Ubuchwepheshe bokuHamba koMphezulu (i-SMT)

Oomatshini abachanekileyo kakhulu bafumana ukuchaneka kokubeka izinto ±0.025mm. Ukulinganiswa rhoqo kweenkqubo ze-optical, izikrufu ze-lead, kunye nezikhokelo, kunye nokugcinwa kokuthintela (ukucoca, ukuthambisa, ukutshintshwa kwenxalenye yokuguguleka), kuqinisekisa uzinzo lokuchaneka kwexesha elide.

Izantya eziphezulu ziyahluka ngokwemodeli (umz., 40,000–60,000 cph kwiimashini ezisebenzisa isantya esiphezulu). Izinto ezichaphazelayo ziquka uhlobo/ubungakanani becandelo (isantya esicothayo seenxalenye ezingaqhelekanga/iinxalenye ezincinci), ukulungiswa kwenkqubo, uzinzo lwe-feeder, kunye nobunzima boyilo lwe-PCB.

Iindidi eziqhelekileyo: ii-nozzles ze-vacuum, ze-magnetic, kunye neze-gripper. Ukukhethwa kusekelwe kubungakanani becandelo, imo, ubunzima, kunye nezinto ezisetyenziswayo (umz., ii-nozzles ze-vacuum ze-Chip components ezincinci, ii-nozzles ze-gripper ze-odd-form parts).

Iintlobo zezondla: ii-tape, iityhubhu, kunye neetreyi. Ukuchaneka kugcinwa ngokulinganisa rhoqo, ukucoca imijelo yokukhupha, kunye nokulungiswa koxinzelelo ukuqinisekisa indawo echanekileyo yecandelo.

- Imihla ngemihla: Coca umphandle, jonga ukuba imilomo ayivalwanga, jonga imeko yesondlo.

- Veki nganye: Coca iinkqubo ze-optical, thambisa izikrufu/izikhokelo ze-lead, vavanya ukuchaneka kokubeka.

- Nyanga nganye: Ukucoca nzulu ngaphakathi, ukulinganisa iiparameter, uhlole ukuguguleka kwezixhobo zombane/zoomatshini.

Ngokwesiqhelo iindawo ezi-8–12:

- Ukufudumeza (iindawo zokuqala ezi-2–3): 100–150°C; ifudumeza i-PCB/izinto ezisetyenziswayo ukuze kuthintelwe ukutshayiswa bubushushu kwaye kusebenze ukutsha.

- Ukuntywila (iindawo eziphakathi kwezi-2–3): 150–180°C; ivuselela ngokupheleleyo i-flux ukususa ii-oxides.

- Ukuphinda kusebenze (iindawo ezi-1–2): 217–230°C (ayinalothi); iyanyibilikisa intlama yesolder ukuze ibotshelelwe.

- Ukupholisa (iindawo ezi-2-3 zokugqibela): Ukupholisa ngokukhawuleza kuqinisa amalungu ukuze kubekho ulwakhiwo olufanelekileyo lwe-microstructure.

I-nitrogen inciphisa i-oxidation, iphucula ukumanzisa/ukucwebezela kwamalungu, kwaye inciphisa amazinga okungasebenzi. Ubumsulwa ≥99.99%. Izinga lokuhamba (5–20 m³/h) lilungiswa ngeemitha zokuhamba ngokusekwe kubungakanani be-oven kunye neemfuno zemveliso.

Ukuphakama kwamaza kumiselwe ukuntywilisela ezantsi kwePCB nge-2–3mm. Amaza aphezulu kakhulu abangela ukudibana; ukuphakama okungaphelelanga kukhokelela ekubeni amalungu angamanzi kakuhle kwaye ome.

Iindlela ziquka ukutshiza kunye nokugquma ngefoam. Ukufana kuqinisekiswa ngokulinganisa izixhobo rhoqo, ukulungiswa kweeparamitha ze-spray nozzle/foam tube, kunye nokuhlolwa okungacwangciswanga kwee-PCB ezigqunyiweyo.

Izinto zeChip: ±0.05mm; QFP/BGA: ±0.025mm. Uphuculo: ukulinganiswa kwe-optical rhoqo, ii-algorithms zokuhlola ezilungisiweyo, ukulungiswa kweeparameter (imida/umahluko), kunye noqeqesho lomqhubi.

Izizathu: imibala efanayo yecandelo/imvelaphi, ungcoliseko/ukubonakaliswa komphezulu, iiparameter ezingafanelekanga, ukuguga kwezixhobo.

Ukunciphisa: ukulungiswa kweparameter (i-grayscale thresholds), ukucoca kwangaphambili kwecandelo, ukugcinwa rhoqo, kunye ne-algorithms ye-AI ephucukileyo.

Ukhuseleko ≥95%. Uphuculo: uyilo lweprobe oluphuculweyo, amanqaku ovavanyo anyusiweyo, uphuhliso olupheleleyo lwenkqubo yovavanyo, kunye neendlela eziphambili (ukuskena umda).

Ukucwangcisa kubandakanya ukuseta ukuhamba kovavanyo, iiparameter, kunye nemigangatho ngokusebenzisa isoftware ekhethekileyo ngokusekelwe kwiinkcukacha zemveliso.

Izinto ezibalulekileyo ekufuneka ziqwalaselwe: ukuqonda ngokuchanekileyo iimfuno zomsebenzi, ukulinganiswa okungqongqo kweeparameter, kunye nokuqinisekiswa okuphindaphindiweyo kokuthembeka.

Ilinganisa ubukhulu, indawo, umthamo, kunye nomlinganiselo.

Imigangatho: ukuphambuka kobukhulu ≤±10%, indawo ≤±15%, ivolumu ≤±12%, i-offset ≤0.1mm (ekhethekileyo kushishino).

Ukuhambelana kweebhrendi ezahlukeneyo kunqongophele kodwa kuyafikeleleka ngokusebenzisa iindlela ezimiselweyo (umz., ikhowudi ye-G, iprotocol ye-SMEMA) kunye nophuhliso lwesibini.

Izisombululo zifuna inkxaso yabathengisi okanye abahlanganisi beenkqubo ukuze kulungiswe iimpazamo.

Uphuculo lubandakanya ukutshintshwa kwehardware (iinxalenye ezichanekileyo, i-optics ephucukileyo) kunye nohlaziyo lwesoftware (ukulungiswa kwe-algorithm).

