I-Rig Flex

I-PCB egobileyo yibhodi yesekethe edibanisa ii-PCB eziqinileyo neziguquguqukayo ngeenkqubo ezithile, ezibonelela ngozinzo oluxhasayo kunye neempawu ezigobekayo/ezigobekayo.

Iindidi eziqhelekileyo ziquka i-single/double-sided flexible edityaniswe ne-single/double-sided rigid, kunye ne-multi-layer flexible edityaniswe ne-multi-layer rigid.

Ii-PCB eziqinileyo ziqinile kwaye zizinzile, ii-PCB eziguquguqukayo zithambile kwaye ziyagobeka kodwa zinamandla aphantsi. Ii-PCB eziqinileyo neziguquguqukayo zidibanisa izibonelelo zazo ukuhlangabezana neemfuno zoyilo oluntsonkothileyo kunye nokusebenza koomatshini.

Yenziwe ngamaleya aqinileyo (FR-4, njl.njl.), amaleya aguquguqukayo (i-polyimide PI), amaleya ancamathelayo (iglue), kunye nemikhondo yesinyithi.

Cinga ngobunzima beesekethe, iimfuno zesignali, kunye neendleko. Iisekethe ezilula zifuna iileya ezi-2-4; iisekethe ezintsonkothileyo ezinesantya esiphezulu zinokufuna iileya ezi-≥6.

Ziphephe ii-engile ezibukhali; sebenzisa ii-engile ezijikelezileyo/ezingama-45°. Gcina ububanzi bomgca bufana kwaye bubanzi ngokufanelekileyo. Ziphephe ii-vias kwiindawo ezigobileyo (umgama ukusuka kwindawo egobileyo ≥50mil).

Imigca kufuneka itshintshele kakuhle kwaye ngokuthe nkqo kwicala eligobileyo. Iingcingo mazisasazwe ngokulinganayo kwaye zibanzi kakhulu. Uyilo lwe-PTH, i-Coverlay, kunye ne-PP ezingahambiyo azivumelekanga kwindawo yotshintsho.

Sebenzisa isoftware yokulinganisa ukubala iiparameter. Khetha ii-dielectrics ezilahlekelwa kancinci (umz., uthotho lwe-RO4000). Lawula ngokungqongqo ukukrola ukuqinisekisa ukuhambelana kobubanzi bomgca.

Yongeza ii-thermal vias kwiileya eziqinileyo phantsi kwezinto ezinamandla aphezulu. Sebenzisa ii-substrates zesinyithi/izincamathelisi eziqhuba ubushushu. Yenza ukulinganisa ubushushu kwinqanaba loyilo ukuze uphucule iindlela zokusasaza ubushushu.

Uyilo ngokwendawo yokufakela kunye nolwakhiwo loomatshini. Ubungakanani bendawo eguquguqukayo kufuneka buqwalasele ukuguquguquka kokugoba ukuze kuthintelwe ukucinezelwa kakhulu.

Qinisekisa ukuba ii-pads kunye ne-traces zihamba kakuhle; phepha ii-engile zasekunene. Beka iinzwane ze-solder ukuze zibe zii-pads ezizimeleyo ukuze uqinise inkxaso kunye nokuqina kwe-solder.

Imingxunya yezixhobo kwiibhodi ezithambileyo akufuneki yabelwane ngayo. Ukubeka imingxunya kwiindawo eziqinileyo kufuneka kuthathelwe ingqalelo ukucutshungulwa kunye nokuchaneka kokuhlanganiswa.

Yahlulahlula iiplani ngendlela efanelekileyo ukuze unciphise ingxolo. Qhagamshela iiplani ngee-vias/imingxuma eyenziwe ngesinyithi, unike ingqalelo ekuthembekeni kunye nomthamo wokuthwala umbane.

Ziphephe ii-vias kwiindawo ezigobileyo. Yongeza ii-traces zobhedu ezikhuselayo okanye ii-traces ezimile okwe-arc xa indawo ivuma. Yandisa indawo yokugoba kangangoko kunokwenzeka.

Ziphephe ii-traces ezinde ezihambelanayo. Sebenzisa i-differential signaling. Yandisa isithuba phakathi kwe-signal kunye nee-ground layers ukuze unciphise ukudibana.

