I-PCB ephindaphindayo ephezulu

Isebenzisa izixhobo ezilahlekelwa kancinci (ezifana neRogers 4350B), ezinokunyamezela ububanzi bomgca ±0.01mm, ukuchaneka kokulawula isithuba somaleko wesignali ±5%, kunye nokuchaneka kokulawula i-impedance ±5Ω.

Izitishi zesiseko ze-5G (24.25-52.6GHz), unxibelelwano lwesathelayithi (ibhendi yeKa 26.5-40GHz), iradar ye-millimeter-wave (77GHz), amaziko edatha akhawulezayo (100Gbps+).

Uvavanyo lobungakanani ngokweeparameters ezifana nokulahleka kokufakwa (

Inxulumene nesakhiwo semolekyuli yezinto ezibonakalayo, ubushushu (i-Df inyuka nge-3%-5% kuyo yonke i-10℃ yokunyuka), kunye nobuninzi (i-Df iyanda ngesikwere sobuninzi).

Rogers 4350B (Dk=3.48, Df=0.0037), Taconic TLY-5 (Dk=2.2, Df=0.0009), Isola 370HR (Dk=3.6, Df=0.004).

Izixhobo zeDk eziphantsi zinciphisa ukulibaziseka kokudluliselwa (umz., izixhobo zeDk=2.2 zinokulibaziseka okukhawulezileyo ngama-25% kune-FR-4), kwaye iDf ephantsi inciphisa ukuncitshiswa kwesignali (ilahleko iphantsi ngama-70% kune-FR-4 xa iDf=0.001).

Ukufunxwa kwamanzi >0.5% kubangela ukuguquguquka kwe-Dk okungaphezulu kwe-5%. Kucetyiswa ukusebenzisa izixhobo ezifunxwa amanzi

Beka phambili izinto ezine-Dk

Ukongeza iiseramikhi ze-aluminium oxide kunokunyusa i-Tg yezinto ukuya kwi-280℃+ kwaye kunciphise i-coefficient of thermal expansion (CTE) ukuya kwi-2-3ppm/℃, nto leyo ephucula uzinzo lobushushu obuphezulu.

Kwiinkqubo zesiqhelo, ububanzi/isithuba somgca ≥50μm; iinkqubo eziphambili zinokufikelela kwi-30μm, zifuna ukuhambelana kolawulo lwe-impedance.

Sebenzisa i-symmetrical stacking, enesithuba esingu-≤0.1mm phakathi kwamandla kunye neengqimba zomhlaba kunye no-≤0.05mm phakathi kweengqimba zesignali kunye neengqimba zesalathiso ukunciphisa ukuphazamiseka kwe-electromagnetic.

Ii-vias eziqhelekileyo zibangela ilahleko ye-3dB kwi-10GHz. Ukusebenzisa i-back-drilling (ukususa ubude obungaphezulu be-stub) kunokunciphisa ilahleko ngaphezulu kwe-60%.

Kuphephe ukujikeleza nge-engile yasekunene (ukukhanya kuya kunyuka nge-15%), beka phambili iikona ezingama-45°; indawo yeluphu yesiginali yokulawula

Sebenzisa ukubhola nge-laser ye-CO₂ (ukuchaneka kwe-aperture ±5μm) ukuze uphephe ukwahlukana nokubhola ngoomatshini, kunye noburhabaxa bodonga lwemingxuma obuyi-Ra≤1.2μm.

Sebenzisa i-electroless copper plating + i-electroplating copper, lawula uburhabaxa be-copper layer Rz≤2μm ukunciphisa ilahleko yomphezulu (ilahleko iyanda nge-10% kuyo yonke i-1μm yokwanda koburhabaxa).

Igolide yokuntywiliselwa kwe-nickel engena-electroless (ENIG) enobukhulu obuyi-1-3μm kunye nokumelana nokuchukumisa

Ubushushu bokugquma kufuneka bulawulwe kwi-Tg+30℃ (umz., ubushushu bokugquma beRogers 4350B 210-230℃), ngoxinzelelo lwe-5-8MPa ukuze kuthintelwe ukuqhekeka.

Sebenzisa i-TDR (i-reflectometer yexesha) ukuze ubone ukuqhubeka kwe-impedance, i-X-ray ukuze ubone ngokuphambuka kwindawo (kuvumelekile ±0.05mm), kunye ne-AOI ukuze ubone ukunyamezelana kobubanzi bomgca.

