I-PCB yobhedu obukhulu

Ibhekisa kwiibhodi zesekethe eziprintiweyo ezinobukhulu befoyile yobhedu obuyi-≥3oz (105μm), ezisetyenziswa kwizixhobo zamandla ezinamandla aphezulu, kwii-elektroniki zeemoto, njl.njl.

Iinkcukacha eziqhelekileyo ziquka i-3oz, i-4oz, i-5oz, i-6oz, kunye ne-20oz ephezulu.

Iindleko zokwenza ziphezulu ngama-30%-80% ngenxa yobunzima bokugrumba, ixesha elide lokufaka i-electroplating, kunye nesantya esiphezulu se-scrap.

Kwifoyile yobhedu eyi-3oz, eqhelekileyo yi-8mil/8mil, kwaye iinkqubo ezikhethekileyo zinokufikelela kwi-5mil/5mil.

Ifuna ukufumbatha ixesha elide ukuqinisekisa ukuba umaleko wobhedu uyafana. Ubukhulu bobhedu obunemingxuma kufuneka bufikelele kwi-25-75μm, kwaye umahluko phakathi kwemingxuma evulekileyo kunye neendonga unokwenzeka.

Ngokwesiqhelo yi-0.8-1.2, enokwandiswa ibe ngaphezulu kwe-1.5 ngokusika inyathelo okanye ngokwenza i-laser.

Yandisa ii-vias zokusasaza ubushushu (i-aperture ≥0.4mm), sebenzisa izixhobo zokuhambisa ubushushu ezisekelwe kwisinyithi, kwaye uyile iileya zefoyile yobhedu enkulu.

Kwifoyile yobhedu eyi-1oz, amandla okuthwala umbane wentambo ecala linye xa kunyuke ubushushu obuyi-10℃ amalunga ne-1A/mm, kwaye i-3oz inokwandiswa ibe yi-2.5-3A/mm.

Okukhona ifoyile yobhedu ityebile, kokukhona ithambile. Akukhuthazwa ukugoba ngaphezu kwe-6oz, kwaye ubuncinane berediyasi yokugoba ye-3oz yi-≥5mm.

Umda wobubanzi bomgca ≥20%, umngxuma omncinci ≥0.3mm, ubukhulu bobhedu obunomngxuma ≥25μm, kwaye wonyusa uxinano lwamanqaku ovavanyo.

Isantya sokujikeleza siphantsi ngama-20%-30% kuneso se-PCB eqhelekileyo (malunga nee-60,000-80,000 revolutions ngomzuzu), kwaye izinga lokutya liyi-0.02-0.04mm/rev.

I-ENIG ifanelekile kwiisignali ezisebenzisa i-frequency ephezulu. I-OSP inexabiso eliphantsi kodwa inamandla okumelana ne-oxidation. I-hard gold plating ifanelekile kwii-connectors ezixhuma kakhulu.

Kwibhendi yefrikhwensi ye-10GHz, ukulahleka kwesiginali yefoyile yobhedu eyi-6oz kuphezulu nge-1.5dB/intshi kuneye-1oz.

Uyilo lwefoyile yobhedu olulinganayo, ubushushu be-lamination yi-180-200℃, uxinzelelo yi-100-150psi, izinga lokupholisa ≤3℃/min.

I-standard ye-IPC ≤12.5μm, imiqondiso yesantya esiphezulu ifuna ≤5μm, enokuphuculwa ngokubeka i-chemical copper + ukuzaliswa kwe-electroplating.

Umndilili weshishini yi-75%-85%, kwaye isivuno esingaphezulu kwe-6oz sinokwehla ngaphantsi kwe-70%.

Izithuthi ezintsha zamandla (iipile zokutshaja, ii-inverters), izixhobo zamandla zoshishino, izixhobo zamandla zeseva, i-aerospace kunye nezinye iindawo.

Usetyenziso oluqhelekileyo lwe-0.8-1.2mil, olusebenzisa amandla aphezulu lufuna i-1.5-2mil, ekufuneka igqunywe ngefoyile yobhedu ukuze kuthintelwe ukurhubuluza.

Nciphisa iinkqubo ezikhethekileyo, hlanganisa ubukhulu befoyile yobhedu, wandise ubungakanani bebhetshi, kwaye uphephe ii-vias ezininzi ezingaboniyo/ezingcwatywe.

Umthamo wonyango wesisombululo se-acidic copper plating umalunga ne-100-150Ah/L, kwaye amanqanaba ee-copper ion kunye nee-chloride ion kufuneka ahlalutywe rhoqo.

Amandla okuxobuka ≥1.5N/mm (1oz), i-3oz ifuna ≥2.5N/mm.

