Iindidi zeeModyuli

Ulawulo lwezinto zokuwelda

1. Zithini ii-component ratios kunye neenzuzo zokusebenza kwe-solder eqhelekileyo engenalo i-lead SAC305?

Ulwakhiwo: Sn96.5Ag3.0Cu0.5, iqondo lokunyibilika liyi-217℃. Iingenelo: Ukumelana nokuxinana kwe-oxidation okuphuculwe yi-30%, kuhambelana nemiyalelo yokusingqongileyo ye-RoHS, ukuthembeka okuqinileyo kobushushu obuphezulu, kunye nokugcinwa kwamandla oomatshini okungaphezulu kwe-85% emva kokuguga kwi-150℃ kangangeeyure ezili-1000.
2. I-eutectic point yee-solder alloys iyichaphazela njani inkqubo yokuwelda?

Ii-solder ze-Eutectic (ezifana ne-Sn63Pb37) azinazo iindawo zokuhlala eziqinileyo-ezimanzi xa zinyibilika, zinefestile encinci yobushushu be-welding, nto leyo efuna ukuba ubushushu obuphezulu be-soldering bube yi-50-70℃ ngaphezulu kune-melting point; ii-solder ezingezizo ze-eutectic zinendawo yokuhlala eziqinileyo-ezimanzi, nto leyo efuna ulawulo oluchanekileyo lobushushu ukuze kuthintelwe ukunyibilika okunganelanga.
3. Ungahlula njani iimeko zokusetyenziswa kwe-flux kunye namanqanaba ahlukeneyo omsebenzi?

Ibanga le-R (umsebenzi ophantsi): Iimeko zokucoceka okuphezulu ezifana neenqwelo-moya kunye nezonyango, kunye nokumelana nokufakwa kwentsalela ≥10¹²Ω;

Ibanga le-RA (umsebenzi ophakathi): Izixhobo ze-elektroniki zabathengi, ezikwaziyo ukulawula izinga leziphene zokuwelda ≤0.5%;

Inqanaba le-SA (umsebenzi onamandla): Iindawo ezixineneyo kakhulu, ezifuna ukucocwa ngokungqongqo ukuze kuthintelwe ukugqwala.
4. Ithini imigangatho yomthamo we-flux kwi-solder wire kunye nefuthe layo kwi-welding?

Umxholo oqhelekileyo: 1.0%-3.0%. Umxholo ophantsi kakhulu ukhokelela ekususweni ngokwaneleyo kweefilimu ze-oxide, nto leyo enyusa izinga leziphene ngama-20%-30%; umxholo ophezulu kakhulu ubangela iintsalela ezininzi ezichaphazela ubushushu, apho i-1.8%-2.2% isetyenziswa rhoqo ekuhlanganiseni nge-elektroniki.
5. Ukusasazwa kobukhulu be-particle ye-metal powder kwi-solder paste kuyichaphazela njani indlela yokuprinta?

Uhlobo 3 (25-45μm): Ifanelekile kwiipadi ezinesithuba esingaphezulu kwe-0.5mm, izinga lesiphene sokuprinta esingaphantsi kwe-5%;

Uhlobo lwesi-4 (20-38μm): Ifanelekile ukuba isithuba esincinci se-0.3mm, inokuba sengozini yokuvaleka kwestencil ngeeparameter ezingafanelekanga (amathuba +15%).
6. Lungakanani uluhlu oluvumelekileyo lokuguquguquka kobushushu kunye nokufuma kwindawo yokugcina i-solder paste?

Ubushushu: 0-10℃ (ngaphakathi kokuguquguquka kwe-±2℃), ukufuma: RH≤60%. Izinga lokutshintsha kwe-viscosity liyanda nge-5%-8% ngosuku xa ukuguquguquka kweqondo lobushushu kudlula i-±2℃, kwaye ukufuma okugqithisileyo kukhawulezisa i-oxidation.
7. Lingakanani ixesha lokugcina ucingo lwe-solder olungavulwanga?

Ucingo lwe-solder olune-lead: iminyaka emi-3-5 (15-25℃, RH≤60%);

Ucingo lwe-solder olungenalo i-lead: iminyaka emi-2-3. I-oxidation iyanda emva kwexesha, kwaye imingxunya isenokunyuka iye kwi-10%-15%.
8. Kutheni i-flux yolwelo kufuneka igcinwe kude nokukhanya?

