I-AOI, i-X-reyi, i-ICT, i-FCT

I-AOI imele i-Automated Optical Inspection. Isebenzisa iikhamera ze-optical ukuthwebula imifanekiso ye-PCB, izithelekise nemifanekiso eqhelekileyo, kwaye ibona ngokuzenzekelayo iziphene ezifana neenxalenye ezingekhoyo, iinxalenye ezingalunganga, i-reverse polarity, i-offset, i-bridging, njl. ngexesha lenkqubo yokubeka iinxalenye, ukuqinisekisa umgangatho wemveliso kunye nokuphucula isivuno semveliso.

I-AOI isebenzisa umgaqo womfanekiso we-optical. Ikhanyisa i-PCB ngomthombo wokukhanya, ikhamera ibamba umfanekiso, ize emva koko i-algorithm yokucubungula umfanekiso ikhuphe iimpawu zecandelo. Ezi mpawu zithelekiswa nedatha yomfanekiso esemgangathweni emiselweyo ukuze kuchongwe ukuba kukho iziphene zokubekwa kwecandelo na.

Izinto ezinje ngokuchaneka kokufumanisa (kufuneka zihlangabezane neemfuno zokuchaneka kokubekwa kwecandelo, umzekelo, ukuchaneka kufuneka kufikelele kwi-±0.02mm xa kufunyanwa izinto ze-0201), isantya sokufumanisa (sihambelana nomjikelo womgca wemveliso), imisebenzi yesoftware (ene-algorithms etyebileyo yokufumanisa, ukucwangcisa okulula, kunye nohlalutyo lwedatha), kunye nokukhula (okuxhasa ukuchongwa kwee-PCB zobukhulu obahlukeneyo kwaye zihambelana neentlobo ezahlukeneyo zecandelo) kufuneka ziqwalaselwe.

Iintlobo zemithombo yokukhanya eqhelekileyo ziquka imithombo yokukhanya emhlophe, imithombo yokukhanya ebomvu, imithombo yokukhanya eluhlaza okwesibhakabhaka, kunye nemithombo yokukhanya efana nesangqa. Imithombo yokukhanya emhlophe inika uluhlu olupheleleyo kwaye ifanelekile ukubonwa ngokubanzi. Imithombo yokukhanya ebomvu inemiphumo emihle yokubonwa kwifoyile yobhedu kunye namalungu e-solder. Imithombo yokukhanya eluhlaza okwesibhakabhaka inomahluko omkhulu kwiimaski ze-solder eziluhlaza. Imithombo yokukhanya efana nesangqa inokunciphisa izithunzi kwaye ifanelekile ukubonwa kwezinto ezintsonkothileyo kunye nee-PCB ezinomahluko wokuphakama.

Kuyimfuneko ukuqinisekisa ukuba umphezulu we-PCB ucocekile ngaphandle kwezinto ezingcolisayo ezifana nothuli kunye namabala eoyile. Jonga ukuba amanqaku oMpawu wokubeka i-PCB acacile kwaye aphelele ukuze isixhobo se-AOI sichonge ngokuchanekileyo kwaye sibeke kwindawo yaso. Kwii-PCB ezifakelwe amacala amabini, hlula ngokucacileyo umphezulu wokufumanisa ukuze uphephe ukubhaqwa kakubi.

Iiparamitha zokufumanisa ziquka iiparamitha zokufumana umfanekiso (ezifana nexesha lokuvezwa, inzuzo, umahluko), iiparamitha ze-algorithm zokufumanisa (ezifana nomda, uvakalelo lokufumanisa umda), kunye neeparamitha zendawo yokufumanisa (ezichaza iindawo zecandelo eziza kubonwa kunye neendawo ezinganakwanga). Ngokwesiqhelo, ngokwendlela yoyilo lwe-PCB, iintlobo zecandelo, kunye neenkqubo zemveliso, iiparamitha kufuneka ziphuculwe ngokusebenzisa ukulungisa iimpazamo kunye nokufumanisa uvavanyo ukuze kufezekiswe iziphumo ezilungileyo zokufumanisa.

I-AOI ingabona iziphene ezifana nezixhobo ezingekhoyo (izixhobo azibekwanga), izixhobo ezingalunganga (iimodeli zezixhobo ezingalunganga), i-reverse polarity (i-polarity - izixhobo ezinobuthathaka ezine-reversed polarity), i-component offset (indawo edlula ukunyamezela okuvumelekileyo), i-solder bridging (i-solder edibanisa ii-pads ezikufutshane), umonakalo wecandelo (umonakalo wembonakalo), ukubethelwa kwelitye le-component (esinye isiphelo secandelo 翘起), njl.

Xa i-AOI ibona isiphene, iya kuphawula ngokuzenzekelayo indawo yesiphene kwaye ithayiphe kwaye ivelise umyalezo we-alamu. Abaqhubi kufuneka bayihlukanise i-PCB enesiphako ngokwesicelo se-alamu, baze bayiqinisekise ngakumbi ngokujonga ngamehlo okanye ngezinye iindlela zokufumanisa. Emva koko, yilungise okanye uyilahle i-PCB ngokwehlobo lwesiphene.

Lungisa rhoqo iikhamera kunye nemithombo yokukhanya yesixhobo se-AOI ukuqinisekisa ukufunyanwa komfanekiso ngokuchanekileyo. Lungisa iiparameter zokufumanisa kwaye ulungise ii-algorithms kwiintlobo ezahlukeneyo zezixhobo kunye noyilo lwe-PCB. Hlaziya ilayibrari yezixhobo kunye nedatha yomfanekiso esemgangathweni ngexesha elifanelekileyo ukuze uzivumelanise neemveliso kunye neenkqubo ezintsha. Nika uqeqesho lobuchwephesha kubaqhubi ukuphucula izakhono zabo zokugweba iiparameter - ukuseta kunye neziphene.

Ukugcinwa kwemihla ngemihla kuquka ukucoca umphezulu wesixhobo, iilensi, kunye nemithombo yokukhanya ukuze kuthintelwe uthuli ukuba lungachaphazeli umgangatho womfanekiso. Jonga rhoqo imeko yokusebenza kwezixhobo zoomatshini zesixhobo (ezifana neereyile zesikhokelo kunye nezikrufu zelothe), zithambise kwaye uziqinise. Jonga uqhagamshelo lombane. Yenza uvavanyo olusebenzayo kunye nokulinganisa isixhobo rhoqo ukuqinisekisa ukusebenza okuzinzileyo kokuchonga.

Iingenelo zisantya sokufumanisa esikhawulezayo, esinokusetyenziselwa ukufumanisa ngexesha langempela kwi-intanethi; ixabiso eliphantsi kakhulu; kunye nokukwazi ukubona ngokubonakalayo ukubonakala kwenxalenye kunye neziphene zomphezulu. Iziphene kukuba ayinakukwazi ukubona iziphene zejoyinti zesolder ezifihliweyo (ezifana nejoyinti zesolder zangaphakathi ze-BGA kunye ne-CSP), kwaye inamandla okubona iziphene ezincinci (ezifana nezithuba ezincinci kune-50μm). Ukuhlolwa kwe-X - Ray kunokubona iziphene zangaphakathi, kodwa kuhamba kancinci kwaye kuyabiza.

