I-PCB yomngxuma oyimfama

I-blind via yi-via edibanisa umaleko wangaphandle kunye nomaleko wangaphakathi we-PCB ngaphandle kokungena ebhodini lonke. Idla ngokusetyenziswa kwii-PCB ezinee-layers ezingaphezu kwezine kwaye inokunyusa uxinano lwe-component nge-15%-20%.

I-billed via yi-via edibanisa iileya ezimbini okanye ngaphezulu zangaphakathi ze-PCB ngaphandle kokuqhagamshelana neeleya zangaphandle, nto leyo enceda ekunciphiseni inani leeleya kunye nokuphucula ukuthembeka kwesignali.

Ii-vias ezingaboniyo zidibanisa umaleko omnye wangaphakathi kunye nomaleko omnye wangaphandle, zingena kancinci ebhodini; ii-vias ezingcwatyiweyo zidibanisa ii-levels ezininzi zangaphakathi, zingena ngokupheleleyo kwii-levels ezidibeneyo, kwaye azinakujongwa ngamehlo.

Ingaphucula uxinano lwezixhobo, ibonelele ngeentambo eziguquguqukayo, inciphise iindleko, iphucule ukuthembeka kwesignali, kwaye inciphise amandla e-parasitic.

Isetyenziswa rhoqo kwiimveliso ezinesithuba esiphezulu kunye neemfuno zokusebenza ezifana neefowuni eziphathwayo, iithebhulethi, izixhobo zonyango, kunye neekhompyutha ezikumgangatho ophezulu.

Ubuncinane bokugrumba nge-laser yi-0.1mm, kwaye ubuncinci bokugrumba nge-traditional yi-0.15mm.

Ububanzi bee-vias ezingcwatyiweyo buqhele ukuba phakathi kwe-0.3mm - 0.5mm.

Kwimigqomo yendabuko, umlinganiselo wobunzulu nobubanzi yi-0.75:1.

Ngokufanayo nee-vias ezingaboniyo, umlinganiselo wobunzulu nobubanzi bee-vias ezingcwatyiweyo ngokugrumba kwendabuko ngokubanzi kufuneka ulawulwe ngaphantsi kwe-

Ewe, kuba iinkqubo zabo zokuvelisa ziyinkimbinkimbi, zifuna iinkqubo ezingakumbi, izixhobo ezichanekileyo, kunye novavanyo olungqongqo, nto leyo enyusa iindleko.

Kwavela ukuba kuhlangatyezwane neemfuno ze-miniaturization kunye nokuhlanganiswa okuphezulu kweemveliso ze-elektroniki kunye nokuphucula uxinano lwesekethe lwee-PCB.

Zidibanisa umaleko omnye wangaphakathi kunye nomaleko omnye wangaphandle.

Zidibanisa iileya ezimbini okanye ngaphezulu zangaphakathi kwaye azidibani neeleya zangaphandle.

Ngenxa yokuba azingeni kwisakhiwo sebhodi yonke, zithatha indawo encinci kunemingxunya eqhelekileyo egqunywe ngeplanga, nto leyo evumela ukuba izinto zibekwe zixinene ngakumbi.

Ngokutsiba iileya zangaphandle, abayili banokusebenzisa iileya ezimbalwa ze-lamination xa behambisa iileya zangaphakathi.

Xa kuthelekiswa nemingxunya yendabuko, ii-vias ezingaboniyo zinendlela emfutshane, enokuphucula ukuthembeka kwesignali ukuya kwinqanaba elithile, kodwa zibuthathaka kancinci kunee-vias ezingcwatyiweyo.

Ngenxa yokuba azidibani neengqimba zangaphandle, amandla e-parasite avelisiweyo mancinci, nto leyo enceda ekuphuculeni ukusebenza kwamaza aphezulu.

Ayizizo kakuhle njengee-via ezingcwatyiweyo. Ii-via ezingcwatyiweyo zinokuthintela imiqondiso yokuphazamiseka evela kwiileya zangaphandle ukuba ingadibani nemigca yomaleko wangaphakathi, ngelixa ii-via ezingaboniyo ziqhagamshela kwiileya zangaphandle, ngoko ke isiphumo sokukhusela silinganiselwe.

Indlela eyimfama; Indlela engcwatywe ngayo.

Zinenani eliphezulu kwiindawo ze-PCB eziphezulu nezixineneyo, kwaye ngenxa yokunciphisa iimveliso ze-elektroniki, inani liyakhula.

Izinto ezinje ngobukhulu bomngxuma, ubunzulu bomngxuma, umlinganiselo wobunzulu nobubanzi, ukulungelelaniswa kwemigangatho ephakathi, ukuthembeka kwesignali, ukusasazwa kobushushu, kunye neendleko kufuneka ziqwalaselwe.

Ububanzi obuncinci bendandatho ye-annular kwii-vias ezifihliweyo kunye nee-blind vias yi-0.15mm, kwaye kwii-laser blind vias, yi-0.10mm.

Imiselwa ngokwendawo yomaleko wangaphakathi ekujoliswe kuwo kunye nobukhulu bebhodi, kwaye kufuneka ulawulo oluchanekileyo ukuqinisekisa ukuma kumaleko ochanekileyo.

Nika ingqalelo ekuhambelaneni ngokuchanekileyo phakathi kweeleya, phepha ukungqubana nezinye ii-vias okanye ii-traces, kwaye ucwangcise ngokufanelekileyo iindawo zokuphucula ukuhanjiswa kwesignali.

Ewe, kodwa uyilo oludibeneyo luya kwandisa ubunzima kunye neendleko zokuvelisa, kwaye kufuneka kuthintelwe kangangoko kunokwenzeka.

Ingenza isakhiwo se-stack-up sibe bhetyebhetye ngakumbi, inciphise inani leeleya, kwaye iphucule ukuhanjiswa kwesignali, kodwa yonyusa ubunzima bokuvelisa.

Cwangcisa ngokusengqiqweni inani, ubungakanani, kunye nohlobo lwee-vias, kuphephe ukuyilwa ngokugqithisileyo, kwaye ukhethe iinkqubo ezifanelekileyo zokuvelisa.

Isetyenziselwa uqhagamshelo lwephini kwiphakheji ye-BGA, enokunciphisa intsalela yesiginali kwaye iphucule uxinano lwendlela.

Zama ukunciphisa ubude bee-via ezingcwatyiweyo, ukunciphisa inani lee-via, ukuqinisekisa ukudluliselwa kwesignali emfutshane nethe ngqo, kunye nokunciphisa ukulahleka kwesignali.

Ubushushu bungathunyelwa kwindawo yokulahla ubushushu ngeendlela ezifana nokudibanisa i-thermal pad ukuze kuthintelwe ubushushu obujikeleze ii-vias.

Uqhagamshelo okanye uqhagamshelo ngqo ngee-pads ezimile okwe-teardrop ukuqinisekisa uqhagamshelo olukhuselekileyo noluthembekileyo.

Uqhagamshelo oluthembekileyo, umbane osebenza kakuhle, kunye nokuphepha iingxaki zonxibelelwano olubi kunye neengxaki zesekethe evulekileyo.

Umgama ukusuka kwi-via ukuya kwi-trace kunye ne-pad yi >=0.25mm, kwaye ububanzi be-isolation pad yi >= drill diameter + 0.6mm.

Nciphisa ubungakanani bee-vias, ubeke ngendlela efanelekileyo, nciphisa indlela yesignali, kwaye ii-vias ezingcwatyiweyo ezingadibaniyo neengqimba zangaphandle kunokunciphisa amandla e-parasitic.

Ukuphathwa ngendlela engafanelekanga kuya kuba nempembelelo. Umzekelo, ii-vias ezinkulu kakhulu, ezininzi kakhulu, okanye ezingasasazwanga ngokulinganayo zinokunciphisa amandla oomatshini.

Cwangcisa ngokusengqiqweni iindawo ezibekwe kuzo ii-vias kunye ne-traces, ulandele imigaqo yokuthembeka kwesignali, kwaye usebenzise amanyathelo okukhusela xa kuyimfuneko.

Landela imigaqo yendlela emfutshane, isignali efanelekileyo, ukuphepha iingxabano, kunye nokwenza izinto ngokulula.

Lungisa ii-vias kunye ne-traces ngokufanelekileyo, nciphisa indawo yee-current loops, kwaye usebenzise amanyathelo afana nee-shielding layers.

Inani elifanelekileyo lee-vias linokuphucula ukusebenza, ngelixa ezininzi kakhulu zinokunyusa ukuphazamiseka kwesignali, zinciphise amandla oomatshini, kwaye zonyuse iindleko.

Lungisa ngokufanelekileyo iindawo ze-vias ngokweendawo ze-component pins kunye necala lokuhamba kwesignali ukuze kube lula ukunxibelelana.

Iindlela eziphambili kukugrumba ngoomatshini kunye nokugrumba nge-laser. Ukugrumba ngoomatshini kufanelekile kwiindawo ezinkulu, kwaye ukugrumba nge-laser kunobunono obuphezulu kwaye kufanelekile kwiindawo ezincinci.

Ngokwesiqhelo, ngaphambi kokuba kufakwe iibhodi ezinamaleko amaninzi, ii-vias ezingcwatywe phakathi kwamaleko angaphakathi zenziwa ngeenkqubo ezifana nokubhola kunye ne-copper plating.

Ukuchaneka kuphantsi kakhulu kunokugrumba nge-laser. I-aperture ngokubanzi inkulu kune-0.15mm, kwaye umlinganiselo wobunzulu nobubanzi yi-

Ukuchaneka okuphezulu, kungenza ubuncinci bomngxuma we-0.1mm, umlinganiselo wobunzulu nobubanzi >0.75:1, kunye nomonakalo omncinci ebhodini.

Sebenzisa iinkqubo zokubeka izinto ezichanekileyo kwaye ulawule ngokungqongqo iinkqubo ezinje ngokugrumba kunye nokugquma.

Ukulawula ngokuchanekileyo ubunzulu, ukuphepha ukuphambuka kokugrumba, kunye nokuqinisekisa umgangatho wempembelelo yodonga kunye ne-copper plating.

Iingxaki ezinje ngokuphambuka kokulungelelaniswa kwee-interlayer, i-copper plating engalunganga kwi-via, kunye neendonga ezirhabaxa.

Ngokubanzi, indibaniselwano ye-electroless copper plating kunye ne-electroplating isetyenziselwa ukuqinisekisa ukuhanjiswa kombane okuhle kodonga oluhamba ngentambo.

Imfuneko eqhelekileyo kukuba ubukhulu be-copper plating bungabi ngaphantsi kwe-18μm, ngokuxhomekeke kwiimfuno zemveliso.

Kufuneka indawo ecocekileyo, engaguqukiyo yobushushu kunye nokufuma ukuze kuncitshiswe impembelelo yothuli kunye notshintsho kubushushu kunye nokufuma kwinkqubo.

Kufuneka izixhobo zokubhola ezichanekileyo, izixhobo zokugquma ubhedu, izixhobo zokugquma, njl.njl., kwaye ukubhola nge-laser kuneemfuno eziphezulu kwiindidi zezixhobo.

Izinto ezinje ngobukhulu bomngxuma, ubungakanani, iimfuno zokuchaneka, inkqubo yokwenziwa, kunye neendleko zezixhobo.

Ukuchaneka kokubhola ulawulo, umgangatho wodonga lwemingxuma, umgangatho wokugquma ubhedu, ukuchaneka kokulungelelaniswa kwee-interlayer, njl.

Ukuhlolwa okubonakalayo, ukulinganiswa kwembobo, ukulinganiswa kwendawo yomngxuma, ukufunyanwa kobukhulu beplati yobhedu, uvavanyo lokusebenza kombane, njl.

Ukwahlulahlula nokurisayikilisha, ukubuyisela nokucokisa inkunkuma yesinyithi, kunye nokulahla enye inkunkuma ngokuhambelana neemfuno zokhuseleko lokusingqongileyo.

Ukubhola nge-laser kusetyenziswa amandla amaninzi, kwaye ukusetyenziswa kwamandla kwenkqubo yonke yokuvelisa kuyahluka ngokuxhomekeke kwinkqubo nakwizixhobo.

Phucula ukuchaneka, unciphise iindleko, unciphise imijikelo yemveliso, kwaye wandise isivuno.

Abaqhubi bafuna ukhuseleko lokuthintela umonakalo we-laser kunye nokubola kweekhemikhali, kwaye izixhobo kufuneka zigcinwe kwaye zihlolwe rhoqo.

Ezifana netekhnoloji yokubhola nge-laser echanekileyo kakhulu, iinkqubo ezintsha zokugquma ubhedu, njl.

Kukho imigangatho efanelekileyo yeshishini, kwaye amashishini nawo anemigangatho yangaphakathi yokuqinisekisa ukuhambelana kwenkqubo kunye nozinzo lomgangatho.

Ngokujonga ngamehlo, ukulinganisa umngxuma, ukulinganisa ubunzulu bomngxuma, ukufumanisa ubukhulu be-copper plating, uvavanyo lokuqhubeka kombane, njl.

Ngenxa yokuhlolwa okungabonakaliyo, ukulungelelaniswa kwee-interlayer kubonwa kakhulu yi-X-ray, ukuhanjiswa kombane kubonwa ngovavanyo lokusebenza kombane, kwaye ubukhulu be-copper plating buyalinganiswa, njl.

Iindonga zemingxuma ezirhabaxa, ukuphambuka kwemingxuma, ubunzulu bemingxuma obungonelanga, ipleyiti yekopolo engaphucukanga, izinto zangaphandle emngxunyeni, njl.

Ukuphambuka kokulungelelaniswa kwee-interlayer, ii-copper plating voids, ii-open circuits, i-residual glue emngxunyeni, njl.

Ngokuxhomekeke kuhlobo lwesiphene, singaphinda sigrunjwe, siphinde sifakwe ithusi, okanye sisuswe izinto zangaphandle. Iziphene ezinzulu zisenokufuna ukukhuhla.

Kunzima ukulungisa iingxaki ezinje ngokuphambuka kokulungelelaniswa kwe-interlayer. Kwi-copper plating voids, ukuphinda ufake i-copper kunokwenziwa, kwaye ukukrazula kuyadingeka kwiimeko ezinzima.

Phantsi kokusetyenziswa nokugcinwa okuqhelekileyo, ilingana nobomi bePCB, kwaye ingasebenza ngaphakathi komjikelo wobomi beemveliso ze-elektroniki ngokubanzi.

Iingxaki ezinje ngokugqwala kwe-copper plating layer, ii-open circuits, kunye nokudluliselwa kwesignali okungaqhelekanga kunokwenzeka.

Thatha amanyathelo okuzikhusela, phepha iindawo ezinobungozi ezifana nokufuma kunye nobushushu obuphezulu, kwaye wenze uhlolo kunye nolondolozo rhoqo.

Kuxhomekeke kwindawo yokusetyenziswa kwemveliso kunye neemfuno zayo. Ngokubanzi, iimveliso ze-elektroniki zihlolwa ngokupheleleyo ngexesha lokuveliswa kwaye zithathwa iisampulu rhoqo ngexesha lokusetyenziswa.

Iimayikroskopu, izixhobo zokulinganisa umngxuma, izixhobo zokuhlola i-X-ray, izixhobo zokuvavanya ukusebenza kombane, njl.

Ngokusekelwe kwimigangatho yoshishino kunye neemfuno zoyilo lwemveliso, ezinje ngokunyamezela ukuvuleka kwentsimbi, imigangatho yobukhulu be-copper plating, njl.

Gcina ucocekile, thintela ukuchaphazeleka ngaphandle, kwaye ujonge rhoqo inkangeleko kunye nokusebenza kombane.

Iindawo ezifumileyo zinokubangela ukubola komaleko wepleyiti yobhedu, nto leyo echaphazela ukuhanjiswa kombane kunye nokudluliselwa kwesignali. Kufuneka amanyathelo okumelana nokufuma.

Ubushushu obuphezulu bunokubangela ukwanda kunye nokuguquguquka kwezinto, okuchaphazela ukuchaneka kwemingxunya kunye nokuthembeka koqhagamshelwano. Ukuchithwa kobushushu kunye nokumelana nobushushu obuphezulu kwezinto kufuneka kuqwalaselwe.

Uyilo olufanelekileyo lunokumelana nokuphazamiseka kwe-electromagnetic ukuya kwinqanaba elithile, kungenjalo iingxaki ezifana nokuphazamiseka kwesignali zinokwenzeka.

Thelekisa namaxabiso aqhelekileyo, hlalutya izizathu zokuphambuka, umisele ukuba zingaphakathi koluhlu olwamkelekileyo na, kwaye unike isiseko sokuphucula inkqubo.

Ukuhlangabezana nemigangatho yokuhlolwa kuyafaneleka, kwaye ukugqitha umlinganiselo wokunyamezela okanye ukuba neziphene ezichaphazela ukusebenza akufanelekile.

Ixesha lokulungisa, abasebenzi bokulungisa, umxholo wokulungisa, idatha yokuhlolwa, iingxaki ezifunyenweyo kunye neemeko zokusingatha, njl.

Ngenxa yesidingo sezixhobo zobungcali kunye netekhnoloji, iindleko zokuhlola ziphezulu kakhulu, ngokukodwa kuxhomekeke kwizinto zokuhlola kunye nobungakanani.

Isetyenziselwa imigca yokudlulisa isignali ukwandisa uxinano lweentambo kunye nokuhlangabezana neemfuno zokudlulisa isignali ngesantya esiphezulu nangesantya esiphezulu.

Isetyenziswa kwiiyunithi zolawulo lweemoto, izinzwa, njl.njl., ukuphucula ukuhlanganiswa, ukunciphisa ivolumu, kunye nokuphucula ukuthembeka.

Isetyenziswa kwizixhobo ze-elektroniki zeenqwelo-moya ukuhlangabezana neemfuno ze-miniaturization, ukusebenza okuphezulu, kunye nokuthembeka okuphezulu.

Ingafezekisa uyilo oluncinci, iphucule ukuhlanganiswa kwamacandelo, kwaye ivumelane neemfuno ezingqongqo zezixhobo ezinxitywayo ukuze kubekho indawo nokusebenza.

Ukuphucula ukuchaneka nokuthembeka kwezixhobo ukuze kuhlangatyezwane neemfuno zezixhobo zonyango ukuze zikwazi ukusebenza kancinci kwaye zisebenze kakuhle.

Isetyenziswa kubalawuli bemizi-mveliso, izixhobo, njl.njl., ukuphucula uzinzo kunye nokuhlanganiswa kwenkqubo.

Uphuhliso lujolise kuxinano oluphezulu, ubungakanani obuncinci, kunye nokudluliselwa kwesignali ngokukhawuleza.

Umzekelo, izixhobo zonyango zifuna ukuthembeka okuphezulu, kwaye izixhobo zonxibelelwano ze-5G zifuna ukusebenza kokudluliselwa kwesignali ngesantya esiphezulu, njl.

Jonga ukuba umaleko wepleyiti yobhedu uhlukene na, ukuba kukho izinto zangaphandle emngxunyeni, nokuba unxibelelwano nomkhondo lulungile na. Sebenzisa izixhobo zovavanyo zombane ukuze ubeke indawo.

Jonga ukuphambuka kokulungelelaniswa kwemigca phakathi, iziphene zeplati yobhedu, kunye nemithombo yokuphazamiseka ejikelezileyo, kwaye uhlalutye ngovavanyo lwesignali.

Ukugqwala okuncinci kunokuphinda kufakwe ipleyiti emva kokucoca, kwaye iimeko ezinzima zifuna ukutshintshwa kwePCB okanye izinto ezinxulumene noko.

Jonga ukuba azikho ii-short circuits kwaye ulungise uyilo lokusasaza ubushushu, njengokongeza ii-heat sinks kunye nokuphucula umoya.

Uyilo olufanelekileyo nokulungiswa kunokuqinisekisa ukuthembeka okuthile, kungenjalo iingxaki ezifana noqhagamshelwano olukhululekileyo zinokubakho.

I-salty spray iyawudlakaza lula umaleko we-copper plating, kwaye kufuneka amanyathelo okukhusela anjengezinto ezimelana nokugqwala okanye ii-coatings.

Kwiindawo eziphakamileyo, utshintsho lomoya omncinci kunye nobushushu obusasazekayo lunokuchaphazela ukusebenza, nto leyo edinga uyilo olujoliswe kulo.

Okukhona umswakama uphezulu, kokukhona kunokwenzeka ukuba umaleko we-copper plating ubole, nto leyo echaphazela ukuhanjiswa kombane kunye nokudluliselwa kwesignali.

Ubushushu obuphezulu bunokubangela ukwanda kunye nokuguquguquka kwezinto, kwaye ubushushu obuphantsi bunokubangela ukuba izinto zibe buthathaka, nto leyo echaphazela ukuthembeka koqhagamshelo.

Ingonakalisa umaleko wepleyiti yobhedu, ibangele ukuvula iisekethe okanye ichaphazele ukuhanjiswa kwesignali. Ukhuseleko lwe-electrostatic luyafuneka.

Uyilo olufanelekileyo, amanyathelo okukhusela, uyilo olucwangcisiweyo lweempawu, njl.

Ewe, ukusebenza kunokwehla ngenxa yokonakala kwe-copper plating layer, ukugqwala, njl.njl., okufuna ukuhlolwa nokugcinwa rhoqo.