Izinto ezisebenzayo ze-flux (ezifana nee-organic acids) zibola ngokukhawuleza xa zibekwe ekukhanyeni, kwaye umsebenzi wehla ngama-40% emva kwenyanga e-1 yokukhanya, ngelixa kuphela i-10%-15% yehla kwiinyanga ezi-6 zokugcina ngaphandle kokukhanya.
9. Kutheni kungavumelekanga ukuxukuxa ngexesha lokubuyisela ubushushu be-solder paste ethathwe kwindawo yokugcina ebandayo?

Ukuxukuxa kubangela ubushushu bangaphakathi obungalinganiyo, nto leyo ekhokelela ekuphelisweni kwangaphambi kwexesha okanye ukuguquguquka okungaqhelekanga kwesinyibilikisi. Ukuphambuka kwe-viscosity ≤5% emva kweeyure ezi-4-6 zokubuyela kwimeko yesiqhelo yobushushu, ngelixa ukuxukuxa okungafanelekanga (ukuxukuxa okungafanelekanga) kunokubangela ukuphambuka ukuya kuthi ga kwi-20%.
10. Ithini indlela yokulinganisa ubushushu kunye nomswakama kwiindawo zokugcina i-solder?

Linganisa rhoqo emva kweenyanga ezi-6 ukuqinisekisa impazamo yobushushu ±1℃ kunye nempazamo yokufuma ±3%RH, uphephe iimeko zokugcina ezingalawulekiyo.
11. Lingakanani ixesha elisetyenziswa kakhulu le-solder paste evulekileyo kumatshini wokuprinta?

Ukusetyenziswa rhoqo akufuneki kudlule iiyure ezi-8 kubushushu begumbi obuyi-20-25℃ kunye ne-RH≤60%. Ukuqina komgangatho kuyanda nge-30%-50% xa kudluliwe, kunye nezinga leziphene zokuprinta linyuka liye kwi-15%-20%.
12. Ungawubona njani umjikelo wokutshintshwa kolwelo lwe-solder kwi-wave soldering tank?

Misela ngomthwalo wemveliso kunye nobungakanani benkunkuma yesolder, tshintsha yonke i-PCB eyi-500-1000㎡ eveliswayo; tshintsha kwangaphambili xa umxholo wobhedu >0.8%, kungenjalo izinga lesiphene liyanda nge-25%-35%.
13. Luluphi ulwalamano phakathi kokusetyenziswa kwentambo yesolder kunye nobukhulu bejoyinti yesolder kwi-selectal welding?

Ukusetyenziswa kuyanda nge-15%-20% kuko konke ukunyuka kwe-0.1mm kwi-diameter yejoyinti ye-solder. Ukusetyenziswa kungenziwa nge-预估 (kuqikelelwe) ngokubala umthamo wejoyinti ye-solder (uxinano lwe-SAC305 yi-7.4g/cm³).
14. Yeyiphi indibaniselwano efanelekileyo yobushushu bencam yentsimbi enyibilikiswayo kunye nexesha lokunyibilikisa kwi-welding ngesandla?

Ubushushu: 350-380℃, ixesha: imizuzwana emi-2-3. Ngaphezulu kwe-400℃ okanye ngaphezulu kwemizuzwana emi-5 zonakalisa ngokulula izinto,
15. I-engile ye-squeegee iwuchaphazela njani umgangatho wokuprinta ngexesha lokuprinta i-solder paste?

I-engile engama-45°-60° yeyona ifanelekileyo. I-60° ithambekele ekutshizeni nasekuqhekekeni, kunye nezinga leziphene linyuka nge-8%-10% kuyo yonke i-5° yokuphambuka.
16. Ungazibona njani iimbombo zangaphakathi kwiindawo zokudibanisa i-solder nge-X-Ray?

I-X-Ray iyakwazi ukubona iindawo ezingenanto ezinobubanzi obuyi-≥0.1mm. Umgangatho we-IPC-A-610: indawo engenanto ≤25% kwiimveliso zeklasi B, ≤15% kwiklasi C, apho iindawo ezingenanto zigqithisileyo zichaphazela ukusasazwa kobushushu kunye namandla.
17. Zithini iimeko ezisemgangathweni kunye noluhlu lokuphambuka oluvumelekileyo lovavanyo lwe-solder paste viscosity?

