I-PCB efakiweyo

I-PCB efakwe ngaphakathi yibhodi yesekethe enezinto ze-elektroniki (ezifana neetships, ii-resistor, kunye nee-capacitors) ezifakwe ngqo kwiileya zayo zangaphakathi, nto leyo enciphisa ubungakanani kunye nokuphucula ukusebenza.

Ii-PCB ezifakiweyo zinokugquma ezinye izinto ukuze kuncitshiswe ukuxinana kwendawo kwaye kufinyezwe iindlela zesignali; izinto ezikwii-PCB eziqhelekileyo zixhonywa kakhulu kumphezulu.

Ifanelekile kwiimeko ezineemfuno eziphezulu zobukhulu kunye nokusebenza, ezinje ngeefowuni eziphathwayo, izixhobo ezinxitywayo, iirada zezithuthi, kunye nezixhobo zeenqwelo-moya.

Uhlalutyo lweemfuno → uyilo lweskimu → ucwangciso loyilo (kubandakanya izinto ezifakwe ngaphakathi) → uyilo lwendlela (gxila ekugqibeleleni kwesignali) → ukujonga imithetho yoyilo → imveliso yefayile yebhodi.

Cinga nge-dielectric constant, i-loss factor, kunye ne-thermal expansion coefficient. Kwizicelo ze-high-frequency, khetha izinto ezi-low-dielectric-constant kunye nezi-low-loss materials; ukuze uzinzo lwe-thermal oluphezulu, khetha izinto ezine-low thermal expansion coefficients.

Ukubeka izinto ngokweemodyuli ezisebenzayo ukuze kufinyezwe iindlela zesignali; ukusasaza izinto ezivelisa ubushushu ukuze kususwe ubushushu; beka izinto ezibuthathaka kude nemithombo yengxolo; cinga ngokwenzeka kwenkqubo.

Iiresistor zenziwa ngokongeza izinto ezikhuselayo kumaleko we-dielectric; ii-capacitors zisebenzisa izinto ezine-dielectric ephezulu ezigqunywe kwi-copper foil okanye kwi-substrates; ii-inductors zenziwa ngee-spiral coils phakathi kwee-layers.

Qinisekisa uqhagamshelo lombane oluthembekileyo, cinga ngokuchithwa kobushushu, ukuvavanywa, kunye nokugcinwa, kwaye ulandele izikhokelo zoyilo lwabenzi beetships.

Cwangcisa umbane kunye neeleya zomhlaba ngokwendlela osetyenziswa ngayo umbane, qinisekisa ukuthembeka kwendiza yombane, unciphise ukumelana kwangaphakathi kunye nokuhla kwevolthi, kwaye unikeze umbane ozinzileyo.

Lawula ubude bomkhondo, seta ububanzi bomkhondo kunye nesithuba esifanelekileyo ukuze unciphise i-crosstalk, ulinganise ukuthintela kwemiqondiso yesantya esiphezulu, kwaye unciphise impembelelo yeeparamitha ze-parasitic.

Kuxhomekeke kwizixhobo kunye noyilo lwendlela, inokufikelela kwi-Gbps ezininzi okanye ngaphezulu ngoyilo olufanelekileyo, njenge-10 Gbps kwizixhobo zonxibelelwano eziphezulu.

Sebenzisa iifomula ezifana nefomula yomgca we-microstrip (Z0 = (87/√(εr+1.41))×ln(5.98H/(0.8W+T))) okanye iifomula ze-stripline, okanye sebenzisa isoftware yoyilo ukubala.

Ichatshazelwa kukulahleka kwezinto (ukulahleka kwe-dielectric/conductor), ubude bomkhondo, imvamisa yesiginali, inani lee-vias, kunye nokungafani kwe-impedance.

Yahlulahlula uyilo lweesekethe ze-analog nezedijithali, ukhusele imiqondiso ebuthathaka, uqinisekise ukuthembeka kwamandla kunye neenqwelo-moya zomhlaba, sebenzisa iisekethe zesihluzi, kwaye ulungise ii-traces ukunciphisa indawo ye-loop.