Iindleko: 10–30% yexabiso lokuqala; amaxesha amiselweyo: inyanga e-1–3 (kuquka ixesha lokungasebenzi lokuguqulwa nokuqinisekiswa).

Ukuxilongwa kokuqala ngemiyalezo ye-alamu, izalathisi zesimo, kunye nokujonga koomatshini.

Izixhobo: ii-multimeter, ii-oscilloscopes, i-infrared thermography.

Iindlela: ukusombulula iingxaki zecandelo, ukutshintshwa kwecandelo, kunye nokuthelekiswa kweparameter.

Imithombo: iimoto, izifudumezi, iimpompo zevacuum, izibane.

Ukunciphisa: iiparameter ezilungiselelweyo (umz., ubushushu be-oven obuphinda buphume), izinto ezisebenzisa amandla kakuhle (ii-motor, izibane), kunye nokugcinwa rhoqo ukuqinisekisa ukusebenza kakuhle.

Uqeqesho luquka imigaqo yokusebenza, iinkqubo zokhuseleko, imigaqo esisiseko, kunye nokugcinwa.

Isiqulatho: ukuqalisa/ukuvala, useto lweparameter, ukulayisha izinto, ukuphathwa kweempazamo, ukhuseleko lombane/loomatshini.

Ubude bexesha: iiveki ezi-1–2 (ithiyori + ukuziqhelanisa nokwenza izinto, kunye nesiqinisekiso esifunekayo).

Imilinganiselo: iibhokisi ezisekelwe phantsi, amaqhosha okumisa ngexesha likaxakeka, izikhuselo, iilebheli zesilumkiso.

Ukhuseleko luqinisekiswa ngokuhlolwa rhoqo kokhuseleko, uqeqesho lwabaqhubi, ukunamathela ngokungqongqo kwimigaqo, kunye nePPE (iintambo zesandla ze-ESD, iiglasi zokhuseleko, iiglavu).

Ukukhethwa kwentlama ye-solder kujonga inkqubo yokunyibilikisa (ukunyibilikisa kwakhona/ukunyibilikisa ngamaza), uhlobo lwento (umz., intlama ye-low melting-point yezixhobo ezinobushushu obuphantsi), kunye neemfuno zokuthembeka (umz., intlama ethembekileyo kakhulu yezixhobo ze-elektroniki zeemoto).

Imizekelo: I-Alpha OM338 inika ukumanzisa okugqwesileyo kunye nokukwazi ukunyibilikisa ukuze i-lead-free ibuyele kwi-liquid; i-Senju Sn63Pb37 yintlama yendabuko ene-lead enamandla aphezulu.

Intlama yesolder mayigcinwe efrijini kumaqondo obushushu angama-2–8°C, kude nokukhanya nokufuma. Ukugcinwa ixesha elide kunciphisa ukusebenza kokuhamba komoya kwaye kwandisa umgubo wesolder, nto leyo ekhokelela kwiziphene ezifana namalungu abandayo kunye nokubopha. Ixesha lokuhlala kwishelufu lidla ngokuba ziinyanga ezi-6–12 zingavulwanga, kwaye iiveki ezi-1–2 emva kokuvulwa.

Vumela iiyure ezi-4–8 zokuphinda kuphume ubushushu begumbi emva kokuba kuqandisiwe ukuze kususwe ukufuma okubangelwa kukwahluka kobushushu. Ukusetyenziswa kulawulwa ngokusebenzisa ubukhulu bestencil/ubungakanani bokuvula kunye neeparamitha zokuprinta (uxinzelelo/isantya se-squeegee) ukuhlangabezana neemfuno zomthamo we-solder.

- Isantya: Ukukhawuleza kakhulu kubangela ukungoneli kwe-paste (ukungoneli kwe-solder); ukucotha kakhulu kunciphisa ukusebenza kakuhle kwaye kubangela ukuqokelelana kwe-paste.

- Uxinzelelo: Amandla oxinzelelo olugqithisileyo ancamathisela ngaphandle kwemingxuma yestencil (ukubopha); uxinzelelo olunganeleyo lukhokelela ekungafakwani ngokwaneleyo.

- I-engile: 45–60° yeyona ifanelekileyo. Ii-engile ezincinci zibangela ukuqengqeleka kwe-paste (ukuprinta okungalinganiyo); ii-engile ezinkulu zithintela ukuzaliswa kwe-paste.

Iiparameters zisekelwe kuhlobo lokuncamathisela, ubukhulu/izithuba zestencil, kunye nobucaba bePCB (ngokuqhelekileyo: isantya 20–50mm/s, uxinzelelo 5–10kgf).

Izinto eziqhelekileyo: intsimbi engatyiwayo kunye ne-nickel alloy.

- Intsimbi engatyiwayo: Ixabiso eliphantsi, ubulukhuni obuphakathi, kulula ukuyicubungula, kodwa ukuguguleka komphetho kunokwenzeka xa isetyenziswa ixesha elide, okuchaphazela ukuchaneka kokuprinta.

- I-Nickel alloy: Ubunzima obuphezulu, ukumelana nokuguguleka, kunye nokuhlala ixesha elide, kodwa iindleko eziphezulu kunye nobunzima bokucubungula.

Kwizinto ezincinci (umz., 01005, 0201), sebenzisa ubukhulu obuyi-50–75μm ukuze ufumane intlama echanekileyo. Kwizinto ezinkulu okanye umthamo ophezulu we-solder, ubukhulu obuyi-100–150μm bufanelekile. Kwakhona qwalasela uxinano/uyilo lwezinto ukuze uphephe ukuphazamiseka kokuprinta.

- Izinto ezisetyenziswa kwi-chip: Iimbobo ezizinxantathu, ezincinci nge-0.05–0.1mm kunee-pads kwicala ngalinye.

- QFP/SOP: Imingxuma emide, incinci nge-0.05–0.1mm kune-pin pitch kwaye ide nge-0.1–0.2mm kunobude be-pin.

- BGA: Izithuba ezijikelezayo/ezisikwere, ububanzi bebhola yesolder obuyi-70–80%.

Imigaqo: ukufumbatha intlama ngendlela efanayo, ukuthintela ukuvalwa kwemigca, kunye nokubekwa lula kwezixhobo.

Ubuninzi bokucoca: ngesiqhelo rhoqo kwi-PCB ezingama-50–100, kuxhomekeke kumthamo wemveliso.

Iindlela: ukucoca ngesandla (i-flux remover kunye nebrashi ekhethekileyo), ukucoca nge-ultrasound, ukucoca nge-vacuum.