Sebenzisa i-substrate ye-Tg ephezulu (≥170℃), uxinzelelo olufanayo lwe-lamination, kwaye ususe inkunkuma ye-drill ngexesha elifanelekileyo emva kokugrumba.

Ubushushu besisombululo sokugrumba nge-alkaline yi-45-55℃, ubunzima obuthile yi-1.2-1.3, uxinzelelo lokutshiza yi-0.8-1.2MPa.

Ii-Vias kufuneka zigqunywe nge-100% nge-solder mask, kwaye ubungakanani bokuvula bukhulu nge-0.2-0.3mm kunomngxuma ukuze kuthintelwe ukugcwala kwe-solder.

Utshintsho kubukhulu befoyile yobhedu lubangela ukuguquguquka kwe-impedance. Kubalulekile ukulinganisa nokulungisa ububanzi bomgca kunye nobukhulu be-dielectric ngokunyamezela kwe-±5%.

Inkqubo eqhelekileyo yi-0.3mm, kwaye ukubhola nge-laser kunokufikelela kwi-0.15mm kodwa ngexabiso eliphezulu.

Kufuneka iphumelele uvavanyo lokuntywiliselwa kwetin oluphindwe kathathu lwe-260℃/10s ngaphandle kokwahlulwa kodonga lwemingxuma okanye ukuxotyulwa kwefoyile yobhedu.

Xa i-Ra＞3μm irhabaxa, ilahleko yesiginali iyanda nge-10%-15%, kwaye kufuneka i-copper foil (VLP) erhabaxa esezantsi.

Sebenzisa uyilo lwefoyile yobhedu ene-mesh, yonyusa iindlela ze-current shunt, kunye nobubanzi bomgca weendlela eziphambili ≥10mil.

I-voltage eqhelekileyo eyi-≥4mil, ifuna i-≥8mil ukuthintela ukuqhekeka kwe-flashover.

Uxinano lwangoku yi-0.8-1.2A/dm², ulawulo oluchanekileyo loxinzelelo lokongeza, kunye nexesha lokufaka i-electroplating liphindwe kabini ukuya kathathu kune-PCB eqhelekileyo.

Sebenzisa isixhobo sokulinganisa se-3D optical, esine-warpage ≤0.7% kunye ne-local deformation ≤0.1mm.

Ixesha lokuntywiliselwa ≤ imizuzwana emi-3, i-engile yokumanzisa

Lungiselela uyilo lwephaneli, nciphisa inkunkuma yomda, kwaye usebenzise uyilo lokwahlulahlula ubukhulu befoyile yobhedu olunezitepsi.

Uxinzelelo lwe-ion yePalladium yi-0.02-0.05g/L, ubushushu buyi-30-35℃, ixesha liyimizuzu eli-10-15 ukuqinisekisa ukugqunywa okufanayo kodonga lomngxuma.

Ubukhulu be-dielectric obuyi-1mil bunokumelana malunga ne-500V, kwaye isithuba se-insulation kunye nesithuba se-copper foil kufuneka zenziwe ngokwenqanaba le-voltage.

Umswakama wokugcina ≤40%, ubushushu ≤25℃, ukupakishwa ngexesha elifanelekileyo emva kokulungiswa komphezulu, kusetyenziswa iingxowa ezingangenisi umswakama kunye nezinto zokucoca ulwelo.

Isantya sokusika i-milling singu-25,000-30,000 revolutions ngomzuzu, izinga lokutya liyi-800-1200mm/min ukuthintela i-edge burrs.

Bhaka kwi-150-160℃ imizuzu engama-60-90, ubunzima buya kuba yi-≥2H, kwaye ukunamathela kuyaphumelela kuvavanyo olunqamlezileyo.

Ububanzi bendawo eyahlulweyo ≥20mil, phepha ii-engile ezibukhali, kwaye uqhagamshele iileya zamandla ezahlukeneyo nge-arrays.

Ubulukhuni beVickers ≥80HV ukuthintela umonakalo kunye nokuguguleka koomatshini.

Inkqubo ye-DES, uxinaniso lwe-potassium permanganate yi-80-100g/L, ubushushu yi-60-70℃, ixesha yimizuzu eli-15-20.

Sebenzisa izixhobo ze-dielectric eziphantsi ze-Dk/Df, lawula uburhabaxa be-copper foil, kwaye ulungise ukuqhubeka komhlaba.

Ukuqhoboshela emva kokuqhoboshela, kugcinwe kwi-120-150℃ kangangeeyure ezi-2-3 ukuze kukhululwe uxinzelelo.

Kufuneka imelane nokusula nge-isopropyl alcohol, i-flux, njl.njl., ngaphandle kokudumba okanye ukutshintsha umbala.

Isithuba esingange-≥20mil, kuthintelwe ubushushu obugqithisileyo, kwaye kungasetyenziswa indlela yokwenza intyatyambo yeplam.