Misela iindawo ezinkulu zokumisa umhlaba, yandisa ii-via zokumisa umhlaba, mfutshane iindlela zokumisa umhlaba, kwaye ukhethe i-single-point/multi-point/hybrid grounding ngokwexesha.

Hlalutya iiparameters ezifana ne-power network impedance, i-voltage drop, kunye nokusasazwa kwangoku ngesoftware yokulinganisa ukuze kuvavanywe iimpembelelo kunye nokwenza ngcono.

Amandla aqinileyo okulwa nokuphazamiseka, acinezela ukuphazamiseka kwendlela eqhelekileyo, aphucula izinga lokudluliselwa kunye nokuthembeka, kwaye enze kube lula ukuhambisa umbane ngoxinano olukhulu.

Gcina ubude buhambelana (umahluko ≤ 10% womgama wokudluliselwa ohambelana nomda wokunyuka kwesignali), ububanzi bomkhondo obufanayo kunye nesithuba, ukuthintela ukujikeleza (umz., 100Ω), kwaye uphephe ukuthetha ngokuphambana.

Nciphisa ubukhulu, yongeza i-anti-pad, yongeza ii-grounding vias ezijikeleze, kwaye ulawule umlinganiselo womda (≤6).

Yenza uhlalutyo lokulinganisa imiqondiso, ukuthembeka kwamandla, kunye novavanyo lwe-EMI simulation, kwaye uvavanye iiprototypes (umz., usebenzisa ii-network analyzers kunye nee-oscilloscopes).

Imiselwa bubude bezinto, inani leeleya, amandla oomatshini, kunye neemeko zokusetyenziswa, ezifana ne-0.5-1.5mm yee-PCB zefowuni ephathwayo kunye ne-1.6-3.2mm yezixhobo zoshishino.

Cinga ngokudibanisa nezinye izinto, amandla oomatshini, indawo yokusasaza ubushushu, kunye nefuthe lokufakwa kwento ekusebenzeni koomatshini.

Lungisa ngokufanelekileyo izinto ezivelisa ubushushu, yongeza imijelo yokusasaza ubushushu (umz., imingxunya yobushushu, ifoyile yobhedu), khetha izixhobo zokuhambisa ubushushu eziphezulu, yongeza izixhobo zokusasaza ubushushu ukuba kuyimfuneko, kwaye ulungiselele ngokulinganisa ubushushu.

Iindlela eziqhelekileyo ziquka ukulungisa izikrufu, ukulungisa izikliphu, kunye nokulungisa iintsimbi, ezifanelekileyo ekugcinweni kakuhle, ekufakelweni okulula, kunye neemeko ezizinzileyo, ngokulandelelana.

Phucula amandla oomatshini ngokwandisa ubukhulu bebhodi okanye ukongeza izinto zokuqinisa, usasaze ubunzima ngokulinganayo, sebenzisa izinto ezithintela ukubetheka ukuze ubambe, kwaye uqinise izinto ezibalulekileyo.

Tshatisa isingxobo sesixhobo, phepha imiphetho ebukhali, cinga ngeenkqubo zokuvelisa (umz., ukusika, ukunyathela), kwaye uyile izakhiwo ezikhokelayo ze-plug-in.

Faka ipeyinti yokuthintela ukungcola kathathu, sebenzisa izihlanganisi ezingangeni manzi, yenza unyango lokutywina, kwaye uphephe ukubeka izinto ezibalulekileyo kwiindawo ezinokuba namanzi/uthuli ngexesha lokubeka.

Amaqondo obushushu aphezulu anokubangela ukwanda kwebhodi kunye nokushukuma kweparameter yecandelo; amaqondo obushushu aphantsi anokubangela ukuba izinto zibe buthathaka. Ii-PCB zomgangatho wezimboni zisebenza kwi -40℃ ~ 85℃, kunye neemfuno ezingqongqo zomgangatho wemikhosi.