Beka amanqaku ovavanyo ngokufanelekileyo kwiindawo eziqinileyo ukuze kube lula ukuvavanya imveliso. Iindawo kufuneka zifikeleleke kwaye zingachaphazeli imisebenzi yesekethe.

Ii-coefficients zokwandiswa kobushushu beeleya eziqinileyo neziguquguqukayo kufuneka zihambelane. Umaleko wokuncamathelisa kufuneka ube nokunamathela okuhle kuzo zombini (umz., i-PI kunye ne-FR-4).

Lungisa ucwangciso lokuqokelelana ngokwesiginali (iisignali zesantya esiphezulu kufutshane neengqimba zomhlaba). Linganisa ubukhulu kunye neendleko.

Sebenzisa imiqondiso ecacileyo kunye nombhalo kwimizobo ukuphawula iireyithi zokugoba, imiyalelo, kunye neemfuno zerediyasi.

Beka iimodeli zemveliso, iinombolo zenguqulelo, imihla yokuveliswa, njl.njl., kwiindawo eziqinileyo. Iimpawu zokuzazisa mazicace, zingagugi, kwaye zilandeleke.

Gcina imikhondo imifutshane kwaye ithe tye ngee-vias ezimbalwa. Sebenzisa izakhiwo ze-microstrip/stripline. Khusela ukuthintela imitha kunye nokuphazamiseka.

Uyilo oluhambelana nobuchule benkqubo yabavelisi (ubuncinci bobubanzi/isithuba somgca, ngobukhulu, njl.njl.). Lungiselela ukuhlanganiswa ngokuzenzekelayo/ngesandla.

Qinisekisa ukuba utshintsho luhamba kakuhle ukuze uphephe ukugxila kuxinzelelo. Sebenzisa utshintsho oluncinci kancinci kububanzi bomgca okanye izakhiwo ezikhethekileyo zotshintsho.

Ukugqunywa kobhedu kwiindawo eziqinileyo kunceda ekuchithekeni kobushushu kwaye kunciphisa ukuxinana komhlaba. Kwiindawo eziguquguqukayo, cinga ngokuthembeka kokugoba ukuze ugqunywe kobhedu.

Jikeleza umhlaba uze wongeze iileya zokukhusela. Gcina kude nemithombo yokuphazamiseka (izinto ezinamandla aphezulu, imikhondo yewotshi, njl.njl.).

Uyilo olufanelekileyo ukunciphisa imithombo yemitha. Khusela iisekethe ezisengozini yokuphazamiseka. Lungiselela umhlaba ukuze unciphise ukuxhathisa.

Khetha ii-via (ezingabonakaliyo/ezingcwatywe/ezigqithileyo) njengoko kufuneka. Ii-via ezingabonakaliyo/ezingcwatywe zinciphisa iileya kodwa zibiza kakhulu. Sebenzisa ii-via ngononophelo kwiindawo eziguquguqukayo.

Yenza imingxunya ibe mikhulu kancinci kuneyenzelwe ukuvumela iglu ihambe. Sebenzisa iidayi ezikhethekileyo kwiindawo ezincinci ezixineneyo.

Yandisa ubhedu kwiindawo eziqinileyo (beka iindawo zokuhlala zobhedu oluqinileyo kwiindawo ezilahliweyo). Khetha ubukhulu bezinto ezisetyenzisiweyo ngokufanelekileyo.

Qinisekisa ububanzi bomgca obaneleyo kwimisinga ephezulu. Sebenzisa ifoyile yobhedu eneeleya ezininzi okanye wongeze iintsalela. Cinga ngokusasazwa kobushushu kunye nokwehla kwevolthi.

Cwangcisa ukwenziwa kweephaneli ngokwezixhobo zemveliso kunye neenkqubo. Phucula ukusebenza kakuhle kunye nokusetyenziswa kwezinto; qaphela ubungakanani bemilo kunye nendawo ezibekwe kuyo.

Misela iindawo zovavanyo kunye neendawo zokulungisa. Izixhobo zoyilo ukuze kube lula ukuziqhekeza. Nika imiyalelo yokulungisa eneenkcukacha.

