Inkqubo yokulungisa i-PCBA

Inkqubo yokuhlaziya i-PCBA (Printed Circuit Board Assembly) yinkqubo yokufumana iziphene kwiindawo ezidityanisiweyo apho ukutywina okanye ukungasebenzi kakuhle, ukususa izinto ezineziphene, kunye nokuphinda kutywinwe izinto ezifanelekileyo. Izibalo zibonisa ukuba malunga ne-5%-15% ye-PCBA ifuna ukuhlaziywa ngexesha lokwenziwa kwemveliso ye-elektroniki.

Ukulungiswa ngokutsha kujongana nemiba efana neziphene zokunyibilikisa kunye nokusilela kwamacandelo ngexesha lemveliso, apho imveliso elungisiweyo kufuneka ihlangabezane nemigangatho yemveliso yokuqala; ukulungiswa kujongana neziphene ezibangelwa kukwaluphala, ukusetyenziswa okungafanelekanga, njl.njl., kwiimveliso esele zisetyenzisiwe. Umgangatho ogqwesileyo kushishino kukulawula izinga leziphene zokulungiswa ngokutsha ngaphakathi kwe-3%.

Inkqubo eqhelekileyo yile: ukufunyanwa kweempazamo → indawo yeziphene → ukususwa kwenxalenye → ukucoca iiphedi → ukutywinwa kwenxalenye entsha → ukuhlolwa nokuqinisekiswa. Phakathi kwazo, ukususwa kwenxalenye kunye nokutywinwa kwenxalenye kubalelwa kwi-60%-70% yexesha lilonke lenkqubo.

Kwanakwimigca yemveliso ye-SMT ephucukileyo, kusekho izinga lokungasebenzi kakuhle kwe-soldering eliyi-0.1%-1% (njengokufaka i-solder ebandayo kunye nokufaka i-bridging). Ukuhlaziya kwakhona kunokuphucula amazinga okufaneleka kwemveliso, kunciphise iindleko zemveliso, kwaye kuthintele ukulahla ibhodi yonke.

Ingaphucula isivuno sokuqala semveliso, inciphise iindleko zemveliso, iqinisekise umgangatho kunye nokuthembeka kwemveliso, kwaye inciphise iindleko zokugcina emva kokuthengisa. Izifundo zibonisa ukuba iinkqubo ezilungileyo zokulungisa ngokutsha zinokunyusa ukuthembeka kwemveliso ngama-20%-30%.

Ikakhulu ibandakanya izikhululo zokulungisa umoya oshushu, izikhululo zokulungisa i-infrared, izikhululo zokulungisa i-BGA, iimpompo zokususa i-soldering, iimayikroskopu, njl. Phakathi kwazo, izikhululo zokulungisa i-BGA zinolawulo lobushushu oluchanekileyo lwe-±1℃, olufanelekileyo kulungiso oluphezulu lwecandelo le-BGA.

Ivelisa umoya oshushu ngetyhubhu yokufudumeza, ize ivuthele umoya oshushu kwiindawo eziza kulungiswa ngokutsha nge-nozzle, inyibilikise i-solder ukuze isuswe okanye ifakelwe i-solder. Ubushushu bomoya oshushu buqhele ukulungelelaniswa ukusuka kwi-200-450℃, ngesantya somoya se-5-50L/min.

Izitishi zokulungisa i-BGA zinemisebenzi yokulawula ubushushu ezimeleyo kwiindawo ezininzi zobushushu, nto leyo evumela ulawulo oluntsonkothileyo lwejika lobushushu, olufanele izixhobo ezipakishiweyo ezifana ne-BGA kunye ne-CSP; izitishi zokulungisa i-common hot air rework zisetyenziswa kakhulu kwiipakeji zesiqhelo ezifana ne-QFP kunye ne-SOP. Ixabiso lesitishi sokulungisa i-BGA liphindwe kathathu ukuya kahlanu kunesitishi sokulungisa i-common hot air rework.

