Iindidi zeeModyuli

Ngobuchwepheshe bokufaka imingxunya i-THT

1. Iingcamango nemigaqo esisiseko

1. Yintoni i-Through Hole Technology (THT)?

I-THT yiteknoloji efaka iileyiti ze-elektroniki kwimingxunya ye-PCB kwaye ifezekisa uqhagamshelo kunye nokufakelwa kombane nge-soldering. Yenye yeenkqubo zemveli zokuhlanganisa nge-elektroniki.
2. Ngowuphi umahluko ophambili phakathi kweTHT kunye neSurface Mount Technology (SMT)?

- Iileyidi zecandelo le-THT zifuna ukutywinwa ngemingxunya edlulayo, ngelixa iinxalenye ze-SMT zifakelwe ngqo kumphezulu we-PCB.

- I-THT inemveliso ephantsi kwaye inendawo eninzi yokusebenza; i-SMT inika ukusebenza okuphezulu kunye noxinano (idatha ye-IPC: uxinano lwe-SMT luphindwe kathathu ukuya kahlanu kune-THT).

- I-THT ifanele izixhobo ezinamandla amakhulu/ezinkulu; i-SMT ifanele izixhobo ezincinci/ezixineneyo.
3. Iyintoni indlela esisiseko yokuhamba kwe-THT?

Ukulungiswa kwecandelo → Ukufakwa → Ukutywina (ukutywina ngamaza okusetyenziswa ngokubanzi, ukutywina ngesandla/ngokudipha kwezixhobo ezikhethekileyo) → Ukucheba ilothe → Ukuhlolwa
4. Zeziphi iintlobo zezinto ze-elektroniki ezifanelekileyo kwi-THT?

- Izinto ezinamandla aphezulu (umz., ii-transistors zamandla, ii-transformers, ii-capacitors ezinkulu ze-electrolytic)

- Izinto ezifuna amandla aphezulu oomatshini (umz., izihlanganisi)

- Izinto ezinesithuba esikhulu seeleya kunye neemfuno eziphantsi zokuchaneka
5. Yintoni ubuncinci be-via diameter ye-PCB kwinkqubo ye-THT?

Inkqubo eqhelekileyo: 0.8mm; Inkqubo ekhethekileyo: 0.4mm (eneendleko ezikhulayo kunye nobunzima)

2. Ukuphathwa kweCandelo kunye nePin

6. Zeziphi iimilo eziqhelekileyo zee-leads ze-THT component?

- Iileyiti ezithe tye (zifanelekile kwiimatshini zokufaka ngokuzenzekelayo)

- Iingcingo ezigobileyo (umz., uhlobo lwe-J, uhlobo lwe-L, ukuphucula uzinzo loomatshini emva kokunyibilikisa)
7. Zithini iimfuno zokukwazi ukunyibilikisa izinto ezisetyenziswa kwi-component leads?

Ngokwe-IPC-J-STD-001: Kwi-235℃±5℃, ifakwa embizeni yesolder imizuzwana emi-2-3, ukugqunywa kwesolder ≥95%
8. Ungawuphucula njani umbane onyibilikiswayo kwiileyiti zecandelo?

- Ukwaleka ngesinyithi (umz., i-Sn, i-Ag plating)

- Ukufaka i-flux ngaphambi kokuyidibanisa ukuze kususwe iileya ze-oxide kwaye kuphuculwe ukufuma
9. Bungakanani ubude be-lead obufanelekileyo kwiinxalenye ze-THT?

Ukuvela kwelothe kumphezulu we-PCB soldering: 2-3mm (imfutshane kakhulu ibangela ukunamathelana okubi; ide kakhulu ibeka emngciphekweni imijikelo emifutshane kwaye ifuna ukuchetywa okungakumbi)
10. Izinto ezahlukeneyo zelothe zikuchaphazela njani ukutywinwa?

- Ubhedu: Ukunyibilika kakuhle, okuxhaphakileyo

- I-iron: Ithanda ukubola, ayikwazi ukunyibilikisa kakuhle, ifuna unyango olukhethekileyo

- Ii-alloys (umz., ii-alloys ze-copper): Zilinganisela amandla kunye nokudityaniswa kwe-solder

3. IBhodi yeSekethe ePrintiweyo (PCB) enxulumene nayo

11. Zithini iimfuno zezinto ze-PCB kwinkqubo ye-THT?

Ihlala isebenzisa i-FR-4 substrate ene-Tg ≥130℃, enezinto zokukhusela umbane ezilungileyo, amandla oomatshini, kunye nokumelana nobushushu.
12. Zithini imigangatho yokunyamezelana kwee-PCB vias?

- Ukunyamezelana kobubanzi: ± 0.05mm

- Ukunyamezelana kwesikhundla semingxuma: ± 0.1mm
13. Ungakuthintela njani ukuguqulwa kwe-PCB ngexesha lokunyibilikisa i-THT?

- Khetha ubukhulu obufanelekileyo be-substrate (ubude obuyi-1.6mm)

- Lungiselela uyilo lwePCB (thintela iindawo ezinkulu zobhedu ezixineneyo)

- Sebenzisa imiphetho yenkqubo kunye nezixhobo zokuxhasa
14. Ukuqina kodonga olusebenzisa i-thread roughness kuyichaphazela njani i-soldering?