Iimeko: 25±0.5℃, isantya sokujikeleza yi-5rpm, vavanya imizuzwana engama-60. I-SAC305 standard viscosity: 80-120Pa·s, kufuneka uhlengahlengiso ukuba ukuphambuka kudlula ±15%.
18. Ziziphi iindlela zokuvavanya amandla okutsalwa kunye neendlela zokufaneleka kwamalungu e-solder?

Vavanya ngesixhobo sokuvavanya ukutsalwa kwesandi ngesantya se-5mm/min. ≥0.5N kwiphakheji ye-0603, ≥1.5N kwi-QFP leads, amandla awoneleyo okusilela xa kungcangcazela.
19. Ungawuhlalutya njani ulwakhiwo lwe-microstructure lwamalungu e-solder ngokwahlulahlula i-metallographic?

Jonga phantsi kwe-microscope emva kokusila nokupolisha, ugxile kubukhulu be-IMC maleko (1-3μm kwi-SAC305), >5μm yenza amalungu e-solder abe buthathaka kwaye anciphise ubomi bawo ngaphezu kwe-50%.
20. Ithini imigangatho yovavanyo lokucoceka kwee-ion kwiintsalela zeflux?

Uvavanyo nge-ion chromatography, intsalela ye-ion kwindawo nganye yeyunithi ≤1.5μg/cm² (kwi-NaCl equivalent), ukugqithisa ngokulula kubangela ukufuduka kwee-electrochemical short circuits.
21. Isantya sokufudumeza kwinqanaba lokufudumeza kwangaphambili xa kutsalwa i-solder kwakhona siyichaphazela njani i-welding?

Izinga le-1-3℃/s lifanelekile. >5℃/s ithanda ukuqhekeka koxinzelelo lobushushu kwiindawo,
22. Kwinkqubo yokunyibilikisa amaza amabini, zithini iindima kunye noseto lweeparameter zamaza angaphambili kunye namaza angasemva?

Igagasi langaphambili (igagasi elinomoya ovuthuzayo): Ukuphakama kwamagagasi yi-30-50mm, isantya yi-2-3m/min, likhupha umoya ovuthuzayo;

Igagasi elingasemva (igagasi elithambileyo): Ukuphakama kwamagagasi yi-20-30mm, isantya yi-1.5-2.5m/min, ibumba amalungu e-solder.
23. Unganciphisa njani ukudilika kwe-solder paste ngokuphucula uyilo lokuvula i-stencil?

Sebenzisa izithuba ezinamanqanaba kunye neekona ezijikelezileyo ezisikwe nge-laser. Nciphisa isithuba se-QFP esingu-0.3mm nge-10%-15% kwaye wongeze iikona ezijikelezileyo ezingu-0.05mm, unciphise izinga lokuwa ukusuka kwi-12% ukuya kwi-3%-5%.
24. Ithini impembelelo yokhuseleko lwe-nitrogen kumgangatho wokuwelda kwi-disguise ekhethiweyo?

Imekobume yenitrogen (umxholo weoksijini
25. Ungalulungisa njani izinga lokupholisa i-reflow soldering ngokwe-PCB ubukhulu?

Xa kukho ukunyuka kwe-0.5mm kobukhulu be-PCB, nciphisa izinga lokuphola nge-1-2℃/s. Ukupholisa ngokukhawuleza kakhulu (>5℃/s) kwiibhodi ezityebileyo ezithanda ukuqhekeka, okucothayo kakhulu kuchaphazela ukusebenza kakuhle kwaye kubangele i-oxidation.
26. Ngowuphi umgaqo ohambelanayo phakathi kwesantya sokususa i-printing press kunye ne-solder paste viscosity?

Okukhona i-viscosity iphezulu, kokukhona isantya sokukhupha sicotha. I-viscosity ephezulu (>150Pa·s): 1-2mm/s, i-viscosity ephantsi (
27. Luluphi ulwalamano phakathi kwenani leendawo zobushushu ze-reflow soldering kunye ne-complex circuit board welding?

Izixhobo ezineendawo zobushushu ezisi-8 nangaphezulu zifanelekile ngakumbi kwiibhodi zeesekethe ezinoxinano oluphezulu, nto leyo ephucula izinga lokufaneleka ukusuka kwi-85% ukuya kwi-95% xa kuthelekiswa nezixhobo ezineendawo ezi-6, kunye nolawulo lobushushu oluchanekileyo.
28. Ithini impembelelo yesixhobo sokuxukuxa kwi-wave soldering tank kwi-uniformity ye-solder liquid?