Imisebenzi ephambili yesoftware ye-AOI ibandakanya ukufunyanwa kunye nokucubungula imifanekiso, ukucwangcisa iinkqubo zokuhlola (ukuchaza indawo yokuhlolwa, ukuseta iiparameter zokuhlolwa, ukukhetha ii-algorithms zokuhlolwa), ukuqatshelwa kunye nokuhlelwa kweziphene, ukubonisa kunye nokurekhoda iziphumo zokuhlolwa, uhlalutyo lwedatha kunye nezibalo (ukuvelisa iingxelo zesivuno, iitshathi zokusasazwa kweziphene, njl.njl.), kunye nokusebenzisana kwedatha nezinye izixhobo zomgca wemveliso (ezifana noomatshini bokukhetha kunye nendawo kunye nezikhululo zokuphinda usebenze).

Izizathu ziquka ukuseta okungafanelekanga kweeparamitha zokufumanisa (ezifana nemida ephezulu kakhulu okanye ephantsi kakhulu), ukubonwa komfanekiso okungalunganga okubangelwa kukubonakaliswa komphezulu wecandelo okanye umahluko wombala, ukuphazamiseka okuvela kumabala okanye izinto zangaphandle kumphezulu we-PCB, ungcoliseko lwelensi yesixhobo se-AOI okanye umthombo wokukhanya, kunye nokuphambuka phakathi kwemifanekiso eqhelekileyo kwithala leencwadi lecandelo kunye nezinto zokwenyani.

Lungisa kwakhona iiparameter zokufumanisa kwaye ulungise umda kunye novakalelo ngokufumanisa uvavanyo. Coca umphezulu we-PCB ukuze ususe amabala kunye nezinto zangaphandle. Coca okanye utshintshe iilensi kunye nemithombo yokukhanya engcolileyo. Hlaziya imifanekiso eqhelekileyo kwithala leencwadi lezinto ukuqinisekisa ukuhambelana nezinto zokwenyani. Sebenzisa ii-algorithms ezininzi zokufumanisa ukuze zihambelane kwaye unciphise imida ye-algorithm enye.

Izixhobo zanamhlanje ze-AOI zihlala zikwazi ukukhulisa kakuhle. Indawo yokuhlolwa kunye neeparameter zinokulungiswa ngokusebenzisa useto lwesoftware ukuze zilungelelaniswe nee-PCB zobukhulu obahlukeneyo. Kwiintlobo ezahlukeneyo ze-PCB (ezifana neebhodi eziqinileyo, iibhodi eziguquguqukayo, iibhodi eziqinileyo neziguquguqukayo), okoko nje zikwisakhono sokufumanisa sesixhobo, ukufumanisa okusebenzayo kunokufezekiswa ngokulungelelanisa iinkqubo zokufumanisa kunye neeparameter ezifanelekileyo.

I-AOI idla ngokufakelwa emva komatshini wokukhetha nokubeka nangaphambi kokufaka i-soldering kwakhona, ukuze kufunyanwe iziphene zokubekwa kwecandelo ngexesha elifanelekileyo kwaye kuthintelwe iimveliso ezineziphene ukuba zingangeni kwinkqubo yokufakela i-soldering kwakhona, nto leyo enciphisa iindleko zokuphinda kusetyenziswe. Ingafakwa emva kokufaka i-soldering kwakhona ukuze kufunyanwe umgangatho we-soldering, kodwa ukuba kufunyenwe iingxaki ngeli xesha, ubunzima kunye neendleko zokuphinda kusetyenziswe ziya kwanda.

Ngokuhlalutya idatha yokufumanisa i-AOI, bala amazinga okuvela kunye nokusasazwa kweziphene ezahlukeneyo ukuze kuchongwe amakhonkco abuthathaka kwinkqubo yemveliso. Umzekelo, ukuba isiphene sohlobo oluthile lwenxalenye sivela rhoqo, iiparameter zokubekwa komatshini wokukhetha kunye nendawo zinokulungiswa. Ukuba kukho iziphene ezininzi zokuvala, inkqubo yokuprinta i-solder paste okanye iprofayili yobushushu be-reflow soldering inokulungiswa.

Ukuhlolwa kwe-X-ray kusebenzisa i-X-ray ukungena kwi-PCB nakwiinxalenye. Ngokusekelwe kumanqanaba ahlukeneyo okufunxa kwezinto ezahlukeneyo ukuya kwi-X-ray, i-grayscale - imifanekiso eyahlukeneyo yenziwa, ngaloo ndlela kufunyanwa iziphene zangaphakathi kwindawo yokubeka i-PCB, ezifana ne-voids, i-cold soldering, kunye ne-non-wetting kwi-solder joints zezixhobo ezipakishiweyo ezifana ne-BGA kunye ne-CSP, kunye nezakhiwo zangaphakathi ezingaqhelekanga zezixhobo kunye nezinto zangaphandle, ukuqinisekisa umgangatho wemveliso kunye nokuthembeka.

I-X - imisebe iyakwazi ukungena. Xa i-X - imisebe ikhanyisa i-PCB, ngenxa yamandla ahlukeneyo okufunxa izinto ezahlukeneyo kwi-PCB (ezifana nobhedu, i-solder, iplastiki yokupakishwa, njl.njl.) ukuya kwi-X - imisebe, ubukhali be-X - imisebe emva kokudlula kwi-PCB buyahluka. Isixhobo sokubona sifumana le misebe ye-X yobukhulu obahlukeneyo size siyiguqule ibe ziimpawu zombane, ezithi emva koko zicutshungulwe kwaye ziguqulwe zibe yimifanekiso engwevu. Ulwakhiwo lwangaphakathi kunye neemeko zesiphene zinokugwetywa ngokuhlalutya imifanekiso.

Izinto ezinje ngokuchaneka kokufumanisa (kufuneka zikwazi ukwahlula iziphene ezincinci, ezifana ne-micron - level solder joint voids), ukukhulisa (ukuhlangabezana neemfuno zokufumanisa izinto ezinobukhulu obahlukeneyo), isantya sokufumanisa (esihambelana nomjikelo womgca wemveliso), isisombululo somfanekiso (isisombululo esiphezulu sinceda ukujonga ngokucacileyo iinkcukacha), ukuguquguquka kwezixhobo (ukuxhasa ukuchongwa kwee-PCB zobukhulu obahlukeneyo kunye nokuhambelana neendlela ezahlukeneyo zokufumanisa), kunye nemisebenzi yesoftware (enemisebenzi efana nohlalutyo lomfanekiso, ukuqondwa kweziphene, kunye nezibalo zedatha) kufuneka ziqwalaselwe.