Itekhnoloji ye-electroplating etyhalwayo, isithuba se-anode-to-board yi-10-15cm, kwaye ujonge rhoqo ukunyibilika kwe-anode.

Ixabiso lokubhoboza nge-laser limalunga nezihlandlo ezi-3-5, kodwa ngobuchule obuphezulu kunye nokuvulwa okuncinci.

Ukuwelda ngesilivere kuyakhawuleza, i-ENIG ithembekile kakhulu, kwaye i-OSP kufuneka igqibe ukuwelda zingadlulanga iiyure ezingama-72.

Khetha i-substrate ene-CTE efana neye-copper foil (efana ne-Tg FR-4 ephezulu ene-CTE emalunga ne-14ppm/℃) ukunciphisa uxinzelelo lobushushu.

Umgangatho we-IPC ufuna ii-pores eziyi-≤10/cm², kwaye usetyenziso oluthembekileyo kakhulu lufuna ii-pores eziyi-≤5/cm², ezinokuphuculwa ngokufakelwa kwe-electroplating ngemingxunya.

Ububanzi bephedi = ububanzi bemingxuma + 0.6mm (eqhelekileyo), kwaye kufuneka ukonyuka kwe-0.1-0.2mm kwiindawo zobhedu olungqindilili ukuze kulungiswe ukuphambuka kokugrumba.

I-Black solder resist inomoya oshushu kakhulu, kwaye ubushushu bomphezulu buphezulu ngama-3-5℃ kune-white solder resist, kodwa ayinampembelelo ingako ekuchithekeni kobushushu ngokubanzi.

Ubukhulu beleyile ye-nickel yi-3-5μm, ubukhulu beleyile yegolide yi-0.05-0.1μm, isisombululo seplating pH yi-4.8-5.2, ubushushu yi-85-90℃.

Kusetyenziswa inkqubo yokugrumba ngekhemikhali, apho ubuninzi bokugrumba ngekhemikhali bulawulwa kwi-0.5-1μm, okanye unyango lokugrumba ngoomatshini.

I-voltage yovavanyo eqhelekileyo yi-1000V AC/1 minute, kwaye usetyenziso lwe-voltage ephezulu lufuna ukonyuswa ukuya kwi-2000-5000V AC.

Phantsi kwe-3oz copper foil, uxinano lwentambo olucala linye lucetyiswa ukuba lube yi-≤15cm²/100cm², kwaye iibhodi ezineeleya ezininzi kufuneka zilinganisele ukuthembeka kwesignali kunye nomthamo wokuthwala umbane.

Izinga lokwandiswa kufuneka libe yi-≥20% ukuqinisekisa ukuba akukho kuqhekeka phantsi koxinzelelo loomatshini.

Iibhodi ze-±50μm (eziqhelekileyo), kunye nezikhawulezayo kufuneka ziphuculwe zibe yi-±25μm, kusetyenziswa inkqubo yokubeka i-laser.

Kufuneka imelane nokutshiza kwakhona kwe-solder kwi-280℃ imizuzwana emi-5 ngaphandle kokuqhekeka okanye ukuqhekeka.

Uvavanyo lwe-90° peel lusetyenziselwa ukurekhoda amandla e-peel ngobubanzi beyunithi nganye, ngomgangatho oqhelekileyo ongu-≥1.5N/mm.

Umlinganiselo wobunzulu bomngxuma ongaboniyo ukuya kububanzi bomngxuma (umlinganiselo womngxuma) ≤3:1 ukuthintela ukuzaliswa kakubi kwe-electroplating.

Umthamo we-phosphorus kumaleko we-nickel plating ongena-electroless kufuneka ulawulwe kwi-7%-9% ukuqinisekisa ukumelana nokugqwala.

Kusetyenziswa izixhobo zokusika ezigqunywe nge-coated (ezifana ne-TiAlN coating), kwaye izixhobo zokusika zitshintshwa rhoqo (zitshintshwa rhoqo emva kwe-50-100㎡ yokucubungula).

Lawula ukuqhubeka kwe-impedance, nciphisa ubude be-Stub, sebenzisa i-differential signal transmission, kwaye wongeze umaleko wokukhusela.

Usetyenziso oluchanekileyo oluyi-±10% (oluqhelekileyo) kunye nolunefuthe eliphezulu kufuneka lulawulwe ngaphakathi kwe-±5%.

Uvavanyo olunqamlezileyo, kwaye lufanelekile ukuba indawo ye-脱落 emva kokuxobuka iteyiphu yi-≤5%.

Kusetyenziswa ukuthululwa kobhedu olufana negridi (isithuba segridi ≤10mil) ukulinganisela ukuthwala kombane kunye nokubuya kwesignali.

