Inkqubo yokuhlanganisa i-SMT ichazwe ngokupheleleyo: Ukusuka kwiBhodi engenanto ukuya kwiMveliso yokugqibela

Intshayelelo: Ukubaluleka Kokuqonda Inkqubo Yokuhlanganisa i-SMT

I-Surface Mount Technology (SMT) sisiseko sokwenziwa kwezinto ze-elektroniki zanamhlanje. Ivumela ukubekwa kwezinto ngokukhawuleza nangokuchaneka okuphezulu ngqo kumphezulu weebhodi zesekethe eziprintiweyo (ii-PCB). Njengoko izixhobo ziba ncinci, zinamandla, kwaye zidibene ngokusebenzayo, iinkqubo ze-SMT kufuneka ziqinisekise ukuthembeka okungagungqiyo, ukunyamezelana okuqinileyo, kunye nomgangatho ogqwesileyo wokutywina.

Nokuba ungunjineli woyilo olungiselela ukuveliswa komthamo, ingcali yokuthenga evavanya abathengisi be-EMS, okanye unjineli ojonga umgangatho wemveliso, ukuqonda inkqubo epheleleyo ye-SMT kubalulekile.

Eli nqaku libonelela ngenkcazelo epheleleyo yomgca wemveliso we-SMT, ukususela kumzuzu ibhodi engenanto ingena kumgca ukuya kwinqanaba lokuba yi-PCBA evavanyiweyo ngokupheleleyo, elungele ukuhanjiswa.

Inyathelo 1: Ukwamkela, Ukubhaka, kunye nokulungiselela i-PCB

Ngaphambi kokungena kumgca we-SMT, ii-PCB ezingenanto kufuneka zihlolwe ngokubonakalayo nangomlinganiselo, ingakumbi kwiibhodi ezisebenzisa i-frequency ephezulu, ii-multilayer, okanye ii-HDI. Iiparameter ezibalulekileyo ziquka i-warpage, i-oxidation kwiindawo ze-pad, kunye nobukhulu bebhodi.

Ubuthathaka bokufuma: Iilaminate ezisekwe kwi-Tg ephezulu okanye kwi-PTFE zinobuthathaka kumswakama. Ukubhaka ngaphambi kokubhaka kwi-105–125°C kangangeeyure ezi-4–12 (ngokwezikhokelo ze-IPC) kuthintela ukuqhekeka, ukuqhekeka, kunye nokungavuthi ngexesha lokuphinda kuphume amanzi.

Inyathelo lesi-2: Ukuprinta iSolder Paste

I-solder paste, edla ngokwenziwa nge-90% yentsimbi kunye ne-10% ye-flux, iprintwa kwii-PCB pads ezivezwe kusetyenziswa i-stencil yentsimbi engagqwaliyo echanekileyo.

• Ubukhulu beStencil: 100–150 microns kuxhomekeke kwipitch yecandelo
• Uyilo lweStencil: Ubungakanani be-Aperture, umlinganiselo wokunciphisa iiphedi, ukunyuka kwesantya
• IiParamitha zokuPrinta: Isantya seSqueegee, uxinzelelo, isantya sokwahlulwa
• Uhlobo lokuncamathisela: Uhlobo 3 lomgangatho, Uhlobo 4 okanye 5 lokubetha okucolekileyo okanye i-micro-BGA

Ukuprintwa ngokuchanekileyo kwe-solder paste kubalulekile ukuze kufumaneke ukumanzisa okufanayo nokuthintela iziphene ezifana nokubopha, ukungoneli kwe-solder, kunye nokubethelwa ngamatye.

Inyathelo lesi-3: Uhlolo lweSolder Paste (SPI)

Iinkqubo ze-SPI ezizenzekelayo zisebenzisa unxantathu we-laser we-2D okanye we-3D ukulinganisa:

• Ukuphakama kwencam
• Ukuhambelana komthamo
• Ulungelelwaniso lwe-offset kunye ne-stencil
• Ukufunyanwa kwebhulorho kunye noqikelelo lwento engenanto

Ii-SPI zibalulekile ekulawuleni inkqubo kwangethuba, zinciphisa ukwanda kweziphene ekuhambeni kwexesha.