Iikhrayitheriya zococeko: akukho ntlama/amabala aseleyo kwiindawo ezivulekileyo, imiphetho egudileyo phantsi kokwandiswa, kunye novavanyo lokuprinta intlama yesolder.

Iintlobo eziqhelekileyo: iteyiphu kunye nereyile, itreyi, kunye nokupakishwa kweetyhubhu.

- Iteyiphu kunye nereyile: Kwizinto ezincinci ezisemgangathweni; qinisekisa indlela efanelekileyo yokutya kunye noxinzelelo ukuthintela ukungalungelelani okanye iingxaki zokutya.

- Itreyi: Kwizinto ezinkulu, ezinobume obungaqhelekanga, okanye ezichanekileyo; ukubeka itreyi ngokuchanekileyo kubalulekile.

- Ityhubhu: Kwizinto ezikhethekileyo (umz., ii-diode); nika ingqalelo kwindlela yokuqondisa kunye nokulungelelanisa izinto.

Indawo yokugcina ngokubanzi: indawo eyomileyo nepholileyo (≤25°C, 40–60% RH).

- Izinto ezibuthathaka kwi-ESD (umz., ii-IC): Zifuna ukupakishwa okuchasene nokungashukumiyo kunye neendawo ezilawulwa yi-ESD ukuthintela umonakalo obangelwa kukukhutshwa kwe-electrostatic.

- Izinto ezithintela ubushushu (umz., ii-capacitors ze-tantalum): Kufuneka ziphephe amaqondo obushushu aphezulu ukuze zigcine ukusebenza kombane.

Ukugcinwa ngendlela engafanelekanga kunokubangela i-oxidation, ukufunxwa komswakama, kunye nokwehla kokusebenza, okuchaphazela umgangatho wokutywina kunye nokuthembeka kwemveliso.

Qinisekisa iilebheli zecandelo kunye namaphepha edatha ngokuchasene neemfuno zemveliso ngaphambi kokuba ulayishe. Sebenzisa iinkqubo zokuthintela iimpazamo (ukuskena ikhowudi yebha, i-RFID) ukujonga nokuqinisekisa ukulayisha. Sebenzisa ukuqinisekiswa kabini kokufakwa kwe-feeder kunye nokuhlolwa okupheleleyo kwecandelo ngexesha lokuveliswa kwento yokuqala.

Imigaqo:

- Beka izinto ezincinci phambi kwezinkulu ukuze uphephe ukuxinana.

- Beka izinto ezikhaphukhaphu phambi kwezo zinzima ukuze uthintele umonakalo.

- Beka izinto ezizinzileyo phambi kwezo zinokushukunyiswa ukuqinisekisa ukuchaneka.

Ukuphucula: Hlanganisa iinxalenye kwi-PCB kwaye ucwangcise iindlela zokubeka usebenzisa umgaqo okufutshane nommelwane ukunciphisa umgama kunye nexesha lokuhamba lokukhetha nokubeka.

Izinto ezifana neekristale, iidiode, kunye nee-polarized capacitors zineemfuno ezingqongqo zee-engile. Ukuchaneka kuqinisekiswa ngenkqubo yokubona yomatshini wokukhetha nokubeka ukuze kulungelelaniswe ngokuchanekileyo, kumiselwe iiparameter zee-engile kwinkqubo yokubeka, kunye nokuhlolwa okungacwangciswanga ngexesha le-first-article kunye nemveliso.

Ukuhlolwa ngezixhobo zokukhanya (imayikroskopu, i-3D AOI). Ukungasebenzi kakuhle kwe-coplanarity kubangela ukuba amalungu abandayo kunye nokudityaniswa kwe-false soldering, okubeka emngciphekweni ukuthembeka kwamalungu kwaye okunokubangela ukungazinzi kombane okanye ii-short circuits ngexesha lokusetyenziswa.

Izizathu: indawo egcinwe kuyo ifumile, umoya ohlala ixesha elide, ukupakisha okonakeleyo.

Ukuthintela: ukupakisha okungenamanzi nokungashukumiyo, ukugcina kwindawo eyomileyo/ene-nitrogen; coca kwaye ufake izinto ezithintela ukubola kwiileyiti zeenxalenye ezigcinwe ixesha elide ngaphambi kokuba uyisebenzise.

Iindidi eziqhelekileyo: i-flux engacocekanga, i-flux enyibilikayo emanzini, i-rosin flux.

- Akukho flux icocekileyo: Intsalela ephantsi, akukho mfuneko yokucoca; ifanelekile ukucoca okuphezulu kunye nokusetyenziswa okusebenzayo.

- Ulwelo olunyibilikayo emanzini: Iintsalela zisuswa ngokucocwa ngamanzi, zinobuhlobo nokusingqongileyo kodwa zifuna amanyathelo ongezelelweyo okucoca.

- I-Rosin flux: Imanzisa kakuhle, kodwa iintsalela zifuna ukucocwa kwe-organic solvent; zifanelekile kwiinkqubo zemveli ezifuna umgangatho ophezulu wokunyibilikisa.

Umthamo we-Flux ulawulwa ngokulungelelanisa iiparameter zezixhobo zokugquma (umz., uxinzelelo lokutshiza, izinga lokuhamba kwamanzi, umgama wokugquma; ukuphakama kwe-foam, ixesha lokugquma i-foam) kunye nokuzivumelanisa nobukhulu be-PCB, uxinano lwamacandelo, kunye neemfuno zenkqubo.

- Ukujikeleza okugqithisileyo: Kubangela iingxaki zombane ezinxulumene nentsalela (ii-short circuits, ukuvuza) kwaye kwandisa ubunzima/ixabiso lokucoca.

- **Akwanelanga

Umsebenzi we-flux unokuvavanywa ngokuvavanya amandla ayo okususa i-oxidation kwiziqwenga zovavanyo eziqhelekileyo kumaqondo obushushu athile kunye namaxesha athile. Umzekelo, faka i-flux kwisiqwenga sovavanyo sobhedu esinomaleko we-oxide, uyifudumale kwi-200–250°C imizuzu emi-5–10, kwaye ujonge ukususwa komaleko we-oxide. Uvavanyo olungangqalanga lunokwenziwa ngokulinganisa izalathisi ezifana nexabiso le-asidi kunye nomxholo we-halogen.