Iindidi eziqhelekileyo ziquka izixhobo zokuhlola i-2D X - ray kunye nezixhobo zokuhlola i-3D X - ray (ezifana nezixhobo zokuhlola i-CT). Izixhobo ze-2D zinesakhiwo esilula kwaye zixabisa kancinci, kwaye zinokubona umphezulu kunye nezinye iziphene zangaphakathi ze-PCB. Izixhobo ze-3D zinokufumana imifanekiso enamaleko amaninzi kwaye zifezekise umfanekiso we-3D, onokubona ngokuchanekileyo iziphene zangaphakathi zezixhobo ezinezakhiwo ezintsonkothileyo, kodwa ixabiso lezixhobo liphezulu kwaye isantya sokufumanisa sicotha kakhulu.

Ngokubanzi, akukho nyango lukhethekileyo olufunekayo ngaphambi kokuba lulungiswe, kodwa kuyimfuneko ukuqinisekisa ukuba umphezulu we-PCB ucocekile ngaphandle kwamabala acacileyo kunye nezinto zangaphandle; susa izigqubuthelo zesinyithi zokukhusela kunye nezinye izixhobo kwi-PCB ezinokuchaphazela uhlolo; kwii-PCB ezineeleya ezininzi, ukuba iileya ezithile zaziwa ukuba azifuneki uhlolo, zinokufakwa kwisoftware yohlolo ukuphucula ukusebenza kakuhle kohlolo.

Iiparamitha zokufumanisa ziquka i-voltage yetyhubhu kunye nomsinga wetyhubhu ye-X - reys (echaphazela ubukhali kunye nokungeneka kwe-X - reys), ixesha lokuvezwa (echaphazela ukukhanya kunye nokucaca komfanekiso), ukukhulisa (okuhlengahlengisiweyo ngokobungakanani becandelo kunye neemfuno zokufumanisa), i-engile yokufumanisa (kwizixhobo zokuhlola ze-3D, ii-engile ezahlukeneyo kufuneka zisetwe ukuze ziskenwe), njl. Ngokwesiqhelo, ngokwezinto ezisetyenzisiweyo, ubukhulu be-PCB, kunye neentlobo zecandelo, iiparamitha kufuneka ziphuculwe ngokulungisa iimpazamo kunye nokufumanisa uvavanyo ukuze kufunyanwe imifanekiso yokuhlolwa engcono kakhulu.

I-X-ray ingabona iziphene zangaphakathi ze-solder joints zezixhobo ezipakishiweyo ezifana ne-BGA, i-CSP, kunye ne-QFN, ezifana ne-voids, i-cold soldering, i-non-wetting, i-missing solder balls, kunye ne-solder ball offset. Ingabona neentanda kunye nezinto zangaphandle ngaphakathi kwezixhobo, kunye neengxaki ezifana ne-interlayer short circuits kunye ne-open circuits ngaphakathi kwe-PCB.

Xa i-X-ray ibona iziphene, kuya kwenziwa ingxelo yokuhlolwa eneenkcukacha, ephawula indawo yesiphene, uhlobo, kunye nobunzima. Abaqhubi kufuneka bahlukanise i-PCB eneziphene ngokwengxelo. Kwiiziphene ezinokulungiswa (ezifana neengxaki ezithile zejoyinti ye-solder), zinokulungiswa ngezixhobo zokulungisa. Kwii-PCB ezineziphene ezinzulu, ziya kulahlwa, kwaye izizathu zeziphene ziya kuhlalutywa ukuze kuphuculwe inkqubo yemveliso.

Lungisa rhoqo izixhobo ze-X-ray ukuqinisekisa ukusebenza okuzinzileyo komthombo we-X-ray kunye ne-detector; phucula iiparameter zokufumanisa kwaye ulungise iiparameter zeentlobo ezahlukeneyo ze-PCB kunye neenxalenye; yamkela ii-algorithms zohlalutyo lomfanekiso eziphambili ukuphucula ukuchaneka kokuqatshelwa kweziphene; ukubonelela ngoqeqesho lobungcali kubaqhubi ukuphucula ubuchule babo bokuhlalutya umfanekiso kunye nobuchule bokugweba iziphene; umisele iinkqubo zokuhlola ezisemgangathweni kunye neenkcukacha zokunciphisa iimpazamo zabantu.

Ukugcinwa kwemihla ngemihla kuquka ukucoca umphezulu wesixhobo ukuze kuthintelwe ukuqokelelana kothuli ekuphazamiseni ukusasazwa kobushushu; ukujonga rhoqo imeko yokusebenza kwetyhubhu ye-X kunye neeparameter zokujonga ezifana nombane wetyhubhu kunye nomsinga wetyhubhu; ukujonga uvakalelo kunye nozinzo lwesixhobo sokubona; ukuthambisa nokubopha izixhobo zothumelo loomatshini besixhobo; ukuqhuba uvavanyo lokusebenza rhoqo kunye nokulinganisa kwisixhobo ukuqinisekisa iziphumo zokufumanisa ezichanekileyo nezithembekileyo.

Iingenelo kukukwazi ukubona iziphene zangaphakathi ezifihlakeleyo ze-PCB kunye neenxalenye, kwaye ineengenelo ezikhethekileyo ekuhlolweni kweendawo zokudibanisa iipakethe ezifana ne-BGA kunye ne-CSP; inokubonelela ngolwazi lwesakhiwo se-3D (ukuhlolwa kwe-3D X - ray). Iingxaki zisantya sokubona esicothayo, iindleko eziphezulu; kufuneka abasebenzi abaziingcali kuhlalutyo lomfanekiso kunye nokugweba iziphene; ii-X - ray zi-radioactive ukuya kwinqanaba elithile, kwaye kufuneka amanyathelo okukhusela. Ukuhlolwa kwe-AOI kukhawuleza, kubiza kancinci, kwaye kunokubona ngokubonakalayo imbonakalo kunye neziphene zomphezulu wezixhobo, kodwa akunakubona iziphene zangaphakathi ezifihliweyo.

Imisebenzi ephambili yesoftware yokuhlola i-X-ray ibandakanya ukufunyanwa kunye nokucubungula imifanekiso (ukulungisa ukukhanya komfanekiso, umahluko, ukucoca, njl.njl.), ukuqatshelwa kunye nokuphawula iziphene (ukuqatshelwa ngokuzenzekelayo okanye ngesandla kweziphene kunye nokumakishwa kweendawo kunye neentlobo zazo), ukwakhiwa kwakhona komfanekiso we-3D (kwizixhobo ze-3D X-ray), ukuveliswa kweengxelo zeziphumo zokuhlolwa (iirekhodi ezineenkcukacha zolwazi lwesiphene, iiparameter zokufumanisa, njl.njl.), uhlalutyo lwedatha kunye nezibalo (ukubala amazinga okwenzeka kweziphene kunye neengxaki zenkqubo yokuvelisa ukuhlalutya), kunye nokusebenzisana kwedatha nezinye iinkqubo zemigca yemveliso.

Izizathu ziquka ukuseta okungafanelekanga kweeparameter zokufumanisa (ezifana ne-voltage yetyhubhu engafanelekanga kunye nexesha lokuvezwa okubangela umgangatho ophantsi womfanekiso), imida ye-algorithms yohlalutyo lomfanekiso (ukungakwazi ukuchonga ngokuchanekileyo iziphene ezinzima), ukungabikho kwamava omqhubi (ukugweba okungalunganga kwemifanekiso), izixhobo ezikhethekileyo kunye nezakhiwo ze-PCB okanye iinxalenye (okubangela ukuba umfanekiso ungabi mhlophe ngendlela engaqhelekanga), kunye neengxaki ngokuchaneka nokuzinza kwezixhobo ngokwazo.