Beka izinto ezingaphakathi kwemingxuma kwiindawo eziqinileyo ukuze kube lula ukuzilungisa. Sabalalisa ngokufanelekileyo izinto ze-SMD kwiindawo eziqinileyo/eziguquguqukayo ukuqinisekisa uqhagamshelo oluthembekileyo.

Beka amanqaku amaninzi aqinileyo kwiindawo eziqinileyo ukuze kubekwe imveliso kunye nokulinganiswa. Iimilo/ubukhulu kufuneka zihlangabezane neemfuno zezixhobo.

Khetha izixhobo ezifanelekileyo kumanqanaba obushushu/omswakama. Qinisa ukuqina kunye nenkxaso kwiindawo zokungcangcazela; phucula uyilo ukuze unciphise iimpembelelo.

Sebenzisa ukwahlukanisa ngokwasemzimbeni (ukutsalwa/ukukhusela) okanye ukwahlukanisa ngombane (ii-opto-couplers/ii-transformers) ukuze wahlukanise imiqondiso ye-analog/yedijithali, njl.njl.

Ncamathisela i-PI/intsimbi/i-FR4 kunye nezinye izinto zokuqinisa ngaphakathi/ngokupheleleyo. Khetha iindlela kunye nobukhulu njengoko kufuneka.

Yenza uyilo lube lula ukuze unciphise iileya kunye nezakhiwo ezintsonkothileyo. Khetha izixhobo/iinkqubo ezingabizi kakhulu. Lungisa ukwenziwa kweephaneli kunye neenkqubo.

Gcina isithuba esaneleyo ukuthintela ukuqhekeka. Sebenzisa izinto zokukhusela/ukubeka iileya ezahlulweyo. I-标识 ekhethekileyo kwaye ukhusele ii-traces ze-high-voltage.

Ukuwelda kufanelekile kwiimeko ezininzi; qinisekisa umgangatho. Ukugoba kwenziwa xa kuqhagamshelwa rhoqo; khetha izihlanganisi kunye neenkqubo ezifanelekileyo.

Inkqubo: Ukwenziwa kwebhodi eqinileyo → ukwenziwa kwebhodi eguquguqukayo → ukubopha okuqinileyo nokuguquguquka → ukucubungula iimilo → unyango lomphezulu → uvavanyo.

Iileya eziqinileyo: FR-4; iileya eziguquguqukayo: i-polyimide (PI).

Lawula ubushushu be-lamination, uxinzelelo, ixesha. Lungisa ulandelelwano ukuze unciphise uxinzelelo. Thintela amaqamza kunye nemibimbi.

Sebenzisa i-ductile copper foil. Lawula iiparameter zokugrumba. Sebenzisa i-grid routing kwiindawo ezigobileyo ukuze usasaze uxinzelelo.

Ukubhola nge-laser + ngokuzalisa/ukufaka i-electroplating. Lawula iiparameter ukuze uphephe ukugquma. Vavanya ngokungqongqo ukuhanjiswa kombane.

Sebenzisa izixhobo zokugaya/zokufaka isitampu ezichanekileyo. Lungisa iindawo eziguquguqukayo ngee-spacers ngexesha lokucubungula. Faka isitampu kwiindawo eziguquguqukayo phambi kwezo ziqinileyo kwi-die stamping.

Igolide yokuntywiliselwa emanzini, iplating yegolide, i-HASL, i-OSP (i-organic solderability preservative), njl.njl., ekhethiweyo njengoko kufuneka.

Lungiselela iiparameter ze-lamination ukuze zibe tyaba. Yandisa ubungakanani bendawo eguquguqukayo kuyilo. Sebenzisa inkxaso efanelekileyo kunye nokulungisa ngexesha lokucubungula.

Lawula ngokungqongqo ukukrola ukuze ububanzi bomgca buhambelane. Khetha izixhobo ze-dielectric ezizinzileyo nezichanekileyo. Jonga kwaye ulungise i-impedance ngexesha langempela ngexesha lokuvelisa.

Lungiselela iinkqubo zokunciphisa amanyathelo. Sebenzisa izixhobo ezizenzekelayo. Hlela imveliso ngokufanelekileyo ukuphucula ukusetyenziswa kwezixhobo.

Yandisa uyilo lwekopolo eseleyo. Lungisa izinga lokufudumeza elingu-≥3.0℃/min. Khetha izinto zeglu ezifanelekileyo zokuzalisa ngokulinganayo.