Umsebenzi ongonelanga wokuhamba kwamanzi uyasilela ukususa ii-oxides kwi-component leads kunye ne-pad surfaces, nto leyo ebangela ukuba i-solder paste ingabi manzi kakuhle, ii-solder joints ezirhabaxa nezingaphelelanga, kunye nomngcipheko ophezulu wee-cold joints okanye i-false soldering, nto leyo echaphazela kakhulu amandla e-soldering kunye nokuthembeka koqhagamshelo lombane.

Ukuphuma komoya ongcolileyo kushiya iintsalela ezincinci nezizinzileyo (iifilimu ezicacileyo/ezingacacanga kangako), ezinefuthe eliphantsi ekusebenzeni kombane, kodwa zinokufunxa uthuli kwiindawo ezinomswakama ophezulu okanye ezingcolisiweyo.

Iintsalela zeflux ezinyibilikayo emanzini ziityuwa ezinyibilikayo emanzini kwaye zinokususwa ngokucocwa ngamanzi (i-ultrasonic + amanzi acocekileyo + isepha).

Iintsalela ze-rosin flux zizinto ezinamathelayo ze-rosin ezitsala uthuli, zifuna izinyibilikisi ze-organic (utywala, i-isopropyl alcohol) ukuze zicocwe.

Ukucoca okungacocekanga akusoloko kufuna ukucocwa okukhethekileyo, kodwa ukucoca ngobunono kungasetyenziselwa iimfuno zococeko oluphezulu kakhulu.

Izinto ekufuneka ziqwalaselwe: ukusebenza kakuhle kokucoca, ukuthobela imiqathango yokusingqongileyo (RoHS/REACH), ukhuseleko (ubuthi/ukutsha), ukubola, iindleko.

Iintlobo eziqhelekileyo:

- Isekelwe emanzini: Isebenza kakuhle kwindalo, isebenza kakuhle kwiintsalela ezinyibilikayo emanzini, kodwa inokugqwala izinto ezinobuthathaka kwaye ifune ukomiswa ukuze kuthintelwe ukugqwala.

- I-Semi-aqueous: Isebenza kakuhle ekucoceni iintsalela ezininzi, kodwa inezinyibilikisi zendalo ezincinci, azinabungozi kangako kwindalo.

- Isebenzisa isinyibilikisi: Ukususa amafutha ngokukhawuleza, kodwa kuyatsha, kuyingozi, kwaye kuyabiza kakhulu.

Ukuqinisekiswa: Jonga iincwadi zemiyalelo yemveliso, qwalasela inqanaba longcoliseko lwe-PCB kunye nokumelana nokugqwala kwenxalenye, kwaye uqinisekise ngokusebenzisa iimvavanyo zesampulu (izilingo zokucoca ezinomlinganiselo owahlukileyo).

- Iphezulu kakhulu: Umngcipheko wokugqwala kwe-PCB/inxalenye, i-arhente eseleyo echaphazela ukusebenza.

- Iphantsi kakhulu: Ukucoca okungagqitywanga, ukusilela ukususa izinto ezingcolisayo.

Ubushushu obuphezulu buphucula umsebenzi wezinto zokucoca kunye namandla okunyibilikisa, kodwa bunokonakalisa ii-PCB/izinto.

- Isekelwe emanzini: 40–60°C

- Omanzi kancinci: 50–70°C

- Isekelwe kwisinyibilikisi: Ubushushu begumbi (20–25°C, ukuya kuthi ga kwi-40°C kwiikheyiji ezikhethekileyo)

Ukuqinisekiswa: Ngokusekelwe kwinqanaba longcoliseko lwe-PCB, uhlobo/uxinzelelo lwearhente yokucoca, kunye nezixhobo, eziqinisekiswe ngovavanyo namava.

- Imfutshane kakhulu: Ukucoca okungaphelelanga, izinto ezingcolisayo ezishiyekileyo.

- Ixesha elide kakhulu: Ukubola okunokwenzeka kwe-PCB/component (umz., ukuxobuka kwemaski yesolder, ukubola kwelothe), imveliso enciphileyo.

Iindlela eziqhelekileyo:

- Ukucoca nge-Ultrasonic: Isiphumo se-cavitation, esifanelekileyo kwii-PCB ezicocekileyo kakhulu ezineenxalenye ezixineneyo/ezintsonkothileyo.

- Ukucoca isitshizi: Ukutshiza ngoxinzelelo oluphezulu, okufanelekileyo ukuvelisa ii-PCB ezingcoliswe kancinci ngobuninzi.

- Ukucoca ngokuntywiliselwa: Ukusebenza okulula, kulungele iibhetshi ezincinci ezineemfuno eziphantsi zococeko.

Injongo: Susa izinto ezisele zokufuma/zokucoca ukuthintela imijikelezo emfutshane, ukugqwala, kunye neengxaki zokusebenza.

Iindlela:

- Ukomisa umoya oshushu: Izixhobo ezilula, ezingabizi kakhulu, kodwa ukomisa kancinci kwaye okunokwenzeka kube nokungalingani.

- Ukomisa nge-vacuum: Ukomisa ngokukhawuleza, ukuthintela i-oxidation, kodwa iindleko zezixhobo ziphezulu kwaye kufuneka indawo eninzi.

- Ukomisa i-nitrogen: Ukuthintela kakuhle i-oxidation, kodwa ixabiso le-nitrogen liphezulu.

Izixhobo eziqhelekileyo:

- FR-4: Isetyenziswa kakhulu, iipropati ezilungileyo zombane/zoomatshini, ixabiso eliphantsi, kodwa ithambekele ekuguqukeni kobushushu obuphezulu—lawula amaqondo obushushu okubuyela umva.

- I-substrate ye-aluminium: I-heat dissipation egqwesileyo yezixhobo zamandla, ifuna unyango lwe-anti-oxidation, kunye nengqwalasela ekudluliseleni ubushushu nge-soldering.

- I-Polyimide (PI): I-PCB eguquguqukayo, ukumelana nobushushu obuphezulu/ukugoba, iindleko eziphezulu kunye nobunzima bokucubungula—ifuna ukuchaneka okuphezulu kokubekwa/ukunyibilikisa.

Ubukhulu obuqhelekileyo: 0.4–2.4mm, ukunyamezelana ± 0.1mm.

- IiPCB ezincinci (0.4–0.8mm): Zinokuguquguquka—sebenzisa izixhobo zokuxhasa kunye nokunyuka kobushushu obucothayo ngexesha lokutywina ukunciphisa uxinzelelo lobushushu.