Zahlulwe ngeempompo zokususa i-soldering ngesandla, iimpompo zokususa i-soldering ngombane, kunye neempompo zokususa i-soldering nge-vacuum. Iimpompo zokususa i-soldering ngesandla zifanelekile ukususa inani elincinci leejoyinti ze-soldering, iimpompo zokususa i-soldering ngombane zisebenza kakuhle, kwaye iimpompo zokususa i-soldering nge-vacuum zifanelekile kwiinxalenye ze-multi-pin. Iimpompo zokususa i-soldering ngombane zisusa i-solder ngokukhawuleza amaxesha ama-3-5 kunezo zesandla.

Kwizixhobo ezincinci ezipakishiweyo ezifana no-0201 no-01005, kufuneka imakroskopu enomlinganiselo wobukhulu obuphindwe ka-50-100; kwizixhobo eziqhelekileyo ezipakishiweyo, umthamo wobukhulu obuphindwe ka-10-30 wanele. Iimakroskopu ezinomlinganiselo ophezulu zibiza ngokuphindwe ka-2-3 kunezo ziphantsi.

Seta ngokwendlela yokupakishwa kwecandelo kunye nohlobo lwesolder. Kwisolder ye-Sn63Pb37, ubushushu bokususa buhlala buyi-350-380℃, kwaye ubushushu bokutywina buyi-320-350℃; kwisolder engenalo i-lead (njenge-SAC305), ubushushu bokususa buyi-380-420℃, kwaye ubushushu bokutywina buyi-350-380℃. Ubushushu obuphezulu kakhulu buyazonakalisa ngokulula izinto, ngelixa ubushushu obuphantsi kakhulu buthintela i-solder ekunyibilikeni.

Ihlala ibandakanya indawo yokufudumeza kwangaphambili (isantya sokufudumeza 1-3℃/s, ubushushu 120-150℃), indawo yokuntywila (150-180℃, 60-120s), indawo yokuntywila kwakhona (ubushushu obuphezulu 217-235℃, obugcinwe kangangemizuzwana engama-30-60), kunye nendawo yokuphola (isantya sokuphola 2-4℃/s). Ukuseta okungalunganga kwe-curve yobushushu kunokubangela iingxaki ezifana ne-BGA cold soldering kunye nokuqhekeka kwebhola ye-solder.

Isantya somoya esiphezulu kakhulu sinokususa izinto ezincinci okanye sibangele ukutshiza kwe-solder; isantya somoya esiphantsi kakhulu sibangela ukudluliselwa kobushushu okwaneleyo. Ngokubanzi, isantya somoya kwiiphakheji ze-0402 nangaphezulu simiselwe kwi-10-20L/min, kwaye kwi-0201 nangaphantsi, yi-5-10L/min.

Kucetyiswa ukuba ixesha lokuxutywa kwejoyinti enye ye-solder lingadluli kwimizuzwana emi-3, kwaye ukuxutywa okuqhubekayo kungadluli kwimizuzwana eli-10. Ixesha elide kakhulu lokuxutywa kwe-solder kwandisa umngcipheko wokuxobuka kwe-PCB copper foil nge-30% kunye nethuba lokonakala kwenxalenye nge-25%.

Lungisa ngokobukhulu be-PCBA kunye noxinano lwamacandelo, ngokubanzi ngoxinano lwamandla oluyi-1-3W/cm². Amandla aphezulu kakhulu anokubangela ubushushu obugqithisileyo kunye nokuguquguquka kwe-PCB, ngelixa amandla aphantsi kakhulu ebangela ukusebenza kakuhle kokufudumeza.

Sebenzisa isikhululo sokulungisa umoya oshushu, ujongise umlomo kwiiphini, ufudumale kwi-350-380℃ ngesantya somoya se-15-20L/min, kwaye ususe icandelo nge-tweezers emva kokuba i-solder inyibilikile. Emva kokususa, coca ii-pad ngentambo yokuyisusa.

Okokuqala, misela i-curve efanelekileyo yobushushu. Emva kokuba iibhola ze-solder zinyibilikisiwe ngokupheleleyo, susa i-BGA ngononophelo ngepeni yokufunxa i-vacuum; coca i-solder eseleyo kwii-pads uze uyibuyisele usebenzisa i-solder paste. Izinga lempumelelo lokususwa kwe-BGA yi-85% ngenxa yokuhambelana kwe-curve yobushushu.