Khetha iglu enamathelayo kakhulu. Coca iindawo ezinamathelayo. Lawula ubushushu bokudibanisa, uxinzelelo, nexesha.

Lungisa iikona ezine ngentsimbi yokunyibilikisa ngaphambi kokuba uvale ilamination. Lungisa iiparameter zelamination ngokweempawu zelamination. Kuphephe imibimbi kunye namaqamza.

Yenza uvavanyo olungqongqo lombane (i-AOI, uvavanyo lwe-flying probe) ngexesha lokuvelisa. Lawula ngokungqongqo iinkqubo ukuze uphephe iziphene ezilandelelanayo.

Sebenzisa iibhodi zokutsala ukuze udlule kwimigca ethe tye kwaye uthintele ukuxinana. Sebenzisa ukulungiswa okukhethekileyo kunye nenkxaso ngexesha lokucubungula ukuze uzinze.

Sebenzisa iinkqubo zokubeka izinto ngendlela echanekileyo (ileza/iphini). Jonga ngokungqongqo kwaye ulungise ulungelelwaniso ngaphambi kokuba u-lamination.

Sebenzisa i-ductile electrolytic copper foil. Yila i-bending radius ≥10x ubukhulu bebhodi. Indlela ekhethekileyo yokuhambisa ukuze kuphuculwe ukumelana nokudinwa.

Lungiselela uyilo lwe-trace ukuze kube lula ukunyibilikisa. Khetha iinkqubo ezifanelekileyo zokunyibilikisa (ukunyibilikisa kwakhona/ukunyibilikisa ngamaza). Lawula ubushushu kunye nexesha.

Sebenzisa izixhobo zokuprinta isikrini ezichanekileyo kunye neestencil. Coca kwaye ubeke iibhodi phambi kokuprinta, kwaye ulawule ngokungqongqo iiparameter ezifana noxinzelelo lwe-squeegee, isantya, kunye ne-engile.

Khetha ii-inki kunye neenkqubo ezifanelekileyo ukuqinisekisa ukuba oonobumba abacacileyo nabagugileyo bayaguga. Nika ingqalelo kwindawo yokuprinta kunye necala, kwaye ujonge umgangatho ukuze uthintele ukufiphala okanye ukukrazuka.

Misela inkqubo epheleleyo yolawulo lomgangatho. Lawula ngokungqongqo izinto ezikrwada, iinkqubo, kunye neeparameter zezixhobo. Gcina kwaye ulinganise izixhobo rhoqo, kwaye wenze uhlolo lweesampuli.

Hlela kwaye uhlaziye inkunkuma efana nesinyithi neplastiki. Coca inkunkuma yesinyithi kwaye uyisebenzise kwakhona okanye uyitshise inkunkuma yeplastiki ngokusingqongileyo.

Faka umgangatho onganyangekiyo, iibhentshi zokusebenzela, imitya yesandla, njl.njl., kwindawo yokusebenzela. Gxobhoza izixhobo kwaye usebenzise ukupakisha okungalinganiyo ...

Phuhlisa iinkcukacha ezineenkcukacha zenkqubo yokuhlaziya, uqeqeshe abasebenzi bokuhlaziya, sebenzisa izixhobo ezifanelekileyo kunye nezixhobo, kwaye ukhusele iisekethe kunye nezixhobo ezingqongileyo.

Gcina indawo yokusebenzela icocekile kwaye ucoca iintsholongwane rhoqo. Sebenzisa ukupakisha okungenathuli nokufuma kwizinto eziluhlaza kunye neemveliso ezigqityiweyo, kwaye usebenzise iinkqubo zokuvelisa ezicocekileyo.

Sebenzisa iipakethe zokukhusela ezifana neengxowa ezingashukumiyo kunye neephedi zefoam. Lebhelisha iimodeli zemveliso, ubungakanani, imihla yokuveliswa, njl.

Sebenzisa izixhobo ezingashukumiyo nezibukhali. Lungisa nge-vacuum suction okanye ii-clamps ezikhethekileyo. Kuphephe ukutsala okanye ukusonga, kwaye sebenzisa iitreyi ezikhethekileyo ukuphatha.