- IiPCB ezingqindilili (1.6–2.4mm): Uzinzo oluphezulu, zifuna amaqondo obushushu aphezulu okunyibilikisa kunye namaxesha okufudumeza amade; qinisekisa amandla okubopha kwiindawo ezinkulu.

Iinkqubo eziqhelekileyo:

- I-HASL: Ilungele ukunyibilikiswa, umphezulu orhabaxa, inokuba ne-oxidation eshushu kakhulu kunye neentshebe zetin.

- ENIG: Ithe tyaba kakhulu kwaye iyakwazi ukunyibilikisa, kodwa ibiza kakhulu; iileya zegolide ezijiyileyo zinokubangela "ukubhitya kwegolide".

- OSP: Ukhuseleko lwe-oxidation, lufuna ukuthintela ukufuma/ukungcola ngaphambi kokuba kufakwe i-solder ukuze kugcinwe ukunyibilika.

- ENEPIG: Ukusebenza kakuhle kakhulu, kodwa kunzima kwaye kuyabiza.

Ukuhlola: Sebenzisa isixhobo sokuvavanya ubude ukuze ulinganise umahluko wobude okanye isixhobo sokulinganisa ubude esinomphezulu othe tyaba.

Iimpembelelo: Ukubekwa kwepeyinti yesolder engalinganiyo (ukungoneli/ukungagqithisi kwe-solder, ukubopha); ukubekwa kakubi kwezakhi (ii-cold joints, i-false soldering), okuchaphazela ukuchaneka kokubekwa.

Izikhokelo zoyilo: Iiphedi ezibanzi nge-0.1–0.2mm kuneeledi kwicala ngalinye; iiphedi eziziingxande zezixhobo zeChip, ezimile ngendlela yokuba zilingane nejometri yeeledi; isithuba sokuthintela ukubhida (umz., 0.6–0.7mm kwi-0.5mm pitch QFP).

Imiba: Ukugcwala kwe-solder paste okanye ukungoneli kokufakwa kwayo, okukhokelela ekudibaneni nasekubandeni kwamalungu, okuphazamisa ukusebenza kombane/koomatshini.

Indima: Ithintela ukudityaniswa kwe-solder kwii-non-pads, ikhusela umphezulu we-PCB, iphucula ubushushu kunye namandla oomatshini.

Iimpembelelo: Ubukhulu obungalinganiyo/obugqithisileyo bubangela iimpazamo kunye neziphene zomthamo we-solder; iimaski ezincinci zonyusa umngcipheko wokuvala; iziphene zomgangatho (amaqamza, ukuxobuka) zinciphisa ukhuseleko kunye nokuthembeka.

Iimfuneko: Imigca emifutshane/ethe tye yokunciphisa ukuphazamiseka; imigca yamandla/yomhlaba ebanzi yokuthwala umbane; ukwahlulwa komaleko wesignali ukuthintela ukuthetha ngokunqamlezayo; kuphephe ukuhambisa umzila kufutshane neepadi ezinokuthintela ukuprinta/ukubekwa.

Iimpembelelo: Ukuphazamiseka okwandileyo kwesignali (ukuphazamiseka, ingxolo); ubunzima bokuvelisa (iingxaki zokuprinta/zokubeka), uxinzelelo lobushushu olubangela ukuguquka.

Injongo: Beka ii-PCB ngokuchanekileyo ukuze ziprintwe, zibekwe, kwaye zifakwe i-solder ngokuchanekileyo.

Iimpembelelo: Ukuphambuka kobungakanani kubangela ukungahambelani/ukungalingani okungazinzanga, okukhokelela kwiimpazamo zokuprinta/zokubeka; iimpazamo zesimo >±0.1mm zidala ukungahambelani kwenkqubo, zitshintsha izinto xa zithelekiswa neephedi.

Imigaqo: Ubungakanani bephaneli ngaphakathi kwemida yezixhobo (ubude ≤80%, ububanzi ≤70% bobuninzi); iindlela zoqhagamshelo (iithebhu eziqhekekayo 0.8–1.2mm ububanzi, ubunzulu be-V-CUT 1/3–1/2 ubukhulu); uyilo lwecandelo elifanayo ukuze kube lula ukuphatha.

Imiba: Ukuxinana kwee-conveyor, umonakalo ngexesha lokususwa kweepaneli, kunye neziphene zokunyibilikisa ngenxa yoyilo olubi.

Injongo: Vumela indawo kunye nokulinganisa izixhobo ukuze zichaneke ukuprinta/ukubeka.

Iimfuneko: Ijikelezi, ububanzi obuyi-1–3mm (0.5–1mm ukuze kube nokuchaneka okuphezulu); umphezulu ogudileyo, ongena-oxide onomahluko ophezulu; ukuchaneka kwendawo ngaphakathi kwe-±0.05mm.

Iimeko: Indawo eyomileyo, epholileyo (20–25℃, 40–60% RH), kude nelanga elithe ngqo kunye nezinto ezitshayo.

Iimpembelelo: Ukufuma kubangela ukubola kwephedi kunye nokungaguquguquki kakuhle kokunyibilikisa; amaqondo obushushu aphezulu aguqula ii-PCB okanye anciphise iimaski zokunyibilikisa; ukubola konakalisa iimpawu zomphezulu.

Ukuphatha ngendlela eyiyo: Nxiba iiglavu ze-ESD/iibhedi zeminwe, sebenzisa iirakhi/iitreyi ezikhethekileyo, kwaye uphathe ngobunono ukuze uphephe ukungqubana.

Umonakalo: Umonakalo we-ESD kwizixhobo; ukuguquka kwesakhiwo, ukuqhekeka kwephedi, okanye ukuqhekeka ngenxa yokungqubana; uxinzelelo loomatshini oluvela ekuphathweni rhabaxa.

Ukulungisa kwangaphambili: Ukucoca (ilaphu elingena-lint + utywala/isicoci senkunkuma ukuze kungcoliswe); ukomisa (60–80℃ kangangeeyure ezi-2–4 ukuze kususwe umswakama); ukuvuselela umphezulu ngokuzithandela (i-asidi ethambileyo ukuze kususwe i-oxidation, kulandele ukuhlamba).

Injongo: Qinisekisa ukuba iindawo ezicocekileyo nezomileyo zicocekile ukuze kuphuculwe ukunamathela kwentlama yesolder kunye nomgangatho wokutywina.

Ukuqinisekisa ukuhambelana: Thelekisa iphakheji yecandelo/iphimbo le-lead kunye nephedi/indlela ngexesha loyilo; khetha izixhobo/ukugqitywa kwe-PCB ukuze ubone ukuhambelana kobushushu/nokuthengiseka.

