Ua wehewehe piha ʻia ke kaʻina hana ʻākoakoa SMT: Mai ka papa ʻōlohelohe a i ka huahana hope loa

Hoʻolauna: Ke Koʻikoʻi o ka Hoʻomaopopo ʻana i ke Kaʻina Hana ʻAha SMT

ʻO ka ʻenehana Surface Mount (SMT) ke kumu o ka hana uila hou. Hiki iā ia ke kau wikiwiki a pololei hoʻi i nā ʻāpana ma luna o ka ʻili o nā papa kaapuni i paʻi ʻia (PCB). I ka lilo ʻana o nā mea hana i ʻoi aku ka liʻiliʻi, ikaika, a hoʻohui ʻia me ka hana, pono nā kaʻina hana SMT e hōʻoia i ka hilinaʻi paʻa, nā hoʻomanawanui paʻa, a me ke ʻano maikaʻi o ke kūʻai ʻana.

Inā he ʻenekinia hoʻolālā ʻoe e hoʻomākaukau ana no ka hana nui ʻana, he loea kūʻai e loiloi ana i nā mea kūʻai aku EMS, a i ʻole he ʻenekinia maikaʻi e nānā ana i nā hua, he mea nui ka hoʻomaopopo ʻana i ke kaʻina hana SMT piha.

Hāʻawi kēia ʻatikala i kahi alakaʻi piha o ka laina hana SMT, mai ka manawa e komo ai kahi papa ʻōlohelohe i ka laina a hiki i kahi i lilo ai i PCBA i hoʻāʻo piha ʻia, mākaukau no ka hāʻawi ʻana.

KaʻAnuʻu Hana 1: Ka Loaʻa ʻana o ka PCB, ka Hoʻomoʻa ʻana, a me ka Hoʻomākaukau ʻana

Ma mua o ke komo ʻana i ka laina SMT, pono e nānā ʻia nā PCB ʻōlohelohe ma ke ʻano maka a me ke ana, ʻoiai no nā papa alapine kiʻekiʻe, multilayer, a i ʻole HDI. ʻO nā palena koʻikoʻi e pili ana i ka warpage, ka oxidation ma nā ʻili pad, a me ka mānoanoa o ka papa.

Ka ʻike ʻana i ka makū: He mea maʻalahi i ka makū nā laminates Tg kiʻekiʻe a i ʻole PTFE. ʻO ka hoʻomoʻa mua ʻana ma 105–125°C no 4–12 mau hola (e like me nā alakaʻi IPC) e pale aku i ka delamination, nā microcracks, a me nā voids i ka wā o ka reflow.

KaʻAnuʻu Hana 2: Paʻi ʻana i ka Solder Paste

ʻO ka hoʻopili solder, i hana pinepine ʻia me 90% metala hui a me 10% flux, ua paʻi ʻia ma luna o nā pads PCB i hōʻike ʻia me ka hoʻohana ʻana i kahi stencil kila kila pololei.

• Mānoanoa o ka Stencil: 100–150 microns ma muli o ke kiki ʻana o ka ʻāpana
• Hoʻolālā Stencil: Ka nui o ka puka, nā lakio hōʻemi pad, nā iho iho
• Nā Palena Paʻi: Ka wikiwiki o ka squeegee, ke kaomi, ka wikiwiki hoʻokaʻawale
• ʻAno Hoʻopili: ʻAno 3 no ke kūlana maʻamau, ʻAno 4 a i ʻole 5 no ka pitch maikaʻi a i ʻole micro-BGA

He mea nui ka paʻi pololei ʻana o ka hoʻopili solder no ka hoʻokō ʻana i ka pulu like ʻana a pale i nā hemahema e like me ke alahaka, ka solder lawa ʻole, a me ka tombstoning.

KaʻAnuʻu Hana 3: Nānā ʻana i ka Solder Paste (SPI)

Hoʻohana nā ʻōnaehana SPI aunoa i ka triangulation laser 2D a i ʻole 3D e ana:

• Ke kiʻekiʻe o ka hoʻopili ʻana
• Ka kūlike o ka leo
• Hoʻonohonoho ʻana o ka offset a me ka stencil
• Ka ʻike ʻana i ke alahaka a me ka helu ʻana o ka hakahaka

He mea nui nā SPI no ka kaohi ʻana i ke kaʻina hana mua, e hōʻemi ana i ka laha ʻana o nā hemahema i ka wā e hiki mai ana.