Hlalutya ukuguquguquka kunye nokusasazwa koxinzelelo ngokusebenzisa ukulinganisa uxinzelelo loomatshini, kwaye wenze impembelelo, uvavanyo lokungcangcazela, kunye novavanyo lokwaluphala lwexesha elide.

Izinto ezahlukeneyo zinamandla ahlukeneyo oomatshini kunye nee-coefficients zokwandisa ubushushu. Umzekelo, i-FR-4 isebenza kakuhle ngokupheleleyo kodwa i-coefficient yokwandisa ubushushu ephezulu, ngelixa izinto ze-polyimide zibonelela ngozinzo olungcono lobushushu kunye namandla oomatshini.

Ii-PCB ezifakiweyo zifuna iinkqubo ezongezelelweyo zokufakela izinto, ezifana nokwenziwa kwesakhiwo esiphakathi kwee-layer kunye ne-lamination echanekileyo ngakumbi, kunye neemfuno eziphezulu zokubhola kunye nokuchaneka kweplating.

Kubandakanya i-lamination, i-micro-via processing (i-aperture ≤50μm), i-component embedding, kunye nonyango lomphezulu (umz., i-gold plating, i-tin spray).

Cacisa ukunyamezelana okuchanekileyo kuyilo, sebenzisa izixhobo ezichanekileyo (ezifana noomatshini bokubhola be-CNC), kwaye wenze uhlolo oluqinileyo lobukhulu kunye nohlengahlengiso lwenkqubo kwinkqubo nganye.

Hlola izinto ezisetyenzisiweyo (iibhodi, izinto ezisetyenziswayo), jonga iiparameter ze-lamination/drilling/plating, sebenzisa uvavanyo lwe-X-ray kunye ne-flying probe ukuze ubone uqhagamshelo lwangaphakathi kunye nokusebenza kombane, kwaye wenze uhlolo olupheleleyo lweemveliso ezigqityiweyo.

Amaqamza okugquma/ukudilika, ukugqobhoza ukungalingani/ukuvulwa okungalinganiyo, unxibelelwano olubi lwecandelo/umjikelo omfutshane, unyango olubi lomphezulu, ukuphambuka kobukhulu, njl.njl.

Lungiselela ubushushu be-lamination, uxinzelelo, kunye neeparameter zexesha, iibhodi zokulungisa kwangaphambili ukususa umswakama kunye nokungcola, kwaye usebenzise i-vacuum lamination ukukhupha umoya.

Sebenzisa izixhobo zokubhola ezichanekileyo kakhulu ukulawula iiparameter, wenze i-micro-etching kwiindonga zemingxunya ukuphucula ukunamathela kwe-copper plating, kwaye ufumane umgangatho ngokusebenzisa i-metallographic sectioning.

Hlola kwaye uvavanye izinto ngaphambi kokuzifaka, phucula iinkqubo zokuzifaka ukuqinisekisa uqhagamshelo oluqinileyo, kwaye wenze uvavanyo olupheleleyo lombane kunye novavanyo lokuthembeka emva kokwenziwa.

Ichaphazeleka ziindleko zezinto (izinto ezisebenza kakuhle zibiza kakhulu), ubunzima benkqubo (umz., ii-micro-vias, ukufakwa kwezixhobo), ubungakanani bemveliso, kunye neendleko zokuhlola.

Phanda ngamandla obuchwephesha (izixhobo, iinkqubo), iinkqubo zokulawula umgangatho, iimeko zemveliso, uphononongo lwabathengi, iikowuteshini, kunye namaxesha okuhambisa.

Kubandakanya ukuhlolwa okubonakalayo, uvavanyo lombane (i-multimeter, i-oscilloscope, i-network analyzer), uvavanyo olusebenzayo, uvavanyo lwe-X-ray, uvavanyo lwe-flying probe, njl.