Bhala phantsi icala le-polarity yecandelo ukuze uphephe ukufakelwa umva; nikela ingqalelo ekufudumaleni okufanayo ngexesha lokususwa ukuze uthintele ukuqhuma kwecandelo ngenxa yobushushu obuphezulu bendawo. Ukufakelwa kwe-polarity ngendlela engafanelekanga kwandisa izinga lokusilela kwemveliso ngama-40%.

Kwiimeko ezinjalo, kufuneka uvavanyo lwe-X-ray ukuze kuchongwe iindawo apho ijoyinti ye-solder ibekwe khona, kwaye kusetyenziswa iindlela zokufudumeza zasekuhlaleni (ezifana nokufudumeza nge-laser) ukuze kususwe. Kunzima kakhulu, kwaye izinga lempumelelo liyi-60%-70% kuphela.

Lawula ubushushu kunye nexesha lokufudumeza, kwaye uphephe ukufudumeza okuphindaphindiweyo kwindawo enye; sebenzisa izixhobo ezifanelekileyo, njengokusebenzisa i-pry bar ukunceda ekususeni izinto ezinkulu ukunciphisa ukutsala kwi-PCB. Ukusebenza ngokuchanekileyo kunokunciphisa izinga lomonakalo kwi-PCB ngama-50%.

Coca i-solder eseleyo kwii-pads usebenzisa i-desoldering wick nge-soldering iron: faka i-wick emanzini, uyibeke kwi-pad, uze uyifudumeze nge-iron ukuze ifunxe i-solder. Tshatisa ububanzi be-wick ne-pad ukuze uphephe ukucoca okugqithisileyo okanye okunganelanga.

Gcoba ngobunono umaleko oxutyiweyo ngephepha elincinci lesanti, ufake i-flux, kwaye ufudumale ukuze ubuyisele ukunyibilika. Iipadi ezixutyiweyo ezinganyangwanga zinokubangela izinga lokungasebenzi kakuhle kwe-soldering elingama-80%.

Ukuze uqhekeze inxalenye yentsimbi, sebenzisa iingcingo ze-jumper; ukuze uqhekeze ngokupheleleyo, lungisa i-pad (i-copper plating, i-solder mask coating) kwaye uvavanye ukusebenza kombane emva kokulungiswa.

Sebenzisa incam yesinyithi yokugalela emile okwetshiseli ukuze ulinganise i-solder engaphezulu, kwaye uhlambe ukuba kuyimfuneko. Impazamo yokuthamba kufuneka ibe ngaphakathi kwe-±0.05mm ukuze kuthintelwe iingxaki zokugalela.

Ewe. Sebenzisa i-ethanol engenamanzi okanye ii-arhente zokucoca ezikhethekileyo ukususa ulwelo olushiyekileyo kunye nokungcola, uphephe ukwanda kwama-20% kwiziphene zokunyibilikisa kunye nokugqwala kwePCB.

Jonga iinkcukacha zezixhobo, faka iipads, kwaye ulungiselele izixhobo ezifanelekileyo kwaye uguqule. Ukulungiswa okunganelanga kunokubangela izinga lokuphinda usebenze kwakhona le-30%.

Sebenzisa imakroskopu kunye nesikhululo sokuvuselela umoya oshushu okanye intsimbi etsolo yokutywina. Lungisa iphini enye kuqala, uze udibanise okuseleyo ukuqinisekisa ukuba indawo ibekwe ngokuchanekileyo.

Sebenzisa i-X-reyi ukuhlola uqhagamshelo lwebhola yesolder (isantya esingenanto ≤5%) kunye ne-multimeter yokubonisa ukuqhubeka kombane. I-X-reyi ibona ngaphezulu kwe-90% yeziphene.

Lungisa izinto ngeglu okanye i-flux ngaphambi kokuba udibanise i-solder, uze uzifudumeze ngokulinganayo ukuze uphephe uxinzelelo lobushushu. Ukutshintsha kwenza i-15%-20% yeziphene zokuxutywa kwe-solder.

