Kuyini i-BGA Assembly?
Ukuhlanganiswa kwe-BGA kubhekisela enkambisweni yokufaka i-Ball Grid Array (BGA) kwi-PCB kusetshenziswa indlela yokugoqa kabusha. I-BGA iyisakhi esifakwe ebusweni esisebenzisa uhla lwamabhola okugoqa ukuze kuxhunywe ugesi. Njengoba ibhodi lesifunda lidlula kuhhavini wokugoqa kabusha kwe-solder, lawa mabhola okugoqa ayancibilika, akhe ukuxhumana kukagesi.
Incazelo ye-BGA
I-BGA: I-Ball Grid Array
Ukuhlukaniswa kwe-BGA
I-PBGA: ipulasitiki i-BGA ipulasitiki ehlanganisiwe i-BGA
I-CBGA: I-BGA yokupakisha i-BGA yobumba
I-CCGA: Ikholomu ye-Ceramic BGA insika ye-ceramic
I-BGA ipakishwe ngesimo sayo
I-TBGA: i-tape ye-BGA enekholomu yegridi yebhola
Izinyathelo Zokuhlanganiswa kwe-BGA
Inqubo yokuhlanganisa i-BGA ivame ukuhilela izinyathelo ezilandelayo:
Ukulungiselela i-PCB: I-PCB ilungiswa ngokufaka i-solder paste kuma-pad lapho i-BGA izofakwa khona. I-solder paste iyinhlanganisela yezinhlayiya ze-solder alloy kanye ne-flux, okusiza ngenqubo yoku-solder.
Ukubekwa kwama-BGA: Ama-BGA, aqukethe i-chip yesekethe ehlanganisiwe enamabhola e-solder phansi, abekwa kwi-PCB elungisiwe. Lokhu kuvame ukwenziwa kusetshenziswa imishini yokukhetha nokubeka ezenzakalelayo noma eminye imishini yokuhlanganisa.
Ukushisisa kabusha: I-PCB ehlanganisiwe enama-BGA abekwe idluliselwa kuhhavini oshisisa kabusha. I-oven eshisisa kabusha ifudumeza i-PCB ekushiseni okuthile okuncibilikisa i-solder paste, okwenza amabhola e-solder ama-BGA ashise kabusha futhi asungule ukuxhumana kukagesi nama-PCB pads.
Ukupholisa Nokuhlola: Ngemva kwenqubo yokugeleza kabusha kwe-solder, i-PCB iyapholiswa ukuze kuqiniswe amalunga e-solder. Bese ihlolwa ukuthi ayinazo yini iziphambeko, njengokungalungi kahle, ama-shorts, noma ukuxhumana okuvulekile. Ukuhlolwa okuzenzakalelayo kwe-optical (AOI) noma ukuhlolwa kwe-X-ray kungasetshenziswa kule njongo.
Izinqubo Zesibili: Kuye ngezidingo ezithile, izinqubo ezengeziwe ezifana nokuhlanza, ukuhlola, kanye nokugqoka okufana nomshini zingenziwa ngemuva kokuhlanganiswa kwe-BGA ukuqinisekisa ukuthembeka kanye nekhwalithi yomkhiqizo oqediwe.
Izinzuzo ze-BGA Assembly
I-BGA Ball Grid Array
I-EBGA 680L
I-LBGA 160L
I-PBGA 217L Plastic Ball Grid Array
I-SBGA 192L
I-TSBGA 680L
I-CLCC
I-CNR
I-CPGA Ceramic Pin Grid Array
Iphakheji Emibili Engaphakathi Kwe-DIP
Ithebhu ye-DIP
I-FBGA
1. Unyawo oluncane
Ukupakishwa kwe-BGA kuqukethe i-chip, ama-connect, i-substrate encane, kanye nesembozo se-encapsulation. Zimbalwa izingxenye eziveziwe futhi iphakheji inenani elincane lamaphini. Ukuphakama okuphelele kwe-chip ku-PCB kungaba ngamamilimitha ayi-1.2.
2. Ukuqina
Ukupakishwa kwe-BGA kuqinile kakhulu. Ngokungafani ne-QFP ene-pitch engu-20mil, i-BGA ayinazo izikhonkwane ezingagoba noma ziphuke. Ngokuvamile, ukususwa kwe-BGA kudinga ukusetshenziswa kwesiteshi sokulungisa kabusha se-BGA emazingeni okushisa aphezulu.
3. Ukwehla kokufakwa kwe-parasitic kanye nomthamo wayo
Ngamaphini amafushane nokuphakama okuphansi kokuhlanganiswa, ukupakishwa kwe-BGA kubonisa ukungenisa okuphansi kwezinambuzane kanye nomthamo, okuholela ekusebenzeni kahle kukagesi okuhle kakhulu.
4. Isikhala sokugcina esandisiwe
Uma kuqhathaniswa nezinye izinhlobo zokupakisha, ukupakisha kwe-BGA kunengxenye eyodwa kwezintathu kuphela yomthamo futhi cishe indawo ye-chip ephindwe ka-1.2. Imikhiqizo yememori kanye nokusebenza esebenzisa ukupakisha kwe-BGA ingafinyelela ukwanda okungaphezu kokuphindwe ka-2.1 komthamo wokugcina kanye nesivinini sokusebenza.
5. Ukuqina okuphezulu
Ngenxa yokwelulwa okuqondile kwamaphini kusuka enkabeni ye-chip ekupakishweni kwe-BGA, izindlela zokudlulisela izimpawu ezahlukahlukene ziyafinyezwa ngempumelelo, kunciphisa ukuncishiswa kwesignali futhi kuthuthukise isivinini sokuphendula kanye namakhono okulwa nokuphazamiseka. Lokhu kuthuthukisa ukuzinza komkhiqizo.
6. Ukushabalalisa ukushisa okuhle
I-BGA inikeza ukusebenza okuhle kakhulu kokushabalalisa ukushisa, lapho izinga lokushisa le-chip lisondela ezingeni lokushisa elizungezile ngesikhathi sokusebenza.
7. Kulula ukuphinda usebenze
Izikhonkwane zephakheji ye-BGA zihlelwe kahle phansi, okwenza kube lula ukuthola izindawo ezonakele ukuze zisuswe. Lokhu kwenza kube lula ukuphinda kusetshenziswe ama-chip e-BGA.
8. Ukugwema isiphithiphithi sezintambo
Ukupakishwa kwe-BGA kuvumela ukubeka amaphini amaningi kagesi kanye nomhlabathi phakathi nendawo, kanye namaphini e-I/O abekwe eceleni. Ukulungiselela kusengaphambili kungenziwa ku-substrate ye-BGA, kugwenywe izintambo ezingahlelekile zamaphini e-I/O.
Amandla Okuhlanganisa i-RichPCBA BGA
I-RICHPCBA ingumkhiqizi odumile emhlabeni wonke wokwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB. Insizakalo yokuhlanganiswa kwe-BGA ingenye yezinhlobo eziningi zesevisi esizinikezayo. I-PCWay ingakunikeza ukuhlanganiswa kwe-BGA okuseqophelweni eliphezulu futhi okungabizi kakhulu kwama-PCB akho. Isilinganiso esincane sokuhlanganiswa kwe-BGA esingasifaka singu-0.25mm 0.3mm.
Njengomhlinzeki wesevisi ye-PCB oneminyaka engu-20 yesipiliyoni ekukhiqizeni, ekukhiqizeni nasekuhlanganiseni i-PCB, i-RICHPCBA inesizinda esicebile. Uma kunesidingo sokuhlanganiswa kwe-BGA, sicela ukhululeke ukuxhumana nathi!