Phinda ulungise iiparameter zokufumanisa ukuze kuphuculwe umgangatho womfanekiso; uphucule okanye uphucule ii-algorithms zohlalutyo lomfanekiso ukuze kuphuculwe amandla okubona iziphene; uqinise uqeqesho lwabaqhubi ukuphucula inqanaba labo lobungcali; umisele ithala leencwadi lesampulu yeziphene ukuze kuhlalutywe ngokuthelekisa imifanekiso enzima; ulondoloze kwaye ulinganise izixhobo rhoqo ukuqinisekisa ukusebenza okuzinzileyo kwezixhobo.

Izixhobo ze-X-ray zanamhlanje zihlala zinokulungelelaniswa okuthile kunye nokuhambelana. Ngokusebenzisa useto lwesoftware kunye nohlengahlengiso lwehardware (njengokutshintsha iilensi ezinobude obahlukeneyo befocal kunye nokulungisa ubungakanani beqonga lokuhlola), zinokuziqhelanisa nokuhlolwa kwee-PCB zobukhulu obahlukeneyo. Kwiintlobo ezahlukeneyo zee-PCB (ezifana neebhodi eziqinileyo, iibhodi eziguquguqukayo, iibhodi eziqinileyo neziguquguqukayo) kunye nezinto, okoko nje zikwisakhono sokufumanisa sesixhobo, ukufunyanwa okusebenzayo kunokufezekiswa ngokulungelelanisa iiparameter kunye neendlela zokufumanisa ezifanelekileyo. Nangona kunjalo, kwii-PCB ezinezakhiwo ezikhethekileyo okanye ii-PCB ezibhityileyo nezityebileyo, izixhobo ezicwangcisiweyo ngokukodwa zinokufuneka.

Idla ngokufakelwa emva kokuphinda kufakwe i-soldering ukuze ihlolwe i-PCB emva kokuwelda kwaye ifumane iziphene zangaphakathi ezinje ngamajoyinti e-solder ngexesha elifanelekileyo. Ingaseka nesikhululo sokuhlola i-X-ray esahlukileyo emva kweenkqubo eziphambili (ezifana nokubekwa kwecandelo le-BGA) ukuze kwenziwe uhlolo olukhethekileyo kwiindawo eziphambili ukuqinisekisa umgangatho wemveliso, kodwa oku kuya kwandisa ubunzima kunye neendleko zomgca wemveliso.

Ngokuhlalutya idatha yokuhlolwa kwe-X-ray, bala ukusasazwa kunye nokuphindaphinda kokwenzeka kweziphene ezahlukeneyo ukuze kuchongwe amakhonkco abuthathaka kwinkqubo yemveliso. Umzekelo, ukuba izinga lokungafumaneki kwamalungu e-BGA solder kwibhetshi ethile yee-PCB lifunyenwe liphezulu, ubungakanani bokuprinta i-solder paste, iprofayili yobushushu bokutshaja kwakhona, okanye uxinzelelo lokubekwa kwecandelo lunokulungiswa. Ukuba izinto zangaphandle ngaphakathi kwecandelo zivela rhoqo, umgangatho wezixhobo ezingenayo kunye nokucoceka kwendawo yemveliso kunokujongwa, kwaye inkqubo inokuphuculwa kwaye ulawulo lunokomelezwa ngokufanelekileyo.

Umgca we-ICT, obizwa ngokuba ngumgca wovavanyo lwe-In-Circuit, sisixhobo esenza uvavanyo lokusebenza kombane kwii-PCB ezinezixhobo ezifakelweyo nezifakwe i-solder. Sidibana neendawo zovavanyo kwi-PCB ngee-probes, sibona ii-open circuits, ii-short circuits, kunye nokuba iiparameter ze-component (ezifana nokuxhathisa, i-capacitance, kunye namaxabiso e-inductance) ziyahlangabezana neemfuno zoyilo, kunye nomgangatho we-soldering wezixhobo. Sinokufumana ngokukhawuleza izixhobo ezineengxaki kunye namalungu e-solder aneengxaki, siqinisekise umgangatho weemveliso ze-PCB kwaye siphucule ukusebenza kakuhle kwemveliso kunye nemveliso.

Umgaqo wovavanyo lwe-ICT usekelwe kuhlalutyo lwenethiwekhi yesekethe. Izixhobo zovavanyo zisebenzisa imiqondiso yokuvuselela (efana nombane kunye nombane) kwiindawo zovavanyo kwi-PCB ngokusebenzisa iiprobes, kwaye emva koko zilinganisa imiqondiso yokuphendula yesekethe. Ngokwenkqubo yovavanyo esetiweyo kunye neeparameters ezisemgangathweni, amaxabiso alinganisiweyo athelekiswa namaxabiso ethiyori ukuze kuchongwe ukuba kukho iingxaki ezifana neesekethe ezivulekileyo, iisekethe ezimfutshane, kunye nokuphambuka kweparameter yecandelo kwisekethe. Umzekelo, kwinxalenye yokumelana, kusetyenziswa i-voltage eyaziwayo, umbane ohambayo uyalinganiswa, kwaye ixabiso lokumelana liyabalwa kwaye lithelekiswa nexabiso eliqhelekileyo.

Xa ukhetha, izinto ezinje ngokuchaneka kovavanyo (ezikwaziyo ukulinganisa ngokuchanekileyo iiparameter zecandelo, ezinje ngokuchaneka komlinganiselo wokuchaneka kwe-±1%), isantya sovavanyo (ukuhlangabezana neemfuno zomjikelo womgca wemveliso), inani lamanqaku anokuvavanywa (afanelekileyo kwinani lamanqaku ovavanyo kwi-PCB), imisebenzi yesoftware (enojongano lwenkqubo yemizobo, umsebenzi wokuchonga ngokuzenzekelayo, amandla ohlalutyo lweenkcukacha-manani zedatha), ukuhambelana kwezixhobo (ezixhasa uvavanyo lweentlobo ezahlukeneyo ze-PCB kunye neepakethe zecandelo ezahlukeneyo), ubomi benkonzo ye-probe, kunye neendleko zokugcinwa kufuneka ziqwalaselwe. Ukongeza, kufuneka kuqwalaselwe nenkxaso yobugcisa kunye nokukwazi kwenkonzo yokuthengisa emva kokuthengisa komthengisi wezixhobo.

