Indibano yePCB

I-PCBA sisifinyezo se-Printed Circuit Board Assembly, esibhekisa kwinkqubo yokudibanisa izinto ze-elektroniki kwi-PCB ukuze kwenziwe inkqubo epheleleyo yesekethe. Linyathelo elibalulekileyo ekuvelisweni kwemveliso ye-elektroniki.

Ngokuyintloko yiThrough-Hole Technology (THT), iSurface Mount Technology (SMT), kunye nehybrid technology. Izixhobo ze-THT solders ezineeled ezifakwe ngemingxunya, izixhobo ze-SMT solders ngqo kumphezulu we-PCB, kwaye i-hybrid technology idibanisa zombini.

Amanyathelo aquka ukulungiswa kwezinto, ukuhlolwa kwe-PCB, i-SMT (ukuprinta i-solder paste, ukubeka izinto, ukutshixa kwakhona), i-THT (ukucubungula i-lead, ukutshixa kwamaza), ukutshixa, uvavanyo lomgangatho, ukucoca kunye nokugquma, kunye nokuhlanganiswa kokugqibela.

Idibanisa izinto ezahlukeneyo ngokwendlela eziyilwe ngayo, ivumela imisebenzi efana nokucubungula imiqondiso kunye nokuguqulwa kwamandla. Linyathelo eliphambili lokuguqula uyilo lube ziimveliso ezibonakalayo.

Inkqubo esisiseko iyafana, kodwa ilungiswa ngokwendlela entsonkothileyo ngayo imveliso, iintlobo zezakhi, ubungakanani bemveliso, njl. Umzekelo, iimveliso ezincinci ezichanekileyo zinokongeza uhlolo lwesandla, ngelixa imveliso yobuninzi igxile kwi-automation.

I-THT yiTekhnoloji ye-Through-Hole, apho izinto ezineeledi zifakwa kwimingxunya yokufakelwa i-solder. Iingenelo: amandla aphezulu oomatshini, afanelekileyo kwizinto ezinombane ophezulu; Iingxaki: ukusetyenziswa okukhulu kwendawo, ukusebenza okuphantsi.

I-SMT yiSurface Mount Technology, eneengenelo zobuninzi bendibano, ubungakanani obuncinci bezinto, ukufaneleka kwemveliso ezenzekelayo, ukusebenza kakuhle, kunye neendleko eziphantsi.

Itekhnoloji ye-hybrid isetyenziswa xa iimveliso zifuna ukusebenzisa amandla aphezulu/amandla oomatshini e-THT kunye nobukhulu obuphezulu/ubuncinci be-SMT, njengeemodyuli zamandla ezinee-inductors ezidlula kwimingxunya kunye neetships zokumisa phezu komhlaba.

Ichatshazelwa ziindleko zecandelo, inani/ubungakanani/ubunzima beenkqubo zePCB, ubunzima bokuhlanganisa, umthamo wemveliso, iimfuno zovavanyo, njl. Iibhetshi ezinkulu zinciphisa iindleko zeeyunithi, ngelixa iinkqubo ezinzima zonyusa iindleko.

Izixhobo ze-elektroniki zabathengi: ixabiso eliphantsi, uxinano olukhulu, ukwenziwa kube lula; Ulawulo lwemizi-mveliso: uzinzo, ukuthintela ukuphazamiseka; Izixhobo zonyango: ukuchaneka okuphezulu kunye nokuthembeka, okufuna ukuthotyelwa ngokungqongqo kwemigangatho.

Izinto eziqhelekileyo ezifana ne-FR-4 (iipropati ezilungileyo zombane/zoomatshini kwiimveliso eziqhelekileyo) kunye ne-CEM-1 (ixabiso eliphantsi kodwa ukusebenza okuphantsi). I-thermal expansion coefficient ichaphazela ukuthembeka kwejoyinti ye-solder; umahluko omkhulu unokubangela iingxaki zoxinzelelo.

Khetha ngokusekelwe kubunzima besekethe: umaleko ophindwe kabini kwiisekethe ezilula, umaleko omninzi kwezintsonkothileyo. Amaleko amaninzi anika indawo engakumbi yokuhambisa kodwa iindleko eziphezulu, kunye neemfuno ezingqongqo zokulungelelanisa umaleko.

IiPCB ezinkulu kakhulu zidlula imida yezixhobo; ezo zingaphantsi kobukhulu zibangela ubunzima bokuphatha/bokunyibilikisa, nto leyo echaphazela ulwakhiwo lwecandelo kunye nokuchithwa kobushushu.

Ubungakanani bephedi, imilo, kunye nesithuba esiphakathi kweendawo zichaphazela ngokuthe ngqo umgangatho wokutywina. Iiphedi ezincinci kakhulu zibangela amalungu omileyo; umgama osondelelene kakhulu ukhokelela ekuvaleni ii-short circuits.

