Sida Loo Aqoonsado PCB Tayada Sare Leh: Tilmaamaha Kormeerka Oo Dhamaystiran

I. Kormeerka Wajiga Naqshadeynta (DFM/DFA)

Ujeeddada Muhiimka ah: Aqoonso cilladaha naqshadeynta kahor si loo yareeyo khataraha dib-u-habaynta wax soo saarka.

1. Xaqiijinta Naqshadeynta Waxqabadka Korontada

• Iswaafajinta Impedance: Caqabadda astaamaha ah ee khadadka gudbinta calaamadaha xawaaraha sare leh (tusaale ahaan, USB, HDMI, khadadka RF) waa inay buuxiyaan shuruudaha naqshadeynta (tusaale ahaan, 50Ω oo hal-dhammaad ah, kala duwanaanshaha 90Ω). Qalabka jilitaanka SI (tusaale ahaan, HyperLynx) waxaa loo isticmaalaa in laga fogaado milicsiga calaamadaha iyo hoos u dhaca.
• Daacadnimada Calaamadda: Hubi isku-xidhka hadalka, dib-u-dhaca, iyo hufnaanta awoodda (PI) si loo hubiyo in calaamadaha soo noqnoqda ee sare aysan faragelin lahayn. Ilaali isku-xidhka awoodda/dhulka oo wanaagsan si loo yareeyo shucaaca EMI.
• Naqshadaynta Lakabyada: Xaqiiji dhumucda lakabka dahaarka, tirada lakabka naxaasta ah, iyo kala sarreynta si loo dheellitiro kala-baxa kulaylka iyo xakamaynta iska caabbinta, iyadoo la buuxinayo shuruudaha EMC.

2. Hubinta Xeerka Wax-soo-saarka (DFM)

• Cabbirrada Raad-raaca: Ballaca/fogaanta ugu yar ee raadadka ≥3mil (1mil oo loogu talagalay HDI), buundada maaskarada alxanka ≥4mil.
• Dhexroorka iyo Suufka Godka: Waxaa lagu taliyay iyada oo loo marayo 0.3mm, suufka 0.6mm si looga hortago leexashada qodista ama kala-goynta suufka.
• Naqshadda Dhumucda Naxaasta: Raad-raacyada korontada waxay isticmaalaan 1oz–2oz (35–70μm) si ay u daboolaan culayska hadda jira iyo ka hortagga kulaylka badan.

3. La qabsiga Qaab-dhismeedka Farsamada

• Dulmar, godad, iyo godadku waxay u dhigmaan dulqaadka ku-xidhka (±0.1mm).
• Qaybaha xasaasiga u ah kulaylka oo ka fog qaybaha dhaliya kulaylka oo leh marinnada hawo-qaadashada.
• Calaamadaha polarity-ga waa inay cad yihiin capacitors-ka iyo IC-yada.

II. La socodka Tayada Wax Soo Saarka Gudihiisa

Ujeeddada Muhiimka ah: Xakamaynta waqtiga-dhabta ah ee leexashada habka si loo hubiyo u hoggaansanaanta habka.

1. Kormeerka Substrate-ka iyo Agabka

• Hubi nooca agabka (FR-4, Rogers, PI), dhumucdiisuna (±5%), iyo qallafsanaanta naxaasta.
• Dusha sare waa inay ka xorowdo xoqan, oksaydh la'aan, oo aan lahayn dildilaac.

2. Qoditaanka iyo Habka Vias

• Saxnaanta Dhexroorka Godka: Dulqaad ±5%, derbiyada godadka nadiif ah, burrs ama smear la'aan.
• Bir-dhalinta Godka: Naxaas aan koronto lahayn ≥0.5μm, naxaas dahaaran ≥20μm (IPC-6012 Fasalka 3).

3. Sawir-qaadista iyo Qoorta

• Kala-duwanaanshaha diiwaangelinta ≤5mil, isku-mid ah ballaca raadadka, naxaasta haraaga ah ≤1%.
• Shaashadda silkscreen waa cad, waxay leedahay ≤10mil, waxay leedahay dhejis wanaagsan.

4. Kormeerka Dhammaystirka Dusha Sare

• KU RAACSANOW: Nikkel 3–5μm, dahab 0.05–0.1μm, ma jiro suuf madow.
• Waaxda Dab-damiska ee Iskaa wax u qabso ah: Dahaarka 0.2–0.5μm, wasakhowga ion-ka ≤1.56μg/cm².
• HASL: Dhumucdiisuna waa ≥2.5μm, dusha siman, ≥95% qoyaan alxan ah.

5. Xakamaynta Dahaarka iyo Xakamaynta Impedance

• leexashada diiwaangelinta ≤10mil, xitaa dhumucda dielectric, xumbo ama kala-goyn la'aan.
• Caqabadda calaamadda ee muhiimka ah ee ±10%, oo ay xaqiijisay TDR.

III. Tijaabada Shaqada iyo Kalsoonida ee Badeecada Dhammaystiran

Ujeeddada Muhiimka ah: Hubi waxqabadka korontada PCB iyo xasilloonida muddada dheer.

1. Tijaabada Waxqabadka Korontada

• Joogtaynta ≤5mΩ, dahaarka ≥10⁹Ω @500V DC.
• Lumista gelinta tijaabada (≤3dB @5GHz) iyo soo celinta khasaaraha naqshadaha xawaaraha sare leh.

2. Tijaabinta Kalsoonida

• Shoogga Kulaylka: 260°C, 10-meeyada oo biyo lagu dhex geliyo, ma jiraan wax xoqid ama nabarro ah.
• Dielectric u adkaysta: 500V DC muddo 1 daqiiqo ah, ma jiraan wax burbur ah.
• Layli karinta: 245°C muddo 3–5 ilbiriqsi ah, ≥95% qoyn.

3. Kormeerka Aragga iyo Cabbirka

• AOI loogu talagalay wareegyada gaagaaban/furan, maaskaro alxan, oksaydheynta.
• Dulmar ±0.1mm, god ±0.05mm, dhumucda dahaarka ≤±10%.

4. Tijaabinta Qaab-dhismeedka Sare

• Dhumucda dahaadhka: XRF si loo hubiyo lakabka naxaasta iyo dahabka/nickel.
• Qaybta isdhaafka ah: Hubinta indhaha ee dhumucda lakabka, dhejiska, iyo biraha derbiga godka.

IV. Baaritaanno Dheeraad ah oo Xaalad Gaar ah

1. PCB-yada Soo Noqnoqda/Xawaaraha Sare

• Falanqeeyaha shabakadda ee S-parameters: luminta calaamadda ≤3dB @≥5GHz, qaladka impedance ≤±8%.

2. PCB-yada dabacsan/adag ee dabacsan

• Tijaabada Laabista: 100,000 wareeg @R≤2mm, ma jiraan wax dildilaac ah.
• Xoogga Farsamada: Meelaha adag ma jiraan wax dildilaac ah.

3. PCB-yada Darajada Baabuurta/Caafimaadka/Hawada Sare

• La kulan IPC-A-600 Fasalka 3aad, UL, RoHS/REACH, iska caabbinta ololka V-0.

V. Qalabka Kormeerka iyo Heerarka Warshadaha