Ixabiso le-Ra kufuneka lilawulwe kwi-1.6-3.2μm: Ukurhabaxa okugqithisileyo kubangela ukungazaliswa kakuhle kwe-solder; ukutyibilika kakhulu kunciphisa ukufuma
15. Ziziphi iimfuno ezikhethekileyo zee-PCB ezinamaleya amaninzi kwi-THT?

- Ifuna ulungelelwaniso oluchanekileyo phakathi kweeleya (ngokuqhelekileyo lucutshungulwa yi-CNC drilling)

- Ingqalelo kwi-interlayer insulation ngexesha lokutywina ukuze kuthintelwe imijikelo emifutshane

4. Inkqubo yokuWelda - Ukunyibilikisa amaza

16. Yintoni umgaqo osisiseko wokunyibilikisa amaza?

Ipompo yesolder ijika i-solder inyibilikise ibe yi-wave, kwaye ii-PCB/leads ziyadityaniswa xa zidlula kwi-wave. I-double-wave soldering inciphisa ukudibana kwe-bridging kunye ne-cold joints.
17. Lithini iqondo lobushushu eliqhelekileyo le-solder xa kudityaniswa amaza?

- Sn63Pb37 (ine-lead): 245℃ -255℃

- Sn96.5Ag3.0Cu0.5 (ayinalothi): 255℃-265℃
18. Lingakanani ixesha eliqhelekileyo lokunyibilikisa i-wave soldering?

Ixesha lokudibana kwe-lead-wave: imizuzwana emi-2-4 (imfutshane kakhulu ibangela ukunyibilika kakubi kwe-solder; ixesha elide kakhulu libeka emngciphekweni umonakalo wecandelo okanye ukuguquka kwe-PCB)
19. Ungalulungisa njani ukuphakama kwegagasi kwi-wave soldering?

Ukuphakama kwamaza: 1/2-2/3 yobukhulu be-PCB (ihlengahlengiswe ngokusebenzisa ukuhamba kwepompo ye-solder kunye noxinzelelo; ukuphakama kakhulu kubangela ukudibana, ikhokelela ephantsi kakhulu ekunganeli kwe-solder)
20. Ziziphi iindlela zokusebenzisa i-flux kwi-wave soldering kunye neempawu zazo?

- Isifutho: Ukusetyenziswa okuphantsi, iyafana, ifanelekile kwixabiso eliphezulu
-ukutshiza ngokuchanekileyo

- Igwebu: Uxinzelelo oluphezulu, olufanelekileyo xa lutyebile
-iisekethe zefilimu

- Amaza: Ukusebenza kakuhle, inkunkuma eninzi

5. Inkqubo yokuWelda - UkuWelda ngesandla kunye nezinye

21. Ungalawula njani ubushushu kunye nexesha lokudibanisa ngesandla izinto ze-THT?

Ubushushu bentsimbi enyibilikisayo: 300℃ -350℃; ngelungu ngalinye: imizuzwana emi-2-3 (thintela umonakalo obushushu obuphezulu)
22. Ziziphi iimpawu kunye nokusetyenziswa kwe-dip soldering?

Iimpawu: Ukusebenza kakuhle kakhulu kodwa kulula ukunqumla; Usetyenziso: Ukuveliswa ngobuninzi kwee-PCB ezilula ezinesithuba esikhulu seeleya
23. Ziziphi iingenelo zokufaka i-solder ekhethiweyo?

Ukutshiza okujoliswe kwiindawo ezithile, kuthintela impembelelo ye-solder kwezinye iindawo. Ifanelekile kwiibhodi ezixutyiweyo ze-THT/SMT ukunciphisa impembelelo ye-wave soldering kwizixhobo ze-SMT.
24. Ngaba i-reflow soldering ingasetyenziselwa izinto ze-THT?

I-Reflow soldering yenzelwe ikakhulu i-SMT. Ingasetyenziselwa iikheyisi ezikhethekileyo ze-THT (umz., izinto ezincinci/ezincinci ezine-lead ezinezixhobo ezikhethekileyo), kodwa kungekhona ezisetyenziswa kakhulu.
25. Zithini iimfuno ze-solder kwiinkqubo ezahlukeneyo ze-soldering?

- Ukunyibilikisa amaza: Ukufuma okuphezulu, ukumelana ne-oxidation

- Ukunyibilikisa ngesandla: Iqondo lokunyibilika eliphakathi, ukufuma kakuhle

- Ukutywina nge-dip: Ukugubungela okuqinileyo

- Iintlobo eziqhelekileyo: Ukutywina ngamaza/ngokudipha kusebenzisa iibhari zokutywina; ukutywina ngesandla kusebenzisa ucingo lokutywina

6. I-Solder kunye ne-Flux

26. Zeziphi izinto eziqhelekileyo ezixutywa yi-THT solders?

Iisolders eziqhelekileyo ziquka i-tin-lead (Sn63Pb37, i-eutectic point 183℃) kunye ne-lead-free (umz., Sn96.5Ag3.0Cu0.5, i-melting point 217℃). Iisolders ezingenalo i-lead ziyasetyenziswa ngakumbi ngenxa yezizathu zokusingqongileyo.
27. Yintoni umahluko phakathi kwe-solders ezingenalo i-lead kunye ne-solders ezine-lead?

Iisolder ezingenalo ilothe zinendawo yokunyibilika ephezulu engama-30-40℃ kwaye azinamanzi kangako, zifuna amaqondo obushushu aphezulu okunyibilikisa kunye nokuchaneka kwenkqubo, kodwa zihambelana nemigangatho yeRoHS.
28. Yintoni indima ephambili ye-flux?