Izixhobo eziqhelekileyo ze-ICT ziquka i-bed - of - nails ICT kunye ne-flying - probe ICT. I-bed - of - nails ICT idibana neendawo zovavanyo ze-PCB ngebhedi esisigxina yezipikili, kwaye inokuvavanya amanqaku amaninzi ngexesha elinye, ngesantya sovavanyo esikhawulezayo, esifanelekileyo kwimveliso yobuninzi. Nangona kunjalo, iindleko zokwenza ibhedi - of - nails ziphezulu, kwaye ibhedi - of - nails kufuneka itshintshwe kwii-PCB ezahlukeneyo. I-flying - probe ICT isebenzisa ii-probes ezihambayo ukuvavanya amanqaku nganye nganye, ngaphandle kwesidingo sokwenza ibhedi - of - nails, enokuguquguquka okuphezulu, efanelekileyo kwimveliso encinci kunye neentlobo ngeentlobo, kodwa isantya sovavanyo sicotha kakhulu.

Kuyimfuneko ukuqinisekisa ukuba umphezulu we-PCB ucocekile ngaphandle kwezinto ezingcolisayo ezifana nenkunkuma ye-solder, ii-tin beads, kunye namabala eoyile ukuze kuthintelwe ukunxibelelana okuhle phakathi kwee-probes kunye neendawo zovavanyo. Jonga ukuba iindawo zovavanyo kwi-PCB ziphelele kwaye azina-oxidation. Ukuba kuyimfuneko, coca okanye uvale i-tin kwiindawo zovavanyo. Susa izigqubuthelo zokukhusela zesinyithi kunye nezinye izixhobo kwi-PCB ezinokuphazamisa uvavanyo. Kwii-PCB ezifakwe emacaleni amabini, hlula ngokucacileyo umphezulu wovavanyo.

Iiparamitha zovavanyo ziquka uhlobo (i-voltage, i-current), ubukhulu, kunye ne-frequency yesignali yokuvuselela; uluhlu lokulinganisa (njengoluhlu lokulinganisa ukumelana oluyi-0.1Ω - 10MΩ); ixesha lovavanyo (ubude bovavanyo lwenqaku ngalinye lovavanyo); useto lomda (njengoluhlu lokuphambuka oluvumelekileyo lwexabiso lokumelana eliyi-±5%), njl. Ngokwendlela yoyilo lwesekethe ye-PCB, iinkcukacha zecandelo, kunye neemfuno zovavanyo, iiparamitha kufuneka zisetwe ngokufanelekileyo ngokusebenzisa ulungiso lweengxaki kunye novavanyo lovavanyo ukuqinisekisa ukuchaneka kunye nokuthembeka kovavanyo.

I-ICT iyakwazi ukubona iisekethe ezivulekileyo (isekethe ayiqhagamshelwanga), iisekethe ezimfutshane (ukuhanjiswa okungalindelekanga phakathi kwemigca eyahlukeneyo), ukufakwa kwecandelo elingalunganga (njengokufaka i-resistor njenge-capacitor), iiparameter zecandelo ezingalunganga (amaxabiso ee-resistor, ii-capacitors, kunye nee-inductors azifani namaxabiso aqhelekileyo), i-reverse component polarity (izixhobo ze-polar ezifana nee-diodes kunye nee-electrolytic capacitors zifakwe ngasemva), i-cold soldering (iindawo ze-solder zibonakala ziqhagamshelwe kodwa zisebenza kakubi ngombane), njl.

Xa i-ICT ibona iziphene, iya kubonisa indawo yesiphene, uhlobo, kunye nolwazi oluneenkcukacha kwi-interface yesoftware yovavanyo. Abaqhubi kufuneka basuse i-PCB enesiphene kumgca wemveliso ngokwemiyalelo kwaye basebenzise izixhobo ezifana nee-multimeters kunye nee-oscilloscopes ukuqinisekisa ngakumbi iingxaki. Kwiimpazamo ezinokulungiswa (ezifana nokunyibilikisa okubandayo kunye nokufakelwa okungalunganga kwecandelo), zilungise ngezixhobo zokuphinda zisebenze. Kwii-PCB ezineziphene ezinzulu ezingalungisekiyo, zikhuphe, ubhale phantsi idatha yesiphene, kwaye uhlalutye izizathu zokuphucula inkqubo yemveliso.

Lungisa rhoqo izixhobo ze-ICT ukuqinisekisa ukuchaneka kwesignali yokuvuselela kunye nenkqubo yokulinganisa. Gcina iiprobe zicocekile kwaye zikwimeko entle, kwaye uzitshintshe iiprobe ezigugileyo okanye ezonakeleyo ngexesha elifanelekileyo. Lungiselela inkqubo yovavanyo kwaye usete ngokuchanekileyo iiparameter zovavanyo. Nika uqeqesho lobuchwephesha kubaqhubi ukuphucula izakhono zabo zokugweba kunye nokusingatha iimpazamo. Misela iinkqubo zovavanyo ezisemgangathweni kunye neenkcukacha zokunciphisa iimpazamo zokusebenza kwabantu.

Ukugcinwa kwemihla ngemihla kuquka ukucoca umphezulu wesixhobo kunye neeprobe ukuthintela uthuli kunye nentsalela yesolder ekuchaphazeleni uvavanyo. Jonga rhoqo uxinzelelo lweprobe ukuqinisekisa ukunxibelelana okuhle neendawo zovavanyo. Jonga ukusebenza kombane kwezixhobo, njengokuzinza kwesignali yokuvuselela. Kwi-ICT ye-bed-of-nails, jonga imeko yokulungisa yebhedi-of-nails kunye nokuqhuba kweepini. Gcina rhoqo iinkqubo zovavanyo kunye nedatha ukuthintela ukulahleka. Yenza uhlengahlengiso rhoqo kunye nokugcinwa kobuchwephesha ngokweemfuno zomenzi wezixhobo.

Iingenelo kukukwazi ukubona ngokuthe ngqo ukusebenza kombane kwesekethe, ukugweba ngokuchanekileyo iiparameter zecandelo kunye nomgangatho wokunyibilikisa, kunye nokufumana ngokuchanekileyo iindawo zokusilela; inefuthe elihle lokufumanisa kwiingxaki ezifana neesekethe ezivulekileyo kunye neesekethe ezimfutshane. Iingxaki kukufuneka kokuseta iindawo zokuvavanya kwi-PCB, kwandisa iindleko zoyilo lwe-PCB kunye nokuvelisa; inokubona kuphela iindawo ezifikelelekayo ngamanqaku ovavanyo, kunye neendawo ezingabonakaliyo zokufumanisa; uphuhliso lwenkqubo yovavanyo luyinkimbinkimbi, kwaye ukuphinda ucwangcise kuyimfuneko kwii-PCB ezahlukeneyo. I-AOI ikakhulu ibona ukubonakala kunye neziphene zomphezulu wezixhobo, ngesantya sokufumanisa esikhawulezayo kunye nexabiso eliphantsi. Ukuhlolwa kwe-X-ray kunokufumanisa iziphene zangaphakathi ezifihliweyo ze-PCB kunye nezixhobo, kodwa inesantya sokufumanisa esicothayo kunye nexabiso eliphezulu.