Sebenzisa izixhobo ze-ICT ukuze uqhagamshelane neendawo zovavanyo kwaye ufumane iiparameter zombane zecandelo, ii-short circuits, ii-open circuits, ii-parameter deviations, njl. Iindawo zovavanyo kufuneka zigcinwe kuyilo.

Lingisa imeko-bume yokusebenza yokwenyani, vavanya imisebenzi ngokupheleleyo, ulandele ulandelelwano lweemvavanyo ezisisiseko ukuya kwezintsonkothileyo, kwaye urekhode kwaye uhlalutye izinto ezingaqhelekanga.

Sebenzisa i-JTAG interface ukuze usebenzise iiseli zokuskena umda wangaphakathi we-chip, ufumane imeko ye-pin kunye noqhagamshelo lwe-inter-chip, kwaye uchonge iimpazamo ze-open kunye ne-short circuit.

Okokuqala jonga imbonakalo (izinto ezitshileyo, amalungu aqhekekileyo e-solder), uze wenze uvavanyo lombane ukunciphisa uluhlu lweziphene, uhlalutye amakhonkco anokubakho ngokusekelwe kwi-schematic, kwaye usebenzise indlela yokutshintsha ukuze ubone indawo yeziphene.

Iphezulu kakhulu, njengoko izinto zikwii-layers zangaphakathi. Ifuna ukususa ngononophelo ii-layers eziphezulu ukuze iveze indawo yempazamo, i-laminate kwakhona ukuze kubuyiselwe ukuthembeka emva kokulungiswa, kwaye kuthintelwe iimpembelelo kwezinye ii-circuits.

Sebenzisa izixhobo ezichanekileyo kakhulu ezifana nezixhobo zokuwelda ezikwi-micro-spot kunye nee-tweezers ezichanekileyo. Cwangcisa inkqubo yokulungisa kwangaphambili kwaye usebenzise ukufudumeza okukufutshane ukulawula ubushushu.

Yenza uvavanyo lombane (ukuthembeka kwesignali, ukuthembeka kwamandla), uvavanyo lokusebenza, kunye novavanyo lokuthembeka (ukwaluphala, ukungcangcazela).

Ukuphuhlisa izicwangciso zovavanyo, iinkqubo zokuxilonga iimpazamo, iinkcukacha zokusebenza kolondolozo, kunye neenkqubo zokuqinisekisa umgangatho.

Izixhobo zokuvavanya: i-multimeter, i-oscilloscope, i-network analyzer, njl. Izixhobo zokulungisa: izixhobo zokuwelda ze-micro-spot, i-hot air gun, njl.

Cinga ngokuchaneka kokuxhathisa, umlinganiselo wamandla, kunye nomlinganiselo wobushushu. Khetha izithinteli ngokusekelwe kwiimfuno zesekethe.

Isetyenziselwa ukucoca, ukwahlulahlula, ukugcina amandla, ukudibanisa isignali, njl.

Qinisekisa ngokusekelwe kwisantya sokusebenza, i-inductance, kunye nomthamo wangoku. Kwisihluzo samandla, cinga nge-ripple kunye ne-load current.

Cinga ngokusebenza, ukusetyenziswa kwamandla, uhlobo lwephakheji, ukuthembeka, kunye nenkxaso yomenzi.

Tshatisa iiparameter zombane kunye nobukhulu obubonakalayo ngexesha loyilo. Khetha izinto ezihambelana nezixhobo zebhodi kunye neenkqubo, kwaye wenze uqinisekiso lokulinganisa.

Kwizinto ezingasebenziyo, lawula ubushushu kunye nexesha lokuthintela ukunyibilika kwe-cold soldering. Kwizinto ezisebenzayo, sebenzisa izixhobo ezichanekileyo kakhulu (umz., ukunyibilika kwe-reflow soldering) ukuqinisekisa uqhagamshelo oluthembekileyo kunye nokuthintela umonakalo wobushushu.

Qikelela ubomi ngokusebenzisa iimvavanyo zokwaluphala ezikhawulezileyo, idatha yomenzi, kunye nokubeka esweni ixesha elide idatha yokusilela yokwenyani.

