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Yintoni eyenzeka kwi-PCB?
2024-07-25
Yintoni eyenzeka kwi-PCB?
IiVias zezona mingxunya zixhaphakileyo kwimveliso yePCB. Zidibanisa iileya ezahlukeneyo zenethiwekhi efanayo kodwa azisetyenziswa kwiindawo zokudibanisa. IiVias zinokwahlulwa zibe ziintlobo ezintathu: ngokusebenzisa imingxuma, ii-vias ezingaboniyo, kunye nee-vias ezingcwatyiweyo. Ulwazi oluneenkcukacha zezi vias zintathu lulandelayo:
Indima yee-Blind Vias kuYilo lwePCB kunye noMveliso
Ii-Vias ezingaboniyo
Ii-blind vias ziimingxuma ezincinci ezidibanisa umaleko omnye we-PCB kwenye ngaphandle kokudlula kwibhodi yonke. Oku kuvumela abayili ukuba benze ii-PCB ezintsonkothileyo nezixineneyo ngokufanelekileyo nangokuthembekileyo kunangeendlela eziqhelekileyo. Ngokusebenzisa ii-blind vias, abayili banokwakha amanqanaba amaninzi kwibhodi enye, benciphisa iindleko zecandelo kwaye bakhawulezise amaxesha okuvelisa. Nangona kunjalo, ubunzulu be-blind via budla ngokungadluli umlinganiselo othile xa kuthelekiswa nokuvulwa kwayo. Ke ngoko, ulawulo oluchanekileyo lobunzulu bokugrumba (i-Z-axis) lubalulekile. Ulawulo olunganelanga lunokubangela ubunzima ngexesha lenkqubo ye-electroplating.
Enye indlela yokwenza ii-vias ezingaboniyo ibandakanya ukugqobhoza imingxunya efunekayo kumaleko ngamnye wesekethe ngaphambi kokuba uzigqume kunye. Umzekelo, ukuba ufuna i-vias engaboniyo ukusuka kwi-L1 ukuya kwi-L4, ungaqala ngokugqobhoza imingxunya kwi-L1 nakwi-L2, nakwi-L3 nakwi-L4, uze ugqume zonke iileya ezine kunye. Le ndlela ifuna izixhobo zokubeka kunye nokulungelelanisa ezichanekileyo. Zombini ezi ndlela zigxininisa ukubaluleka kokuchaneka kwinkqubo yokuvelisa ukuqinisekisa ukusebenza kunye nokuthembeka kwe-PCB.
Ii-Vias ezingcwatywe
Zithini ii-vias ezingcwatyiweyo?
Yintoni umahluko phakathi kwe-micro via kunye ne-buried via?
Ii-vias ezingcwatywe zizinto ezibalulekileyo kuyilo lwe-PCB, zidibanisa iisekethe zangaphakathi ngaphandle kokufikelela kwiileya zangaphandle, nto leyo ezenza zingabonakali ngaphandle. Ezi vias zibalulekile ekuqhagamshelweni kwesignali yangaphakathi. Iingcali kushishino lwe-PCB zihlala ziphawula, "Ii-vias ezingcwatywe zinciphisa amathuba okuphazamiseka kwesignali, zigcina ukuqhubeka kwe-impedance yempawu yomgca wothumelo, kwaye zigcina indawo yocingo." Oku kuzenza zilungele ii-PCB ezinoxinano oluphezulu kunye nesantya esiphezulu.
Ekubeni ii-vias ezingcwatyiweyo zingenakugrunjwa emva kokugrunjwa, ukugrunjwa kufuneka kwenziwe kwiileya zesekethe nganye ngaphambi kokugrunjwa. Le nkqubo ithatha ixesha elininzi xa ithelekiswa nee-through-holes kunye nee-blind vias, nto leyo ekhokelela kwiindleko eziphezulu. Nangona kunjalo, ii-vias ezingcwatyiweyo zisetyenziswa kakhulu kwii-PCB ezinoxinano olukhulu ukuze kwandiswe indawo enokusetyenziselwa ezinye iileya zesekethe, ngaloo ndlela kuphucula ukusebenza kunye nokuthembeka kwe-PCB iyonke.
