i-pcb ekhawulezayo

Kuyimfuneko ukulandela ulawulo olulinganayo (impazamo ngaphakathi kwe-±5mil), ukulinganisa i-impedance (i-50Ω/75Ω eqhelekileyo), kunye nomgaqo wesithuba se-3W (ububanzi bomgca obuphindwe kathathu ukuze kuthintelwe i-crosstalk).

Nciphisa ukubonakaliswa kwesignali ngokuphelisa ii-resistor ezifanayo (uthotho oluvela kumthombo okanye oluhambelanayo kwisiphelo), ukulawula ukuthintela okuqhubekayo kokulandelela, kunye nokuphepha ukulandelwa kwe-engile yasekunene (ukubonakaliswa kuyanda nge-30%).

Yenziwe ngemigca emibini yesignali enobude obulinganayo, umgama olinganayo, kunye ne-polarity echaseneyo, inamandla okulwa nokuphazamiseka kunye nomlinganiselo wokungavumi we-common-mode odlula i-40dB.

Ingenisa amandla e-parasitic (malunga ne-0.5pF) kunye ne-inductance (malunga ne-1nH). Inkqubo yokugrumba umva iyacetyiswa ukunciphisa ubude be-stub.

Ngokwesiqhelo kusetyenziswa iileya ezi-4-16, umaleko wamandla kunye nomgangatho womhlaba zidibene ngokusondeleyo, kwaye ubukhulu be-dielectric bulawulwa kwi-0.1-0.3mm ukuqinisekisa uzinzo lwe-impedance.

Kuxhomekeke kububanzi/isithuba somgca (njenge-0.1mm/0.1mm), kwaye uxinano lwendlela kwindawo ye-BGA lunokufikelela kwiitrakhi ezili-100-150/cm².

Yandisa isithuba semigca, faka ukwahlulwa komgca womhlaba, kwaye uphephe imikhondo ehambelanayo edlula i-100mil, nto leyo enokunciphisa ukungqubana ngaphezulu kwe-50%.

Iyanciphisa ukulahleka kwesiginali (malunga ne-3dB), igcina indawo yomphezulu, kwaye yonyusa uxinano lwendlela nge-20%-30%.

Sebenzisa izixhobo ezifana ne-SI9000 ukubala i-impedance yeempawu ngokusekelwe kwi-dielectric constant (FR4 malunga ne-4.4), ububanzi bomgca, kunye nobukhulu be-dielectric.

Sebenzisa ubuncinci umaleko we-dielectric oyi-0.1mm ukuze ukwahlukanise, kwaye uphephe ukujikeleza kwindawo eyahlulweyo xa usahlula umaleko wamandla.

Izixhobo ezisebenzisa i-high-frequency ezifana neRogers 4350B (Dk=3.66, Df=0.004) kunye ne-Isola FR408HR (Dk=3.8, Df=0.007).

I-dielectric constant ephantsi (Dk) inciphisa ukulibaziseka kokudluliselwa, kwaye i-dielectric loss tangent ephantsi (Df) inciphisa ukuncitshiswa kwesignali (ukunciphisa ilahleko ye-0.5dB kwi-10GHz nganye).

Ngokubanzi, kufuneka i-Tg≥150℃, kwaye i-Tg≥170℃ iyafuneka ukuze kufakwe i-solder engenalo i-lead ukuqinisekisa uzinzo olulinganayo kumaqondo obushushu aphezulu.

Ukufunxwa kwamanzi kuya kubangela ukuba ixabiso le-Dk linyuke (malunga ne-5%), nto leyo eyandisa ukulibaziseka kokudluliselwa kwesignali. Izixhobo ezinezinga lokufunxwa kwamanzi

Ifanele ifane ne-CTE yetshiphu (malunga ne-6-10ppm/℃) ukuthintela ukuqhekeka kwejoyinti yesolder okubangelwa kuxinzelelo lobushushu.

Kwizicelo ezisetyenziswa rhoqo, khetha i-RTF (elungisiweyo ngasemva) i-copper foil enoburhabaxa bomphezulu i-Ra

Kufuneka ihambelane nomgangatho we-UL94 V-0 ukuqinisekisa ukhuseleko emlilweni.

Xa ubushushu butshintsha ngo-±20℃, ukuguquguquka kwe-Dk kungaphantsi kwe-2% ukuqinisekisa ukuhanjiswa kwesignali okuzinzileyo.

Izixhobo ezingasebenzi kakuhle zineendleko eziphezulu. Khetha izixhobo ezifanelekileyo ngokwesantya sesignali (ezifana ne-FR4 ephuculweyo ngaphantsi kwe-10GHz).

Kufuneka imelane neekhemikhali ezifana nee-etchants kunye ne-soldering fluxes, ngesantya sokugqwala

Ukubhola→ukuplanga→ukudluliselwa kwepateni→ukukrola→imaski yesolder→unyango lomphezulu (njengegolide yokuntywilisela, i-OSP), ngolawulo oluchanekileyo lwe-±0.05mm.

