He aha ka ʻAhahui BGA?
ʻO ka ʻākoakoa BGA e pili ana i ke kaʻina hana o ke kau ʻana i kahi Ball Grid Array (BGA) ma luna o kahi PCB me ka hoʻohana ʻana i ke ʻano hana soldering reflow. ʻO BGA kahi ʻāpana i kau ʻia ma luna e hoʻohana ana i kahi ʻano o nā pōpō solder no ka hoʻopili uila. Ke hele ka papa kaapuni ma o kahi umu solder reflow, heheʻe kēia mau pōpō solder, e hana ana i nā pilina uila.
Ka wehewehe ʻana o BGA
BGA: Pūʻulu Māka Pōpō
Ka Hoʻokaʻawale ʻana o BGA
PBGA: BGA palakika i hoʻopuni ʻia me ka palakika
CBGA: BGA no ka ʻōpala BGA keramika
CCGA: Kolume keramika BGA kia keramika
BGA i hoʻopili ʻia ma ke ʻano
TBGA: lipine BGA me ke kolamu maka poepoe
Nā ʻanuʻu o ka ʻAha BGA
ʻO ke kaʻina hana hōʻuluʻulu BGA e pili ana i kēia mau ʻanuʻu:
Hoʻomākaukau PCB: Hoʻomākaukau ʻia ka PCB ma ka hoʻopili ʻana i ka solder paste i nā pads kahi e kau ʻia ai ka BGA. ʻO ka solder paste kahi hui ʻana o nā ʻāpana alloy solder a me ka flux, e kōkua ana i ke kaʻina hana soldering.
Ke kau ʻana o nā BGA: ʻO nā BGA, nona ka chip kaapuni i hoʻohui ʻia me nā pōpō solder ma lalo, ua kau ʻia ma luna o ka PCB i hoʻomākaukau ʻia. Hana pinepine ʻia kēia me ka hoʻohana ʻana i nā mīkini pick-and-place automated a i ʻole nā lako ʻākoakoa ʻē aʻe.
Hoʻopili Hou ʻana: A laila e hoʻouna ʻia ka PCB i hōʻuluʻulu ʻia me nā BGA i kau ʻia ma o ka umu reflow. Hoʻomehana ka umu reflow i ka PCB i kahi mahana kikoʻī e hoʻoheheʻe ai i ka hoʻopili solder, e hoʻoulu ai i nā pōpō solder o nā BGA e reflow a hoʻokumu i nā pilina uila me nā pads PCB.
Hoʻomaʻalili a me ka Nānā ʻana: Ma hope o ke kaʻina hana reflow solder, hoʻomaʻalili ʻia ka PCB e hoʻopaʻa i nā hui solder. A laila nānā ʻia no kekahi mau hemahema, e like me ke kuhi hewa ʻana, nā pōkole, a i ʻole nā pilina hāmama. Hiki ke hoʻohana ʻia ka nānā ʻana o ka optical automated (AOI) a i ʻole ka nānā ʻana o X-ray no kēia kumu.
Nā Kaʻina Hana Lua: Ma muli o nā koi kikoʻī, hiki ke hana ʻia nā kaʻina hana hou e like me ka hoʻomaʻemaʻe, ka hoʻāʻo ʻana, a me ka uhi ʻana conformal ma hope o ka hui ʻana o BGA e hōʻoia i ka hilinaʻi a me ka maikaʻi o ka huahana i hoʻopau ʻia.
Nā Pōmaikaʻi o ka ʻAha BGA
Pūʻulu Makaʻaha Pōpō BGA
ʻEBGA 680L
LBGA 160L
PBGA 217L Plastic Ball Grid Array
SBGA 192L
TSBGA 680L
CLCC
CNR
ʻO ka Pūʻulu Grid Pin Ceramic CPGA
Pūʻolo Inline Pālua DIP
ʻAoʻao DIP
FBGA
1. Kapuahi liʻiliʻi
ʻO ka ʻōpala BGA he ʻāpana, nā mea hoʻopili, kahi substrate lahilahi, a me kahi uhi encapsulation. He kakaikahi nā ʻāpana i hōʻike ʻia a he liʻiliʻi ka helu o nā pine o ka pūʻolo. Hiki ke haʻahaʻa ke kiʻekiʻe holoʻokoʻa o ka ʻāpana ma ka PCB i 1.2 millimeters.