Isantya sokujikeleza se-20-40rpm sinika ulwelo olufana kakhulu nolwelo olunyibilikisiweyo. Emva kokuyeka ukuxukuxa, umahluko wobushushu phakathi kwamaleko aphezulu nasezantsi uyanda nge-3-5℃ ngeyure, kunye nokuphambuka kokwakheka kunye nezinga lesiphene elinyukayo nge-10%-15%.
29. Ithini impembelelo yokuchaneka komthamo we-tin spray we-selective welding nozzle kwi-small solder joints?

Ukuchaneka kufuneka kulawulwe ngaphakathi kwe-±0.01mg. Kwiipakethe ze-0201, ukuphambuka >±0.02mg kwandisa amathuba okujikeleza okufutshane/ukungoneli kwe-soldering nge-40%-50%, nto leyo echaphazela kakhulu isivuno.
30. Luthini uluhlu lolawulo loxinzelelo kwinkqubo yokondla ngentambo ye-solder?

Uxinzelelo lwe-0.8-1
31. Ithini inkqubo eqhelekileyo kunye namanyathelo okukhusela ekusebenziseni kwakhona i-solder engenalo ilothe?

Inkqubo: Ingqokelela ehleliweyo → ukunyibilikisa kunye nokususwa kokungcola → ukulungiswa kokwakheka. Ubushushu bokunyibilikisa yi-280-320℃, umxholo wetin ≥99.5% emva kokususwa kokungcola. Thintela ungcoliseko lwesinyithi esinzima; amanzi amdaka kufuneka asuswe kwaye atshiswe ukuze ahlangabezane nemigangatho yokukhupha ye-GB 8978-1996.
32. Ziziphi izinto eziphambili zeegesi eziguquguqukayo ezijikeleza umoya kunye nemida yokuchatshazelwa kwazo emsebenzini?

Iqulethe i-abietic acid kunye ne-isopropanol. Imida yokuvezwa emsebenzini: i-abietic acid 5mg/m³ (umyinge oqikelelweyo ngexesha), i-isopropanol 980mg/m³. Zixhobise ngomoya osebenza kakuhle kakhulu ukuthintela ukurhawuzelelwa kokuphefumla kunye nemithambo-luvo.
33. Ithini ikhowudi yokuhlelwa kwenkunkuma enobungozi kunye neemfuno zokulahlwa kwezinto ezidityanisiweyo zenkunkuma?

Ichazwe njenge-HW49 (ikhowudi 900-041-49), kufuneka ilahlwe ziiyunithi ezifanelekileyo, ithobele iMiqathango yoLawulo lweeMpahla eziHazardous Waste Transfer, kwaye ithintele ngokungqongqo ukuxubana nenkunkuma yasekhaya.
34. Zithini iimfuno zomgangatho wokumelana nokuqhuma kwiindawo zokugcina i-solder?

I-Ex dⅡBT4 ekwaziyo ukumelana nokuqhuma iyadingeka ukugcina ulwelo olunokutsha. Sebenzisa izibane/iiswitshi ezikwaziyo ukumelana nokuqhuma kwaye uthintele izixhobo ezivelisa iintlantsi. Ukungathobeli imithetho kwandisa umngcipheko womlilo/ukuqhuma ngama-30%-50%.
35. Ungakuthintela njani ukungcoliswa kwenkunkuma yesolder ngexesha lokugcina?

Gcina kwizikhongozeli ezomileyo ezivaliweyo ezine-antioxidant eyi-0.5%-1.0%BHT. I-oxidation iyanda nge-50% kwiiyure ezingama-24 xa ivuliwe; indawo yokugcina evaliweyo yandisa ixesha lokuphinda isetyenziswe ukuya kwiinyanga ezi-3-6.
36. Ungazinciphisa njani iindleko ngokuphucula ubukhulu bokuprinta i-solder paste?

Nciphisa ubukhulu ukusuka kwi-0.15mm ukuya kwi-0.12mm phantsi kokuthobela umgangatho, unciphise ukusetyenziswa nge-20%-25%. Ukulungiswa kwe-DOE kunciphisa iindleko kwi-PCB nganye nge-0.3-0.5 RMB.
37. Ingakanani imilinganiselo yokulahleka komndilili weshishini le-solder wire kunye neendlela zokunciphisa?