Umaleko wesignali ≥18μm, kunye nomaleko wamandla ≥35μm ukuqinisekisa amandla okuthwala umsinga kunye nokuthembeka kwesignali.

Sebenzisa iteknoloji ye-laser direct imaging (LDI) enomlinganiselo wobubanzi bomgca obuyi-±0.02mm kunye ne-etching factor ≥3.

Ubukhulu bemaski yesolder yi-0.02-0.05mm. Ubukhulu obugqithisileyo buya kuchaphazela i-impedance. Kucetyiswa ukuba uvule iifestile zemigca yesignali yesitshixo.

Kwimiqondiso ye-high-frequency, khetha igolide yokuntywiliselwa (umaleko we-Au 0.05-0.1μm) okanye unyango lomphezulu wesilivere olune-contact resistance

Ubushushu bokunyibilika kwakhona kwe-soldering obuphezulu buyi-245-255℃, kwaye ixesha lesigaba solwelo liyi-60-90s ukuqinisekisa ukuba ubukhulu beleya ye-solder joint IMC yi-1-3μm.

Ukuchaneka kokubekwa kwezinto ze-0201 yi-±0.05mm, kwaye i-pin offset yezixhobo ze-QFP yi-

Sebenzisa ukucoca okusekelwe emanzini okanye okune-semi-aqueous ngee-ionic residues

Sebenzisa ukusika nge-milling okanye nge-laser panel kunye noxinzelelo olushiyekileyo

Bhaka kwi-120℃ iiyure ezi-2-4 ukususa umswakama ebhodini nokuthintela ukuqhuma kwebhodi ngexesha lokutywina.

Sebenzisa i-network analyzer (efana neKeysight N5244B) enoluhlu lweemvamisa zovavanyo lwe-1-40GHz kunye nempazamo ye-±5%.

Uvavanyo lwedayagram yamehlo (ubude bamehlo ≥80%, ububanzi bamehlo ≥70%), uvavanyo lwe-S-parameter (S11 -3dB).

Fumana izithuba zangaphakathi kwi-BGA solder joints (umlinganiselo we-void

Ingabona ii-short circuits, ii-open circuits, ii-component placement offsets (ukuchaneka ± 0.02mm), kunye neempazamo ze-polarity.

Uvavanyo olugubungela ii-key nodes luyi-≥95% ukuqinisekisa ukuchaneka koqhagamshelo lombane.

Akukho nto ifunekayo kwisixhobo, singavavanya ii-PCB ezinoxinano oluphezulu, kwaye isantya sokuvavanya singama-50-100 amanqaku ngomzuzu.

Ubushushu obuphezulu kunye nokufuma (85℃/85% RH, 1000h), ukutshayiswa kobushushu (-40℃ ~ 125℃, imijikelo eli-1000).

I-voltage yovavanyo yi-500V, kwaye ukumelana nobushushu yi-≥10GΩ ukuqinisekisa ukwahlulwa kwesignali.

I-voltage yovavanyo yi-1000V umzuzu omnye ngaphandle kokuphazamiseka okanye ukutshayelwa.

Faka kwi-oven yenkcenkce engama-235℃, ixesha lokumanzisa lingaphantsi kwemizuzwana emi-3 kwaye indawo yokunkcenkceshela ingaphezulu kwama-95%.

Ukulahleka okukhulu kwezinto ezibonakalayo, ukungafani kwe-impedance, ii-traces ezinde kakhulu (ukuncipha kwe-angiometric kwandisa nge-2dB kwi-10cm nganye), kunye nee-vias ezininzi kakhulu.

Lungiselela ii-resistor zokuphelisa, lungisa i-trace topology, kwaye unciphise inani lee-vias kunye nezihlanganisi.

Yongeza umaleko wokukhusela, lungisa indlela eya kuyo, kwaye ufake ukwahlulwa komgca womhlaba ukuze unciphise i-crosstalk nge-30%-50%.

Yandisa ii-capacitor ezidibanisayo (indibaniselwano ye-0.1μF+10μF), lungisa ulwakhiwo lwemaleko yamandla, kwaye ufinyeze indlela yonikezelo lwamandla.

Uxinzelelo olugqithisileyo lobushushu, ukungalingani kwe-CTE, ijika lobushushu elingafanelekanga le-soldering, kunye nesantya sokulungiswa kwakhona kufuneka sibe

Sebenzisa isixhobo sokuvavanya i-flying probe okanye i-micro-ohmmeter echanekileyo ukuya kuthi ga kwi-0.1mΩ kunye nendawo ebekwe kuyo

Ixhasa iibhendi zefrikhwensi ye-millimeter-wave (24-40GHz), ilahleko ephantsi (ilahleko

Izinga lokudluliselwa kwe-100Gbps+, ukuthembeka kwesignali elungileyo, kunye nenkxaso yetekhnoloji yokudibanisa uxinano oluphezulu (HDI).

Iileya zamandla ezininzi, ii-backplanes ezinesantya esiphezulu (ilahleko

Ukuphatha idatha enkulu (i-bandwidth 1TB/s+), kufuneka kulawulwe i-crosstalk kunye ne-delay, kunye noxinano lweentambo oludlula ii-traces ezingama-200/cm².