Imiba: Izinto ezingalungelelananga kakuhle, ukunyibilika kakubi kwe-solder (amalungu abandayo, aqhekekileyo), kunye nomonakalo woxinzelelo olubangelwa kukungalingani kwe-CTE.

Imiba: I-Pad, indlela yokuhambisa izinto, uyilo lwecandelo, iphaneli, indawo ye-MARK, kunye noyilo lwemaski yesolder.

Uphuculo: Inciphisa iimpazamo (umz., ii-pads ezichanekileyo zinciphisa amazinga eziphene, i-layouts ephuculweyo ibeka isantya), ifinyeza amaxesha omjikelo, kwaye inciphisa iindleko zokuphinda usebenze.

Izizathu: Ukungqubana (izinto/ukupakisha, ii-PCB/ii-rack), ukungeniswa (ukuvuza kwezixhobo), imisebenzi yabantu (ukungqubana kwempahla).

Iingozi: Umonakalo we-ESD kwizinto ezibuthathaka (umz., ii-IC); ukutsala kothuli okuchaphazela indawo/ukunyibilikisa.

Imilinganiselo: Umgangatho we-ESD (10⁶–10⁹Ω), impahla ye-ESD (imitya yesandla ≤1MΩ), izixhobo ezisekelwe phantsi (≤4Ω), ii-ionizers, kunye nokupakisha okuchasene nokunganyakazi.

Iimpembelelo:

- Umswakama ophezulu: Izixhobo zifunxa umswakama (ukungagugi kakuhle kwe-solder), ii-PCB zijikajika, i-solder splatter enokubakho ngexesha lokuphinda iphume.

- Ukufuma okuphantsi: Umngcipheko ophezulu we-ESD, ukutsalwa luthuli.

Ulawulo: Izithambisi-moya + izinto zokususa umswakama, zigcina i-40–60% ye-RH.

Iziphumo: Ukufuma okuphezulu kubangela iziphene zokunyibilika kwe-soldering (ukutshiza, ukubanda kwamalungu); ukufuma okuphantsi kukhokelela kumonakalo we-ESD kunye neengozi ze-short-circuit.

Iimpembelelo:

- Ubushushu obuphezulu: Ukuguga kweenxalenye, iipropati ze-solder paste ezitshintshileyo, zinokuba sengozini yokubanda/ukuqhawuka kwamalungu.

- Ubushushu obuphantsi: Ukwanda koburhabaxa bentlama, ukuprinta okungekho semgangathweni, ukuguguleka okuphezulu kwezixhobo.

Ulawulo: I-air conditioner echanekileyo + izinzwa zobushushu, 20–25℃.

Iziphumo: Ubushushu obuphezulu bonakalisa izixhobo/amalungu e-solder; ubushushu obuphantsi bubangela iingxaki zokunyibilikisa i-solder kunye nezixhobo.

Iimfuneko: Ngokwesiqhelo iKlasi ye-10,000 (ISO 7) okanye ngaphezulu.

Iimpembelelo: Uthuli lubangela iziphene zokunyibilikisa (iishothi/iisekethe ezivulekileyo), ukuguguleka kwezixhobo.

Iindlela: Izihluzi ze-HEPA, iiworkshops ezivaliweyo, ukucoca rhoqo, kunye nolawulo lothuli lwabasebenzi/izixhobo.

Izinto: Ukuhamba kwenkqubo, ukufikelela kulondolozo, ukuphazamiseka phakathi kwezixhobo.

Imiphumo: Ukuphazamiseka komsebenzi, ukugcinwa okunzima, idatha yokuhlolwa engachanekanga.

Ukwenziwa ngcono: Uyilo olunemilo ethe tye/emile okwe-U olusekelwe kwindlela esebenza ngayo inkqubo, kunye nokuguquguquka kokwandiswa.

Okuqulethweyo: Ukuthengwa/ukugcinwa/ukusasazwa kwezinto, ukuphathwa kwe-PCB.

Ukubaluleka: Iqinisekisa ukunikezelwa ngexesha elifanelekileyo, inciphisa iindleko zempahla, iphucula ukusebenza kakuhle.

Iindlela: Iinkqubo zolawulo lwezinto ezisetyenzisiweyo, uyilo lwendawo yokugcina impahla oluphuculweyo, uthutho oluzenzekelayo (umz., ii-AGV).

Izinto: Umgaqo-nkqubo osemgangathweni, incwadi yesikhokelo, iinkqubo, imiyalelo yomsebenzi, iirekhodi.

Ukusekwa: Chaza iinjongo, ukumisela iinkqubo ngendlela efanayo, ukuqeqesha abasebenzi, ukugcina ukulandeleka.

Indima: Inciphisa ukuguquguquka, ijonga iinkqubo, ivumela uphuculo oluqhubekayo.

Uqeqesho ngendima:

- Abaqhubi: Ukusebenza kwezixhobo, ukucwangcisa, ukugcinwa (ithiyori + ukusebenza ngesandla);

- Abahloli: Ukusebenza kwe-AOI/X-Ray, imigangatho (izifundo zetyala + indlela yokusebenza).

Ukubaluleka: Kunciphisa iimpazamo, kuphucula izakhono, kwandisa imveliso.

Izinto ezisetyenziswayo xa kufikwa kwixabiso: Izixhobo, izinto ezisetyenziswayo, abasebenzi, amandla, izibonelelo.

Iindlela: Ukuphucula ukusetyenziswa kwezixhobo, ukuthenga ngobuninzi, amanyathelo okonga umbane.

Impembelelo: Iindleko eziphantsi, ukukhuphisana kwamaxabiso, isikhundla esiqinileyo kwimarike.

Izinto: Ubungakanani beodolo, umthamo wezixhobo, ukubonelelwa kwezinto, abasebenzi.

Indlela: Beka phambili ii-odolo, ixesha le-buffer, amandla okulinganisa imfuno.

Imiba: Izixhobo ezingasebenziyo/ezigcwele kakhulu, ukulibaziseka kokuhanjiswa, ukungalingani kwempahla.

Okuqulethweyo: Iitshati zohambo, imiyalelo yomsebenzi, i-BOM, imigangatho yokuhlolwa.

Inkqubo: Uyilo lweenjineli → uphononongo lwabaphathi → uhlaziyo oluneziphuculo.