Iingcingo zekopolo ziyakwazi ukunyibilikiswa lula; iingcingo zesinyithi zifuna ukucocwa kwangaphambili; iingcingo ze-alloy zifuna ukushukuma okufanayo. Iingcingo zesinyithi ezinganyangwanga zinezinga lokungasebenzi kakuhle kwe-70%.

Kubandakanya ukuhlolwa ngokubona, uvavanyo lokusebenza kombane (ukuqhubeka, ukumelana nobushushu), kunye novavanyo lokusebenza. Ukuhlolwa ngokubona kufumanisa ama-70%-80% eziphene ezicacileyo.

Jonga iindawo ezigcweleyo nezigudileyo zokudibanisa ngaphandle kokudibanisa okubandayo, ukubopha, okanye ukuvala i-icicles; qinisekisa ukuba iilead zifakwe i-solder ngokupheleleyo kwaye azonakalanga. Kufuneka kuthotyelwe imigangatho ye-IPC-A-610.

Ibona umgangatho wangaphakathi we-solder joint wezinto ze-BGA/CSP, ichonge i-cold soldering, iibhola ze-solder eziqhekekileyo, kunye ne-voids, kunye nezinga lokufumanisa iziphene ezingaphezu kwe-95% kwiingxaki zangaphakathi.

Ivavanya ukusebenza kombane ngokusebenzisa izixhobo zebhedi yezinzipho, ifumanisa iingxaki zeeparitha ezimfutshane, ezivulekileyo, kunye neparameters zecandelo, igubungela i-80%-90% yoqhagamshelo lombane.

Hlanganisa i-PCBA kwinkqubo ukuze ulinganise iimeko zokusebenza zokwenyani kwaye uvavanye ukusebenza, uchonge i-90% yokusilela kokusebenza okubangelwa kukudityaniswa kwentsimbi.

Izizathu: ii-pads ezingacocekanga, ubushushu obunganelanga, ukugeleza okungasebenzi kakuhle. Izisombululo: phinda ucoce ii-pads, lungisa ubushushu/ixesha, kwaye ufake ezinye iindlela zokutshintsha ukugeleza ezisemgangathweni ophezulu.

Susa i-solder engaphezulu ngentambo/intsimbi esusa i-soldering, lungisa ubushushu be-soldering kunye nesantya somoya ukuze uthintele ukutshiza. Ukuphathwa kakuhle kufezekisa izinga lokulungiswa le-95%.

Izizathu ezinokubakho: umonakalo wecandelo, ukugqithisa kakhulu ngexesha lokutywina, ukuguquka kwe-polarity. Izibalo zibonisa ukuba umonakalo wecandelo ufikelela kwi-40%, ukugqithisa kakhulu yi-30%.

Lungisa utshintsho oluncinci ngokufudumeza; tshintsha ii-PCB xa kukho utshintsho olunzima. Ukulawula ubushushu/ixesha kunciphisa izinga lotshintsho ngama-60%.

Sebenzisa iibhentshi zokusebenzela ezikhuselekileyo kwi-ESD, imitya yesandla, kunye nee-tweezers; gcina umswakama we-RH ongama-40%-60% ukunciphisa umonakalo we-ESD ngama-90%.

Abaqhubi kufuneka banxibe iiglasi/iiglavu zokuzikhusela ukuthintela ukutsha; izixhobo ezisemhlabeni ukuthintela ukutshayiswa ngumbane; bafake uphawu lwesilumkiso kwizixhobo ezishushu kakhulu.

Izinto ezisetyenziswa kwinkunkuma, i-solder, kunye ne-flux yinkunkuma enobungozi, efuna ukulahlwa ziiyunithi ezifanelekileyo; amanzi amdaka okucoca kufuneka ahlangabezane nemigangatho yokukhupha inkunkuma ye-GB 8978.

Uninzi lweeflux ziyatsha kwaye kufuneka zigcinwe kwiindawo ezipholileyo nezinomoya opholileyo kude nemithombo yomlilo; kuphephe ukudibana nolusu/namehlo kwaye uhlambe ngamanzi ngoko nangoko ukuba zibonakala.