Sebenzisa izixhobo ze-Df eziphantsi, phucula uburhabaxa befoyile yobhedu (ifoyile yobhedu ye-RTF inokulahleka okuphantsi ngama-30% kunefoyile yobhedu ye-RA), kwaye ufinyeze ubude bomkhondo.

Jonga ukungaqhubeki kwe-impedance (ezifana nee-vias, izihlanganisi), qinisekisa ukuphambuka kwe-impedance

Ubude obugqithisileyo bomkhondo ohambelanayo bubangela i-crosstalk. Ukwandisa isithuba somgca ukuya kumgaqo we-3W (u-W bububanzi bomgca) kunye nokongeza ukuhlukaniswa komhlaba kunokunciphisa i-crosstalk nge-20dB.

Phelisa ngee-resistors ezifanayo (ukuxhathisa = ukuthintelwa komgca wokudlulisela) kwaye usebenzise utshintsho lobubanzi bomgca obuhamba kancinci ukuze unciphise i-coefficient yokubonakalisa engaphantsi kwe-0.1.

Isikhuselo esine-plane epheleleyo yomhlaba (isithuba

Ukuhanjiswa kwe-copper foil (ukuhanjiswa kwe-thermal 398W/mK) kubalelwa kwi-70%, ukuhanjiswa kwe-material yi-20%, kunye ne-convection/radiation yi-10%.

Yandisa ubushushu ngobuninzi (≥200/cm²), sebenzisa ifoyile yobhedu etyebileyo (≥3oz), kwaye udibanise nezinki zobushushu ukunciphisa ukumelana nobushushu nge-40%.

Isiseko se-aluminiyam (170W/mK) > isiseko se-copper (398W/mK) > i-FR-4 eqhelekileyo (0.35W/mK).

Kwi-10℃ nganye enyukayo, i-Dk inyuka nge-0.5%-1%, kwaye i-Df inyuka nge-3%-5%. Ubushushu obucetyiswayo bokusebenza yi-

Ngokusebenzisa ububanzi obuyi-0.3-0.5mm, isithuba esingu-≤1mm ukuqinisekisa iindlela zokuqhuba ubushushu ezisebenzayo kunye nokunciphisa ukumelana nobushushu ngama-30%.

Uvavanyo lwe-S-parameter (S11, S21, njl.njl.), uvavanyo lwe-impedance, uvavanyo lokulahleka kwe-dielectric, uvavanyo lokujikeleza kobushushu (-40℃ ~ 125℃, imijikelo engama-500).

I-S11 (ilahleko yokubuya), i-S21 (ilahleko yokufakwa). Uluhlu lweefrikhwensi zovavanyo lugubungela ibhendi yokusebenza ngokuchanekileyo kwe-±0.5dB.

Yenza uvavanyo lobushushu obumanzi (85℃/85% RH, 1000h) kunye novavanyo lokutshiza ngetyuwa (5% NaCl, 24h) ukuqinisekisa ukumelana nemozulu yezinto.

Ilinganisa imo ye-reflection waveform ngokukhupha isignali yenyathelo ukuze ifumane ukungaqhubeki kwe-impedance, enesisombululo esifikelela kwi-0.1mm.

Sebenzisa amagumbi angenamsindo ukuvavanya ukukhutshwa kwemitha (≤-40dBμV/m@1GHz) kunye novavanyo lokusebenza kakuhle kwe-shield (>60dB).

Sebenzisa i-nitrogen reflow soldering (umxholo we-oxygen

Khetha izihlanganisi ezisebenzisa i-frequency ephezulu ezifana ne-SMA, 2.92mm, 1.85mm, njl., kunye nee-frequency zokusebenza ezigubungela ibhendi efunekayo kunye nokulahleka kokufakwa

Qinisekisa ukuba i-impedance iyahambelana phakathi kwezihlanganisi kunye nee-PCB, kwaye ucoce ii-terminals emva kokunyibilikisa ukuze unciphise ilahleko nge-15%.

Kufuneka uhlangabezane neemfuno zebhendi ye-24-52GHz kwaye usombulule iingxaki zokusasazeka kobushushu (ubuninzi bamandla >10W/cm²) kunye neengxaki zokunciphisa i-aturization.