Isusa ii-oxides kwiindawo ezidibanisa i-soldering, inciphisa uxinzelelo lomphezulu we-solder, iphucula ukufuma, kwaye ithintela ukuphinda kufakwe i-oxidation ngexesha lokutywina.
29. Ahlulwa njani amanqanaba omsebenzi we-flux?

Ihlelwe ngokwe-IPC-J-STD-001 njengo-R (ongasebenziyo), i-RMA (umsebenzi ophakathi), kunye ne-RA (esebenzayo). Umsebenzi ophezulu uphucula ukususwa kwe-oxide kodwa unokunyusa umngcipheko wokubola kwentsalela.
30. Zithini iziphumo ze-flux residues kwi-circuits?

Inokubangela imijikelo emifutshane, ukuvuza, okanye ukubola kweenxalenye/iiPCB ngamanxuwa asebenza kakhulu, adla ngokufuna ukucocwa emva kokunyibilikiswa kwesinyithi.

7. Izixhobo kunye neZixhobo

31. Zeziphi iintlobo eziphambili zoomatshini bokufaka izinto ngokuzenzekelayo?

Iintlobo eziphambili: ezithe tye (ezifanelekileyo kwiinxalenye ze-axial ezifana nee-resistor) kunye nezithe nkqo (ezifanelekileyo kwiinxalenye ze-radial ezifana nee-capacitors ze-electrolytic).
32. Ithini indlela eqhelekileyo yokufaka izinto ezizenzekelayo xa kusetyenziswa oomatshini bokufaka izinto?

Oomatshini banamhlanje bafikelela kuchanekileyo lwe-±0.1mm, olufanele uninzi lwezixhobo ze-THT.
33. Ukugcinwa kwemihla ngemihla koomatshini bokutywina ngamaza kuquka ntoni?

Ukucocwa rhoqo kweembiza ze-solder, ukutshintshwa kwe-solder, ukulinganiswa kokuphakama kobushushu/amaza, ukucocwa kwenkqubo ye-flux, kunye nokuthambisa ngoomatshini.
34. Ngawaphi amanqaku aphambili okukhetha nokusebenzisa izixhobo zokutywina ngesandla?

Khetha ii-ironi zokutywina ezingama-30W-60W ezineemilo ezahlukeneyo zeencam; faka inkcenkce kwincam ngaphambi kokuba uyisebenzise ukuthintela i-oxidation.
35. Zeziphi iintlobo zezinto ezisetyenziswa rhoqo kwiinkqubo ze-THT?

Ibandakanya izixhobo zokubeka ii-PCB, izibambi zezixhobo, kunye nezixhasi zokufaka i-solder ukuqinisekisa ukuchaneka kwendawo kunye nozinzo.

8. Ulawulo lomgangatho kunye nohlalutyo lweziphene

36. Zeziphi iziphene eziqhelekileyo kwi-THT soldering?

Iijoyinti ezibandayo, ukuvalelana, ukugalelana okunganelanga, iibhola zejoyinti, njl. Iijoyinti ezibandayo zibhekisa kunxibelelwano olubi lombane; ukuvalelana kubangela imijikelo emfutshane phakathi kwee-pads.
37. Zithini izizathu kunye nezisombululo zamalungu abandayo?

Izizathu: Iileyidi ezifakwe i-oxidized, ukunyibilika okwaneleyo, ubushushu/ixesha elingafanelekanga, umsebenzi ophantsi wokujikeleza. Izisombululo: Coca iileyidi, lungisa iiparameter, khetha ukuhamba okufanelekileyo.
38. Zithini izizathu kunye namanyathelo okuthintela ukuvalwa kweendlela?

Izizathu: I-solder egqithisileyo, ukuphakama kwamaza aphezulu, isithuba esincinci se-lead, i-flux engalinganiyo. Ukuthintela: Lungisa ivolumu ye-solder, ukuphakama kwamaza, uyilo lwe-PCB, kunye nokusetyenziswa kwe-flux.
39. Ungawuhlola njani umgangatho we-THT soldering?

Ukuhlolwa okubonakalayo (AOI), i-X-ray (AXI), uvavanyo lwangaphakathi kwesekethe (ICT). Ukuhlolwa okubonakalayo kweziphene zomphezulu; i-X-ray yamalungu angaphakathi abandayo.
40. Zithini imigangatho yomgangatho we-THT soldering?

Ngokwe-IPC-A-610, iindawo zokudibanisa i-solder mazibe bushelelezi, zingaqhekeki, zibe ne-≥95% ye-lead coverage kunye noqhagamshelo lombane oluthembekileyo.

9. Ukhuseleko kunye noKhuseleko lweNdalo

41. Zithini iimfuno zokusingqongileyo kwiinkqubo ze-THT?

Thobela imiyalelo yeRoHS yokunciphisa izinto ezinobungozi; hlamba iigesi zokukhupha umoya; phinda usebenzise inkunkuma eyosiweyo kwaye uyiguqule ngendlela efanelekileyo.
42. Ziziphi iimfuno ezikhethekileyo abanazo abaqhubi be-soldering abangenalo ilothe?

Nxiba iiglavu kunye neeglasi zeglasi ezimelana nobushushu; jonga impilo yakho rhoqo ukuze uthintele ukutsha kunye nokuphefumla igesi eyingozi.
43. Ungawulahla njani umnyibilikisi wenkunkuma kunye nokutshintshatshintsha kwenkqubo ye-THT?