Ukulinganisa i-solder yomoya oshushu (HASL): ixabiso eliphantsi kodwa lithambile, lichaphazela ukutywina kwe-fine-pitch; igolide yokuntywiliselwa kwe-nickel engena-electro (ENIG): ukutywina okulungileyo, ukuchaneka okuphezulu, ixabiso eliphezulu; i-organic solderability preservative (OSP): ikhusela ubhedu, iindleko eziphakathi, neemfuno zokugcina ezingqongqo.

Ukuhlolwa ngokubonakalayo (ukukrweleka, ukuguqulwa), uvavanyo lwe-flying probe/ICT (uqhagamshelwano), uhlalutyo lwe-metallographic (ulwakhiwo lwangaphakathi/ukubekwa kweplati).

Ukucoca ukususa ukungcola; Ii-PCB eziphathwe nge-OSP zifuna ukubhaka ukuze zisuse umswakama kwaye zithintele ukugalela amaqamza.

Iifayile zoyilo ezifana neGerber zichaza ulwakhiwo lwecandelo kunye neendawo zephedi, zisebenza njengesiseko sokuhlanganiswa ukuqinisekisa ukuthotyelwa koyilo.

Izixhobo azinakufakelwa, ii-short-circuits/open-circuits zombane, ukuphazamiseka kwesignali, ukungasebenzi kakuhle kobushushu, okukhokelela ekusileleni kokusebenza okanye kwiingxaki zokusebenza.

Uyilo olufanelekileyo lwezixhobo (thintela iindawo ezixineneyo/ezinzima ukufikelela kuzo), uyilo olucwangcisiweyo lwephedi, ukuhambelana kwe-SMT/THT, imingxunya yokubeka, kunye nokuhambisa ukuze kuthintelwe ii-engile ezibukhali kunye nemikhondo emide.

Cinga ngokusebenza kombane (ukuhambelana kweeparameter), ukuhambelana kweepakethe neephedi, ukuthembeka, iindleko, kunye nozinzo lwezixhobo.

Iipakethi ezisebenzisa imingxunya (umz., i-DIP) ye-THT, indawo enkulu yokusebenza; Iipakethi zokufaka umphezulu (umz., i-SOP/BGA) ye-SMT, uxinano oluphezulu kodwa ubunzima obuphezulu bokunyibilikisa (umz., i-BGA ifuna ulawulo oluchanekileyo lobushushu).

Ukungaguquguquki kakuhle kwe-soldering kubangela ukoma kwamalungu kunye nokunyibilika kobuxoki. Iileyidi ezifakwe i-oxidized/oyile zifuna unyango lwangaphambi kwexesha (ukucocwa, ukucocwa).

I-Reflow soldering ifanele izixhobo ze-SMT; i-wave soldering ifanele izixhobo ze-through-hole kunye ne-SMT ezinkulu. Iinkcukacha zihlala zichaza iinkqubo ezihambelanayo.

Ukuphuma kokuqala (FIFO), ubushushu/umswakama olawulwayo (20-25℃, 40%-60%RH), ukusampula rhoqo, kunye nokuvavanya/ukukrazula izinto eziphelelwe lixesha/ezirhanelwayo.

Umsebenzi ongaqhelekanga wesekethe (iiparameters ezingalunganga, ukungasebenzi kakuhle kwetshiphusi), ii-short circuits/overloads, kunye nomonakalo kwi-PCB nakwezinye izinto.

Ukuhlolwa okubonakalayo (umonakalo, i-lead oxidation), uvavanyo lweeparameter zombane (i-multimeter/LCR meter), kunye novavanyo olusebenzayo lwezinto ezibalulekileyo (umz., ukuqinisekiswa kwenkqubo ye-chip).

Uxinzelelo olugqithisileyo lobushushu lunokubangela ukuqhekeka kwejoyinti ye-solder yangaphakathi kwiitships okanye ukuqhekeka kwe-dielectric kwii-capacitors, okukhokelela ekukhubekeni okanye ekusileleni kweparameter. Iprofayili yobushushu kunye nexesha kufuneka zilawulwe.

Iimpawu ze-polarized (umz., i-capacitor ±, ii-diode arrows) ziphawulwe kwii-PCB pads. Ukufakelwa ngesandla kufuna ukuqinisekiswa okubonakalayo; izixhobo ezizenzekelayo zifuna iiparameter ze-polarity ezicwangcisiweyo.