Coca rhoqo intsalela yesolder kwaye uyikhuphe kwizixhobo; faka ukhuseleko lobushushu obugqithisileyo ukuze lucime ngokuzenzekelayo xa imida yobushushu igqithile.

Kufuneka ulandele imiyalelo yeRoHS, uthintele izinto ezinobungozi ezifana ne-lead/mercury/cadmium, unciphise ukuguquguquka komoya, kwaye usebenzise izinto zokucoca ezinobuhlobo nokusingqongileyo.

Lungiselela iinkqubo, yamkela izixhobo ezizenzekelayo, kwaye uqeqeshe abaqhubi. Izixhobo ezizenzekelayo zinokunyusa ukusebenza kakuhle nge-30%-50%.

Nciphisa uhlengahlengiso lwesibini ngenxa yokusebenza okungafanelekanga, khetha izixhobo/izixhobo ngendlela efanelekileyo, kwaye ulungise iinkqubo ukuze wehlise amazinga okuqala eziphene. Uhlengahlengiso lwesibini lubandakanya i-25%-35% yeendleko zizonke.

Lungiselela iiparameter zenkqubo, khetha i-flux/solder efanelekileyo, kwaye womeleze uhlolo lwenqaku lokuqala kunye nokuthathwa kwesampulu kwinkqubo. Ukuphuculwa kwenkqubo kunokunciphisa amazinga eziphene ngama-40%-60%.

Iphucula uzinzo lomgangatho, inciphisa iimpazamo zabantu, iququzelela uqeqesho lwabasebenzi abatsha, kwaye iphucula ukusebenza kakuhle. Ukumisela umgangatho kunokunciphisa ukuguquguquka kwamanani eziphene ngama-50%.

Yenza uvavanyo lokwaluphala (iiyure ezingama-24-100) kunye novavanyo lokusingqongileyo (ubushushu obuphezulu/umswakama/ukungcangcazela) kwiimveliso ezilungisiweyo ukuze kuvavanywe ukuthembeka kwexesha elide.

Kuyimfuneko ukuqwalasela iimfuno zokulungiswa kwakhona kwezixhobo ze-SMT kunye ne-THT. Xa kususwa izixhobo ze-THT, kufuneka kuqwalaselwe impembelelo kwizixhobo ze-SMT. Ubunzima bokulungiswa kwakhona buphezulu ngama-30%-50% kunobo beebhodi ze-SMT ezicocekileyo.

Le nto ithambile kwaye kulula ukuyiguqula, ngoko ke kufuneka izixhobo ezikhethekileyo zokulungisa; ubushushu bokufudumeza kufuneka bube ngaphantsi kwe-10-20℃ kunobo bePCB eqinileyo ukuze kuthintelwe ukonakala kwesiseko.

Isekethe yangaphakathi iyinkimbinkimbi, kwaye ukudluliselwa kobushushu akulunganga ngexesha lokufudumeza, nto leyo enokubangela isekethe emfutshane okanye isekethe evulekileyo yomaleko wangaphakathi; ukulungiswa kwephedi kunzima, kwaye izinga lempumelelo yokuphinda usebenze kwakhona yi-50%-60% kuphela.

Susa isigqubuthelo sokukhusela kuqala uze ukhusele izinto zangaphakathi. Phinda usifake emva kokuphinda usebenze ukuqinisekisa isiphumo sokukhusela. Ukusebenza okungafanelekanga kuya kuchaphazela ukuhambelana kwe-electromagnetic.

Inomoya oqhuba kakuhle wobushushu kwaye ibuthathaka kakhulu. Ifuna ukufudumeza ngokukhawuleza ukuze iphephe ukuqhekeka okubangelwa kuxinzelelo lwendawo, kwaye izinga lokufudumeza kungcono lilawulwe kwi-5-10℃/s.

Kufuneka babe nobuchule obuphezulu kwizakhono ezifana nokuchonga izinto, iteknoloji yokuwelda, ukusebenza kwezixhobo, kunye nohlalutyo lweempazamo, kwaye baqhelene nemigangatho efana ne-IPC-A-61. Izinga leziphene labasebenzi abaqeqeshwe ngobuchule liphantsi ngama-40% kunelabo baqalayo.