Umyinge weshishini: 8%-12%. Iindlela: Ukondla ngentambo ngokuzenzekelayo (kunciphisa ilahleko nge-3-5%), iinkqubo eziphuculweyo (kunciphisa ukunyibilikisa okungenanto nge-15%-20%), ukurisayikilisha inkunkuma yentambo (izinga lokubuyisela le-70%-80%), kunokunciphisa ukuya kwi-5%-8%.
38. Yintoni inkqubo yovavanyo lweendleko-ukusebenza kweepaste ze-solder ezivela kwiimpawu ezahlukeneyo?

Izalathisi: Ixabiso leyunithi, umxholo wesinyithi (+5% yexabiso nge +1%), izinga lokungasebenzi kakuhle kokuprinta (-0.5 RMB/PCB nge -1%), ixesha lokugcinwa (-3% yexabiso lokugcina ngenyanga +1), libalwa ngokwesalathisi esilinganisiweyo.
39. Ungawunciphisa njani udoti we-wave soldering ngokusebenzisa inkqubo yokwenza ngcono?

Amanyathelo: Ukukhuselwa kwe-nitrogen (kunciphisa inkunkuma ngama-40%-60%), ioyile yokulwa ne-oxidation (kunciphisa izinga le-oxidation ngama-50%-70%), ulawulo lobushushu ±2℃, kunokunciphisa inkunkuma ukusuka kwi-5kg/kits ukuya kwi-2-3kg/kits.
40. Luthini ulwalamano phakathi kokuthengiswa kwezinto ezithengiswayo kunye nokufumana imali eninzi?

Ukunyuka kwengeniso ukusuka kwi-4 ukuya kwi-6 ngonyaka kunciphisa iindleko zokufumana imali nge-33%. Ukuphucula ukusebenza kakuhle ngokuthenga i-JIT, ukuphuculwa kwempahla (ukunciphisa kwe-20%-30%), kunye nomjikelo omfutshane (ukunciphisa kweentsuku ezili-15-20).
41. Zeziphi iinkqubo ezibalulekileyo ekufuneka zigxile kuzo ngexesha lokuhlolwa kwesatifikethi se-ISO 9001 sababoneleli be-solder?

Ingqwalasela: Ukuhlolwa kwezinto eziluhlaza (ukugubungela nge-100%), ulawulo lwemveliso (umz., ukuphambuka kwexesha lokuxuba intlama yesolder ≤5%), uvavanyo lwemveliso olugqityiweyo (≥10 izinto ngebhetshi nganye), ukuphathwa kwemveliso okungahambelaniyo (ukufika ngexesha ≥95%).
42. Ungawuvavanya njani amandla ophando nophuhliso lomthengisi ngokusebenzisa uhlolo lwangaphakathi?

Izalathi zovavanyo: Izixhobo ze-R&D (i-DSC, ukufumaneka kwe-SEM), umlinganiselo wabasebenzi be-R&D (≥15%), inani lamalungelo omenzi (≥3 amatsha ngonyaka), umjikelo wophuhliso lwemveliso entsha (umndilili weenyanga ≤6).
43. Ungawumisela njani umgangatho wediphozithi kubaboneleli be-solder?

Umlinganiselo: 5%-10% yemali yokuthenga yonyaka. Ukuncitshiswa kwexabiso leebhetshi ezineziphene >3%, buyisela emva kweebhetshi ezi-3 ezilandelelanayo ukuze kukhuthazwe ulawulo lomgangatho.
44. Zeziphi iiparameter zobugcisa ezibalulekileyo ekufuneka zifakwe kwisivumelwano sobuchwepheshe nabathengisi be-solder?

Ibandakanya: Ukwakheka kwe-alloy (umz., ukunyamezelana kwe-SAC305 Sn±0.5%, Ag±0.2%, Cu±0.1%), iqondo lokunyibilika (217℃±3℃), i-viscosity (50-150Pa·s±10%), inqanaba lomsebenzi (umz., i-RA grade halide ≤0.5%), iimfuno zokusingqongileyo (RoHS 2.0), njl.
45. Ungalulawula njani ulwazi lwebhetshi yesolder ngenkqubo yokulandelela umgangatho?