Ukuxhathisa: ukutyibilika kwexabiso/isekethe evulekileyo. I-Capacitor: ukuvuza/isekethe emfutshane. I-Inductor: utshintsho lwe-inductance/ukujika okufutshane. I-Chip: ukusilela kokusebenza/iimpazamo zephini.

Gcina ngokweendidi ezinomswakama kunye nokhuseleko lwe-ESD. Gcina inkqubo yokugcina impahla ukuze ubhale ulwazi, wenze iisampulu rhoqo, kwaye ulawule amanqanaba esitokhwe ngokufanelekileyo.

Yandisa isithuba se-trace (≥3×ububanzi), sebenzisa i-ground isolation, ulungise i-routing topology, kunye ne-match impedance.

Faka iiparameter ze-parasitic, mhlawumbi ezinokubangela ilahleko kunye nokulibaziseka kwiifrikhwensi eziphezulu. Ii-Vias zesignali ezingaphezulu kwe-10GHz kufuneka zibe nobubanzi obungaphantsi kwe-0.3mm.

Yongeza izixhobo zokukhusela i-ESD (umz. ii-TVS diodes), seta iindlela zokukhupha i-ESD, kwaye ugcine umkhondo wesignali yesitshixo ≥2mm ukusuka kwimiphetho yebhodi.

Sebenzisa i-X-ray ukuhlola amalungu angaphakathi e-solder. Ukuphakama kwamalungu kufanele kube yi-0.4-0.6mm, kunye nesantya se-void ≤15%.

I-ENIG yokutshiza rhoqo nangokuchaneka. I-OSP yexabiso eliphantsi (isebenza iinyanga ezi-6-8). I-tin yokuntywila yokutshiza ngamaza.

Beka kakuhle izigqubuthelo zekhaka ezine-grounding impedance

Ububanzi obuyi-0.3-0.5mm, isithuba esiphakathi kwe-≤1mm, ≥100 vias/cm² ukuqinisekisa ukusebenza kakuhle kokusasazwa kobushushu.

Imigca yedatha ye-DDR4: ukunyamezela ubude ±5mil. Iipawundi ezahlukeneyo ze-PCIe: ±2mil.

Yongeza ii-capacitors zokuqhawula (0.1μF kwi-frequency ephezulu, 10μF kwi-frequency ephantsi). Gcina isithuba sombane/somhlaba esingaphantsi kwe-0.1mm.

Umgangatho we-IPC: ≤0.7% kwiinkqubo ezingenalo ilothe, ≤0.5% kwiindawo ze-BGA.

Sebenzisa i-dynamic voltage scaling, vula iimodyuli ze-idle down, kwaye ukhethe ii-chips ze-low-IQ (umz., uthotho lwe-TI MSP430).

Nciphisa ukulahleka kwesiginali kunye neeparamitha ze-parasitic, yonyusa uxinano lwendlela. Ixabiso liphezulu ngama-20%-30% kunee-vias ezidlula kwimingxunya.

Sebenzisa izixhobo ze-CAM350 okanye ze-Altium DFM ukujonga ububanzi/isithuba esincinci se-trace (≥6mil), umlinganiselo we-aspect (≤8:1), njl.

Iindlela eziqhelekileyo: ipeyinti yokuthintela ezintathu (ubukhulu obuyi-0.1-0.3mm), i-nano-coating (

Sebenzisa uyilo lwe-fan-out ukunciphisa uxinzelelo lwe-BGA routing. Iibhodi ezineeleya ezi-4 zilungele i-80% yeemfuno eziqhelekileyo; ≥ iileya ezi-6 zoyilo olukhawulezayo.

Jonga ukucoceka kwephedi, ubukhulu bepaste yesolder (0.12-0.15mm), kunye nobushushu bokuphinda ubuye (incopho 235-245℃).

Sebenzisa i-megohmmeter ye-500V. Ukumelana nobushushu kufuneka kube yi-≥100MΩ kumswakama we-≤60%.

