SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

Kuvumelekile uhlengahlengiso oluncinci kuphela ngaphakathi kwe-±0.05mm. Izixhobo ezinokuphambuka okugqithisileyo kufuneka zibuyiselwe kumthengisi ukuze kuthintelwe ukwaphuka kwephini okubangelwa kukubekwa ngenkani.

Sebenzisa imo "yenkxaso esembindini + i-crimping ephele kabini". I-pick-and-place machine nozzle kufuneka iqhagamshelane nombindi kunye neziphelo zombini zecandelo ngaxeshanye ukuqinisekisa uxinzelelo olufanayo.

Ubukhulu kufuneka buncitshiswe bube yi-60–90μm ukuze kuthintelwe ukuqokelelana kwentlama yesolder enokubangela ukubhidlika. Kucetyiswa ukuba kusetyenziswe istencil eyenziwe ngombane.

Ukulungiswa okuncinci (ukutshintsha ≤0.1mm) kuyavunyelwa ngaphambi kokuba kuphinde kufakwe i-solder, kodwa kufuneka kuncediswe nge-tweezer efakwe kwi-flux ukuze kuthintelwe ukungcolisa i-pad.

Akukhuthazwa ukutywina emva kwentsimbi kuba iindawo ezisezantsi ezidityanisiweyo azinakuhlolwa ngokubonakalayo. Inxalenye kufuneka isuswe kwaye intlama yentsimbi kufuneka iprintwe kwakhona.

Qinisekisa ukuba umahluko kwinani le-solder paste kuzo zombini iziphelo zecandelo yi-≤3%, kwaye unciphise izinga lokufudumeza i-soldering reflow ukuya kwi-≤1.5℃/s ukunciphisa uxinzelelo lobushushu olungalinganiyo.

Akukhuthazwa kuba kungonakalisa umphezulu weebhola ze-solder. Kufuneka kusetyenziswe i-flux ekhethekileyo (njengohlobo olungacocekanga) ukuphucula ukufuma.

Yehlisa uxinzelelo lokubekwa luye kwi-0.05–0.1N, kwaye ulibazise ixesha lokukhululwa kwe-nozzle (0.2–0.5s) ukuze uphephe ukuguquka kweebhola ze-solder phantsi koxinzelelo.

Inqanaba le-vacuum kufuneka libe yi-≥ - 80kPa ukuqinisekisa ukufunxwa okuzinzileyo kwezinto ezincinci. Kwangaxeshanye, kufuneka kulungiselelwe isenzi sokubona ukuvuza.

Ukuba inani leebhola zesolder ezilahlekileyo liyi-≤5% kwaye azizikhonkwane ezibalulekileyo, ukulungiswa nge-laser kunye nokuzaliswa kwebhola kungasetyenziswa; kungenjalo, ibhodi kufuneka ilahlwe.

Iipakethe zeseramikhi ziyakwazi ukufunxwa bumswakama. Kufuneka zibhakwe kwi-150℃ kangangeeyure ezisi-8 ukuze kupheliswe uxinzelelo lwangaphakathi kwaye kuncitshiswe umswakama ube ngaphantsi kwe-0.1%.

Xa umahluko we-CTE > 10×10⁻⁶/℃, inkqubo yokupholisa ecothayo (isantya ≤1℃/s) kufuneka yongezwe emva kokuphinda kufakwe i-solder ukuze kuncitshiswe ukuqhekeka kwejoyinti ye-solder.

Hayi. Ekubeni ii-LGA pads zingenazo iibhola ze-solder, kufuneka i-nozzle ethe tyaba ene-sensor yoxinzelelo ukuqinisekisa ukuba uxinzelelo lubekwe ngendlela efanayo.

Umaleko wegolide onamaplanga kufuneka ube yi-≥3μm, kwaye umaleko we-nickel onamaplanga kufuneka ube yi-≥5μm. Ngaphandle koko, ukumelana okugqithisileyo kokunxibelelana kunokukhokelela ngokulula ekuncipheni kwesignali okanye ekusileleni kobushushu.

Umbindi wombhobho kufuneka ulungelelaniswe nombindi womxhuzulane wecandelo (ukuphambuka ≤0.01mm), kwaye umsebenzi wokufumanisa ukuma kwecandelo lomatshini wokukhetha nokubeka kufuneka usebenze.

Iiphini zokuxhasa i-elastic (ubulukhuni bonxweme 60–70) ziyafuneka ukuze kuthintelwe ukushenxa kwenxalenye okubangelwa kukugoba kwe-substrate.

Amabala eelensi aya kubangela impazamo yokubona i-lead >0.02mm. Kufuneka icocwe nge-ethanol epheleleyo kanye ngeveki.

I-SAM (Scanning Acoustic Microscopy) isetyenziselwa ukubona ukwahlukana kwe-solder joint interface. Indawo yokuhlukanisa i-solder kufuneka ibe yi-≤10% yendawo ye-pad.

Iitships ezijijekileyo zifuna ulawulo oluchanekileyo lokulungelelaniswa kweebhola ze-solder kunye namaqhuma (ukuchaneka ≤±0.002mm), kwaye inkqubo yokuzalisa kufuneka isetyenziswe.

Ingafezekisa ukuwelda okungenasoluli-paste, ngesantya se-solder joint void

Isebenzisa imisebe yelaser ukulawula ngokuthe ngqo izinto (ukuchaneka ≤±0.001mm), ngaphandle kwesidingo seempumlo zoomatshini, kwaye ifanelekile ekupakishweni kwe-nanoscale.

Ingalinganisa inkqubo yokubeka ngexesha langempela, iqikelele ukusasazwa koxinzelelo lwezixhobo, kwaye ilungise iiparameter kwangaphambili ukunciphisa umngcipheko wokungaphumeleli kwejoyinti yesolder.

Yongeza izixhobo zokupholisa umoya zasekuhlaleni (ezilawulwa bubushushu obungama-23±2℃), kwaye kwangaxeshanye, nciphisa ixesha lokuvezwa kwezinto emva kokuvula (≤imizuzu engama-30) ukuze uphephe ukungcolisa ibhola yesolder.

① I-PCB kufuneka ibhakwe kwi-120℃ kangangeeyure ezi-4 ngaphambi kokuba iprintwe nge-solder paste; ② Izixhobo mazifakwe kwimveliso emva nje kokuba zivuliwe, kwaye kufuneka kulungiswe isixhobo sokususa umswakama (RH≤40%) kwizixhobo.

I-solder eseleyo kufuneka icocwe nge-desoldering braid, kwaye ii-oxide kufuneka zisuswe ngokucoca i-plasma ukuqinisekisa ukuba uburhabaxa bomphezulu we-Ra ye-pad yi-≤1.6μm.