Ifuna ubushushu/umswakama olawulwayo (±2℃, 40%-60%RH) kunye nokhuseleko lwe-ESD (umgangatho ochasene nokungashukumi, imitya yesandla, impahla yokusebenza) ukuze kuthintelwe ukukhukuliseka kweparameter kunye nomonakalo we-ESD.

Umgaqo: Ukuprinta i-solder paste → indawo yokubeka izinto → ukufudumeza ukuze i-paste inyibilike → ukupholisa kwi-solder. Iprofayili yobushushu: Fudumeza (1-3℃/s ukuya kwi-150-180℃), faka (180-200℃, 60-120s), phinda uphume (incopho 217-235℃, 30-90s), pholile (3-6℃/s).

Umgaqo: I-solder yolwelo yenza amaza, kwaye iileya ze-PCB ziyathengiswa xa zidlula. Zifanelekile kwiinxalenye ze-through-hole kunye ne-SMT ezinkulu.

Ukusetyenziswa: Ukucwangcisa, ukulungisa, kunye neendawo ezifikelelekayo ukuze kusebenze ngokuzenzekelayo. Amanyathelo okhuseleko: Intsimbi yokunyibilikisa 20-60W, ucingo lwe-solder 0.5-1.0mm, ubushushu 300-350℃, ixesha 3-5s, ukucoca kwangaphambili, kunye nokuhlolwa emva kokuhlolwa.

Khetha ngokwenkqubo: Intlama yesolder engenalo ilothe (Sn-Ag-Cu, 217-227℃) yokuphinda iphume; iibha zesolder ezinelothe/ezingenalo ilothe (Sn-Pb, 183℃ yokudibanisa ilothe) yokudibanisa amaza; ucingo lwesolder lokudibanisa ngesandla, ucinga ukuba kulula ukumanzisa kunye neendleko.

Iiparamitha zenkqubo yokulawula (iprofayili yobushushu, ixesha lokunyibilikisa), ukulinganisa izixhobo, ukuqeqesha abasebenzi, ukusebenzisa izixhobo ezifanelekileyo, ukuhlolwa kwe-AOI/X-Ray, kunye nokuhlaziya iziphene ngexesha elifanelekileyo.

Ijoyinti eyomileyo: Lungisa ubushushu, yandisa ixesha, coceka iindawo; I-short circuit: Nciphisa i-solder, yenza ngcono uyilo; Ukudibanisa: Lungisa ivolumu ye-paste, iprofayili yobushushu; I-solder engonelanga: Yandisa i-paste, yenza ngcono inkqubo; I-solder erhabaxa: Yongeza i-flux, lungisa ubushushu.

Iindima: Susa ii-oxides, nciphisa uxinzelelo lomphezulu, phucula ukufuma. Iintlobo: Ezingaphiliyo (umsebenzi ophezulu, ukubola, kufuna ukucocwa), ezingaphiliyo (umsebenzi ophakathi, ukubola okuphantsi, kufuna ukucocwa), ezisekwe kwi-rosin (eziqhelekileyo, ezingaboliyo, ezingacocekanga). Khetha ngenkqubo nangemveliso.

Ixabiso le-Tg limisela ukumelana nobushushu be-substrate. I-FR-4 eqhelekileyo ine-Tg ~130-140℃, ngelixa izinto ze-Tg eziphezulu (≥170℃) zimelana neencopho zokugeleza kwakhona kwe-250℃, nto leyo enciphisa umngcipheko wokususwa kwe-delamination. Iinkqubo ezingenalo i-lead zifuna i-Tg≥150℃.

I-SMT esemgangathweni: 4/4mil (0.1/0.1mm); Iinkqubo ze-HDI zifikelela kwi-2/2mil (0.05/0.05mm) ngokuvezwa okuchanekileyo kunye ne-electroless copper plating.

Landela i-IPC-7351: Ububanzi bephedi ye-QFP +0.1-0.2mm xa kuthelekiswa nobubanzi belead; iiphedi ze-0603 zicebisa i-0.65×0.65mm kwi-0.04-0.06mg ye-solder paste ngephedi nganye.

I-Dominant SAC305 (96.5Sn/3.0Ag/0.5Cu) iyanyibilika kwi-217℃, i-34℃ ingaphezulu kune-Sn-Pb eutectic (183℃), ifuna amaqondo obushushu aphezulu okubuyela umva.

Izinto ze-0402: istencil eyi-0.12mm; i-pitch eyi-0.5mm BGA: istencil eyi-0.1mm ene-85% yokuvula iphedi ukuthintela iibhola ze-solder.

IPC-A-610: I-Solder paste offset ≤25% yobubanzi bephedi; ≤0.1mm ye-0.4mm pitch QFP.