2. Paʻa
He paʻa loa ka ʻōpala BGA. ʻAʻole e like me QFP me ka pitch 20mil, ʻaʻohe pine o BGA e hiki ke kūlou a haki paha. Ma keʻano laulā, pono ka wehe ʻana o BGA i ka hoʻohana ʻana i kahi kahua hana hou BGA ma nā mahana kiʻekiʻe.
3. Hoʻohaʻahaʻa ka inductance parasitic a me ka capacitance
Me nā pine pōkole a me ke kiʻekiʻe haʻahaʻa o ka ʻākoakoa, hōʻike ka ʻōpala BGA i ka inductance parasitic haʻahaʻa a me ka capacitance, e hopena ana i ka hana uila maikaʻi loa.
4. Hoʻonui ʻia ka wahi mālama
Ke hoʻohālikelike ʻia me nā ʻano ʻōpala ʻē aʻe, hoʻokahi hapakolu wale nō o ka nui o ka ʻōpala BGA a ma kahi o 1.2 manawa ka nui o ka ʻāpana chip. Hiki i nā huahana hoʻomanaʻo a me nā huahana hana e hoʻohana ana i ka ʻōpala BGA ke hoʻokō i ka piʻi ʻana o ka hiki ke mālama a me ka wikiwiki o ka hana ma mua o 2.1 manawa.
5. Kūlana kiʻekiʻe
Ma muli o ka hoʻolōʻihi pololei ʻana o nā pine mai ke kikowaena o ka chip i loko o ka pahu BGA, ua hoʻopōkole maikaʻi ʻia nā ala hoʻoili no nā hōʻailona like ʻole, e hōʻemi ana i ka attenuation hōʻailona a hoʻomaikaʻi i ka wikiwiki o ka pane a me nā hiki ke pale i ke komo ʻana. Hoʻonui kēia i ke kūpaʻa o ka huahana.
6. Hoʻopuehu maikaʻi i ka wela
Hāʻawi ʻo BGA i ka hana hoʻopuehu wela maikaʻi loa, me ka mahana o ka ʻāpana e hoʻokokoke ana i ka mahana ambient i ka wā o ka hana.
7. Kūpono no ka hana hou ʻana
Ua hoʻonohonoho pono ʻia nā pine o ka ʻūpā BGA ma lalo, e maʻalahi ai ka loaʻa ʻana o nā wahi i hōʻino ʻia no ka wehe ʻana. Hoʻomaʻalahi kēia i ka hana hou ʻana o nā ʻāpana BGA.
8. Ka pale ʻana i ka haunaele uea
ʻAe ka ʻōpala BGA i ke kau ʻana i nā pine mana a me ka honua he nui ma ke kikowaena, me nā pine I/O i kau ʻia ma ka periphery. Hiki ke hana ʻia ka pre-routing ma ka substrate BGA, e pale ana i ka uea chaotic o nā pine I/O.
Nā hiki ke hoʻākoakoa ʻo RichPCBA BGA
He mea hana kaulana ʻo RICHPCBA no ka hana ʻana i nā PCB a me ka ʻākoakoa PCB. ʻO ka lawelawe ʻākoakoa BGA kekahi o nā ʻano lawelawe he nui a mākou e hāʻawi aku nei. Hiki iā PCBWay ke hāʻawi iā ʻoe i ka ʻākoakoa BGA kiʻekiʻe a me ke kumukūʻai kūpono no kāu mau PCB. ʻO ka pitch liʻiliʻi no ka ʻākoakoa BGA hiki iā mākou ke hoʻokipa he 0.25mm 0.3mm.
Ma ke ʻano he mea lawelawe PCB me 20 mau makahiki o ka ʻike ma ka hana ʻana, ka hana ʻana a me ka hoʻākoakoa ʻana o PCB, he waiwai ko RICHPCBA. Inā he koi no ka hoʻākoakoa BGA, e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou!