Ukuhamba kwenkqubo yokuhlanganisa i-PCBA

Ukufunyanwa kwexesha langempela kokuguqulwa kwe-polarity yecandelo, izinto ezingekhoyo, kunye ne-offset. Isantya sokuqondwa si-≤0.1s/icandelo, kwaye izinga lokuchaneka li>99.9%.

① Jonga ukuguguleka kwezikrufu zelothe ngokusebenzisa izinzwa zokungcangcazela (izinga lokuchaneka kokuqikelela >95%); ② Qeqesha iimodeli ezisekelwe kwidatha yembali ukuze zinike isilumkiso seeyure ezingama-72 kwangaphambili sokuphelelwa lixesha kwe-nozzle.

Uxinzelelo kufuneka lube ngaphezu kobunzima becandelo elingaphezulu kwe-≤2, kwaye ukuguquka kweebhola ze-lead/solder kufuneka kube yi-≤5% ukuthintela umonakalo woomatshini.

Izinto zokuthambisa kufuneka zingabi nazinto ziyingozi ezifana ne-Pb, Hg, Cd, kunye nomxholo we-SVHC (Substances of Very High Concern) ≤0.1%.

① Beka izinto ezinkulu kwicala le-wave-soldering kuqala (ezifana nezihlanganisi); ② Emva koko beka izinto ezincinci kwicala le-reflow-soldering (ezifana ne-01005) ukuze uphephe impembelelo yokufudumeza okwesibini kwizinto ezincinci.

① Kwi-ENIG, ubukhulu beleya ye-nickel (5 - 8μm) kufuneka bulawulwe ukuze kuthintelwe ii-pads ezimnyama; ② Kwi-OSP, ukubekwa kufuneka kugqitywe zingadlulanga iiyure ezingama-24 ukuze kuthintelwe ukubola komphezulu we-copper; ③ Kwi-HASL, kufuneka kuqatshelwe ukuba i-pad flatness (≤0.05mm).

Ii-nozzles ezisetyenziswa rhoqo (ezifana ne-BGA) kufuneka zicocwe rhoqo emva kweeyure ezi-4 ukuze kuthintelwe ukwehla kwamandla okufunxa okubangelwa yintsalela ye-solder paste.

Sebenzisa ii-feeders ezikrelekrele (ezinomsebenzi wememori) ukugcina kwangaphambili iiparameter zokutya zezixhobo ezahlukeneyo, kwaye ixesha lokutshintsha lingancitshiswa libe yimizuzu emi-5.

Lungiselela ukwabiwa kwecandelo ngesoftware yokulinganisa inkqubo (efana neValor) ukuze wenze umahluko womsebenzi wentloko nganye yokubeka indawo ≤5%.

① Sebenzisa uyilo lwemodyuli (ezifana neentloko ezikhawulezayo ezinoxanduva lwezinto ezincinci, iintloko ezichanekileyo eziphezulu ezinoxanduva lwe-BGA); ② Vumelanisa iindlela zokuhamba kwentloko nganye yokubeka ngokusebenzisa inkqubo yolawulo ephakathi.

① Sebenzisa uyilo lwemodyuli (ezifana neentloko ezikhawulezayo ezinoxanduva lwezinto ezincinci, iintloko ezichanekileyo eziphezulu ezinoxanduva lwe-BGA); ② Vumelanisa iindlela zokuhamba kwentloko nganye yokubeka ngokusebenzisa inkqubo yolawulo ephakathi.

① Nyusa ubushushu obuphambi kobushushu nge-10 - 15℃; ② Yandisa ubushushu obuphezulu ngemizuzwana emi-5 - 8; ③ Yehlisa izinga lokupholisa liye kwi-≤2℃/s ukuthintela ukuqhekeka koxinzelelo lwangaphakathi lwebhodi.

① Sebenzisa ii-feeders ezikrelekrele ukuze uchonge ngokuzenzekelayo iintlobo zezixhobo; ② Lungiselela inkqubo yokubeka isitya esingcangcazelayo + umbono ukuze ihambelane nezixhobo ezinkulu kunye neteyiphu kunye nereyile.

Isantya sokondla se-feeder (ngesiqhelo si-≤200 amaxesha ngomzuzu) kunye nokusebenza kakuhle kokudluliselwa kwe-PCB zezona zinto ziphambili ezithintelayo.

① Misela amakhethini okhuseleko (ixesha lokuphendula ≤20ms); ② Akuvumelekanga ukuvula ucango olukhuselayo xa izixhobo zisebenza (izixhobo zokutshixa kufuneka zicwangciswe); ③ Abaqhubi kufuneka banxibe iivesti zokulumkisa ezikhanyayo.

① Sebenzisa intlama yokucoca intsalela esezantsi (umthamo oqinileyo ohambayo ≤1.5%); ② Hlamba ngamanzi acocekileyo emva kokubeka (ukumelana ≥18MΩ・cm).

Ingaqhelana nezinto ezahlukeneyo ngobukhulu (ukusuka kwi-01005 ukuya kwi-50mm×50mm), kwaye utshintsho - ngokuhamba kwexesha luncitshiswa luye kwi-1/3 yezixhobo zemveli.

① Udidi lwelaser kufuneka luhlangabezane nomgangatho weKlasi yoku-1 (amandla ≤0.5mW); ② Iqokobhe lesixhobo kufuneka livalwe ukuze kuthintelwe ukuvuza kwelaser; ③ Abaqhubi banxiba iiglasi zokukhusela zelaser.

Uxinzelelo lweesuntswana zothuli >5μm kufuneka lube ziinxalenye eziyi-≤3,520/m³. Ngaphandle koko, izinto zangaphandle zinokubangela ukuxinana ngexesha lokufunxwa kwezixhobo (ukunciphisa isivuno nge-3–5%).

Ubunzima be-solder paste (efunekayo ukuba yi-80–120Pa·s) kunye ne-thixotropy (i-slump ≤2mm) kufuneka ivavanywe kwakhona, kwaye ingasetyenziswa kuphela emva kokuphumelela uvavanyo.

① Ixabiso le-Cpk (kufuneka libe yi-≥1.33); ② Ukuchaneka kokuphinda-phinda (3σ ≤±0.02mm); ③ Umahluko phakathi kokuchaneka okungaguqukiyo kunye nokuchaneka okuguquguqukayo (kufuneka kube yi-≤10%).

① Misela inkqubo yokuvavanya iimpazamo (njengokuqinisekiswa kwamanani aphindwe kabini); ② Iiparamitha zenkqubo ephambili (ezifana noxinzelelo, ubushushu) kufuneka zijongwe ngexesha langempela kwaye zigcinwe iminyaka eli-10; ③ Inxalenye yokuqala yeshifti nganye kufuneka ihlolwe ngokupheleleyo.

① Lungisa iiparameter zokutya kwe-feeder (ezifana nokungcangcazela rhoqo); ② Coca rhoqo ii-nozzles kunye neepayipi ze-vacuum; ③ Misela inkqubo yokuphinda usebenzise izixhobo ezilahliweyo (ezifana nokuhlola izixhobo ze-0402 ezinokuphinda zisetyenziswe).

① Ngenisa ifayile yoyilo lwe-PCB; ② Seta imithetho yokutshintsha kwe-nozzle kunye nolandelelwano lokuthathwa kwecandelo; ③ Sebenzisa ii-algorithms zokulinganisa (ezifana nee-algorithms ze-genetic) ukuze ubale indlela emfutshane kwaye unciphise ixesha lokuhamba ungenzi nto.

① Bhala phantsi ixesha lokubekwa, inombolo yesixhobo, kunye namaxesha okusetyenziswa kwe-nozzle ye-PCB nganye; ② Nxibelelanisa inombolo yebhetshi yecandelo nendawo yesondlo ukuze uvale ngokukhawuleza ibhetshi yengxaki.

① Phuhlisa iimeko zoqeqesho lwe-VR (ezifana nokulinganisa ukutshintshwa kwe-nozzle, ukulungisa iimpazamo kwi-feeder); ② Misela indlela yokuphendula kwimisebenzi engalunganga (efana nokuwa kwe-virtual component); ③ Bhala idatha yokusebenza ukuze uvavanye ukusebenza kakuhle koqeqesho.

Nika ingqalelo kwiiteyiphu zeplastiki ezithwala umoya okanye iitreyi ezikhuselweyo zesinyithi. Unyango lwe-ionization luyafuneka kwiphakheji ngaphambi kokuba ivulwe.

① Coca ilensi kunye nomthombo wokukhanya; ② Lungisa ixesha lokufumana ikhamera kunye nexesha lokuvezwa kwayo; ③ Jonga ukuba amanqaku eMark angcolisiwe okanye angcolisiwe na; ④ Buyisela amanqaku eMark ngemilo eyahlukeneyo (njengokutshintsha ukusuka kwisangqa ukuya kwisimo esinqamlezileyo).

I-thixotropy embi ye-solder paste okanye ixesha elide lokuhlala emva kokuprinta (>iiyure ezi-2). Ubushushu beworkshop kufuneka bulawulwe kwi-23±2℃, kunye nomswakama kwi-50±5% RH.

① Kwizinto ezinkulu (ezifana ne-QFP), beka phambili ukuchaneka (isantya ≤30mm/s); ② Kwizinto ezincinci (ezifana ne-0402), isantya singanyuswa siye kwi-80 - 100mm/s, kwaye ukuchaneka kungaphuculwa ngokubonelelwa ngokubonakalayo.

Musa ukubeka izinto ezingalinganiswanga, musa ukusebenzisa iimpumlo ezigugileyo kakhulu, kwaye musa ukuvelisa ii-PCB ngaphandle kokuhlolwa kuqala.

① Ububanzi bangaphakathi bomlomo buvaliwe (kufuneka bususwe ngenaliti yentsimbi eyi-0.2mm); ② Ijenereyitha ye-vacuum iyasilela (i-vacuum degree

Kucetyiswa ukuba uqokelele iiparameter ezibalulekileyo (ezifana noxinzelelo, ukuphambuka kwindawo) rhoqo emva kwemizuzwana eyi-0.5. Ukulibaziseka kwedatha okungaphezulu kwesekhondi enye kunokukhokelela ekungafumaneki kakuhle kwezinto ezingaqhelekanga zomgangatho.

Linganisa umbane kube kanye emva kombane - yonke imihla, okanye emva kokuvelisa ii-PCB ezingama-50, ukuqinisekisa ukuba ukuchaneka kokulungelelaniswa phakathi kwezixhobo kunye nee-pad yi-≤ ±0.02mm.

Kufuneka ukuthambisa rhoqo emva kweeyure ezingama-200 zokusebenza. Ukungabikho kweoyile kuya kukhokelela ekwandeni kwempazamo yokudlulisela (njengokujika kwe-X/Y axis positioning >0.03mm).

Khetha amanqaku amathathu eMark kwiindawo ezahlukeneyo kwiPCB, uze ulinganisele ukuphakama kwe-Z-axis ye-nozzle ngokulandelanayo. Impazamo kufuneka ibe yi-≤±0.005mm.

① Imigaqo yezixhobo kunye nokucwangcisa (ezifana ne-G - ikhowudi, i-teach - i-pendant programming); ② Ukulungiswa kweeparamitha zenkqubo (ezifana noxinzelelo, ii-curves zobushushu); ③ Ukuxilongwa kwempazamo kunye nokugcinwa kokuthintela; ④ Ukusetyenziswa kwezixhobo ezisemgangathweni (ezifana ne-SPC, i-FMEA).

① Sebenzisa imilomo ye-ceramic okanye ye-carbide efakwe isamente (ubomi bayo bunyuke ngokuphindwe ka-3 ukuya ku-5); ② Misela inkqubo yokuhlaziya imilomo (njenge-laser - ukulungisa umphezulu ogugileyo).

① Yongeza iimodyuli ze-edge computing (ezifana nee-PLC gateways); ② Sebenzisa i-protocol ye-OPC UA ukufezekisa unxibelelwano phakathi kwezixhobo; ③ Misela i-data hub yokugcina idatha yemveliso yexesha langempela.

Inkqubo yokucima umlilo yegesi engangenisi mandla kufuneka ixhotyiswe, kwaye uxinzelelo lweoksijini kwindawo yokusebenzela kufuneka lulawulwe phakathi kwe-18 - 21%.

Ixesha eliphakathi ukusuka ekuprinteni ukuya ekubekweni kufuneka libe yiyure eyi-≤1 ukuze kuthintelwe ukuba i-solder paste ifunxe umswakama ize ibangele ukuba i-soldering voids ibuyele kwi-flow.

I-solder engenalo i-lead ineqondo eliphezulu lokunyibilika (malunga ne-217℃), nto leyo ebangela ukwanda kwe-15 - 20% ekusetyenzisweni kwamandla okuphinda kufakwe i-solder. Ukusetyenziswa kwamandla kungancitshiswa ngokuphucula i-curve yobushushu besithando (njengokunciphisa ixesha lokubamba).

① Qinisekisa ingqiqo yenkqubo kwangaphambili (ukunciphisa ixesha lokulungisa iimpazamo kwindawo nge-50%); ② Lingisa iimeko zokusebenza ezigqithisileyo ukuze kuvavanywe uzinzo lwezixhobo; ③ Qeqesha abaqhubi ngaphandle kokusebenzisa izixhobo zokwenyani.

① Gcina umda wenkqubo we-≥5mm ukuze ubambe izinto ezisetyenziswayo; ② Isithuba phakathi kwezinto ezikufutshane kufuneka sibe yi-≥3mm ukuze kuthintelwe ukuphazamiseka ngexesha lokutshiza ngetin.

① Ibhetshi nganye yezinto kufuneka inike ingxelo yezinto ezisetyenzisiweyo (BOM); ② Isazisi somsebenzisi kunye nexesha lokusebenza kufuneka zirekhodwe ngexesha lenkqubo yokubeka; ③ Amalungu e-solder kufuneka ahlolwe nge-100% X - Ray kwaye iirekhodi zomfanekiso kufuneka zigcinwe.

Kwizinto ezikwi-0402 nangaphezulu, izinga lokwaliwa kufuneka libe yi-≤0.5%; kwizinto ezincinci ze-0201 nangaphantsi, izinga lokwaliwa kufuneka libe yi-≤1.5%.

Ukuhlolwa komqhubi ngokwakhe → Ukuhlolwa kwakhona kwenkokeli yeqela → Ukuhlolwa kwesampulu yomhloli womgangatho. Imveliso enkulu ivunyelwe kuphela emva kokuqinisekiswa.

Ukuphambuka kwe-engile okungaphezulu kwe-5° kunokubangela ukungalungelelani kweebhola ze-lead/solder kunye nee-pad, okwandisa umngcipheko wokubhidlika okanye ukunyibilikiswa ngokungekho mthethweni. Kufuneka kuhlawulwe kwaye kulungiswe ngesoftware yezixhobo.