Oomatshini abakumgangatho ophezulu (umz., iFuji NXT) bane-Cpk≥1.33, ukuphindaphindwa kwe-XY ±25μm, ukuchaneka kwe-θ ±0.5°, ezifanelekileyo kwizixhobo ze-0201 kunye ne-0.3mm pitch BGA.

Uxinzelelo lokubekwa kwe-MLCC: 0.3-0.5N (umngcipheko wokuqhekeka xa uxinzelelo luphezulu); ii-QFP leads: 0.8-1.2N kwi-coplanarity.

Lungiselela ukuchaneka kokubekwa (±0.05mm), qinisekisa ivolumu ye-solder paste elinganayo, isantya se-ramp sokuhamba kwakhona ≤3℃/s ukunciphisa i-gradient yobushushu.

Fudumeza (150-180℃): 1-2℃/s irempu; faka amanzi (180-210℃): 60-90s; phinda ujikeleze incochoyi 245-255℃, ≥217℃ kwimizuzwana engama-60-90; pholile 2-4℃/s.

I-nitrogen (O₂＜500ppm) inciphisa i-oxidation kwaye iphucula ukufuma, kodwa yongeza i-15-20% kwiindleko zokucubungula, ezifanelekileyo kwizicelo ezinokuthembeka okuphezulu.

I-IPC-A-610 Udidi 3: Indawo engenanto ≤10% yendawo yebhola yesolder; usetyenziso olubalulekileyo (umz., iimoto) lufuna ≤5%.

Ukutywina ngamaza amabini: Amaza aguquguqukayo antywilisela ubukhulu be-PCB obuyi-1/3-1/2; ukuphakama kwamaza okugudileyo yi-0.5-1mm ngaphantsi komzantsi we-PCB.

Ukugeleza okungacocekanga: umxholo oqinileyo ＜5%; ukugeleza okuqinileyo okuphezulu (＞10%) kuphucula ukufuma kodwa kwandisa umngcipheko wentsalela, nto leyo efuna ukucocwa ngokufanelekileyo.

Kwiqondo lobushushu lembiza yesolder eliyi-245-255℃, isantya yi-1.2-1.8m/min; ii-PCB zekopolo ezijiyileyo zifuna i-1m/min ukuze zigcwaliswe.

Ukutywina okungenalo ilothe: Ubushushu obuphakathi kwe-350-380℃, ixesha lokudibana kwemizuzwana eyi-≤3. Ubushushu obugqithisileyo bubangela ukuphakanyiswa kwephedi okanye ukuxinana kwelothe.

Iinkqubo zokulungelelanisa ezibonakalayo (±25μm ngokuchanekileyo) ezinezixhobo zokubuyisela ibhola ziqinisekisa

Fudumeza i-150-180℃, ubushushu bokuphinda usebenze bube yi-320-350℃, isantya somoya sibe yi-4-6 (20-30L/min) ukuze kuthintelwe ukuguquka kwelothe.

Amanzi: anobuhlobo nokusingqongileyo kodwa afuna ubushushu obuphezulu (60-80℃), umngcipheko wokugqwala; Isinyibilikisi (umz., i-NMP): sisebenza kakuhle kodwa sifuna izixhobo ezikhusela ukuqhuma, imiqathango ye-VOC.

IPC-TM-650: Intsalela ye-Ionic ＜1.5μg/cm² elinganayo neNaCl, ukumelana nokugquma komphezulu ＞10⁹Ω.

I-AOI ekhawulezayo igubungela ≥95% yeziphene ze-0402 zecandelo, ＞98% kwi-QFP bridging/missing leads, kodwa inengxaki ne-BGA internal voids.

I-Micro-focus X-Ray ifikelela kwisisombululo se-5μm, ibona amalungu e-BGA angama-0.3mm pitch kunye nangaphakathi e-PCB angama-20.

I-ICT echanekileyo kakhulu ivula ngaphantsi kwe-0.1Ω, kunye nokumelana nokudibana kwezipikili

IPC-J-STD-033: Izinto ze-MSL level 3 ≤168 iiyure kwi-30℃/60%RH; bhaka kwi-125℃ iiyure ezi-4-8 ukuba zidlulile.

Amalunga angama-0603: amandla amancinci okutsala ≥1.5N; iileya ze-QFP: amandla okucheba ≥5N, ngokwe-IPC-9701 nganye.

IPC-A-600: ≤1.5%; Ii-PCB ezidityaniswe ne-BGA ≤0.7% ukuthintela amalungu omileyo.

Izixhobo zeCMOS zinobuntununtunu be-HBM

Ixabiso lezinto zokwakha liyi-40-50%, ukucubungula (kubandakanya ukuhla kwexabiso) yi-30-40%, uhlolo luyi-10-20%. Ixabiso leyunithi liyi-30-50% ngaphezulu kunemveliso enkulu.