Indlela yokuchonga i-PCB esemgangathweni ophezulu: Isikhokelo esipheleleyo sokuhlola

I. Uhlolo lweSigaba soYilo (DFM/DFA)

Injongo Ephambili: Chonga iziphene zoyilo kwangaphambili ukuze unciphise iingozi zokuphinda uvelise.

1. Ukuqinisekiswa koYilo lokuSebenza koMbane

• Ukuthelekiswa kwe-Impedance: Uthintelo olubonakalayo lwemigca yokudlulisa isignali yesantya esiphezulu (umz., i-USB, i-HDMI, imigca ye-RF) kufuneka ihlangabezane neemfuno zoyilo (umz., i-50Ω enesiphelo esinye, i-differential 90Ω). Izixhobo zokulinganisa ze-SI (umz., i-HyperLynx) zisetyenziselwa ukuthintela ukubonakaliswa kwesignali kunye nokuncitshiswa kwayo.
• Ukunyaniseka kweSignali: Jonga ukuba akukho nxibelelwano, ukulibaziseka, kunye nokuthembeka kwamandla (PI) ukuqinisekisa ukuba imiqondiso ye-high-frequency ayinaziphazamiso. Gcina uqhagamshelo olufanelekileyo lwamandla/lwendiza yomhlaba ukuze unciphise imitha ye-EMI.
• Uyilo lwe-Layer Stackup: Qinisekisa ubukhulu bomaleko wokugquma, inani lomaleko wobhedu, kunye nomyalelo wokuqokelelana ukuze kulinganiswe ukusasazwa kobushushu kunye nolawulo lwe-impedance, ukuhlangabezana neemfuno ze-EMC.

2. Ukuhlolwa kweMithetho yokwenziwa (i-DFM)

• Iiparameter zokulandelela: Ububanzi/isithuba esincinci sokulandelela ≥3mil (1mil ye-HDI), ibhulorho yemaski yesolder ≥4mil.
• Ububanzi beHole kunye nePad: Icetyiswa nge-0.3mm, iphedi yi-0.6mm ukuthintela ukuphambuka kokugrumba okanye ukuqhekeka kwephedi.
• Uyilo loBungqingqwa beCopper: Iitrasi zamandla zisebenzisa i-1oz–2oz (35–70μm) ukuhlangabezana nomthwalo wangoku kunye nokuthintela ubushushu obugqithisileyo.

3. Ukulungelelaniswa koLwakhiwo lweMishini

• Umzobo, imingxunya, kunye nezithuba zihambelana nokunyamezelana kwendawo ebiyelweyo (± 0.1mm).
• Izinto ezichaphazela ubushushu zibekwe kwindawo enye ukusuka kwiindawo ezivelisa ubushushu ezineendlela zokungenisa umoya.
• Iimpawu zePolarity mazicace kwii-capacitors kunye nee-IC.

II. Ukubeka iliso kuMgangatho kwiMveliso

Injongo Ephambili: Ulawulo lwexesha langempela lokuphambuka kwenkqubo ukuqinisekisa ukuthotyelwa kwenkqubo.

1. Ukuhlolwa kweSubstrate kunye nezinto

• Jonga uhlobo lwezinto (FR-4, Rogers, PI), ubukhulu (±5%), kunye noburhabaxa bekopolo.
• Umphezulu mawungabi nakrwelo, ungabi na-oxidation, ungasuswa.

2. Inkqubo yokubhola kunye neVias

• Ukuchaneka kobubanzi bemingxunya: Ukunyamezelana ±5%, udonga olucocekileyo lwemingxuma, akukho ziqhuma okanye i-smear.
• Ukwenziwa kwesinyithi kwiHole: Ubhedu olungena-electrom ≥0.5μm, ubhedu olufakwe ipleyiti ≥20μm (IPC-6012 Class 3).

3. Ukufota kunye nokukrola

• Ukuphambuka kobhaliso ≤5mil, ububanzi bomkhondo bufana, ubhedu oluseleyo ≤1%.
• Isikrini sesilika sicacile, sichasene ne-≤10mil, sinamathela kakuhle.

4. Ukuhlolwa koMphezulu wokugqiba

• VUMELANA: I-Nickel 3–5μm, igolide 0.05–0.1μm, akukho pad imnyama.
• ISebe loMlilo lamavolontiya: Ukwaleka 0.2–0.5μm, ungcoliseko lwee-ion ≤1.56μg/cm².
• I-HASL: Ubukhulu obuyi-≥2.5μm, umphezulu ogudileyo, ≥95% ukumanzisa i-solder.

5. Ulawulo lweLamination kunye ne-Impedance

• Ukuphambuka kobhaliso ≤10mil, ubukhulu obulinganayo be-dielectric, akukho maqamza okanye i-delamination.
• Uthintelo olubalulekileyo lwesignali ngaphakathi kwe-±10%, luqinisekiswe yi-TDR.

III. Uvavanyo Lokusebenza Kwemveliso Egqityiweyo Nokuthembeka

Injongo Ephambili: Qinisekisa ukusebenza kombane we-PCB kunye nokuzinza kwexesha elide.

1. Uvavanyo Lokusebenza Kombane

• Ukuqhubekeka ≤5mΩ, ubushushu ≥10⁹Ω @500V DC.
• Vavanya ilahleko yokufaka (≤3dB @5GHz) kunye nelahleko yokubuyisela kwiidizayini zesantya esiphezulu.

2. Uvavanyo lokuthembeka

• Ukothuka kobushushu: 260°C, ukuntywiliselwa ngemizuzwana eli-10, akukho kususwa okanye ukudumba.
• Ukumelana neDielectric: I-500V DC umzuzu omnye, akukho monakalo.
• Ukuthengiseka: 245°C kwimizuzwana emi-3–5, ≥95% yokumanzisa.

3. Uhlolo olubonakalayo nolunemilinganiselo

• I-AOI yeesekethe ezimfutshane/ezivulekileyo, imaski yesolder, i-oxidation.
• Umzobo ± 0.1mm, umngxuma ± 0.05mm, ubukhulu be-lamination ≤ ± 10%.

4. Uvavanyo oluPhambili lweSakhiwo

• Ubukhulu bokugquma: I-XRF yokujonga iileya zekopolo kunye negolide/i-nickel.
• Indawo yokudlula: Ukujonga okubonakalayo ukuba kukho ubukhulu beleya, ukunamathela, kunye nokwakheka kwesinyithi eludongeni olunomngxuma.

IV. Imeko Ekhethekileyo Uhlolo Olongezelelweyo

1. Ii-PCB eziQhelekileyo/eziKhawulezayo

• Isihlalutyi senethiwekhi seeparameter ze-S: ukulahleka kwesiginali ≤3dB @≥5GHz, impazamo ye-impedance ≤±8%.

2. Ii-PCB eziguquguqukayo/eziqinileyo neziguquguqukayo

• Uvavanyo lokugoba: Iibhayisekile ezili-100,000 @R≤2mm, akukho ziqhekeko.
• Amandla Oomatshini: Akukho kwahlukana kwiindawo eziqinileyo.

3. Ii-PCB zeMoto/zezonyango/zeAerospace

• Dibana ne-IPC-A-600 Class 3, UL, RoHS/REACH, V-0 flame resistance.

V. Izixhobo zokuhlola kunye neMigangatho yoShishino