KaʻAnuʻu Hana 4: Koho a me ka Hoʻonoho ʻana i ka Wā Kiʻekiʻe

Hoʻopaʻa ka ʻōnaehana pick-and-place i nā ʻāpana SMT ma luna o nā pads i uhi ʻia me ka solder paste. Hiki i nā ʻōnaehana hou ke lawelawe i:

• Nā ʻāpana passive liʻiliʻi e like me 01005
• Nā IC me nā pūʻolo QFN, LGA, a me BGA pitch maikaʻi
• Nā ʻāpana ʻano ʻē me nā algorithms ʻike maʻamau
• Ke kau ʻana o ka ʻaoʻao luna a me lalo i ka manawa like

Nā Manaʻo no ka lawelawe ʻana i nā ʻāpana:

• ʻAno hānai: Reel, tray, stick
• Nānā ʻike no ka hoʻohuli a me ke kaulike
• Ka mana kiʻekiʻe a me ka coplanarity
• Ka palekana electrostatic i ka wā e hōʻiliʻili ai

Hiki i nā mīkini e like me Yamaha, Panasonic, a i ʻole Juki ke piʻi i nā wikiwiki hoʻokomo ma mua o 80,000 CPH me ka pololei ʻoi aku ka maikaʻi ma mua o ±30 microns.

KaʻAnuʻu Hana 5: Hoʻopili Hou

I kēia manawa, komo nā papa i ka umu reflow, nona nā ʻāpana i kāohi ʻia a hiki i 10. Lawelawe kēlā me kēia ʻāpana i ka lawe mālie ʻana i ka papa i kahi pae hoʻoheheʻe solder, a laila e hoʻomaʻalili iā ia me ka ʻole o ka hoʻoulu ʻana i ke kaumaha wela.

• ʻĀpana Hoʻomehana Mua: 80–150°C
• ʻĀpana Soak: 150–180°C no ka hoʻāla ʻana o ka flux
• ʻĀpana Kiʻekiʻe Reflow: 230–250°C (ma muli o ke kola solder)
• ʻĀpana Hoʻoluʻolu: Iho wikiwiki i lalo o 180°C e hana i nā hui paʻa

Pono kēlā me kēia ʻākoakoa PCB e hana i ka profiling thermal e hoʻopilikino i ke kūlou e pili ana i ka hoʻopaʻa ʻana o nā mea, ka nui o nā ʻāpana, a me ka absorption wela o ka substrate.

KaʻAnuʻu Hana 6: Nānā Optical Automated (AOI)

Ma hope o ka reflow, hoʻohālikelike nā mīkini AOI i ke kiʻi papa soldered manawa maoli me kahi kuhikuhi gula.

• Polarity a me ke kuhikuhi ʻana
• Ke alo a me ka ʻole
• Nā ʻāpana solder kēpau
• Nā kaapuni pōkole, nā alakaʻi i hāpai ʻia, a me nā hui anu

Hoʻohana nā AOI hou i nā kāmela multi-angle, ke kumu hoʻohālike 3D, a me ke aʻo mīkini e hoʻomaikaʻi i nā helu ʻike, ʻoi aku hoʻi no nā hoʻonohonoho kiʻekiʻe.

KaʻAnuʻu Hana 7: Nānā X-Ray no nā Pūʻolo Paʻakikī

Loaʻa i nā ʻāpana e like me BGAs, LGAs, a me QFNs nā hui solder huna ma lalo o ka pūʻolo. Hiki i ka nānā ʻana o X-ray ke:

• Ka hōʻoia ʻana o ka pulu ʻana o ka pōpō solder
• Ka ʻike ʻana i ka hakahaka ma nā pads mana a me ka honua
• Ka nānā ʻana i ka uhi ʻana o ka pad thermal
• Alahaka a me ka ʻike pōkole

Loaʻa ka 3D CT scan no ka nānā ʻana i ke kumu kumu holomua a me ka noiʻi ʻana i ka hāʻule ʻana.