Ukubaluleka: Umisela imisebenzi ngendlela efanayo, unceda uqeqesho, kwaye wenza kube lula ukulandelelwa.

Okuqulethweyo: Ukucoca imihla ngemihla, ukugcinwa rhoqo, ukujonga ukhuseleko, ukulinganisa.

Uphuhliso: Ngokusekelwe kwiincwadi zesikhokelo kunye neepateni zokunxiba, beka phambili izixhobo ezibalulekileyo.

Iimpembelelo: Ukuchaneka okunciphileyo, ukonakala rhoqo, ubomi bezixhobo bufutshane.

Indlela yokusebenza: Ukuxilongwa kokuqala → ukuhlolwa kobuchwephesha → ukulungiswa → uvavanyo.

Uphuculo: Uqeqesho, amathala eencwadi amatyala eempazamo, uluhlu lwezinto ezingasetyenziswa.

Iziphumo: Ukungasebenzi kwemveliso, umonakalo oqhubekayo, ukungangqinelani komgangatho.

Idatha eqokelelweyo: Ukusebenza kwezixhobo, iziphene, ukusetyenziswa kwezinto, iiyure zomsebenzi.

Iindlela zokuhlalutya: Iitshathi zePareto, iidayagram ze-fishbone, iigrafu zetrend.

Indima: Uchonga imiqobo, uxela kwangaphambili iingxaki, unika ulwazi ngokwenza izigqibo.

Amanqanaba: Uhlolo loyilo → iprototyping → ukwenziwa ngcono kwenkqubo → ukuqhuba kwepilo → ukuveliswa ngobuninzi.

Iindlela: Intsebenziswano phakathi kwemisebenzi eyahlukeneyo, ukuqinisekiswa kwenkqubo, ulawulo lwekhonkco lokubonelela.

Imingeni: Ukungalingani kwenkqubo yoyilo, ukulibaziseka kwezixhobo, ukunqongophala kwezinto.

Injongo: Ukuqinisekisa uzinzo lwenkqubo kunye nokuhambelana komgangatho.

Amanyathelo: Chaza ububanzi → ukuqinisekiswa kwesicwangciso → ukuphumeza → hlalutya idatha → gqiba.

Iikhrayitheriya: Izinga elifanelekileyo leempazamo ngaphakathi kwemida, iiparameter ezizinzileyo, ukuhambelana kwebhetshi.

Okuqulethweyo: Iinkqubo zokusebenza, iiparameter zezixhobo, iikhrayitheriya zokuhlola, imigangatho yokuhamba.

Ukuphunyezwa: Imiyalelo yomsebenzi, uqeqesho, ukubekwa esweni, izikhuthazo.

Ukubaluleka: Kunciphisa ukuguquguquka, kukhawulezisa imveliso, kwenza kube lula ukungenisa.

Iimpazamo eziqhelekileyo: Ukubekwa kwecandelo ngendlela engalunganga, ukutshintshwa kwe-polarity, iindawo ezingekhoyo, iimpazamo zeparameter.

Iindlela: Izinzwa, iinkqubo zokubona, ulawulo lokufikelela, ukuqinisekiswa koluhlu lokuhlola.

Indima: Inciphisa iziphene, itshintshe iindleko, kwaye iphucula ukuthembeka kwenkqubo.

Imiyalelo: Ukuphucula inkqubo, ukuphucula izixhobo, uphuhliso lwezakhono, ukuphucula i-QMS.

Ukuphunyezwa: Amaqela ophuculo, ukuqokelelwa kweengcebiso, umjikelo we-PDCA.

Ukubaluleka: Kukhuthaza ukukhuphisana, kuyaqhelana notshintsho lwemarike, kukhuthaze ubuchule.

Imigangatho ephambili: IPC-A-610 (umgangatho we-solder), IPC-7095 (iinkqubo ze-BGA), I-JEDEC J-STD-020 (uvakalelo lokufuma).

Ukuthobela imithetho: Uqeqesho, uphicotho-zincwadi lwangaphakathi, iinkqubo zokulandelela, izixhobo ezisemgangathweni.

Imigaqo: I-RoHS (izinto ezithintelweyo), ulawulo lwenkunkuma, ukusetyenziswa kakuhle kwamandla.

Iindlela: Iinkqubo ezingenalo ilothe, iinkqubo zokuphinda kusetyenziswe izinto, izixhobo ezisebenzisa umbane ngendlela eyongayo.

Iziphumo: Iintlawulo, umonakalo obangelwa ligama, ukulahlekelwa yisabelo semarike.

Imigaqo:

- Ukuthintelwa kwezinto ezinobungozi (RoHS);

- Ukulahla inkunkuma ngendlela efanelekileyo;

- Ukugcinwa kwamandla kunye nokunciphisa ukukhutshwa komoya ongcolileyo.

Amanyathelo:

- Iinkqubo ezingenalo ilothe, ukucoca ngamanzi;

- Iinkqubo zokuphinda kusetyenziswe inkunkuma;

- Izixhobo ezisebenzisa umbane ngokugqithisileyo.

Iziphumo: Iintlawulo, umonakalo obangelwa ligama, ukulahlekelwa yisabelo semarike.

Izixhobo zekhonkco lobonelelo:

- Ukuthengwa kwezinto, ulawulo lwababoneleli, uthutho, isitokhwe.

Ulawulo:

- Uvavanyo lomthengisi ofanelekileyo;

- Ubambiswano lwexesha elide;

- Ukulungiswa kwezinto ezifunekayo kunye nolawulo lwezinto ezifunekayo ze-ABC.

Iimpembelelo:

- Imveliso iyekile ngenxa yokunqongophala;

- Iziphene zomgangatho ezivela kwizinto ezimbi;

- Ukulibaziseka kokuhanjiswa kwezinto ngenxa yeengxaki zezothutho.

Iindlela zokuqokelela:

- Uphando lokwaneliseka, iinombolo zoncedo, ukutyelela kwindawo.

Amanyathelo okuphatha:

- Bhala phantsi → hlalutya → sombulula → ulandelela.

Iingenelo:

- Ukwaneliseka okuphezulu kwabathengi, ukuphuculwa komgangatho, kunye nokuthetha kakuhle ngomlomo.

Abaqhubi kunye neenjongo:

- Ukuhlangabezana neemfuno zemarike, ukuphucula ukhuphiswano, ukwandisa isabelo semarike.

Imingeni:

- Imiqobo yobugcisa, iindleko eziphezulu, ukunqongophala kwetalente.