Ngemingxunya
Imingxunya edlulayo isetyenziselwa ukudibanisa zonke iileya kumaleya aphezulu nasezantsi. Ukuplaga ubhedu ngaphakathi kwimingxuma kungasetyenziswa ekudibaneni kwangaphakathi okanye njengomngxunya wokubeka izinto. Injongo yemingxuma edlulayo kukuvumela ukuba iingcingo zombane okanye ezinye izinto zidlule kumphezulu. Imingxunya ibonelela ngendlela yokufaka nokukhusela uqhagamshelo lombane kwiibhodi zesekethe eziprintiweyo, iingcingo okanye izinto ezifanayo ezifuna indawo yokuncamathisela. Zikwasetyenziswa njengee-ankile kunye neziqhoboshi kwiimveliso zoshishino ezifana nefenitshala, iishelufu, kunye nezixhobo zonyango. Ukongeza, imingxunya edlulayo inokubonelela ngokufikelela kwi-pass-thread kwiintonga ezinemisonto kumatshini okanye kwizinto zokwakha. Ngaphezu koko, inkqubo yokuxhuma imingxuma iyafuneka. I-Viasion ishwankathela ezi mfuno zilandelayo zokuxhuma imingxuma.
*Coca imingxunya usebenzisa indlela yokucoca ngeplasma.
*Qinisekisa ukuba umngxuma odlulayo awunazo iingceba, uthuli kunye nokungcola.
*Linganisa imingxunya edlulayo ukuqinisekisa ukuba iyahambelana nesixhobo sokufaka iplagi
*Khetha isixhobo sokuzalisa esifanelekileyo sokugcwalisa imingxunya: i-silicone caulk, i-epoxy putty, i-expanding foam okanye i-polyurethane glue.
*Faka uze ucinezele isixhobo sokufaka kwingxobo edlulayo.
*Yibambe ngokukhuselekileyo ubuncinane imizuzu eli-10 ngaphambi kokuba uyikhulule.
*Susa naziphi na izinto zokugcwalisa ezingafunekiyo ezijikeleze imingxunya emva kokuba ugqibile.
*Jonga imingxunya rhoqo ukuqinisekisa ukuba ayinazo iimvula okanye umonakalo.
*Phinda le nkqubo njengoko kufuneka ukuze udlule kwiingxunya ezinobukhulu obahlukeneyo.
Eyona ndlela iphambili yokusebenzisa i-via kukunxibelelana ngombane. Ubungakanani bayo buncinci kuneminye imingxuma esetyenziselwa izinto ezidibanisayo. Imingxuma esetyenziselwa izinto ezidibanisayo iya kuba mikhulu. Kwiteknoloji yokuvelisa i-PCB, ukubhola yinkqubo esisiseko, kwaye umntu akanakuyikhathalela loo nto. Ibhodi yesekethe ayinakubonelela ngonxibelelwano lombane kunye nemisebenzi yesixhobo esisisigxina ngaphandle kokubhoboza imingxunya efunekayo kwipleyiti egqunywe ngobhedu. Ukuba ukubhoboza okungafanelekanga kubangela nayiphi na ingxaki kwinkqubo yokubhoboza imingxunya, oku kunokuchaphazela ukusetyenziswa kwemveliso, okanye ibhodi yonke iya kulahlwa, ngoko ke inkqubo yokubhoboza ibalulekile.
Iindlela zokubhola ii-vias
Kukho iindlela ezimbini zokubhola ii-vias: ukubhola ngoomatshini kunye nokubhola nge-laser.