Inkunkuma eyongezwayo kufuneka isetyenziswe kwakhona ziinkampani ezifanelekileyo; inkunkuma ephumayo (ikhemikhali enobungozi) kufuneka ivalwe kwaye iphathwe ziinkampani zenkunkuma ezinobungozi ezingochwephesha.
44. Zithini iimfuno zokungenisa umoya kwiindawo zokusebenzela zokunyibilikisa?

Gcina umoya ungena kakuhle ukuqinisekisa ukuba amazinga egesi ayingozi angaphantsi kwemida yokuchatshazelwa ngumsebenzi, ngokutshintsha komoya okungaphezulu kwe-12 ngeyure.
45. Ngawaphi amanyathelo okhuseleko kwiikhemikhali ezisetyenziswa kwiinkqubo ze-THT?

I-Flux kunye nezinye iikhemikhali ziyatsha; gcina kude nemithombo yomlilo. Kwiikhemikhali ezitshayo, hlambulula ngoko nangoko emva kokuba unxibe kwaye ugcine/usebenzise ngokwemiyalelo.

10. Ukulungiswa kwenkqubo kunye nolawulo lweendleko

46. Ungayiphucula njani indlela esebenza ngayo inkqubo ye-THT?

Lungiselela ulandelelwano lokufakwa, sebenzisa oomatshini abazenzekelayo abakhawulezayo, ulungelelanise ukuhamba kwenkqubo, kwaye uphucule uzinzo lwezixhobo.
47. Zeziphi izinto eziphambili ezixabisa iinkqubo ze-THT?

Iinxalenye, i-PCB, i-solder/flux, ukwehla kwexabiso/ukugcinwa kwezixhobo, abasebenzi, kunye neendleko zokuhlola.
48. Ungazinciphisa njani iindleko zemveliso ye-THT?

Ukuthenga ngobuninzi ukunciphisa iindleko zecandelo, ukuphucula uyilo lwe-PCB ukunciphisa inkunkuma, ukuphucula isivuno ukunciphisa ukuphinda kusetyenziswe, kunye nokulungelelanisa ukwabiwa kwezixhobo.
49. Ixabiso le-THT lithelekiswa njani ne-SMT?

I-THT inotyalo-mali oluphantsi kwizixhobo kodwa iindleko zomsebenzi/zezinto zokwakha ziphezulu. I-SMT ineendleko eziphezulu kwizixhobo kodwa ukusebenza kakuhle/uxinano luphezulu, nto leyo ekhokelela ekuncipheni kweendleko zeeyunithi zexesha elide.
50. Ungayiphucula njani isivuno se-THT soldering ngokusebenzisa ukwenziwa ngcono kwenkqubo?

Lawula ngokuchanekileyo ubushushu, ixesha, kunye nomthamo wokujikeleza; yomeleza uhlolo olungenayo; ukugcinwa kwezixhobo rhoqo; uqeqesho lwabaqhubi.

11. Izicelo ezikhethekileyo kunye neenkqubo ezixutyiweyo

51. Ziziphi iingenelo zokuhlanganiswa kwe-THT/SMT exutyiweyo?

Idibanisa ukufaneleka kwe-THT kwiinxalenye ezinamandla aphezulu kunye ne-SMT's high-density miniaturization, ihlangabezana neemfuno zoyilo lwesekethe ezintsonkothileyo.
52. Ithini indlela esebenza ngayo inkqubo yokuhlanganisa i-THT/SMT exutyiweyo?

Ukubekwa kwe-SMT kuqala, emva koko ukufakwa kwe-THT kunye nokugalelwa (amaza okanye ukugalelwa okukhethiweyo). Qinisekisa ukuba izixhobo ze-SMT ziyakwazi ukumelana namaqondo obushushu okugalelwa kwe-THT.
53. Ungakuthintela njani ukwahlukana kwe-SMT component ngexesha lokudityaniswa kwamaza kwiinkqubo ezixutyiweyo?

Sebenzisa iglu yobushushu obuphezulu ukulungisa izinto ze-SMT, ulungise iiparamitha zokunyibilikisa amaza ukunciphisa impembelelo, kwaye usebenzise amaza amabini ukuze wenze imo yamaza ibe ngcono.
54. Zeziphi iimfuno ezikhethekileyo ezinazo i-THT kwizicelo ezinokuthembeka okuphezulu?

Izixhobo ezikumgangatho ophezulu, ii-PCB, kunye nee-solders; ulawulo olungqongqo lwenkqubo yokunyibilikisa; amanyathelo ovavanyo olongezelelweyo; ukusetyenziswa okunokwenzeka kweenkqubo ezikhethekileyo ezifana nokutywina nge-vacuum.
55. Zeziphi izinto ezibalulekileyo ekufuneka ziqwalaselwe kwi-THT kwizicelo zomkhosi?

Landela ngokungqongqo imigangatho yomkhosi (umz., i-GJB), ukuhlolwa kwezinto ezikrwada eziyi-100%, iinkqubo zokunyibilikisa ezilandelekayo, kunye novavanyo oluphambili (i-X-ray/i-ultrasonic).

12. Iiteknoloji Ezisakhulayo kunye noPhuhliso lweXesha Elizayo

56. Zithini iindlela zophuhliso lwexesha elizayo lwe-THT?

Ukuya kwi-automation kunye nobukrelekrele, ukudibanisa izixhobo ezintsha kunye neenkqubo ukuhlangabezana neemfuno zokuhlanganisa ezinamandla aphezulu/uxinano oluphezulu.
57. Ithini impembelelo yoshicilelo lwe-3D kwi-THT?