Phumelela isiqinisekiso se-AEC-Q200, kunye nobushushu bokusebenza obuyi -40℃ ~ 125

I-IPC-4101 (inkcazo yezinto ezisisiseko), i-IPC-6012 (umgangatho wokwamkelwa kwebhodi eqinileyo), i-IEEE 802.3 (umgangatho wesignali yesantya esiphezulu).

Iyahambelana ne-MIL-PRF-55110 (iisekethe ze-microwave), ubushushu bokusebenza -55℃ ~125℃, iphumelele uvavanyo lwetyuwa kunye ne-mold.

Ihlangabezana neemfuno ze-AEC-Q200 (isiqinisekiso secandelo elingasebenziyo) kunye ne-ISO 26262 (ukhuseleko olusebenzayo).

Idibana ne-3GPP TR 38.810 (izixhobo zesikhululo esisezantsi), ilahleko yokufakwa -15dB.

Ilandela i-NASA-STD-8739.3 (izinto ze-elektroniki), iphumelele uvavanyo lobushushu obumanzi lweeyure ezili-1000, utshintsho lwe-Dk

Izixhobo zokulahleka okuphantsi kakhulu (Df

I-CTE yehlisiwe yaya kwi-1ppm/℃, ukuhanjiswa kobushushu kwanda ukuya kwi-100W/mK, ngelixa kugcinwa i-Dk ephantsi (2.8).

Izixhobo eziguquguqukayo zine-Dk ephezulu kancinci (3.0-3.5) kunye ne-Df ephezulu ngama-20%-30%, kodwa zivumela i-3D routing.

Izinto ezilungele indalo (ezifana nefayibha yelinen) ezine-Dk=3.2 kunye ne-Df=0.004, ezifanelekileyo kwii-elektroniki zabathengi.

I-Al₂O₃ ceramic substrate ene-Dk=9.8 kunye ne-thermal conductivity eyi-24W/mK, ifanelekile ekudityanisweni kwezixhobo zamandla.

Umyili we-Altium, uCadence Allegro, i-ANSYS HFSS (ukulinganisa nge-electromagnetic), iKeysight ADS (ukulinganisa ngesekethe).

Yakha imodeli ye-3D, seta iiparameter zezinto kunye neemeko zomda, linganisa iiparameter ze-S kunye nosasazo lwentsimi ngempazamo

Yenza ukulinganisa kwinqanaba lesekethe, ilungisa iinethiwekhi ezihambelanayo, iqikelela ilahleko yokufaka kunye nelahleko yokubuya, kwaye ixhasa uhlalutyo lweeparameter ze-S-port ezininzi.

Impazamo ngaphakathi kwe-±3Ω, ifuna ukulinganiswa ngeeparameter zenkqubo yokwenyani (ezifana noburhabaxa befoyile yobhedu, ubukhulu be-dielectric).

Lungisa ulwakhiwo lwe-trace ngokusekelwe kulwabiwo lwentsimi, phucula ukufanisa i-impedance ngokuskena iiparameter, kwaye uyila ngokuphindaphindiweyo ukunciphisa ilahleko.

Umatshini wokugrumba nge-laser (ukuchaneka ±5μm), i-vacuum laminator, umatshini wokukrola ngokuchanekileyo (ukunyamezelana kobubanzi bomgca ±0.01mm).

Ilaser ye-CO₂ ifanelekile kwiibhodi ezityebileyo (>1mm) ezineembobo ezinkulu (≥0.3mm); Ilaser ye-UV ifanelekile kwiibhodi ezibhityileyo (

Iqondo lokukhupha umoya

I-Etch factor ≥3:1, ukuqinisekisa ubungakanani be-etch esecaleni

Ingabona ububanzi bomgca/ukuphambuka kwesithuba (± 0.005mm), iishothi/iisekethe ezivulekileyo, ubungakanani obuncinci besiphako yi-0.01mm.

Iyahambelana neRoHS 2.0 (ithintela izinto eziyingozi ezi-6 ezifana ne-lead kunye ne-mercury), umxholo we-halogen

Sebenzisa i-solder engenalo ilothe, umxholo wesinyithi esinzima 95%).