Izisombululo:

- Intsebenziswano phakathi kweyunivesithi neshishini, ukufunyanwa kwemali, uphuhliso lwezakhono.

Izinto eziphambili:

- Izixhobo ezizenzekelayo, i-IoT, idatha enkulu, i-AI, iinkqubo ze-MES/ERP.

Ukuphunyezwa:

- Uvavanyo → ukuphuculwa kwezixhobo → ukuhlanganiswa kwedatha → ukusasazwa kwenkqubo.

Utshintsho:

- Ukusebenza kakuhle okuphezulu, umgangatho ozinzileyo, iindleko eziphantsi, kunye nemveliso enokulungiselelwa ngokwezifiso.

Izinto ezisetyenziswayo:

- Ukuthintela, uvavanyo, iindleko zokungaphumeleli kwangaphakathi/kwangaphandle.

Indlela yohlalutyo:

- Hlela idatha ngokweendidi → hlalutya ii-ratios → ulandelele ii-trends.

Iingcinga:

- Beka phambili uphuculo, uvavanye amanyathelo, uphucule amaqhinga omgangatho.

Iintlobo zomngcipheko:

- Imarike, ubugcisa, umgangatho, uthungelwano lokubonelela, iingozi zabasebenzi.

Inkqubo:

- Chonga (uphando/idatha) → vavanya (umgangatho/ubungakanani) → nciphisa (ukuphepha/ukunciphisa/ukudlulisela).

Ukubaluleka:

- Inciphisa ilahleko, iqinisekisa uzinzo, kwaye yonyusa ukuqina.

Iifomu zentsebenziswano:

- Amashishini adibeneyo, intsebenziswano yobugcisa, i-OEM/ODM.

Imingeni:

- Imiqobo yorhwebo, ukungalingani okuqhelekileyo, umahluko kwiinkcubeko, iingxabano ze-IP.

Amanyathelo:

- Ubuchule, ukuthatha inxaxheba okuqhelekileyo, ukuthengisa okucwangcisiweyo, ukhuseleko lwe-IP.

Ukubaluleka:

- Iphucula ukubonakala, ukuthembeka, kunye nexabiso lemveliso.

Amaqhinga:

- Ukubeka isikhundla (ixabiso elikhethekileyo) → ukunyuswa (imiboniso/imidiya yoluntu/udumo).

Indima:

- Itsala abathengi abatsha, ingena kwiimarike zeprimiyamu, kwaye ikhuthaza ubudlelwane bexesha elide.

Iintlobo ze-IP:

- Amalungelo omenzi, iimpawu zorhwebo, amalungelo okushicilela, iimfihlo zorhwebo.

Amanyathelo:

- Ulawulo oluzinikeleyo, ubhaliso olufike ngexesha, izivumelwano zokungatyhileki.

Ukubaluleka:

- Ikhuthaza uphando nophuhliso, ikhusela ubuchule, kwaye iqinisa ukhuphiswano oluphambili.

Iintlobo zeetalente:

- Iinjineli zeenkqubo/izixhobo/umgangatho, abaphathi bemveliso, abasebenzi be-R&D.

Uphuhliso:

- Uqeqesho lwangaphakathi/lwangaphandle, ukutshintshiselana ngemisebenzi, ukufundiswa.

Izikhuthazo:

- Imbuyekezo, ukunyuselwa, ukuqatshelwa.

Indima:

- Itsala italente, iphucula izakhono, kwaye ikhuthaza ukuveliswa kwezinto ezintsha.

Inkqubo yohlalutyo:

- Ukucocwa kwedatha → ukuhlelwa ngokweendidi → uhlalutyo lwezibalo/ukwembiwa kwedatha → ukubona ngeliso.

Inkxaso yesigqibo:

- Ukulungiswa kwenkqubo, ukugcinwa kwezixhobo, ukubekwa phambili kwe-R&D.

Izinto ekufuneka ziqwalaselwe:

- Ukuchaneka kwedatha, kuphephe ukuxhomekeka kakhulu, uhlaziyo lwemodeli.

Izinto zenkcubeko:

- Imilinganiselo, umbono, umoya, inkcubeko yeziko/yezinto eziphathekayo.

Iindlela zokwakha:

- Khuthaza ifilosofi, uququzelele imisebenzi, ulungelelanise iinkqubo, uphucule imeko-bume.

Iimpembelelo:

- Yomeleza umanyano, iphucula ulwalamano, kwaye ikhuthaza abasebenzi.

Imigaqo engenamkhethe:

- Ukususwa kwenkunkuma, ukwenziwa ngcono kwenkqubo, ukugxila kumgangatho, ukuqhelaniswa nabathengi.

Ukuphunyezwa:

- Ukujonga imephu yemijelo yexabiso, ulawulo lwe-kanban, uphuculo oluqhubekayo.

Imingeni kunye nezisombululo:

- Ukuchasana notshintsho (uqeqesho), ukuzimela (intsebenziswano phakathi kwemisebenzi eyahlukeneyo), izikhewu zeetalente (ukuqeshwa/uphuhliso).

Iimeko zesicelo:

- Ukubeka esweni izixhobo ezikude, uhlalutyo lwedatha yemveliso, intsebenziswano yekhonkco lobonelelo, ukulandeleka kwemveliso.

Uphuculo:

- Amaqonga e-intanethi yezoshishino olawulo oluqhutywa yidatha.

Imingeni:

- Ukhuseleko lwe-intanethi, ukuhambelana kwezixhobo, ukunqongophala kwetalente.

Iimfuno ezithile:

- Hlela (susa izinto ezingezizo ezibalulekileyo), Beka ngolandelelwano (ukubhala iilebheli), Khazimla (ucoceko), Beka izinto ngokwemigangatho (uxwebhu), Gcina (uqeqesho).

Ukuphunyezwa:

- Ukusekwa kweqela → uqeqesho → ukhuphiswano → uphononongo lokusebenza.

Iimpembelelo:

- Indawo ecocekileyo, iziphene ezimbalwa, ukusebenza kakuhle okuphezulu, kunye nokuqonda umgangatho.

Izicelo:

- Uyilo olubonakalayo, ukuhlanganiswa, kunye nokulinganisa imveliso.

Iingenelo:

- Imijikelo ye-R&D emifutshane, iindleko eziphantsi, ucwangciso lwemveliso oluphuculweyo.

Imiqobo:

- Iindleko eziphezulu zesoftware, ubunzima bobuchwephesha, kunye nezikhewu zokulinganisa-inyani.