Yadda Ake Gano PCB Mai Inganci: Cikakken Jagorar Dubawa

I. Duba Tsarin Tsarin (DFM/DFA)

Babban Manufar: Gano kurakuran ƙira a gaba don rage haɗarin sake fasalin samarwa.

1. Tabbatar da Tsarin Aikin Lantarki

• Daidaitawar Impedance: Tsarin hana siginar da ke da saurin gaske (misali, USB, HDMI, layukan RF) dole ne su cika buƙatun ƙira (misali, 50Ω mai iyaka ɗaya, bambancin 90Ω). Ana amfani da kayan aikin kwaikwayo na SI (misali, HyperLynx) don guje wa nuna sigina da raguwa.
• Ingancin Sigina: Duba don tattaunawa tsakanin mutane, jinkiri, da kuma ingancin wutar lantarki (PI) don tabbatar da cewa siginar mita mai yawa ba ta da tsangwama. A kula da haɗin wutar lantarki/ƙasa mai kyau don rage hasken EMI.
• Tsarin Tarin Layer: Tabbatar da kauri na Layer na Rufewa, adadin Layer na Tagulla, da kuma tsarin tattarawa don daidaita watsawar zafi da sarrafa juriya, tare da biyan buƙatun EMC.

2. Duba Dokokin Masana'antu (DFM)

• Sigogi na Bin-sawu: Mafi ƙarancin faɗin/tazara tsakanin ramuka ≥mil3 (mil 1 don HDI), gadar abin rufe fuska ta solder ≥mil4.
• Diamita da Kushin Rami: An ba da shawarar ta hanyar 0.3mm, kushin 0.6mm don hana karkacewar haƙa rami ko rabuwar kushin.
• Tsarin Kauri na Tagulla: Layukan wutar lantarki suna amfani da 1oz–2oz (35–70μm) don biyan buƙatun wutar lantarki da kuma hana zafi fiye da kima.

3. Daidaita Tsarin Inji

• Tsarin zane, ramuka, da ramukan sun dace da juriyar rufewa (±0.1mm).
• Abubuwan da ke da saurin kamuwa da zafi sun taru daga sassan da ke samar da zafi tare da hanyoyin samun iska.
• Dole ne a bayyana alamun polarity ga capacitors da ICs.

II. Kula da Ingancin Ayyuka a Cikin Samfura

Babban Manufar: Kulawa ta ainihin lokaci na karkacewar tsari don tabbatar da bin ƙa'idodin tsari.

1. Duba ƙasa da kayan aiki

• Duba nau'in kayan (FR-4, Rogers, PI), kauri (±5%), da kuma kauri na jan ƙarfe.
• Ya kamata saman ya zama babu karce, babu oxidation, babu delamination.

2. Hakowa da Tsarin Vias

• Daidaiton diamita na rami: Juriya ±5%, bangon rami mai tsabta, babu burrs ko smear.
• Ramin Ƙarfe: Tagulla mara amfani da wutar lantarki ≥0.5μm, jan ƙarfe mai rufi ≥20μm (IPC-6012 Class 3).

3. Hoto da kuma zane

• Bambancin rajista ≤mil5, faɗin alama iri ɗaya, ragowar jan ƙarfe ≤1%.
• Allon siliki mai tsabta, an daidaita shi ≤mil 10, manne mai kyau.

4. Duba Kammalawar Sama

• YARDA: Nickel 3–5μm, zinari 0.05–0.1μm, babu kushin baƙi.
• Sashen Kashe Gobara na Masu Sa-kai: Rufi 0.2–0.5μm, gurɓataccen ion ≤1.56μg/cm².
• HASL: Kauri ≥2.5μm, santsi a saman, ≥95% jika solder.

5. Lamination da Control of impedance

• Bambancin rajista ≤mil 10, har ma da kauri na dielectric, babu kumfa ko ɓarna.
• Muhimmin tasirin sigina a cikin ±10%, wanda TDR ya tabbatar.

III. Gwajin Aiki da Inganci na Kammala Samfurin

Babban Manufar: Tabbatar da aikin wutar lantarki na PCB da kwanciyar hankali na dogon lokaci.

1. Gwajin Aikin Lantarki

• Ci gaba ≤5mΩ, rufin ≥10⁹Ω @500V DC.
• Asarar shigar da gwaji (≤3dB @5GHz) da kuma asarar dawowa don ƙirar masu sauri.

2. Gwajin Inganci

• Girgizar Zafi: 260°C, nutsewa cikin zafin jiki na 10s, babu ɓarna ko ƙuraje.
• Tsayayya ga Dielectric: 500V DC na minti 1, babu fashewa.
• Ƙarfin daidaitawa: 245°C na tsawon sa'o'i 3-5, ≥95% jika.

3. Dubawa da Dubawa a Gani

• AOI don gajerun da'irori/buɗewa, abin rufe fuska na solder, da kuma iskar shaka.
• Bayani ±0.1mm, rami ±0.05mm, kauri na lamination ≤±10%.

4. Gwajin Tsarin Gine-gine Mai Ci Gaba

• Kauri na Faranti: XRF don duba layukan tagulla da zinare/nickel.
• Sashe na giciye: Duban gani don kauri na yadudduka, mannewa, da kuma ƙarfe bango na rami.

IV. Ƙarin Dubawa na Musamman

1. PCBs Masu Yawan Mita/Masu Sauri

• Mai nazarin hanyar sadarwa don sigogin S: asarar sigina ≤3dB @≥5GHz, kuskuren impedance ≤±8%.

2. PCBs masu sassauƙa/tsauri

• Gwajin Lanƙwasawa: Kekuna 100,000 @R≤2mm, babu tsagewa.
• Ƙarfin Inji: Babu rabuwar ƙasa a wuraren da suka yi tauri.

3. PCBs na Motoci/Likita/Aerospace-Grade

• Haɗu da IPC-A-600 Class 3, UL, RoHS/REACH, juriyar harshen wuta V-0.

V. Kayan aikin dubawa da ƙa'idodin masana'antu