Uyilo lwesiseko olungenangqiqo, umaleko wokukhusela owonakeleyo, isithuba esinganelanga sokuhambisa umzila, kunye nokungathinteli okungenakuthelekiswa nanto kwemiqondiso yesantya esiphezulu.

Izinto zePolyimide zinokunyamezela amaqondo obushushu aphezulu exesha elifutshane angama-260°C. Kucetyiswa ukuba kulawulwe amaqondo obushushu aphezulu angama-245°C-255°C ngexesha lobushushu obuphezulu eliyi-≤60 imizuzwana.

Lungiselela iiparameter zenkqubo ezifana noxinzelelo lokubeka kunye nee-curves zobushushu. Sebenzisa oomatshini bokukhetha nokubeka kunye neenkqubo zokubeka izinto ezichanekileyo, kwaye uqinise ukuhlolwa kwezinto ezingenayo.

Jonga i-radius ye-fillet zone ye-transition zone (ecetyiswayo ≥0.5mm), kuphephe ukugxila koxinzelelo lwe-assembly, kwaye wongeze ii-reinforcement plates okanye ulungise iinkqubo zokugoba.

Beka phambili izinto ezincinci, ezibhityileyo, nezikwaziyo ukumelana nokugoba (umz., iitships ezijijekileyo, i-0201 kunye neepakeji ezincinci). Ziphephe izinto ezine-过长 okanye iilead ezinzima.

Hlanganisa ukubhola nge-laser kunye noomatshini, sebenzisa imingxunya yokubeka kunye neethagethi ukuze ulungelelanise, kwaye ubeke iliso ngexesha langempela nge-AOI.

Sebenzisa i-X-reyi ukuze ubone iindawo ezingenanto zangaphakathi kunye nokunyibilikisa okubandayo. Yenza uvavanyo lokutsala kunye novavanyo lomjikelo wobushushu ukuze uvavanye ukuthembeka kwendalo.

Ngokwemigangatho ye-IPC, ubukhulu be-substrate buphindwe ka-≥3 (umz., i-substrate ye-PI eyi-0.1mm, ecetyiswayo eyi-≥0.3mm). Jonga kwiiparamitha zomthengisi wezinto.

Jonga ubude bendlela kunye nokuba nengqondo yokujika kwendlela. Qinisekisa ukuhambelana kwe-impedance kunye ne-dielectric constant yezixhobo ze-dielectric.

Khetha iglu ene-viscosity efanelekileyo, lawula ubungakanani besicelo kunye nendawo, kwaye ulungise iiparameters zokuhambisa kunye neendlela ukuze uphephe ukugcwala.

Imibimbi inokubangela ukuguquka kwemikhondo okanye ukwaphuka, nto leyo echaphazela ukusebenza kombane kunye noomatshini. Yitshintshe okanye uyilungise kwaye uyivavanye kwakhona.

Sebenzisa uvavanyo lwe-flying probe, i-ICT, okanye i-FCT. Linganisa ukugoba kwangempela kweendawo eziguquguqukayo kunye nokuthembeka kwesignali yovavanyo, i-voltage/current, njl.njl.

≥10¹⁰Ω kubushushu/kumswakama oqhelekileyo, ≥10⁸Ω emva kweeyure ezili-168 kwi-85℃/85%RH (umgangatho we-IPC-6012).

Faka i-voltage elinganisiweyo izihlandlo ezili-1.5-2 imizuzu eli-1-5 ngaphandle kokuphazamiseka okanye ukutshayelwa (umz., i-75-100V kwi-voltage elinganisiweyo engama-50V).

Yenza imijikelo yobushushu obuphantsi kakhulu (-40℃→igumbi→85℃), gcina ubushushu ngabunye imizuzu engama-30-60, imijikelo engama-≥50, kwaye uhlole ukuba akukho mingxunya okanye ukuqhekeka.

Sebenzisa izixhobo ezikhethekileyo ukuseta i-engile (umz., ±90°) kunye ne-frequency (ii-cycles ezili-10/min), goba ude ungasebenzi, kwaye urekhode ii-cycles (≥100,000 times).

Sebenzisa abavavanyi be-flying probe okanye ii-multimeters ukuze ulungise ingxaki ngenqaku. Dibanisa ne-AOI ukuze ufumane indawo evulekileyo kunye ne-金相切片 ukuze uhlole ngaphakathi ukuba kuyimfuneko.