Ivumela ukwenziwa ngokukhawuleza kwee-PCB kunye nezixhobo ezikhethekileyo, inciphisa ixesha lophuhliso kunye neendleko zemveliso eziphantsi.
58. Zithini iingenelo zokusetyenziswa kwe-AI kwi-THT?

Izicelo zokuphucula iparameter yokunyibilikisa, ukufunyanwa kweziphene ngokuzenzekelayo, kunye nokuqikelela ukusilela kwezixhobo ukuphucula ubukrelekrele.
59. Izinto ezintsha ze-solder ziqhuba njani uphuhliso lwe-THT?

Iisolder ezintsha (umz., ubushushu obuphantsi, ukuhanjiswa kobushushu obuphezulu) ziyahlangabezana neemfuno ezikhethekileyo zesicelo kwaye zandisa ububanzi be-THT.
60. Zeziphi iingxaki namathuba eziziswa ziimfuno zokusingqongileyo kwi-THT?

Imingeni: Imfuneko yezinto/iinkqubo ezinobuhlobo nokusingqongileyo. Amathuba: Ukuqhuba ukuphuculwa kobuchwepheshe kunye neemfuno ezintsha zemarike.

13. Uhlengahlengiso lweparameter yenkqubo

61. Ungazilungisa njani iiparameter zokunyibilikisa amaza kwiindawo ezibandayo rhoqo?

Amalunga abandayo adla ngokubangelwa kukunganeli kobushushu/ixesha. Yongeza ubushushu be-solder nge-5-10℃ kunye nexesha lokudibana nge-0.5-1s, okwenza kube lula kancinci kancinci.
62. Uxinzelelo lwe-flux luyichaphazela njani umgangatho we-soldering? Ungalulungisa njani?

Uxinzelelo oluphantsi lubangela ukuba amalungu abandayo; uxinzelelo oluphezulu lukhokelela kwintsalela engaphezulu. Jonga ubunzima obuthile: yongeza uxinano ukuba luphantsi, umxube ukuba uphezulu, ukuze ugcine umgama wenkqubo.
63. Isantya sokufaka sichaphazela njani umgangatho kwiimashini ezizenzekelayo?

Isantya esigqithisileyo sibangela ukungalungelelani okanye ukuguqulwa kwelothe; isantya esicothayo sinciphisa ukusebenza kakuhle. Misela isantya esifanelekileyo ngokusebenzisa imveliso yovavanyo ukuze ulinganise umgangatho kunye nokusebenza kakuhle.
64. Yintoni indima yobushushu obufudunyezwayo ngaphambi kobushushu kwi-THT soldering? Ungabubeka njani?

Ukufudumeza kususa umswakama, kunciphisa uxinzelelo lobushushu, kwaye kuphucula ukufuma. Imiselwe kwi-100-150℃, ilungelelaniswe nezinto ze-PCB, ubukhulu, kunye nokumelana nobushushu bezinto.
65. Ubushushu obungqongileyo buyichaphazela njani i-THT soldering?

Xa kutshintshiswa ubushushu obuphakathi kwe-10℃, lungisa ubushushu bokunyibilikisa nge-3-5℃. Ubushushu obuphantsi bunciphisa ukunyibilika kwe-solder; ubushushu obuphezulu bukhawulezisa ukufuma kwe-flux. Fudumeza ii-PCB ngaphantsi kwe-15℃.
66. Ungakuthintela njani ukwahlulwa kwe-PCB pad kwi-THT?

Nciphisa ixesha lokugalela i-solder libe yimizuzwana eyi-2 ukuya kweyi-4, kuphephe ukugalela i-solder ngokuphindaphindiweyo; sebenzisa ii-PCB ezine-Tg≥130℃; susa i-solder usebenzisa izibhamu zomoya oshushu ezishushu eziphantsi (≤350℃) kunye ne-flux paste, unciphise ukuqhekeka kwe-pad nge->80%.
67. Ungawuvavanya njani ukumelana nokudinwa kwamalungu e-THT solder?

Uvavanyo lomjikelo wobushushu (-40℃ ~ 125℃, imijikelo engama-500) ukujonga ukwanda kweentanda; i-SEM yohlalutyo lwesakhiwo se-microstructure. Ubomi bokudinwa bufanele buhlangabezane nokhuseleko loyilo oluphindwe kathathu.
68. Yintoni indima yokukhusela i-nitrogen kwi-THT soldering kunye nokusetyenziswa kwayo?

14. Iinkcukacha zenkqubo kunye nokusombulula iingxaki

69. Ungaphatha njani iintsalela ezimnyama kwiindawo zokudibanisa i-THT solder?

Iintsalela ezimnyama zihlala zijikeleza i-carbonization. Sebenzisa i-flux engasebenzi kakhulu, yonyusa ubushushu obungaphambi kobushushu nge-10-15℃, okanye ucoce nge-ultrasonic nge-isopropyl alcohol kwiimeko ezinzima.
70. Zithini iindima zamaza amabini kwi-THT wave soldering?

I-turbulent wave (A-wave) icoca i-leads kwaye iphucula ukungena kwe-solder; i-smooth wave (B-wave) ibumba amalungu kwaye isusa ukudibana. Umlinganiselo wokuphakama ucetyiswa kwi-1:1.2-1:1.5.
71. Ukuguquguquka kwesantya sokuhambisa kuyichaphazela njani umgangatho wokunyibilikisa i-THT?