Uxinzelelo lokutsalwa ≤15MPa, uxinzelelo lokucinezela ≤10MPa, ukuthintela ukuguquka kwefoyile yobhedu.

Akukho ntsalela ye-resin okanye inkunkuma yokubhola, kuqinisekiswa kukujongwa kwecandelo le-metallographic.

Emva kokwaluphala kwi-85℃/85% RH kangangeeyure ezili-168, umahluko wombala ΔE≤3.

Iprofayili yomphezulu isetyenziselwa ukulinganisa ixabiso leRa, kwaye iRa yefoyile yobhedu eqhelekileyo yi≤5μm.

I-via enye eyi-0.5mm inokuthwala malunga ne-0.5-1A, kwaye inani lee-via kufuneka limiselwe ngokwemfuno yangoku.

I-X-ray fluorescence spectrometer (XRF) isetyenziselwa ukulinganisa ubukhulu bomaleko wobhedu kwiindawo ezahlukeneyo, ngokuphambuka okungu-≤10%.

Ukunyamezelana kobukhulu bomzobo ±0.1mm, ukuphambuka kwe-engile ±0.5°.

Tshatisa i-terminal impedance, lungisa i-trace topology, kwaye unciphise i-right-engile traces kunye ne-impedance discontinuities.

Ukuxinana okuncinci kunokunyangeka nge-chemical micro-etching, kwaye ukuxinana okuqatha kufuna unyango lokuphinda kufakwe umphezulu.

Uxinzelelo lwesikrini 25-35N/cm, uxinzelelo lwe-squeegee 3-5kg/cm, isantya 30-50mm/s.

Umaleko wamandla kunye nomaleko womhlaba zikufutshane, umaleko wesignali ubekwe embindini, kwaye ukufana kobukhulu obuphakathi kulawulwa.

Kusetyenziswa isixhobo sokuvavanya ubunzima be-micro-Vickers, apho umgama phakathi kwamanqaku ovavanyo ≥0.5mm, kunye nexabiso eliqhelekileyo lithathwa.

Kusetyenziswa indawo yokubeka amanqaku, kwaye ukuphambuka kuyafunyanwa kwaye kuhlawulwe sisixhobo se-AOI.

Emva kokuhlikihla ama-500 (uxinzelelo lwe-500g), akukho kurhawuzelelwa okubonakalayo okanye ukuvezwa kobhedu.

Sebenzisa izinto ezisetyenziswa kumaleko we-buffer (ezifana neefilimu zokuncamathelisa ezisebenzisa ubushushu) okanye uyilo lweendawo zokunciphisa uxinzelelo.

Kungasetyenziswa i-resin plugging + i-surface electroplating, okanye i-solder paste filling ize icubungulwe.

Indlela yokugqobhoza igesi okanye ukujonga i-metallographic microscope isetyenziselwa ukubala inani lee-pores kwindawo nganye.

Isantya esiphezulu kakhulu sinokubangela ii-burrs, kwaye isantya esiphantsi kakhulu sichaphazela ukusebenza kakuhle, nto leyo ekufuneka ilungiswe ngokobukhulu be-copper foil.

Yandisa isithuba sokulandelela (umthetho we-≥3W), faka imigca yesikhuseli somhlaba, kwaye ulungise ukwabiwa komaleko wendlela.

Uxinzelelo olushiyekileyo luya kubangela ukuguquka kwefoyile yobhedu kunye nokuqhekeka, okunciphisa ukuthembeka kwexesha elide.

Iziphene zasekuhlaleni zingaphinda zishicilelwe ngesandla, kwaye iziphene zendawo enkulu kufuneka ziphinde zishicilelwe kwaye zilungiswe.

Kwisithuba esingaphezulu kwe-≥20mil, inani libalwa ngokwemfuno yokuthwala umbane, kwaye zisasazwa ngokulinganayo.

Indlela ye-X-ray diffraction okanye uvavanyo lwe-stress ring isetyenziselwa ukulinganisa ixabiso loxinzelelo lwangaphakathi.

Uburhabaxa obukhulu buya kubangela ukungalingani kwe-electroplating kwaye kwandisa umahluko wobukhulu be-hole copper.

Emva kovavanyo lokwaluphala lwe-UV (iiyure ezingama-500), akukho mbala okanye itshokhwe.

I-hard gold plating inobomi bokufaka nokukhupha obungaphezulu kwe-1000 amaxesha, kwaye inkqubo yegolide yokuntywiliselwa imalunga ne-50-100 amaxesha.

Ixabiso lee-vias ezingaboniyo nezingcwatyiweyo liphezulu ngama-30%-50% kuneleemingxuma ezidlulayo, kwaye ukunyuka kwexabiso kubaluleke kakhulu kwimeko yekopolo etyebileyo.