Imisebenzi ephambili yesoftware yovavanyo lwe-ICT ibandakanya ukucwangciswa kwenkqubo yovavanyo (ukuchaza amanqaku ovavanyo, ukuseta iiparameter zovavanyo, ukubhala i-logic yovavanyo), ukuphunyezwa kovavanyo kunye nolawulo (ukuqala, ukumisa, ukuyeka uvavanyo), ukuqatshelwa kweziphene kunye ne-alamu (ukugweba ngokuzenzekelayo iziphumo zovavanyo, ukuphawula iziphene, kunye nokukhupha ii-alamu), ukuboniswa kunye nokurekhoda iziphumo zovavanyo (ukubonisa idatha yovavanyo ngendlela yeetshathi kunye neengxelo), uhlalutyo lwedatha kunye nezibalo (ukubala iintlobo zeziphene kunye namazinga okwenzeka, ukuhlalutya iingxaki zenkqubo yemveliso), kunye nokusebenzisana kwedatha nezinye iinkqubo zemigca yemveliso (njengenkqubo ye-MES).

Izizathu ziquka uyilo olungafanelekanga lwamanqaku ovavanyo (njengomgama omncinci kakhulu phakathi kwamanqaku ovavanyo nendawo engafanelekanga), okubangela ukudibana okubi kweprobe okanye ukuphazamiseka okuhlangeneyo; ukuseta okungachanekanga kweeparamitha zovavanyo (njengomda omncinci kakhulu okanye obanzi kakhulu); ukuguguleka kweprobe, i-oxidation, okanye ukungcola, okuchaphazela ukuhanjiswa kwemiqondiso yovavanyo; umphezulu wePCB ongalinganiyo, okubangela uxinzelelo lweprobe olungalinganiyo; iimpazamo ezinengqondo kwinkqubo yovavanyo, okubangela ukungagwebi kakuhle kweesekethe eziqhelekileyo; ukusebenza kombane okungazinzanga kwesixhobo ngokwaso, njl.

Lungiselela uyilo lweendawo zovavanyo ukuqinisekisa uyilo olufanelekileyo, isithuba esifanelekileyo, kunye nomgangatho olungileyo womphezulu weendawo zovavanyo. Lungisa kwakhona kwaye ulungise iiparameter zovavanyo, kwaye umisele uluhlu olufanelekileyo lomgca ngokusebenzisa iimvavanyo ezininzi zovavanyo. Hlambulula rhoqo, ulondoloze, kwaye utshintshe iiprobe. Phatha ii-PCB ezingalinganiyo okanye sebenzisa iiprobe eziguquguqukayo. Jonga ngononophelo kwaye ulungise iimpazamo ezinengqondo kwinkqubo yovavanyo. Lungisa rhoqo kwaye ulinganise izixhobo ukuqinisekisa ukusebenza okuzinzileyo kwezixhobo.

Izixhobo ze-ICT zebhedi-zezipikili zihlala zifuna ukwenza ngokwezifiso izipikili zebhedi-zezipikili zee-PCB zobukhulu obahlukeneyo kunye neentlobo ezahlukeneyo, ngokuguquguquka okungekuhle, kodwa zisebenza kakuhle ngobunzima-zivelisa uhlobo olufanayo lwee-PCB. Izixhobo ze-ICT ze-Flying-probe zilawula ukuhamba kwee-probes ngesoftware ngaphandle kwesidingo sokutshintsha i-hardware, kwaye zinokuziqhelanisa novavanyo lwee-PCB zobukhulu obahlukeneyo kunye neentlobo. Yinkqubo yovavanyo kunye neeparameter kuphela ekufuneka zilungiswe. Nangona kunjalo, kwii-PCB ezinkulu kakhulu okanye ii-PCB ezinobukhulu obuninzi kakhulu ezinamanqaku amaninzi ovavanyo, ukusebenza kakuhle kovavanyo kunokunciphisa.

Uvavanyo lwe-ICT ludla ngokufakwa emva kwenkqubo yokunyibilikisa kwakhona i-soldering nangaphambi kovavanyo olusebenzayo, ukuze kubonwe iingxaki zokusebenza kombane eziveliswa ngexesha leenkqubo zokunyibilikisa kunye nokubekwa kwecandelo, kuthintelwe iimveliso ezineziphene ukuba zingangeni kwiinkqubo ezilandelayo, kwaye kuncitshiswe iindleko zokuphinda kusetyenziswe. Ingaseka kwakhona, ngokweemfuno zenkqubo yemveliso, isikhululo sovavanyo lwe-ICT esahlukileyo emva kokubekwa kwecandelo eliphambili ukuze kwenziwe uhlolo lwangaphambili kwiindawo eziphambili zesekethe.

Ngokuhlalutya idatha yovavanyo lwe-ICT, bala ukusasazwa kunye nokwenzeka rhoqo kweziphene ezahlukeneyo ukuze kuchongwe amakhonkco abuthathaka kwinkqubo yemveliso. Umzekelo, ukuba izinga leziphene lohlobo oluthile lweeparamitha zecandelo liphezulu, umgangatho wezinto ezingenayo, ukuchaneka kokubekwa, okanye inkqubo yokunyibilikisa i-soldering unokuhlolwa. Ukuba iingxaki zesekethe evulekileyo okanye zesekethe emfutshane zivela rhoqo, uyilo lwe-PCB lunokulungiswa (njengokulungisa iingcingo kunye nokongeza amanqaku ovavanyo), iiparamitha zokunyibilikisa i-soldering zinokuphuculwa, okanye amanyathelo okulwa nokunganyakazi ngexesha lenkqubo yemveliso anokomelezwa.

Umgca we-FCT, obizwa ngokuba ngumgca wovavanyo lwe-Functional Circuit, usetyenziselwa ukuqinisekisa imisebenzi yee-PCB okanye iimveliso ezidityanisiweyo emva kokubekwa kwecandelo kunye nokudityaniswa kwe-solder. Ulinganisa imeko-bume yokusebenza yemveliso, ufaka imiqondiso yokuvuselela, kwaye uchonge ukuba imiqondiso yokukhupha kunye nemisebenzi eyahlukeneyo yemveliso iyahlangabezana neemfuno zoyilo. Ingachonga iimpazamo ezinokwenzeka ezinengqondo kunye nemiba yokusebenza, iqinisekise ukuba imveliso ingasetyenziswa ngokuqhelekileyo. Linyathelo elibalulekileyo ekuqinisekiseni ukuthembeka kokusebenza kunye nokuthembeka kwemveliso.

Umgaqo wovavanyo lwe-FCT usekelwe kwiimpawu zokusebenza kunye neenkcukacha zoyilo lwemveliso. Izixhobo zovavanyo zisebenzisa iimeko ezithile zokuvuthuza, ezinje ngombane kunye nokufakwa kwesignali, kwi-PCB okanye kwimveliso evavanyiweyo, kwaye kwangaxeshanye, ziqokelela iimpawu zokuphuma kwemveliso. Ezi zimpawu zokuphuma ziyathelekiswa kwaye zihlalutywe ngedatha yokukhupha echanekileyo esetiweyo, ii-waveforms, iimeko ezinengqondo, njl. Ukuba iziphumo zokuphuma azihambelani nemigangatho, kumiselwa ukuba kukho iziphene zomsebenzi, ngaloo ndlela kufumaneke iindawo zokungasebenzi kakuhle kwemveliso.