Iirekhodi zenkqubo: Inombolo yebhetshi, umhla wokuveliswa, ukwakheka, ixesha lokugcina impahla, njl.njl., edibene nezihlonzi ezikhethekileyo ze-PCBA. Ixesha lendawo yengxaki lincitshisiwe ukusuka kwiiyure ezingama-24 ukuya kwezingama-≤2.
46. Iintlobo ezahlukeneyo ze-solder paste squeegees ziwuchaphazela njani umgangatho wokuprinta?

I-Polyurethane squeegee: Iguquguquka, ifanelekile kwi-viscosity ephantsi kunye ne-fine pitch (iiphini
I-Metal squeegee: Ubulukhuni obuphezulu, bufanelekile kwiifilimu ezinobungqindilili obuphezulu kunye neefilimu ezityebileyo (ii-pad >0.8mm, ukunyamezelana kobukhulu ±5μm).
47. Ungawuvavanya njani ngokobungakanani ukusebenza kakuhle kweenkqubo zolawulo lwe-solder?

Izalathisi: Utshintsho oluvela kwimpahla (inqanaba elihle kakhulu izihlandlo ezi-8-10 ngonyaka), ixesha ukusuka ekuthathweni ukuya emgceni (≤ iyure e-1), umlinganiselo wexesha lokungasebenzi ngenxa yeengxaki zolawulo (
48. Ungazisombulula njani iingxaki zezizathu ngokwembono yezinto ezidityanisiweyo xa i-大面积虚焊 (ukunyibilika okunganelanga) kwenzeka emva kokuwelda kwe-PCBA?

Amanqaku okusombulula iingxaki:

1. Jonga ukuba umxholo wesinyithi se-solder paste ≥90% (umgangatho ongenalo ilothe), ukungabikho kwayo kwandisa umngcipheko wokunganeli kwe-solder nge-40% nangaphezulu;

2. Qinisekisa ukuba umsebenzi wokuhamba kwamanzi uyahlangabezana nenqanaba le-RA, umsebenzi onganeleyo ubangela ukuba amanzi angangeni kakuhle;

3. Qinisekisa ukuba i-solder paste iphelelwe lixesha (ukuxinana/ukonakala komsebenzi).
49. Ungazikhetha njani izinto ezifanelekileyo zokufaka i-solder ukuze ziqinisekiswe ngexesha lokuveliswa kwesilingo se-PCBA esincinci?

Amaqhinga:

1. Beka phambili imodeli efanayo ye-solder njengemveliso yobuninzi ukuqinisekisa ukuqhubeka kwenkqubo;

2. Kwiimveliso ezintsonkothileyo, khetha iimpawu ezi-2 ukuya kwezi-3 ezinentsebenzo efanayo ukuze uthelekise;

3. Vavanya ngesantya seziphene, idatha yamandla okutsalwa kwejoyinti yesolder, kunye neendleko ezipheleleyo.
50. Ungawuvavanya njani umphumo wendawo yokugcina i-solder kwixesha layo elibekiweyo?

Izinto eziphambili:

- Ixesha lokuphelelwa lixesha lifinyezwa ngama-20% kwi-5℃ nganye ngaphezu komgangatho oqhelekileyo (umz., intlama >10℃);

- Izinga le-oxidation liyanda nge-15% kwi-10% yokunyuka komswakama we-RH;

Hlalutya unxibelelwano lwedatha ngokusebenzisa iirekhoda zobushushu/zomswakama ukuze uqikelele ixesha lokuphela kweshelufu.
51. Ungafumanisa njani ukuba kufuneka kutshintshwe na i-solder bath ngexesha lokugcinwa kwetanki yokunyibilikisa amaza rhoqo?

Iikhrayitheriya zokutshintsha:

1. Ukungcola kudlula umgangatho oqhelekileyo (umz., Cu >0.8%, IPC-J-STD-006B), amandla ejoyinti yesolder ancipha nge-20%-30%;

2. Inkunkuma yesolder igubungela ngaphezulu kwe-20% yomphezulu wokuhlamba, nto leyo echaphazela umgangatho;

3. Izinga leziphene zokuwelda liyanda rhoqo ngenxa yeengxaki zokuhlamba ngesolder.
52. Ungaziphucula njani izicwangciso zokuthenga usebenzisa uhlalutyo lwedatha enkulu kulawulo lwezinto ezithengiswayo?