Ubushushu bokusebenza buyi -40℃ ~ 125℃, buphumelele isiqinisekiso se-AEC-Q100, kwaye buhlala ixesha elide kune-15 leminyaka.

Uyilo olulula (ubuninzi 100,000 iiyure), kunye nokumelana nemitha.

Ukuthobela imigangatho yokhuseleko lombane lwezonyango (IEC 60601), kunye nokuphazamiseka kwesignali

Ukongeza iileya zokwahlukanisa, kusetyenziswa izihlanganisi ezikhuselweyo, ukuphucula iinkqubo zokumisa umhlaba, kunye nokukwazi ukulwa nokuphazamiseka okuphuculwe ngama-40%.

Ukusebenzisa izixhobo zesiqhelo (ezifana ne-FR4), ukwenza lula iinkqubo, kunye nokwenza ngcono uyilo, iindleko zincitshiswe ngama-20%-30%.

Ukusebenzisa ii-PCB ezisekwe kwisinyithi okanye ii-thermal ngokusebenzisa ii-arrays, kunye nokumelana nobushushu okuncitshiswe yi-30% kunye nobushushu bomphezulu

I-Ansys HFSS, i-Cadence Sigrity, i-ADS, enempazamo yokuchaneka kokulinganisa

Ukwakha imodeli yenethiwekhi yamandla kunye nokuhlalutya ingxolo yamandla (i-ripple

Ixesha lokunyuka kwesignali yokufaka (

Ukuchaza imithombo yokuphazamiseka kunye nemigca yexhoba, ukuseta isithuba kunye nobude, kunye nesiphumo sokulinganisa kunye nempazamo yokulinganisa

Ukuhlalutya ilahleko yokudluliselwa kwesignali (S21) kunye nokubonakaliswa (S11) ukuvavanya ukusebenza kwenkqubo.

Ukusebenzisa ukulinganisa i-time-domain okanye i-frequency-domain, ukugxila kwingxolo kwi-frequency band ye-100kHz-100MHz.

Ukuqikelela ubungakanani bemitha (

Ukuseta ubushushu obungqongileyo, i-coefficient yokusasazwa kobushushu, kunye nokusetyenziswa kwamandla, kunye nempazamo yokusasazwa kobushushu

Ukuthelekisa i-impedance, imizobo yamehlo, kunye ne-S-parameters, kunye nokuhlalutya izizathu zomahluko (ezifana ne-parasitic parameters kunye neempazamo zenkqubo).

Uhlalutyo olupheleleyo lwesignali, amandla, ubushushu, kunye nokusebenza koomatshini, kunye nokusebenza kakuhle koyilo oluphuculweyo ngama-40%.

IPC-6012 (iinkcukacha zokusebenza kwebhodi eprintiweyo), i-IEEE 802.3 (imigangatho ye-Ethernet), i-JEDEC (imigangatho yokupakisha).

GB/T 4588 (iinkcukacha ngokubanzi zeebhodi zesekethe eziprintiweyo), SJ/T 11364 (ulawulo longcoliseko lweemveliso zolwazi lwe-elektroniki).

Kubandakanya ulawulo lwe-impedance, imithetho yocingo, uyilo lwe-layer stack, iimfuno ze-EMC, njl.njl., iindidi ezili-12 eziphambili zeenkcukacha.

Ukunyamezelana kobubanzi bomgca ±10%, ukunyamezelana kobubanzi bomngxuma ±0.05mm, uburhabaxa bomphezulu uRa

Ukuthobela iRoHS 2.0 (ukuthintela izinto eziyingozi ezi-6), iREACH (ukulawula izinto ezingama-224).

Kufuneka uphumelele iziqinisekiso ze-UL, CE, kunye ne-FCC ukuqinisekisa ukhuseleko lombane kunye nokuhambelana kwe-electromagnetic.

Kulandela inkqubo yolawulo lomgangatho ye-ISO 9001, ene-CPK ≥1.33.

Ukuthobela i-GJB 362B (iinkcukacha ngokubanzi zeebhodi eziprintiweyo), kunye neemfuno ezingqongqo zokuguquguquka kwendalo.

Ukuthobela i-ISO 13485 (inkqubo yolawulo lomgangatho wezixhobo zonyango), kunye neemfuno zokulandeleka eziyi-100%.

Emva kwe-IATF 16949, kunye nezinga lokufaneleka kokungaguquguquki kwemveliso ≥99.5%.

Iifrikhwensi eziphezulu (iibhendi zefrikhwensi yeterahertz), ilahleko ephantsi (Df

I-AI iphucula uqhagamshelwano lwentambo (ukusebenza kakuhle kunyuswe ngama-60%), iqikelela imiba yokuthembeka kwesignali, kwaye ivelisa ngobuchule imithetho yoyilo.

Ukufezekisa ukwenziwa ngokukhawuleza kwezakhiwo ezintsonkothileyo ngokuchanekileyo kwe-0.1mm kunye nokunciphisa iindleko ze-30%.