Ukugqobhoza ngoomatshini ngemingxunya yinkqubo ebalulekileyo kushishino lwePCB. Ngemingxunya, okanye ngemingxunya, kukho imingxuma esilinda edlula ngokupheleleyo ebhodini ize idibanise icala elinye kwelinye. Zisetyenziselwa ukufaka izinto kunye nokudibanisa iisekethe zombane phakathi kweengqimba. Ukugqobhoza ngoomatshini ngemingxunya kubandakanya ukusebenzisa izixhobo ezikhethekileyo ezifana needrill, iireamers, kunye nee-countersink ukwenza le mingxunya ngokuchanekileyo nangokuchaneka. Le nkqubo ingenziwa ngesandla okanye ngoomatshini abazenzekelayo kuxhomekeke kubunzima boyilo kunye neemfuno zemveliso. Umgangatho wokugqobhoza ngoomatshini uchaphazela ngokuthe ngqo ukusebenza kwemveliso kunye nokuthembeka, ngoko ke eli nyathelo kufuneka lenziwe ngokuchanekileyo ngalo lonke ixesha. Ngokugcina imigangatho ephezulu ngokugqobhoza ngoomatshini, ngemingxunya kungenziwa ngokuthembekileyo nangokuchaneka ukuqinisekisa uqhagamshelo lombane olusebenzayo.
Ukubhola nge-laser
Ukugqobhoza ngoomatshini ngemingxunya yinkqubo ebalulekileyo kushishino lwePCB. Ngemingxunya, okanye ngemingxunya, kukho imingxuma esilinda edlula ngokupheleleyo ebhodini ize idibanise icala elinye kwelinye. Zisetyenziselwa ukufaka izinto kunye nokudibanisa iisekethe zombane phakathi kweengqimba. Ukugqobhoza ngoomatshini ngemingxunya kubandakanya ukusebenzisa izixhobo ezikhethekileyo ezifana needrill, iireamers, kunye nee-countersink ukwenza le mingxunya ngokuchanekileyo nangokuchaneka. Le nkqubo ingenziwa ngesandla okanye ngoomatshini abazenzekelayo kuxhomekeke kubunzima boyilo kunye neemfuno zemveliso. Umgangatho wokugqobhoza ngoomatshini uchaphazela ngokuthe ngqo ukusebenza kwemveliso kunye nokuthembeka, ngoko ke eli nyathelo kufuneka lenziwe ngokuchanekileyo ngalo lonke ixesha. Ngokugcina imigangatho ephezulu ngokugqobhoza ngoomatshini, ngemingxunya kungenziwa ngokuthembekileyo nangokuchaneka ukuqinisekisa uqhagamshelo lombane olusebenzayo.
Amanyathelo okuzikhusela kwi-PCB ngoyilo
Qinisekisa ukuba ii-via azisondelelene kakhulu neenxalenye okanye ezinye ii-via.
IiVia ziyinxalenye ebalulekileyo yoyilo lwePCB kwaye kufuneka zibekwe ngononophelo ukuqinisekisa ukuba azibangeli naluphi na uphazamiseko kwezinye izinto okanye iivia. Xa iivia zisondelelene kakhulu, kukho umngcipheko wokufinyela kwesekethe, okunokonakalisa kakhulu iPCB nazo zonke izinto eziqhagamshelweyo. Ngokwamava kaViasion, ukuze kuncitshiswe lo mngcipheko, iivia kufuneka zibekwe ubuncinane kwi-0.1 intshi ukusuka kwiindawo, kwaye iivia akufuneki zibekwe kufutshane kune-0.05 intshi enye kwenye.
Qinisekisa ukuba ii-via azigubungeli ii-traces okanye ii-pad kwi-layers ezikufutshane.
