicwangciswe kakuhle ezantsi, nto leyo eyenza kube lula ukufumana iindawo ezonakeleyo ukuze zisuswe. Oku kwenza kube lula ukuphinda kusetyenziswe iitships ze-BGA.
8. Ukuphepha ingxolo yentambo
Ukupakishwa kwe-BGA kuvumela ukubeka iiphini ezininzi zamandla kunye nomhlaba embindini, kunye neephini ze-I/O ezibekwe ecaleni. Ukulungiselela kwangaphambili kungenziwa kwi-substrate ye-BGA, kuthintelwe ukufakelwa kweephini ze-I/O ezingalawulekiyo.
Amandla okuhlanganisa iRichPCBA BGA
I-RICHPCBA ngumvelisi odumileyo kwihlabathi liphela wokwenziwa kwe-PCB kunye nokuhlanganiswa kwe-PCB. Inkonzo yokuhlanganiswa kwe-BGA yenye yeentlobo ezininzi zeenkonzo esizinikezelayo. I-PCWay inokukunika indibano ye-BGA esemgangathweni ophezulu nengabizi kakhulu kwii-PCB zakho. Ubuncinci bepitch yokuhlanganiswa kwe-BGA esinokuyithwala yi-0.25mm 0.3mm.
Njengomboneleli weenkonzo ze-PCB onamava eminyaka engama-20 kwimveliso, ukwenziwa kunye nokuhlanganiswa kwe-PCB, i-RICHPCBA inemvelaphi etyebileyo. Ukuba kukho imfuneko yokuhlanganiswa kwe-BGA, nceda unxibelelane nathi!