Buyisela ubhedu ngokutyumza ngokwasemzimbeni + ukunyibilika kweekhemikhali (izinga lokubuyisela umva > 98%), kwaye uphathe inkunkuma yeresin ngendlela engenabungozi.

Izinto ezisekelwe kwi-polylactic acid ezine-Dk=3.3 kunye ne-Df=0.005, izinga lokubola lingaphezulu kwama-80% kwiintsuku ezili-180 emva kokusetyenziswa.

Iinkqubo zokusingqongileyo zonyusa iindleko nge-10%-15%, kodwa ukuthobela imithetho kuthintela iingozi zesohlwayo.

Ii-algorithms ze-AI ziphucula i-topology ye-routing, zinciphisa ixesha loyilo lwesandla ngama-50% kunye nokulahleka kwesiginali nge-15%.

Ivumela izakhiwo ze-3D ezintsonkothileyo ezinokuchaneka kokulungelelaniswa phakathi kweeleya ±0.05mm, kodwa ukulahleka kwezinto okwangoku kuphezulu (Df=0.01).

Ifuna izixhobo zokulahleka okuphantsi kakhulu (Df

Ifuna izixhobo ezine-Dk

Yamkela iteknoloji yokupakisha ye-2.5D/3D ukuze ifinyeze iindlela zesignali kwaye inciphise ukulahleka kwenkqubo nge-30%.

Ziphephe iindawo ezinobushushu obuphezulu kunye nomswakama ophezulu (ubushushu obungaphantsi kwama-60℃, ukufuma okungaphantsi kwama-60% RH), kwaye ucoce uthuli lomphezulu rhoqo (ukususwa kothuli olusebenzisa i-electrostatic).

Sebenzisa i-back-drilling ukususa okungaphezulu usebenzisa iziqwenga, ubude beziqwenga buyi-≤1/8λ; sebenzisa i-through-hole reflow soldering ukunciphisa amandla e-parasitic.

Beka phambili izinto ezisetyenziswa yiDk ephantsi (

Vavanya ii-S-parameters nge-network analyzer, efuna i-S11 ≤ -15dB kunye ne-characteristic impedance error ±5Ω; sebenzisa i-TDR ukujonga i-reflection coefficient

Ubukhulu beleyile ye-dielectric yi-0.05-0.2mm, uburhabaxa befoyile yobhedu yi-Ra≤0.5μm; iitrakhi zeleleyile ezikufutshane zi-orthogonal, isithuba seleleyile yamandla/yomhlaba

Sebenzisa iithini zokukhusela zesinyithi (ukusebenza kakuhle kokukhusela ≥80dB) ezinobubanzi besithuba

Isithuba somgca ≥3 × ububanzi bomgca, impazamo yobude

I-ENIG ibonelela ngomphezulu ogudileyo kunye nokulahleka okuncinci; ubukhulu obuncinci be-OSP bufanela ukusetyenziswa rhoqo, kuthintela ukulahleka kwemagnethi kwiileya ze-nickel.

Sebenzisa i-HFSS/CST ukuze wenze i-full-wave electromagnetic simulation ukuqinisekisa i-SI/PI; yenza uhlalutyo lwe-S-parameter sweep kuma-≥10 frequency points.

Khetha izinto ezine-CTE ≤15ppm/℃, yonyusa ubushushu ngobuninzi (≥20/cm²), kwaye usebenzise iibhodi ezifakwe isinyithi ezigqunywe ngekopolo.

Sebenzisa izixhobo ze-Df ezisezantsi ezisekelwe kwi-PTFE; phucula ubukhulu beleyara ye-dielectric ukuze ihlangabezane neemeko ze-resonance ze-λ/4 kwaye unciphise ukulahleka kwamandla.

Ukunyamezelana kobubanzi bomgca ±0.02mm kubangela ukungasebenzi kakuhle kwe-impedance 波动 ±3Ω; ukunyamezelana kobukhulu be-dielectric ±0.01mm kubangela ukuphambuka kwe-Dk ±0.1, okufuna ulawulo olungqongqo.

Beka iindibaniselwano ze-MLCC (10nF/100nF/1μF) kwindawo yokungena kwamandla; yahlulahlula umaleko wamandla ngesithuba esingu-≥50mil phakathi kweedomeyini ze-voltage.

Impedance yoqhagamshelwano lwe-Fixture