Ukutshintshatshintsha kwesantya >±5% kubangela ixesha elingaguqukiyo lokunyibilikisa, nto leyo ekhokelela ekubeni i-soldering ibe shushu okanye i-over-soldering. Sebenzisa ulawulo lwe-servo oluvaliweyo ukunciphisa ukuguquguquka ngaphakathi kwe-±1%.
72. Ungalinganisa njani ukumelana nombane kwiijoyinti ze-solder ze-THT?

Sebenzisa i-micro-ohmmeter ene-1A constant current ukulinganisa ukuhla kwe-voltage. Ukumelana noqhagamshelwano kufuneka kube yi-≤5mΩ (≤1mΩ kwiindawo ezinombane ophezulu).
73. Zithini iimfuno ezikhethekileyo ze-THT kwiipali zokutshaja ze-EV?

Ifuna ukhuseleko lwe-IP67, ukumelana nomswakama we-85℃/85%RH ukwaluphala iiyure ezili-1000; iiterminals ezinombane ophezulu kufuneka zibe nokumelana noqhagamshelwano lwe-≤0.5mΩ kunye namandla okutsalwa kwe-≥50N.

15. Iiparamitha zenkqubo kunye nokugcinwa kwezixhobo

74. Luthini ulwalamano phakathi komxholo we-flux solid kunye ne-THT soldering?

Umxholo oqinileyo udla ngokuba yi-10%-25%. Umxholo ophezulu unyusa intsalela; umxholo ophantsi unciphisa ukususwa kwe-oxide. Kucetyiswa ukuba i-15%-20% isetyenziselwe ukutywina ngaphandle kwelothe.
75. Ungayisombulula njani i-content tilting emva kokufakwa kwe-THT?

Jonga uxinzelelo lwe-nozzle (0.4-0.6MPa), lungisa ukuchaneka kwendawo ye-feeder (impazamo ye-≤0.1mm), kwaye usebenzise i-glue esele ilungisiwe kwiinxalenye ezinzima.
76. Ungayila njani ubungakanani bokuvula imaski ye-solder ye-PCB ye-THT?

Iimbobo mazibe nkulu nge-0.1-0.2mm kunee-pad ezikwicala ngalinye ukuthintela ungcoliseko lweemaski nokuphucula isivuno nge-~15%.
77. Zeziphi izinto ezibalulekileyo ekufuneka zenziwe imihla ngemihla kwizixhobo ze-THT?

Jonga ubushushu bembiza yesolder (±3℃), uxinzelelo lweflux (±5% ukuguquguquka), ukuphakama kwamaza (1.5-2.5mm), uxinzelelo lwe-conveyor (20-30N), kunye nokumelana nomhlaba (≤4Ω).
78. Ungazibona njani iziphene ze-THT solder nge-AOI?

Misela iiparameter zemilo yamalungu, umbala, i-engile yokumanzisa (≤30°), kwaye usebenzise i-machine learning ukuze ufumane izinga lokuchonga iziphene eliyi-≥95%.

16. Izicelo ezikhethekileyo kunye nokuthembeka

79. Zithini iimfuno ezikhethekileyo zokutywina i-transformer lead kwi-THT?

Sebenzisa i-cross-soldering kwii-multi-leads, yandisa ixesha lokunyibilikisa ukuya kwi-4-6s; faka i-silver-containing solder (umz., Sn96.5Ag3.0Cu0.5) enokumelana nobushushu obuphezulu ≤3℃/W.
80. Ukuphakama kuyichaphazela njani i-THT soldering?

Kwimitha nganye yokuphakama kwe-1000, uxinzelelo lomoya luyehla nge-10%, iqondo lokubila le-solder liyehla nge-5-8℃. Nciphisa ubushushu bokunyibilikisa i-solder kwaye wandise umsebenzi wokujikeleza.
81. Ungayisebenzisa njani indlela yokufaka izinto ezikwimo engaqhelekanga kwi-THT?

Sebenzisa izixhobo ezenzelwe wena okanye isikhokelo sokubona irobhothi ukuze ufumane ukuchaneka kwe-±0.02mm; lungiselela iileya ezingalinganiyo kwangaphambili ukuze zilingane ngokuchanekileyo.
82. Kutheni ii-THT solder joints zijika zibe mhlophe kwaye zingalungiswa njani?

Amabala amhlophe abangelwa kukungcola (umz., i-zinc) okanye ubushushu obugqithisileyo (>270℃). Buyisela i-solder kwaye ugcine ubushushu bukwi-230-260℃.
83. Kubandakanya ntoni ukulinganiswa kwezixhobo ze-THT ngonyaka?

Linganisa iprofayili yobushushu (±5℃), ukuphakama kwamaza (±0.1mm), ivolumu yokujikeleza (±10%), kunye nexesha (±0.1s) kwiiparameter eziphambili.

17. Ulawulo loMgangatho kunye neMigangatho yoShishino

84. Ungabala njani i-THT first-pass yield?

Inzuzo yokupasa kokuqala = (Iiyunithi zizonke - Iiyunithi ezisilelayo kuqala)/Iiyunithi zizonke × 100%. Inqanaba eligqwesileyo ≥98%.
85. Zithini iimfuno zesatifikethi se-THT kwizixhobo zokubonisa uloliwe?