KaʻAnuʻu Hana 8: Nānā Lima a me ka Hana Hou

ʻOiai ma nā laina hana ponoʻī, pono ke komo ʻana o ke kanaka no:

• Nānā maka ma lalo o nā microscope
• Hoʻopili ʻana i ka hoʻopili ʻana
• Ke hoʻololi nei i nā ʻāpana i hoʻopaʻa ʻia i ka hale kupapaʻu a i ʻole nā ​​​​​​mea i hoʻonohonoho pono ʻ
• Ke hana hou nei i ka BGA me ka hoʻohana ʻana i nā kikowaena hana hou ea wela

Pono ka hana hou e hahai i nā kūlana IPC-7711/21 a hoʻopaʻa ʻia i loko o ka ʻōnaehana traceability.

KaʻAnuʻu Hana 9: Hoʻāʻo Kaapuni (ICT) a me ka Hoʻāʻo Hana (FCT)

Hōʻoia ka hoʻāʻo ʻana i ka hana a me ka hilinaʻi o ka huahana ma mua o ka lawe ʻana.

Nā Hiʻohiʻona ICT:

• Ana i ke kū'ē, ka capacitance, ka voltage
• ʻIke i nā ʻāpana hāmama, pōkole, nalowale, a hewa paha
• Hoʻokumu ʻia ma ke ʻano he mea paʻa, me ka hoʻohana ʻana i ka pilina moe-o-nā kui

Nā Hiʻohiʻona FCT:

• Hoʻohālike i ke ʻano o ka huahana o ke ao maoli
• Kamaʻilio me nā microcontrollers a i ʻole nā ​​​​mea ʻike
• Hiki ke hoʻokomo i ka hoʻāʻo ʻana o ka UART, I2C, SPI, a i ʻole CAN interface

Ka Papa Hana 10: ʻAhaʻōlelo Hope Loa, Lepili, a me ka Hoʻopili ʻana

Ke hala nā hoʻokolohua uila, hoʻomau ka papa i nā hana hope loa:

• Ke kau ʻana o ka mea hoʻohui a me ke kaula hoʻopaʻa
• Ke kau ʻana o ka pā a i ʻole ka uhi conformal
• Hoʻomaʻemaʻe ultrasonic a i ʻole solvent (koho ʻaʻole hoʻomaʻemaʻe)
• Ka māka laser a i ʻole ka lepili barcode
• ʻO ka hoʻopili anti-static a me ka lepili i hoʻopilikino ʻia

Hāʻawi nā mea lawelawe EMS holomua i ka hiki ke hahai piha ʻia no kēlā me kēia hailona, ​​​​no kēlā me kēia helu serial, a i ʻole no kēlā me kēia ʻāpana, ma muli o nā kūlana ʻoihana.

ʻO ka ʻAha SMT ke Alahaka mai ka Hoʻolālā a i ka Hana

He hana paʻakikī ka ʻākoakoa ʻana o SMT e pono ai ka kaohi pololei, ka nānā mau ʻana, a me ka ʻike loea ma waena o nā hana. Pono e hoʻomaikaʻi ʻia kēlā me kēia pae—mai ka waiho ʻana o ka hoʻopili a hiki i ka nānā ʻana a me ka hoʻopili hope loa—e hōʻoia i ka hilinaʻi a me ka hana.

Ma Rich Full Joy, kākoʻo mākou i nā PCB alapine kiʻekiʻe, wikiwiki, multilayer, a me nā mea koʻikoʻi me:

• Nā lako SMT holomua a me ka profiling reflow
• ʻIke modula BGA, QFN, a me RF
• Nā hiki ke hana ma ka hale me X-Ray, AOI, SPI, a me ICT/FCT
• Nā manawa alakaʻi pōkole a me nā prototypes haʻahaʻa haʻahaʻa
• Nā pilina lōʻihi ma waena o nā ʻoihana aerospace, telecom, lapaʻau, a me nā ʻoihana kaʻa

Ke ʻimi nei i kahi hoa SMT ʻoihana no kāu huahana aʻe? E kāhea aku i kā mākou hui ʻenekinia i kēia lā no kahi loiloi DFM manuahi a me kahi ʻōlelo wikiwiki.