Ibandakanya uqeqesho lwethiyori (ulwazi lwenkqubo, iinkcukacha ezisemgangathweni) kunye noqeqesho olusebenzayo (ukusebenza kwezixhobo, ukuziqhelanisa nokuwelda), kunye novavanyo emva koqeqesho, kwaye umjikelo ngokubanzi uhlala iiveki ezi-1-2.

Ibandakanya imiyalelo yenkqubo yokuhlaziya, iincwadi zokusebenza kwezixhobo, imigangatho yokuhlolwa komgangatho, iirekhodi zokuhlaziya, njl.njl., ezinokuphucula ukulandeleka nokusebenza kakuhle kohlalutyo lweengxaki.

Misela iindawo zokulawula eziphambili (ezifana nokususa iinxalenye, ukucoca iiphedi, ukuwelda, njl.njl.), kwaye wenze uhlolo lokuqala, uhlolo lwepatroli kunye nokuhlolwa kwemveliso egqityiweyo, okunokunciphisa izinga leziphene ngama-30%-40%.

Qokelela idatha yokuhlaziya iingxaki, wenze uvavanyo lwenkqubo ukuze uphucule iiparameter, kwaye ungenise ubuchwepheshe obutsha kunye nezixhobo, ezinokunyusa ukusebenza kakuhle nge-10%-15% ngonyaka.

Khetha ngokwendlela yohlobo lwe-PCBA solder yokuqala, beka phambili iimveliso ezinokwakheka okufanayo, kwaye uqwalasele ukusebenza okufana nendawo yokunyibilika, ukufuma, kunye nokuthembeka.

Zahlulwe ngolu hlobo lwe-flux olungena coceko, i-flux enyibilikayo emanzini kunye ne-flux esekelwe kwi-rosin. I-flux engacocekanga ifanelekile kwiimeko apho kukho imfuneko ephantsi yococeko, kwaye i-flux enyibilikayo emanzini ilungele ukucocwa kodwa intsalela kufuneka iqatshelwe.

Isetyenziselwa ukulungisa izinto ezincinci okanye ukuthintela ukushenxa ngexesha lokudityaniswa kwentsimbi, kwaye kufuneka ibe namandla afanelekileyo okubopha (≥5N/mm²) kunye nokumelana nobushushu.

Khetha ngokwendlela yohlobo lwe-flux (efana ne-isopropyl alcohol kwi-rosin-based), kwaye uqwalasele ukhuseleko lokusingqongileyo, ukugqwala kunye nokuguquguquka.

Kuyimfuneko ukujonga imodeli, iinkcukacha, inkangeleko, ukusebenza kombane, njl.njl. ukuqinisekisa ukuhambelana kwezinto zokuqala. Izinto ezingenayo kakuhle ziya kunyusa izinga lokungaphumeleli kokulungiswa kwakhona nge-20%.

Coca ukungcola okungaphakathi kwe-air nozzle ukuze uthintele ukuvaleka, jonga imeko yetyhubhu yokufudumeza kwaye ulinganise ubushushu rhoqo, kwaye uthambise izixhobo zoomatshini. Ukuvaleka kwe-air nozzle kuya kunyusa izinga lokungasebenzi kakuhle kwe-welding malunga ne-15%.

Ubushushu bulinganiswa kube kanye ngenyanga (impazamo ≤±1℃), kwaye ukuphakama kwe-Z-axis kulinganiswa kube kanye ngekota (ukuchaneka ≤±0.05mm). Okungalinganiswanga kunokunyusa izinga lokungasebenzi kwe-welding nge-20%.

Ukufunxa okwaneleyo: tshintsha iringi yesitywini ukuze ufumane ipompo yokufunxa ngesandla, jonga ipompo yokufunxa okanye ucoce indawo evalekileyo ukuze ufumane ipompo yokufunxa ngombane; ukungakwazi ukususa i-solder: jonga ukuba umlomo wombhobho wonakele okanye uvalekile, tshintsha kwaye ucoce i-solder eseleyo.