Xa kuyilwa ii-vias zebhodi yesekethe, kubalulekile ukuqinisekisa ukuba ii-vias azihambelani nazo naziphi na ii-traces okanye ii-pads kwezinye iileya. Kungenxa yokuba ii-vias zinokubangela ii-electrical shorts, nto leyo ekhokelela ekungasebenzi kakuhle kwenkqubo kunye nokungaphumeleli. Njengoko iinjineli zethu zicebisa, ii-vias kufuneka zibekwe ngobuchule kwiindawo ezingenazo ii-traces okanye ii-pads ezikufutshane ukuze kuthintelwe lo mngcipheko. Ukongeza, kuya kuqinisekisa ukuba ii-vias aziphazamisi ezinye izinto kwi-PCB.
Cinga ngomlinganiselo wangoku kunye nobushushu xa uyila ii-vias.
Qinisekisa ukuba ii-vias zine-copper plating efanelekileyo ukuze zikwazi ukuthwala umbane.
Ukudityaniswa kwee-vias kufuneka kuqwalaselwe ngononophelo, kuthintelwe iindawo apho ukuhanjiswa kwendlela kunokuba nzima okanye kungenzeki.
Qonda iimfuno zoyilo ngaphambi kokukhetha ngobukhulu kunye neentlobo.
Soloko ubeke ii-vias ubuncinane i-0.3mm ukusuka kwimiphetho yebhodi ngaphandle kokuba kuchazwe ngenye indlela.
Ukuba ii-vias zibekwe kufutshane kakhulu, zingonakalisa ibhodi xa zigqojozwa okanye zithuthwa.
Kubalulekile ukuqwalasela umlinganiselo we-aspect ratio yee-vias ngexesha loyilo, njengoko ii-vias ezinomlinganiselo ophezulu we-aspect ratio zinokuchaphazela ukuthembeka kwesignali kunye nokutshatyalaliswa kobushushu.
Qinisekisa ukuba ii-vias zinendawo eyaneleyo yokungena kwezinye ii-vias, izinto kunye nemiphetho yebhodi ngokwemigaqo yoyilo.
Xa ii-vias zibekwe ngababini okanye ngamanani abalulekileyo, kubalulekile ukuzisasaza ngokulinganayo ukuze zisebenze kakuhle.
Lumka ii-vias ezinokuba kufutshane kakhulu nomzimba wecandelo elithile, kuba oku kunokubangela ukuphazamiseka kwemiqondiso edlulayo.
Ukuqwalasela ii-vias ezikufutshane neenqwelomoya.
Zifanele zibekwe ngononophelo ukunciphisa ingxolo yesiginali kunye namandla.
Cinga ngokubeka ii-vias kumaleko ofanayo nemiqondiso apho kunokwenzeka khona, njengoko oku kunciphisa iindleko ze-vias kwaye kuphucula ukusebenza.
Nciphisa inani lee-vias ukuze unciphise ubunzima kunye neendleko zoyilo.
Iimpawu ze-PCB ngokusebenzisa umngxuma
Ububanzi obungena emngxunyeni
Ububanzi bemingxuma edlulayo kufuneka budlule ububanzi bephini ye-plug-in component kwaye bugcine umda othile. Ububanzi obuncinci obunokufikelela kwiintambo ngemingxuma bunqunyelwe yiteknoloji yokubhola kunye ne-electroplating. Ububanzi bemingxuma edlulayo buncinci, indawo encinci kwi-PCB, kokukhona umthamo we-parasitic uncinci, kwaye kokukhona ukusebenza kwe-high-frequency kungcono, kodwa iindleko ziya kuba phezulu.
Iphedi enomngxuma odlulayo
Iphedi iqonda unxibelelwano lombane phakathi komaleko wangaphakathi we-electroplating we-through-hole kunye neentambo kumphezulu webhodi yesekethe eprintiweyo (okanye ngaphakathi).