Kufuneka isiqinisekiso sokuthembeka kokusingqongileyo se-EN 50121 EMC kunye ne-EN 50155. Amalungu e-solder kufuneka aphumelele uvavanyo lokungcangcazela lwe-5-50Hz/2g kangangeeyure ezi-3.
86. I-PCB preheat slope iyichaphazela njani umgangatho we-THT soldering?

Ukuthambeka okushushubezwayo kucetyiswa kwi-1-3℃/s. Ukuthambeka okugqithisileyo kubangela uxinzelelo lobushushu; ukuthambeka okunganelanga kunciphisa ukusebenza kwe-flux. Ukuthambeka okufanelekileyo kunciphisa iziphene ngama-20%.
87. Ungavavanya njani ukunyibilika kwee-solder ze-THT?

Sebenzisa uvavanyo lokulinganisela ukumanzisa: I-Sn-Pb solder kufuneka ifikelele kumandla okumanzisa aphezulu ≤2s kwi-235℃, okanye i-engile yokumanzisa ≤25° ukuze isebenze kakuhle.
88. Ungakuthintela njani ukukhululeka kwejoyinti yesixhumi sesoda kwi-THT?

Faka i-threadlocker (umz., iLoctite 243) kwi-10-15N・m anti-loosening torque, okanye sebenzisa ii-latches zoomatshini zokumelana nokungcangcazela.

18. Ukuphuculwa kwenkqubo kunye neetekhnoloji ezintsha

89. Ubuninzi be-soldering buyichaphazela njani ukuthembeka kwamalungu e-THT?

Ukutywina okuphindaphindiweyo okungaphezulu kwezihlandlo ezi-3 kwandisa ubukhulu be-intermetallic layer nge-50% kwaye kunciphisa ubomi bokudinwa nge-60%. Umda ube yi-≤2 imizamo yokutywina ngelungu ngalinye.
90. Ungabala njani izinga lokuveliswa kwenkunkuma yesolder kwi-THT?

Izinga lokulahlwa = (I-solder iyonke esetyenzisiweyo - I-solder esebenzayo esetyenzisiweyo)/I-solder iyonke esetyenzisiweyo × 100%. Ulawulo oluqhelekileyo ≤3%-5%.
91. Zithini iimfuno zococeko lwe-THT kwiimveliso zomkhosi?

Kufuneka ihlangabezane nemigangatho ye-MIL-P-28809 enongcoliseko lwe-ionic yomphezulu ≤1.0μg/cm², ivavanywe nge-ion chromatography ukuthintela ukufuduka kwe-electrochemical.
92. Ungawenza njani ngcono umlinganiselo wokupholisa kwi-THT wave soldering?

Izinga lokuphola elicetyiswayo kwi-3-5℃/s. Ukukhawuleza kakhulu kubangela ukuqhekeka; ukucotha kakhulu kunciphisa ukusebenza kakuhle. Sebenzisa umoya opholisiweyo kunye namanzi ukuze ulawule ngokuchanekileyo.
93. I-THT ingadibaniswa phi neetekhnoloji ezintsha zokunyibilikisa isinyithi (umz., ukunyibilikisa nge-laser)?

Kwiibhodi ezixutyiweyo ezinoxinano olukhulu, sebenzisa i-laser soldering kwi-SMT kunye ne-wave soldering kwiinxalenye ze-THT ezinamandla aphezulu; okanye usebenzise i-laser rework ukulungisa iziphene ze-THT.