Ngokubanzi, itshintshwa rhoqo emva kweminyaka eli-1-2 ngokwexesha lokusetyenziswa. Emva kokwaluphala, ubushushu obufanayo buyehla, kwaye izinga lokungasebenzi kakuhle kwe-welding liyanda malunga ne-12%.

Hlambulula ilensi rhoqo ngephepha lelensi elikhethekileyo, thintela ukungqubana ukuze uthintele ukufuduka kwezinto ezibonakalayo, kwaye ulinganise ubude befocal minyaka le ukuqinisekisa ukuba imifanekiso icacile.

Kuqala sebenzisa izinyibilikisi zeekhemikhali (ezifana ne-acetone) ukunyibilikisa izinto ezifakwe kwi-capsulation, uzilungise ngokwenkqubo eqhelekileyo emva kokususwa, uze uzifake kwakhona emva kokugqitywa, unike ingqalelo kwiimeko zokunyibilika kunye nokuphiliswa kwezinto.

Eyona nto iphambili inikwa ekususeni izinto ezinkulu nezivelisa ubushushu obuphezulu ukuze kuthintelwe ukuchaphazela iindawo ezilungisiweyo; landela umgaqo ukususela kokulula ukuya kokunzima ukunciphisa iingozi.

Izixhobo ezikhethekileyo (ezifana ne-flip chip rework station) ziyafuneka, kwaye kusetyenziswa iteknoloji yokufudumeza nge-laser okanye i-ultrasonic welding. Iiparameter zimiselwa ngovavanyo lwangaphambi kwexesha, kwaye izinga lempumelelo lidla ngokuba yi-60%-70%.

Sebenzisa i-multimeter ukuze uvavanye ukuqhubeka kwesekethe ukuze ufumane indawo yesekethe emfutshane, kwaye ujonge kwaye usombulule iingxaki ezifana nokudibanisa i-solder residue, ukungalingani kwephini yecandelo, kunye nomonakalo wesekethe ye-PCB.

Jonga ukuba isiseko silungile na kwaye isigqubuthelo sokukhusela sifakiwe endaweni yaso, jonga ukuba umgca wesignali wonakele na ngexesha lokudityaniswa, sebenzisa i-spectrum analyzer ukubona umthombo wokuphazamiseka, kwaye uthathe amanyathelo anjengokukhusela nokucoca.

Hlalutya idatha yokuhlaziya ngokusebenzisa ukufunda koomatshini ukuze kuqikelelwe iziphene, kusetyenziswe ukubonwa ngamehlo ukuze kufunyanwe ngokuzenzekelayo izinto ezineziphene, kwaye kulungiswe ngobuchule iiparameter zezixhobo ukuphucula ukusebenza kakuhle kunye nomgangatho.

Iya kuphuhlisa ijolise ekudibaniseni ngokuchanekileyo okuphezulu kunye nemisebenzi emininzi (njengokudibanisa ukuhlolwa kwe-X-ray, ukutyala ibhola ngokuzenzekelayo, ukuwelda, njl.njl.), kwaye ifezekise unxibelelwano nenkqubo ye-MES ukuphucula ulawulo olukrelekrele.

Khuthaza ii-flux kunye nezixhobo zokucoca ezinobuhlobo nokusingqongileyo, uphuhlise izixhobo ezisebenzisa amandla amancinci, kwaye uphonononge itekhnoloji yokuhlaziya engonakalisiyo ukunciphisa ungcoliseko kunye nenkunkuma yezixhobo.

Ingenza ngokukhawuleza izixhobo zokulungisa ukuze kuncitshiswe iindleko, kwaye isetyenziselwa ukulungisa umonakalo wengingqi we-PCB (njengemigca yokuqhuba eprintayo) ukuze kube lula iinkqubo ezintsonkothileyo.

Ukulawula izixhobo zokuhlaziya ngedijithali kunye nokubeka esweni kude, ulungise iinkqubo ngohlalutyo lwedatha enkulu, kwaye umisele iinkqubo zokulandelela imveliso ukuze kuphuculwe ulawulo lomgangatho.