Umthamo womngxuma odlulayo
Umngxuma odlulayo une-parasite capacitance emhlabeni. I-capacitance ye-parasite edlulayo iya kucothisa okanye yonakalise umda onyukayo wesignali yedijithali, into engalunganga ekudlulisweni kwesignali ye-high-frequency. Sisiphumo esibi kakhulu se-capacitance ye-parasite edlulayo. Nangona kunjalo, kwiimeko eziqhelekileyo, impembelelo ye-capacitance ye-parasite edlulayo yincinci kwaye inokuba yinto encinci—ububanzi obuncinci bomngxuma odlulayo, kokukhona i-parasite capacitance incinci.
Ukuhanjiswa komngxuma odlulayo
Iimbobo ezidlulayo zisetyenziswa kakhulu kwii-PCB ukuqhagamshela izixhobo zombane, kodwa zinokuba nesiphumo esingalindelekanga: i-inductance.
I-inductance yipropathi yemingxunya edlulayo eyenzeka xa umbane udlula kuyo kwaye ubangele intsimi yemagnethi. Le ntsimi yemagnethi inokubangela ukuphazamiseka kwezinye iintambo ezidlulayo, okubangela ukulahleka kwesignali okanye ukuphazamiseka. Ukuba sifuna ukunciphisa ezi ziphumo, kubalulekile ukuqonda indlela esebenza ngayo i-inductance kunye namanyathelo oyilo onokuwathatha ukunciphisa impembelelo yayo kwii-PCB zakho.
Ububanzi bemingxuma edlulayo kufuneka budlule ububanzi bephini ye-plug-in component kwaye bugcine umda othile. Ububanzi obuncinci obunokufikelela kwiintambo ngemingxuma bunqunyelwe yiteknoloji yokubhola kunye ne-electroplating. Ububanzi bemingxuma edlulayo buncinci, indawo encinci kwi-PCB, kokukhona umthamo we-parasitic uncinci, kwaye kokukhona ukusebenza kwe-high-frequency kungcono, kodwa iindleko ziya kuba phezulu.
Kutheni kufuneka ii-PCB vias zifakwe iplagi?
Nazi ezinye zezizathu zokuba kutheni ii-PCB vias kufuneka zifakwe iplagi, njengoko zishwankathelwe yiShenzhen Rich Full Joy Electronics Co., Ltd:
I-Shenzhen Rich Full Joy Electronics Co., Ltd:
Ii-PCB vias zibonelela ngekhonkco elibonakalayo kwiindawo zokufakela kunye nokudibanisa iileya ezahlukeneyo ze-PCB, ngaloo ndlela ivumela ibhodi ukuba yenze umsebenzi wayo ngokufanelekileyo. Ii-PCB vias zikwasetyenziselwa ukuphucula ukusebenza kobushushu be-PCB kunye nokunciphisa ukulahleka kwesiginali. Njengoko ii-PCB vias ziqhuba umbane ukusuka kwelinye ileya le-PCB ukuya kwelinye, kufuneka zifakwe iplagi ukuqinisekisa unxibelelwano phakathi kweeleya ezahlukeneyo ze-PCB. Okokugqibela, ii-PCB vias zinceda ukuthintela ii-short circuits ngokuphepha ukudibana nazo naziphi na ezinye izinto ezivezwe kwi-PCB. Ke ngoko, ii-PCB vias kufuneka zifakwe iplagi ukuthintela naziphi na iingxaki zombane okanye umonakalo kwi-PCB.
Isishwankathelo
Ngamafutshane, ii-PCB vias ziyinxalenye ebalulekileyo yee-PCB, ezivumela ukuba zikwazi ukuhambisa imiqondiso ngokufanelekileyo phakathi kweeleya kwaye zidibanise izinto ezahlukeneyo zebhodi. Ngokuqonda iintlobo zazo ezahlukeneyo kunye neenjongo, unokuqinisekisa ukuba uyilo lwakho lwe-PCB lulungiselelwe ukusebenza nokuthembeka.