Ngobuchwepheshe bokufaka imingxunya i-THT

1. Iingcamango nemigaqo esisiseko

1. Yintoni i-Through Hole Technology (THT)?

2. Ngowuphi umahluko ophambili phakathi kweTHT kunye neSurface Mount Technology (SMT)?

3. Iyintoni indlela esisiseko yokuhamba kwe-THT?

4. Zeziphi iintlobo zezinto ze-elektroniki ezifanelekileyo kwi-THT?

5. Yintoni ubuncinci be-via diameter ye-PCB kwinkqubo ye-THT?

2. Ukuphathwa kweCandelo kunye nePin

6. Zeziphi iimilo eziqhelekileyo zee-leads ze-THT component?

7. Zithini iimfuno zokukwazi ukunyibilikisa izinto ezisetyenziswa kwi-component leads?

8. Ungawuphucula njani umbane onyibilikiswayo kwiileyiti zecandelo?

9. Bungakanani ubude be-lead obufanelekileyo kwiinxalenye ze-THT?

10. Izinto ezahlukeneyo zelothe zikuchaphazela njani ukutywinwa?

3. IBhodi yeSekethe ePrintiweyo (PCB) enxulumene nayo

11. Zithini iimfuno zezinto ze-PCB kwinkqubo ye-THT?

12. Zithini imigangatho yokunyamezelana kwee-PCB vias?

13. Ungakuthintela njani ukuguqulwa kwe-PCB ngexesha lokunyibilikisa i-THT?

14. Ukuqina kodonga olusebenzisa i-thread roughness kuyichaphazela njani i-soldering?

15. Ziziphi iimfuno ezikhethekileyo zee-PCB ezinamaleya amaninzi kwi-THT?

4. Inkqubo yokuWelda - Ukunyibilikisa amaza

16. Yintoni umgaqo osisiseko wokunyibilikisa amaza?

17. Lithini iqondo lobushushu eliqhelekileyo le-solder xa kudityaniswa amaza?

18. Lingakanani ixesha eliqhelekileyo lokunyibilikisa i-wave soldering?

19. Ungalulungisa njani ukuphakama kwegagasi kwi-wave soldering?

20. Ziziphi iindlela zokusebenzisa i-flux kwi-wave soldering kunye neempawu zazo?

5. Inkqubo yokuWelda - UkuWelda ngesandla kunye nezinye

21. Ungalawula njani ubushushu kunye nexesha lokudibanisa ngesandla izinto ze-THT?

22. Ziziphi iimpawu kunye nokusetyenziswa kwe-dip soldering?

23. Ziziphi iingenelo zokufaka i-solder ekhethiweyo?

24. Ngaba i-reflow soldering ingasetyenziselwa izinto ze-THT?

25. Zithini iimfuno ze-solder kwiinkqubo ezahlukeneyo ze-soldering?

6. I-Solder kunye ne-Flux

26. Zeziphi izinto eziqhelekileyo ezixutywa yi-THT solders?

27. Yintoni umahluko phakathi kwe-solders ezingenalo i-lead kunye ne-solders ezine-lead?

28. Yintoni indima ephambili ye-flux?

29. Ahlulwa njani amanqanaba omsebenzi we-flux?

30. Zithini iziphumo ze-flux residues kwi-circuits?

7. Izixhobo kunye neZixhobo

31. Zeziphi iintlobo eziphambili zoomatshini bokufaka izinto ngokuzenzekelayo?

32. Ithini indlela eqhelekileyo yokufaka izinto ezizenzekelayo xa kusetyenziswa oomatshini bokufaka izinto?

33. Ukugcinwa kwemihla ngemihla koomatshini bokutywina ngamaza kuquka ntoni?

34. Ngawaphi amanqaku aphambili okukhetha nokusebenzisa izixhobo zokutywina ngesandla?

35. Zeziphi iintlobo zezinto ezisetyenziswa rhoqo kwiinkqubo ze-THT?

8. Ulawulo lomgangatho kunye nohlalutyo lweziphene

36. Zeziphi iziphene eziqhelekileyo kwi-THT soldering?

37. Zithini izizathu kunye nezisombululo zamalungu abandayo?

38. Zithini izizathu kunye namanyathelo okuthintela ukuvalwa kweendlela?

39. Ungawuhlola njani umgangatho we-THT soldering?

40. Zithini imigangatho yomgangatho we-THT soldering?

9. Ukhuseleko kunye noKhuseleko lweNdalo

41. Zithini iimfuno zokusingqongileyo kwiinkqubo ze-THT?

42. Ziziphi iimfuno ezikhethekileyo abanazo abaqhubi be-soldering abangenalo ilothe?

43. Ungawulahla njani umnyibilikisi wenkunkuma kunye nokutshintshatshintsha kwenkqubo ye-THT?

44. Zithini iimfuno zokungenisa umoya kwiindawo zokusebenzela zokunyibilikisa?

45. Ngawaphi amanyathelo okhuseleko kwiikhemikhali ezisetyenziswa kwiinkqubo ze-THT?

10. Ukulungiswa kwenkqubo kunye nolawulo lweendleko

46. ​​Ungayiphucula njani indlela esebenza ngayo inkqubo ye-THT?

47. Zeziphi izinto eziphambili ezixabisa iinkqubo ze-THT?

48. Ungazinciphisa njani iindleko zemveliso ye-THT?

49. Ixabiso le-THT lithelekiswa njani ne-SMT?

50. Ungayiphucula njani isivuno se-THT soldering ngokusebenzisa ukwenziwa ngcono kwenkqubo?

11. Izicelo ezikhethekileyo kunye neenkqubo ezixutyiweyo

51. Ziziphi iingenelo zokuhlanganiswa kwe-THT/SMT exutyiweyo?

52. Ithini indlela esebenza ngayo inkqubo yokuhlanganisa i-THT/SMT exutyiweyo?

53. Ungakuthintela njani ukwahlukana kwe-SMT component ngexesha lokudityaniswa kwamaza kwiinkqubo ezixutyiweyo?

54. Zeziphi iimfuno ezikhethekileyo ezinazo i-THT kwizicelo ezinokuthembeka okuphezulu?

55. Zeziphi izinto ezibalulekileyo ekufuneka ziqwalaselwe kwi-THT kwizicelo zomkhosi?

12. Iiteknoloji Ezisakhulayo kunye noPhuhliso lweXesha Elizayo

56. Zithini iindlela zophuhliso lwexesha elizayo lwe-THT?

57. Ithini impembelelo yoshicilelo lwe-3D kwi-THT?

58. Zithini iingenelo zokusetyenziswa kwe-AI kwi-THT?

59. Izinto ezintsha ze-solder ziqhuba njani uphuhliso lwe-THT?

60. Zeziphi iingxaki namathuba eziziswa ziimfuno zokusingqongileyo kwi-THT?

13. Uhlengahlengiso lweparameter yenkqubo

61. Ungazilungisa njani iiparameter zokunyibilikisa amaza kwiindawo ezibandayo rhoqo?

62. Uxinzelelo lwe-flux luyichaphazela njani umgangatho we-soldering? Ungalulungisa njani?

63. Isantya sokufaka sichaphazela njani umgangatho kwiimashini ezizenzekelayo?

64. Yintoni indima yobushushu obufudunyezwayo ngaphambi kobushushu kwi-THT soldering? Ungabubeka njani?

65. Ubushushu obungqongileyo buyichaphazela njani i-THT soldering?

66. Ungakuthintela njani ukwahlulwa kwe-PCB pad kwi-THT?

46. Ungayiphucula njani indlela esebenza ngayo inkqubo ye-THT?