Sebenzisa izithinteli zokuphelisa (umz., umsebenzi we-DDR ODT) kunye nokunciphisa i-impedance. Qinisekisa ukuba utshintsho lwe-impedance lungaphantsi kwe-10%.

I-1oz copper (35μm): ~1A/mm ububanzi bomkhondo. 2oz: ~1.5A/mm (ukunyuka kobushushu

Umnyama unceda ekuchitheni ubushushu kodwa kunzima ukuwujonga. Uluhlaza luxhaphake kakhulu. Umhlophe ubonakalisa ukukhanya okuphezulu (≈80%).

Ububanzi obuqhelekileyo: 0.4-0.8mm. Iphithi: 0.5-1.0mm. Iphithi engu-0.5mm ifuna izinto ezingama-0201.

Sebenzisa isoftware yokulinganisa efana ne-ANSYS, ngokusekelwe kumahluko e-CTE (umz., FR-4 15ppm/℃, i-copper 17ppm/℃).

Sebenzisa ukucoca okunezigaba ezininzi (iisekethe zohlobo lwe-π). Ububanzi be-Power traces obuyi-≥20mil ukunciphisa ukuthintela indlela.

Ububanzi ≥0.6mm, isithuba ≥1.27mm. Ukugqitywa komphezulu ENIG, akukho gquma lemaski yesolder.

Indawo yeluphu yesignali enesiphetho esinye

Sebenzisa i-SI9000 ukubala i-impedance, ukunyamezelana kolawulo ±10%. Sebenzisa ukulinganisa ukuphela kunye nokwenza ngcono i-topology.

Umda: ± 0.1mm. Ububanzi bemingxuma: ± 0.05mm. Ubunzulu be-V-Cut: 1/3-2/3 yobukhulu bebhodi.

Sebenzisa imikhondo ehambelana nobude benyoka kunye nokukhusela umhlaba. Gcina kude nemigca yedatha ekhawulezayo kwaye uphephe ukunqumla iileya.

Yenza uvavanyo lokwaluphala olukhawulezileyo (85℃/85%RH, 1000h) kunye novavanyo lokungcangcazela (5-500Hz, ukukhawulezisa kwe-2G).

Ubungakanani bephedi bukhulu kuneentsimbi zecandelo eziyi-0.1-0.2mm. Ububanzi bephedi ye-SMD 1.2-1.5× ububanzi bephedi.

Yandisa indawo yobhedu olushushu, sebenzisa iglu yobushushu (≥1W/mK), kwaye uvule ii-vias zobushushu phantsi kwezixhobo zamandla.

Ngokwe-IEC 61000-4-2: ukukhupha okuchukumisayo ±8kV, ukukhupha umoya ±15kV, kunye nokusebenza okuqhelekileyo.

Ubukhulu obuqhelekileyo yi-15-25μm. Kufuneka igqunywe ngokupheleleyo yikopolo ukuze kuthintelwe ukuba i-short circuits ingangeni kwikopolo eveziweyo.

Hlanganisa indlela yokusebenzisana kunye nendlela ezenzekelayo. Beka izinto eziza kuqala kwindlela, kunye neempawu ezibalulekileyo eziqala ngendlela.

Ubushushu: 120-150℃ (60-90s). Ukuphinda kusebenze: 217-230℃ (40-60s). Izinga lokuphola: 3-6℃/s.

Umhlaba onenqaku elinye okanye amanqaku amaninzi. Amanqaku amaninzi kwiisekethe ezisebenzisa i-frequency ephezulu (>10MHz), kunye nokumelana nomhlaba

Cinga ngomthamo wangoku, ukumelana noqhagamshelwano (

Jonga amalungu e-solder ngecandelo le-Metallographic (i-metallographic sectioning), fumana iziphene zomphezulu nge-AOI, hlalutya ukwakheka kwezinto nge-XRF.

Isithuba se-5mil, i-impedance eyi-100±10Ω, umahluko wobude