Inyathelo lesi-4: Ukukhetha nokuBeka ngesantya esiphezulu

Inkqubo yokukhetha nokubeka izinto ifaka izinto ze-SMT kwiiphedi ezigqunywe yi-solder paste. Iinkqubo zanamhlanje ziyakwazi ukuphatha:

• Izinto ezingasebenziyo ezincinci njenge-01005
• Ii-IC ezineephakheji ze-QFN, ze-LGA, kunye ne-BGA ezicacileyo
• Izinto ezimile ngendlela engaqhelekanga ezinee-algorithms zombono ezenziwe ngokwezifiso
• Ukubekwa ngaxeshanye kwicala eliphezulu nelisezantsi

Izinto ekufuneka ziqwalaselwe xa kuPhathwa kweCandelo:

• Uhlobo lwesondlo: I-Reel, itreyi, intonga
• Ukuhlolwa kombono wokujikeleza nokulungelelanisa
• Ulawulo lokuphakama kunye nokulingana
• Ukhuseleko lwe-electrostatic ngexesha lokuthatha

Oomatshini abanjengoYamaha, iPanasonic, okanye iJuki banokufikelela kwisantya sokubekwa esingaphezulu kwe-80,000 CPH ngokuchaneka okungcono kune-±30 microns.

Inyathelo lesi-5: Ukunyibilika kwakhona kweSoldering

Iibhodi ngoku zingena kwi-oven ephinda igcwale amanzi, eneendawo ezilawulwa bubushushu ezifikelela kwi-10. Indawo nganye isebenza ekuziseni ibhodi kwinqanaba lokunyibilika kwe-solder kancinci kancinci, ize iphole ngaphandle kokufaka uxinzelelo kubushushu.

• Indawo yokuFudumeza: 80–150°C
• Indawo yokuNcangcazela: 150–180°C ukuze kusebenze i-flux
• Indawo ePhakamileyo yokuFudumeza kwakhona: 230–250°C (kuxhomekeke kwi-solder alloy)
• Indawo Yokupholisa: Ukwehla ngokukhawuleza ukuya ngaphantsi kwe-180°C ukuze kwakheke amalungu azinzileyo

Indibano nganye ye-PCB kufuneka ihlolwe ngobushushu ukuze ilungelelaniswe negophe ngokusekelwe kwingqokelela yezinto, uxinano lwamacandelo, kunye nokufunxwa kobushushu be-substrate.

Inyathelo lesi-6: Uhlolo lwe-Optical oluzenzekelayo (i-AOI)

Emva kokuphinda kusetyenziswe, oomatshini be-AOI bathelekisa umfanekiso webhodi efakwe i-solder ngexesha langempela kunye nesalathiso segolide.

• I-Polarity kunye nolwalathiso
• Ubukho kunye nokungabikho
• Iifillets ze-lead solder
• Iisekethe ezimfutshane, iileyiti eziphakanyisiweyo, kunye namalungu abandayo

Ii-AOI zanamhlanje zisebenzisa iikhamera ezinee-engile ezininzi, imodeli ye-3D, kunye nokufunda koomatshini ukuphucula amazinga okubhaqwa, ingakumbi kwiindlela zokubeka izinto ezinoxinano olukhulu.

Inyathelo lesi-7: Ukuhlolwa kwe-X-Ray kwiipakeji ezintsonkothileyo

Izinto ezifana nee-BGA, ii-LGA, kunye nee-QFN zineendawo zokudibanisa ezifihliweyo phantsi kwephakheji. Ukuhlolwa kwe-X-ray kwenza:

• Ukuqinisekiswa kokumanzisa ibhola yesolder
• Ukufunyanwa kwezinto ezingenanto kwii-power kunye nee-ground pads
• Uhlalutyo lokugubungela iiphedi zobushushu
• Ibhulorho kunye nokuchonga okufutshane

I-3D CT scan iyafumaneka ukuze kuhlalutywe unobangela weengcambu kunye nophando lokungaphumeleli.