Xa ukhetha, izinto ezinje ngokuba nobuchule bemisebenzi yovavanyo (nokuba ingahlangabezana nazo zonke iimfuno zovavanyo olusebenzayo lwemveliso), ukuchaneka kovavanyo (ukuchaneka kokulinganisa iimpawu ze-analog nezedijithali), isantya sovavanyo (ukufanisa umjikelo womgca wemveliso), ukuhambelana (ukuxhasa uvavanyo lweemveliso zeemodeli ezahlukeneyo kunye neenkcukacha), imisebenzi yesoftware (enemisebenzi efana nokuhlela inkqubo yovavanyo, ukurekhoda idatha kunye nohlalutyo, kunye nezindululo zokuxilongwa kweempazamo), ukwandiswa kwezixhobo (ukukwazi ukongeza iimodyuli zovavanyo ngokweenguqulelo zemveliso), kunye neendleko zezixhobo kunye nenkonzo yokuthengisa emva kokuthengisa kufuneka kuqwalaselwe.

Izixhobo eziqhelekileyo ze-FCT ziquka izixhobo ze-FCT ezizinikeleyo ezisekelwe kwizixhobo kunye nezixhobo ze-FCT ezipheleleyo ezisekelwe kwizixhobo. Izixhobo ze-FCT ezizinikeleyo zenzelwe iimveliso ezithile, ezinomgangatho ophezulu wovavanyo kunye nokusebenza kakuhle, kodwa ukuguquguquka okungekuhle. Izixhobo kufuneka zihlengahlengiswe xa imveliso ihlaziywa. Izixhobo ze-FCT ezipheleleyo zisebenzisa izixhobo zovavanyo ezinokuphinda zisetyenziswe (ezifana nee-multimeter, ii-signal generators, ii-oscilloscopes, njl.njl.) kwaye zifezekisa uvavanyo lweemveliso ezahlukeneyo ngokusebenzisa isoftware programming. Zinokuguquguquka okuphezulu kunye noluhlu olubanzi lwezicelo, kodwa uphuhliso lweenkqubo zovavanyo luyinkimbinkimbi, kwaye iindleko zokuqala zezixhobo ziphezulu kakhulu.

Kuyimfuneko ukuqinisekisa ukuba i-PCB ayinamonakalo wangaphandle, umgangatho olungileyo wokunyibilikisa, kwaye akukho ziphene zicacileyo ezifana nokunyibilikisa okubandayo kunye neesekethe ezimfutshane. Yenza ukucoca okufunekayo kwi-PCB ukuze ususe intsalela yokukhupha ulwelo, uthuli, kunye nokunye ukungcola kumphezulu. Jonga ukuba izihlanganisi, ii-interfaces, njl. kwi-PCB zifakwe ngokuchanekileyo na kwaye azinamonakalo. Ngokweemfuno zovavanyo, yenza uhlengahlengiso oluyimfuneko kwi-PCB (njengokutshisa inkqubo, useto lwe-jumper, njl. njl.).

Iiparameter zovavanyo ziquka uhlobo (uphawu lwe-analog, uphawu lwedijithali), ubukhulu, imvamisa, kunye nomjikelo womsebenzi wesiginali yokufaka; ixesha lovavanyo; iikhrayitheriya zokugweba zezibonakaliso zokuphuma (ezifana nobubanzi bevolthi, inqanaba le-logic, iimpawu ze-waveform); ulandelelwano kunye neemeko zamanyathelo enkqubo yovavanyo, njl. Ngokweenkcukacha zomsebenzi wemveliso kunye neemfuno zokusebenza zokwenyani, kunye nokusebenza kwezixhobo zovavanyo, iiparameter kufuneka zisetwe ngokufanelekileyo ngokusebenzisa ukulungisa iimpazamo kunye nokuqinisekisa ukuqinisekisa ukusebenza kunye nokuchaneka kovavanyo.

I-FCT iyakwazi ukubona iimpazamo zomsebenzi onengqondo (ezifana nolawulo olungaqhelekanga lwe-logic lwee-chips), ukuhanjiswa kwesignali okungaqhelekanga (ukuncitshiswa kwesignali, ukuphazamiseka, ukuphazamiseka), ukungaphumeleli komsebenzi wojongano (i-USB, ujongano lwenethiwekhi, njl. abakwazi ukunxibelelana ngokwesiqhelo), iingxaki zolawulo lwamandla (ukuphuma kwe-voltage okungazinzanga, ukhuseleko olungaqhelekanga lwangoku), iziphene zomsebenzi wesoftware (iimpazamo zokusebenza kweprogram, ixesha lokuphendula), njl. Ezi ziphene zinokubangelwa kukubekwa kwecandelo ngendlela engalunganga, ukunyibilika kakubi kwe-solder, umonakalo wecandelo, okanye iingxaki zoyilo.

Xa i-FCT ibona iziphene, izixhobo zovavanyo ziya kurekhoda ulwazi lwesiphene kwaye zikhuphe isaziso se-alamu. Abaqhubi kufuneka baphawule iimveliso ezineziphene ngokwemiyalelo kwaye basebenzise izixhobo zobungcali (ezifana nee-oscilloscopes kunye nee-logic analyzers) ukuze bahlalutye ngakumbi izizathu zokusilela. Kwiingxaki ezinokulungiswa (ezifana neempazamo zenkqubo kunye nokunyibilikisa kwe-component cold soldering), zilungise kwaye uzivavanye kwakhona. Kwiimveliso ezingenakulungiswa, ziphathe ngokwenkqubo yokukrazula, kwaye unike ingxelo ngedatha yesiphene kumasebe emveliso kunye ne-R & D ukuphucula inkqubo kunye nokwenza ngcono uyilo.

Lungisa rhoqo izixhobo zovavanyo ukuqinisekisa ukuchaneka kwemiqondiso yokufaka kunye neyokukhupha. Lungisa inkqubo yovavanyo kwaye usete ngokuchanekileyo iiparameter zovavanyo kunye nemigangatho yokugweba. Sebenzisa iindlela ezininzi zovavanyo kunye neendlela (ezifana novavanyo lwemeko yomda kunye novavanyo lomda) ukuze ufumane ngokupheleleyo imisebenzi yemveliso. Nika uqeqesho lobuchwephesha kubaqhubi ukuphucula uhlalutyo lwabo lweempazamo kunye nezakhono zokugweba. Misela indlela epheleleyo yokurekhoda idatha yovavanyo kunye nohlalutyo, kwaye ufumane iingxaki ezinokubakho ngokuthelekisa idatha yembali.

Ukugcinwa kwemihla ngemihla kuquka ukucoca umphezulu wezixhobo kunye nezixhobo zovavanyo ukuthintela uthuli kunye nokungcola ukuba kungachaphazeli uvavanyo. Jonga rhoqo imeko yokusebenza kwemodyuli nganye yesixhobo (njengemodyuli yamandla kunye nemodyuli yokuvelisa isignali) kwaye ubeke iliso kwizalathisi zokusebenza eziphambili. Jonga kwaye ulinganise izixhobo zovavanyo ukuqinisekisa unxibelelwano oluhle. Hlaziya isoftware yovavanyo ngexesha elifanelekileyo ukulungisa iimpazamo kunye nokongeza imisebenzi emitsha. Yenza ukulinganiswa okubanzi rhoqo kunye nokugcinwa okunzulu ngokweemfuno zomenzi wezixhobo.