Kuphephe ukucinezela okanye ukutsala iindawo ezithambileyo. Sebenzisa iiprobe ezithambileyo, qinisekisa ukuba ibhodi iyakwazi ukulinganisa indawo echanekileyo, kwaye uqinisekise ukuba akukho mandla anganyakaziyo.

Phinda udibanise amalungu e-solder abandayo/angenanto usebenzisa i-hot air gun. Sebenzisa i-wick yokunyibilikisa i-soldering kwiisekethe ezimfutshane, kwaye ulawule ubushushu kunye nexesha.

Kwiindawo eziguquguqukayo, sebenzisa i-laser micromachining ukususa iindawo ezonakeleyo kwaye ulungise nge-electroplating ekhethiweyo okanye i-conductive adhesive. Kwiindawo eziqinileyo, sebenzisa iingcingo ze-jumper okanye ufake ezinye izinto endaweni yazo.

Phinda wenze uvavanyo lokumelana nokusebenza kunye nokuthintela ukugquma kunye nokuhlolwa okubonakalayo. Qinisekisa iindawo ezilungisiweyo (faka i-conformal coating, yongeza ii-reinforcement plates) kwaye wenze uvavanyo lokusingqongileyo ukuba kuyimfuneko.

Ukulungiswa kwesakhiwo kubiza kancinci xa kukho umonakalo omncinci; ukuphinda kuvele ngcono xa kukho umonakalo omkhulu okanye onamaleko amaninzi. Iindleko zokulungisa zimalunga ne-30%-70% yeendleko zokuvelisa.

Khusela iindawo ezingalungiswanga ngezinto zokukhusela ubushushu. Sebenzisa izixhobo ezincinci, ezingabukhali ukuze uphephe ukukrwela iindawo ezithambileyo, kwaye ucoce izinto ezingcolisayo eziseleyo.

Inani leeleya, ubungakanani, ubunzima benkqubo (umz., ii-vias ezingaboniyo/ezingcwatywe, ukuthintela okuchanekileyo), ukukhethwa kwezinto, ubungakanani be-odolo. Iinkqubo zibalelwa kwi-30%-50%.

Lungiselela uyilo ukuze unciphise iileya kunye neenkqubo ezikhethekileyo. Khetha izixhobo ezingabizi kakhulu, yonyusa ubungakanani bebhetshi, kwaye uxoxisane ngezicwangciso ezikhethekileyo nabathengisi.

Iintsuku ezili-10-15 zeemveliso eziqhelekileyo, iintsuku ezingama-20-30 zeemveliso ezintsonkothileyo, kunye neentsuku ezi-5-7 zeeodolo ezingxamisekileyo (ezineendleko ezongezelelekileyo).

Ukudibanisa okuxineneyo okuphezulu, uyilo oluncinci nolukhaphukhaphu (umz., i-Anylayer HDI), izixhobo eziguquguqukayo ezine-dielectric constant ephantsi kunye nokuguquguquka okuphezulu, kunye nokudibanisa nokupakisha okuphucukileyo njengeSiP.

Ukuhlangabezana neemfuno zokudluliselwa kwesignali rhoqo kakhulu nangesantya esiphezulu, ukusombulula iingxaki zokuncitshiswa kunye nokuthetha ngokulandelelana, kunye nokuphucula ukumelana nokugoba kunye nokuthembeka kweendawo eziguquguqukayo.

I-AI iphucula uyilo kwaye iqikelela iziphene. Ukufunda komatshini kulungisa iiparameter zenkqubo, kwaye ukuhlolwa okubonakalayo kwe-AI kuphucula ukusebenza kakuhle kokuqaphela iziphene.

Ukuthobela iRoHS, iREACH, njl.njl., imiqathango kwizinto ezinobungozi, ukunciphisa ukukhutshwa kwamanzi amdaka/igesi, kunye nokusetyenziswa kwezinto/iinkqubo ezinobuhlobo nokusingqongileyo.

Ukuthembeka okuphezulu, ukuhambelana kwezinto eziphilayo, isiqinisekiso se-ISO 13485, iimfuno ezingqongqo ze-EMC, kunye nokumelana nokubulala iintsholongwane kubushushu obuphezulu/uxinzelelo.