Inyathelo lesi-8: Ukuhlolwa ngesandla kunye nokuhlaziywa

Kwanakwimigca ezenzekelayo, ukungenelela kwabantu kuyadingeka ukuze:

• Ukuhlolwa okubonakalayo phantsi kweemakroskopu
• Ukutshixa nge-touch-up
• Ukutshintsha izinto ezibekwe ngamatye okanye ezingalungelelananga kakuhle
• Ukuphinda usebenze i-BGA kusetyenziswa izikhululo zokuhlaziya umoya oshushu

Ukuphinda ubhale kufuneka kulandele imigangatho ye-IPC-7711/21 kwaye kungeniswe kwinkqubo yokulandelela.

Inyathelo 9: Uvavanyo oluqhutywa ngaphakathi kwiSekethe (ICT) kunye novavanyo olusebenzayo (FCT)

Uvavanyo luqinisekisa ukusebenza kakuhle kwemveliso kunye nokuthembeka kwayo ngaphambi kokuba ifike.

Iimpawu ze-ICT:

• Ilinganisa ukumelana, amandla, i-voltage
• Ifumanisa izinto ezivulekileyo, ezimfutshane, ezingekhoyo, okanye ezingalunganga
• Isekelwe kwizixhobo, kusetyenziswa uqhagamshelwano lwezinzipho ebhedini

Iimpawu zeFCT:

• Ilinganisa indlela esebenza ngayo imveliso yehlabathi lokwenyani
• Inxibelelana nabalawuli abancinci okanye izinzwa
• Ingabandakanya uvavanyo lwe-UART, i-I2C, i-SPI, okanye i-CAN interface

Inyathelo le-10: Ukudibanisa kokugqibela, ukulebhelisha, kunye nokupakishwa

Nje ukuba uvavanyo lombane luphumelele, ibhodi iyaqhubeka namanyathelo okugqibela:

• Ukufakelwa kwesixhumi kunye nokuhlanganiswa kwentambo
• Ukufakelwa kwe-enclosure okanye i-conformal coating
• Ukucoca nge-ultrasonic okanye nge-solvent (akukho mfuneko yokuyicoca)
• Ukumakisha nge-laser okanye ukulebhelisha ngebhakhowudi
• Ukupakisha okuchasene nokungashukumiyo kunye nokubhala iilebheli ezenziwe ngokwezifiso

Ababoneleli be-EMS abaphambili banikezela ngokulandelelana okugcweleyo nge-lot nganye, ngenombolo ye-serial, okanye ngeyunithi nganye, kuxhomekeke kwimigangatho yoshishino.

I-SMT Assembly yiBhulorho ukusuka kuYilo ukuya ekusebenzeni

Ukuhlanganiswa kwe-SMT yinkqubo ephucukileyo efuna ulawulo oluchanekileyo, ukujongwa rhoqo, kunye nobuchule obuhambelanayo. Inqanaba ngalinye—ukususela ekufakweni kwepeyinti ukuya ekuhlolweni nasekupakishweni kokugqibela—kufuneka lilungiswe ukuqinisekisa ukuthembeka nokusebenza.

KwiRich Full Joy, sixhasa ii-PCB ezisebenza rhoqo, ezinesantya esiphezulu, ezinemigangatho emininzi, kunye nezibalulekileyo ngeenjongo ezahlukeneyo:

• Izixhobo ze-SMT eziphucukileyo kunye neprofayili yokuhlaziya kwakhona
• Amava emodyuli ye-BGA, QFN, kunye ne-RF
• Amandla e-X-Ray, AOI, SPI, kunye ne-ICT/FCT angaphakathi endlwini
• Amaxesha amafutshane okukhokela kunye neeprototypes ezinomthamo ophantsi
• Ubudlelwane bexesha elide kwimizi-mveliso yeenqwelo-moya, yonxibelelwano, yezonyango, neyeemoto

Ngaba ufuna iqabane eliyingcali le-SMT kwimveliso yakho elandelayo? Nxibelelana neqela lethu lobunjineli namhlanje ukuze ufumane uphononongo lwasimahla lwe-DFM kunye nesicatshulwa esikhawulezayo.