Inzuzo kukuba inokubhaqa iingxaki kwinqanaba lokusebenza kwemveliso, elikufutshane nemeko yokusetyenziswa komsebenzisi, kwaye inokubhaqa iziphene ezinengqondo kunye nokusebenza ezingenakubhaqwa ngezinye iimvavanyo. Iziphene ziindleko zovavanyo eziphezulu (iindleko zezixhobo kunye nezixhobo), uphuhliso lwenkqubo yovavanyo oluntsonkothileyo, kunye nesantya sovavanyo esicothayo. I-AOI ikakhulu ibhaqa iziphene zembonakalo kunye nomphezulu, ngesantya esikhawulezayo kunye neendleko eziphantsi. Ukuhlolwa kwe-X-ray kunokubhaqa iziphene zangaphakathi ezifihliweyo. I-ICT igxile ekubhaqweni kweeparameter zombane zeesekethe kwaye inokufumana ngokuchanekileyo izinto ezineziphene, kodwa akukho namnye kwaba bathathu onokuqinisekisa ngokuthe ngqo imisebenzi yemveliso.

Imisebenzi ephambili yesoftware yovavanyo lwe-FCT ibandakanya ukubhala nokuhlela inkqubo yovavanyo (ukuchaza inkqubo yovavanyo, ukuseta iiparameter, ukubhala iingxelo zesigwebo esinengqondo), ulawulo lokwenziwa kovavanyo (ukuqala, ukumisa, ukumisa uvavanyo), ukuqokelelwa kwedatha kunye nokuboniswa ngexesha langempela (ukubonisa iifom ze-waveforms zesignali yokufaka kunye neyokuphuma kunye namaxabiso), ukuqatshelwa kwesiphene ngokuzenzekelayo kunye ne-alamu (ukuphawula iimpazamo kunye nokukhuthaza ngokweekhrayitheriya zesigwebo), ukurekhoda iziphumo zovavanyo kunye nokuveliswa kwengxelo (ukubala izinga lokupasa, ukurekhoda ulwazi lwesiphene), uhlalutyo lwedatha kunye nokulandelelwa (ukuhlalutya umkhwa wedatha yovavanyo, ukulandelela imbali yovavanyo lwemveliso).

Izizathu ziquka ukuseta okungafanelekanga kweeparameter zovavanyo (ububanzi obukhulu kakhulu okanye obuncinci kakhulu), iimpazamo ezinengqondo kwinkqubo yovavanyo (iimeko zokugweba ezingachanekanga), ukuguquguquka kokusebenza kwezixhobo zovavanyo ngokwazo (ukuphuma kwesignali okungazinzanga), unxibelelwano olubi lwesixhobo sovavanyo (okubangela ukuhanjiswa kwesignali okungaqhelekanga), uphazamiseko lokusingqongileyo (ukuphazamiseka kwe-electromagnetic okuchaphazela ukuqokelelwa kwesignali), kunye neengxaki zokuhambelana kuyilo lwemveliso (ukusebenza okungaqhelekanga kwindawo yovavanyo).

Phinda ujonge kwaye ulungise iiparameter zovavanyo, kwaye ulungise umda ngokusebenzisa iimvavanyo ezininzi. Jonga ngononophelo kwaye ulungise ingqiqo yenkqubo yovavanyo kwaye wenze uvavanyo olwaneleyo lokuqinisekisa. Gcina kwaye ulinganise izixhobo zovavanyo rhoqo ukuqinisekisa ukusebenza okuzinzileyo. Jonga kwaye uphucule imeko yoqhagamshelwano lwesixhobo sovavanyo, kwaye utshintshe isixhobo ukuba kuyimfuneko. Khusela okanye ulungise imeko yovavanyo ukuze unciphise ukuphazamiseka. Nxibelelana nesebe le-R & D ukuqinisekisa ukuhambelana koyilo lwemveliso kwindawo yovavanyo kwaye usombulule iingxaki ezinokubakho.

Izixhobo ze-FCT ezizinikeleyo ezisekelwe kwizinto ezisetyenziswayo zihlala zenzelwe iimveliso ezithile kwaye azikwazi ukulungelelanisa ii-PCB zobukhulu obahlukeneyo kunye neentlobo ezahlukeneyo. Izixhobo kufuneka zihlengahlengiswe. Izixhobo ze-FCT ezisetyenziswayo ngokubanzi ezisekelwe kwizixhobo zinokuziqhelanisa novavanyo lwee-PCB zobukhulu obahlukeneyo kunye neentlobo ezahlukeneyo ukuya kwinqanaba elithile ngokusebenzisa isoftware kunye nokutshintsha indawo efanelekileyo yovavanyo, kodwa kwiimveliso ezinemisebenzi okanye izakhiwo ezikhethekileyo, ezinye iimodyuli zovavanyo zisenokufuna ukwenziwa ngokwezifiso.

Uvavanyo lwe-FCT luhlala lubekwe ekupheleni komgca wemveliso, oko kukuthi, emva kokuba iinkqubo ezifana novavanyo lwe-ICT kunye nokuhlolwa kwembonakalo zigqityiwe, ukuqinisekisa ukuba iimveliso ezihlolwe ziinkqubo zangaphambili ziqinisekisiwe ukuba zisebenza njani kwimeko ekufutshane nokusetyenziswa kwangempela, kunye nokuthintela iimveliso ezingafanelekiyo ukuba zingene kumthengi. Ngokweempawu zemveliso, uvavanyo lwe-FCT olunezigaba lunokubekwa emva kokuhlanganiswa kweemodyuli ezibalulekileyo zokusebenza ukuze kufunyanwe iingxaki ngexesha elifanelekileyo kwaye kuncitshiswe inkunkuma yeenkqubo ezilandelayo.

Ngokusebenzisa uhlalutyo lwezibalo lwedatha yovavanyo lwe-FCT, iipateni zokusasazwa kunye neendawo ezinengxaki ephezulu yeziphene zomsebenzi wemveliso zinokufunyanwa. Umzekelo, ukuba uhlobo oluthile lwesiphene somsebenzi luvela rhoqo, iinkqubo zemveliso ezihambelanayo (ezifana nokubekwa kwecandelo, ukutywina, ukutshiswa kwesoftware) zinokuphandwa ngokupheleleyo. Hlalutya ulwalamano phakathi kweziphene kunye nezinto ezifana neebhetshi zezinto eziluhlaza, izixhobo zemveliso, kunye nabaqhubi, kwaye uphucule iiparameter zenkqubo, uqinise ulawulo lomgangatho, kwaye uphucule uyilo lwemveliso ngokufanelekileyo, ngaloo ndlela uphucula umgangatho wemveliso iyonke kunye nokusebenza kakuhle kwemveliso.