I-Shenzhen Rui Zhi Xin Feng Electronics Co., Ltd. inikezela ngemveliso epheleleyo ye-PCB, ukufumana izinto, ukuhlanganisa i-PCB, kunye neenkonzo zokuvelisa ze-elektroniki. Ngamava angaphezu kweminyaka engama-20, siye sanikezela rhoqo izisombululo ze-PCBA ezikumgangatho ophezulu ngamaxabiso akhuphisanayo kubathengi abangaphezu kwama-6,000 behlabathi. Inkampani yethu iqinisekisiwe ngeziqinisekiso ezahlukeneyo zoshishino kunye nokuvunywa kwe-UL. Zonke iimveliso zethu zifumana uvavanyo lwe-E-test oluyi-100%, i-AOI, kunye ne-X-RAY ukuze zihlangabezane nemigangatho ephezulu zoshishino. Sizimisele ukubonelela ngomgangatho ogqwesileyo kunye nokuthembeka kuyo yonke iprojekthi yokuhlanganisa i-PCB.
Ukubhola nge-laser ye-PCB Ukubhola nge-mechanical ye-PCB
Ukubhola ngeLaser kwiiPCB Ukubhola ngePCB
Ukubhola i-PCB Laser Hole Ukubhola oomatshini be-PCB
Ukubhola iMicrovia ngeLaser yePCB Ukubhola imingxunya yePCB
Iteknoloji yokubhola ye-PCB Laser Inkqubo yokubhola ye-PCB
Inkqubo yokubhola Intshayelelo:
1. Ukuqhobosha, ukubhoboza, kunye nokufunda imingxunya
Injongo: Ukugqobhoza imingxunya kumphezulu we-PCB ukuze kusekwe uqhagamshelo lombane phakathi kweeleya ezahlukeneyo.
Ngokusebenzisa iiphini eziphezulu ukubhola kunye neephini ezisezantsi zokufunda imingxunya, le nkqubo iqinisekisa ukudalwa kwee-vias ezenza kube lula ukunxibelelana kweesekethe eziphakathi kweeleya kwibhodi yesekethe eprintiweyo (i-PCB).
Ukubhola nge-CNC:
Injongo: Ukugqobhoza imingxunya kumphezulu we-PCB ukuze kusekwe uqhagamshelo lombane phakathi kweeleya ezahlukeneyo.
Izinto eziphambili:
Iibhithi zokubhola: Yenziwe nge-tungsten carbide, i-cobalt, kunye nezincamathelisi zendalo.
Ipleyiti Yesigqubuthelo: Ngokuyintloko yi-aluminium, esetyenziselwa ukubeka ii-drill bit positioning, ukusasaza ubushushu, ukunciphisa ii-burrs, kunye nokuthintela umonakalo weenyawo zoxinzelelo ngexesha lenkqubo.
Ipleyiti Yokuxhasa: Ngokuyintloko ibhodi edibeneyo, esetyenziselwa ukukhusela itafile yomatshini wokugrumba, ukuthintela ukuphuma kwee-burrs, ukunciphisa ubushushu bee-drill bit, kunye nokucoca intsalela ye-resin kwi-drill bit flutes.
Ngokusebenzisa ukubhola kwe-CNC okuchanekileyo kakhulu, le nkqubo iqinisekisa uqhagamshelo oluchanekileyo noluthembekileyo phakathi kweeleya kwiibhodi zesekethe eziprintiweyo (ii-PCB).
Ukuhlolwa kweMingxunya:
Injongo: Ukuqinisekisa ukuba akukho ziphazamiso ezifana nokugrumba kakhulu, ukugrumba ngaphantsi, imingxunya evalekileyo, imingxunya emikhulu, okanye imingxunya engakhuliyo emva kwenkqubo yokugrumba.
Ngokwenza uhlolo olucokisekileyo lwemingxunya, siqinisekisa umgangatho kunye nokuhambelana kwe-via nganye, siqinisekisa ukusebenza kombane kunye nokuthembeka kwebhodi yesekethe eprintiweyo (i-PCB).