Iindlela:

1. Hlalutya ukusetyenziswa kwembali, imijikelo yokuthenga, kunye nokuguquguquka kwamaxabiso ukuze kuqikelelwe imfuno;

2. Ukugcina izinto kwangaphambili ngokusekelwe kwiiodolo zexesha lonyaka ukunciphisa iingozi zokuphelelwa zizinto;

3. Landelela iindlela ezisetyenziswayo zokuthenga ukuze uphucule ixesha lokuthenga. Idatha ibonisa iindleko ze-inventory eziyi-15%-20% kunye nokunciphisa iindleko zokuthenga eziyi-8%-12%.
53. Yintoni impembelelo yokusebenzisa iintlobo ezahlukeneyo ze-solder yokuhlaziya ukuthembeka kwemveliso ngexesha lokuhlaziya i-PCBA?

Iimpembelelo:

- I-solder enokwakheka okufanayo: Ukusebenza okudibeneyo okuhlala kufana nokwasekuqaleni;

- I-solder enokwakheka okwahlukileyo (umz., i-solder esekwe kwi-bismuth enobushushu obuphantsi): Ukungafani okukhulu kwe-CTE (esekwe kwi-bismuth ≈2x SAC305), enokuqhekeka kwimijikelo yobushushu, ukuthembeka kuncitshiswe ngama-50%+.

Ulawulo lwezinto zokuwelda

1. Zithini ii-component ratios kunye neenzuzo zokusebenza kwe-solder eqhelekileyo engenalo i-lead SAC305?

2. I-eutectic point yee-solder alloys iyichaphazela njani inkqubo yokuwelda?

3. Ungahlula njani iimeko zokusetyenziswa kwe-flux kunye namanqanaba ahlukeneyo omsebenzi?

4. Ithini imigangatho yomthamo we-flux kwi-solder wire kunye nefuthe layo kwi-welding?

5. Ukusasazwa kobukhulu be-particle ye-metal powder kwi-solder paste kuyichaphazela njani indlela yokuprinta?

6. Lungakanani uluhlu oluvumelekileyo lokuguquguquka kobushushu kunye nokufuma kwindawo yokugcina i-solder paste?

7. Lingakanani ixesha lokugcina ucingo lwe-solder olungavulwanga?

8. Kutheni i-flux yolwelo kufuneka igcinwe kude nokukhanya?

9. Kutheni kungavumelekanga ukuxukuxa ngexesha lokubuyisela ubushushu be-solder paste ethathwe kwindawo yokugcina ebandayo?

10. Ithini indlela yokulinganisa ubushushu kunye nomswakama kwiindawo zokugcina i-solder?

11. Lingakanani ixesha elisetyenziswa kakhulu le-solder paste evulekileyo kumatshini wokuprinta?

12. Ungawubona njani umjikelo wokutshintshwa kolwelo lwe-solder kwi-wave soldering tank?

13. Luluphi ulwalamano phakathi kokusetyenziswa kwentambo yesolder kunye nobukhulu bejoyinti yesolder kwi-selectal welding?

14. Yeyiphi indibaniselwano efanelekileyo yobushushu bencam yentsimbi enyibilikiswayo kunye nexesha lokunyibilikisa kwi-welding ngesandla?

15. I-engile ye-squeegee iwuchaphazela njani umgangatho wokuprinta ngexesha lokuprinta i-solder paste?

16. Ungazibona njani iimbombo zangaphakathi kwiindawo zokudibanisa i-solder nge-X-Ray?

17. Zithini iimeko ezisemgangathweni kunye noluhlu lokuphambuka oluvumelekileyo lovavanyo lwe-solder paste viscosity?

18. Ziziphi iindlela zokuvavanya amandla okutsalwa kunye neendlela zokufaneleka kwamalungu e-solder?

19. Ungawuhlalutya njani ulwakhiwo lwe-microstructure lwamalungu e-solder ngokwahlulahlula i-metallographic?

20. Ithini imigangatho yovavanyo lokucoceka kwee-ion kwiintsalela zeflux?

21. Isantya sokufudumeza kwinqanaba lokufudumeza kwangaphambili xa kutsalwa i-solder kwakhona siyichaphazela njani i-welding?

22. Kwinkqubo yokunyibilikisa amaza amabini, zithini iindima kunye noseto lweeparameter zamaza angaphambili kunye namaza angasemva?

23. Unganciphisa njani ukudilika kwe-solder paste ngokuphucula uyilo lokuvula i-stencil?

24. Ithini impembelelo yokhuseleko lwe-nitrogen kumgangatho wokuwelda kwi-disguise ekhethiweyo?

25. Ungalulungisa njani izinga lokupholisa i-reflow soldering ngokwe-PCB ubukhulu?

26. Ngowuphi umgaqo ohambelanayo phakathi kwesantya sokususa i-printing press kunye ne-solder paste viscosity?

27. Luluphi ulwalamano phakathi kwenani leendawo zobushushu ze-reflow soldering kunye ne-complex circuit board welding?

28. Ithini impembelelo yesixhobo sokuxukuxa kwi-wave soldering tank kwi-uniformity ye-solder liquid?

29. Ithini impembelelo yokuchaneka komthamo we-tin spray we-selective welding nozzle kwi-small solder joints?

30. Luthini uluhlu lolawulo loxinzelelo kwinkqubo yokondla ngentambo ye-solder?

31. Ithini inkqubo eqhelekileyo kunye namanyathelo okukhusela ekusebenziseni kwakhona i-solder engenalo ilothe?

32. Ziziphi izinto eziphambili zeegesi eziguquguqukayo ezijikeleza umoya kunye nemida yokuchatshazelwa kwazo emsebenzini?

33. Ithini ikhowudi yokuhlelwa kwenkunkuma enobungozi kunye neemfuno zokulahlwa kwezinto ezidityanisiweyo zenkunkuma?

34. Zithini iimfuno zomgangatho wokumelana nokuqhuma kwiindawo zokugcina i-solder?

35. Ungakuthintela njani ukungcoliswa kwenkunkuma yesolder ngexesha lokugcina?

36. Ungazinciphisa njani iindleko ngokuphucula ubukhulu bokuprinta i-solder paste?

37. Ingakanani imilinganiselo yokulahleka komndilili weshishini le-solder wire kunye neendlela zokunciphisa?

38. Yintoni inkqubo yovavanyo lweendleko-ukusebenza kweepaste ze-solder ezivela kwiimpawu ezahlukeneyo?

39. Ungawunciphisa njani udoti we-wave soldering ngokusebenzisa inkqubo yokwenza ngcono?

40. Luthini ulwalamano phakathi kokuthengiswa kwezinto ezithengiswayo kunye nokufumana imali eninzi?

41. Zeziphi iinkqubo ezibalulekileyo ekufuneka zigxile kuzo ngexesha lokuhlolwa kwesatifikethi se-ISO 9001 sababoneleli be-solder?

42. Ungawuvavanya njani amandla ophando nophuhliso lomthengisi ngokusebenzisa uhlolo lwangaphakathi?

43. Ungawumisela njani umgangatho wediphozithi kubaboneleli be-solder?

44. Zeziphi iiparameter zobugcisa ezibalulekileyo ekufuneka zifakwe kwisivumelwano sobuchwepheshe nabathengisi be-solder?

45. Ungalulawula njani ulwazi lwebhetshi yesolder ngenkqubo yokulandelela umgangatho?

46. ​​Iintlobo ezahlukeneyo ze-solder paste squeegees ziwuchaphazela njani umgangatho wokuprinta?

47. Ungawuvavanya njani ngokobungakanani ukusebenza kakuhle kweenkqubo zolawulo lwe-solder?

48. Ungazisombulula njani iingxaki zezizathu ngokwembono yezinto ezidityanisiweyo xa i-大面积虚焊 (ukunyibilika okunganelanga) kwenzeka emva kokuwelda kwe-PCBA?

49. Ungazikhetha njani izinto ezifanelekileyo zokufaka i-solder ukuze ziqinisekiswe ngexesha lokuveliswa kwesilingo se-PCBA esincinci?

50. Ungawuvavanya njani umphumo wendawo yokugcina i-solder kwixesha layo elibekiweyo?

51. Ungafumanisa njani ukuba kufuneka kutshintshwe na i-solder bath ngexesha lokugcinwa kwetanki yokunyibilikisa amaza rhoqo?

52. Ungaziphucula njani izicwangciso zokuthenga usebenzisa uhlalutyo lwedatha enkulu kulawulo lwezinto ezithengiswayo?

53. Yintoni impembelelo yokusebenzisa iintlobo ezahlukeneyo ze-solder yokuhlaziya ukuthembeka kwemveliso ngexesha lokuhlaziya i-PCBA?

46. Iintlobo ezahlukeneyo ze-solder paste squeegees ziwuchaphazela njani umgangatho wokuprinta?