I-PCB encinci enemingxuma

Ibhodi yesekethe eprintiweyo (i-PCB) eyenziwe kusetyenziswa itekhnoloji yokugrumba nge-laser okanye i-plasma enobubanzi bomngxuma obungaphantsi kwe-0.15mm (ishishini lidla ngokusebenzisa i-0.1mm njengomgangatho), esetyenziselwa ukunxibelelana okuxineneyo.

Ububanzi bomngxuma bungaphantsi nge-50% kunobo be-PCB eziqhelekileyo, ububanzi bomgca/isithuba singafikelela kwi-30μm/30μm, uxinano lweentambo lunyuswa ngama-2-3, kwaye lufanelekile ukuhanjiswa kwesignali okuhamba rhoqo kunye nesantya esiphezulu.

Ngokwenkqubo, zahlulwe zibe zii-vias ezingaboniyo (ukuqhuba icala elinye), ii-vias ezingcwatywe (ukuqhuba kwangaphakathi), kunye nee-vias (ngokusebenzisa ibhodi yonke). Uluhlu oluqhelekileyo lwe-blind via diameter yi-50-100μm.

Isetyenziswa kakhulu kwiimeko zokudibanisa ezinoxinano olukhulu ezifana neefowuni eziphathwayo (ezingaphezu kwama-60%), izitishi zesiseko se-5G, iibhodi zee-server, kunye nokupakisha iitshiphusi ze-AI.

Yavela emva kokuvuthwa kwetekhnoloji yokubhola nge-laser ngeminyaka yoo-1990. Inkqubo yangoku eqhelekileyo inokufikelela kububanzi bemingxuma obuyi-30μm, kwaye irekhodi elincinci lobubanzi bemingxuma yi-15μm.

Ububanzi obuncinci bemingxuma yemveliso yobuninzi bemizi-mveliso bunokufikelela kwi-50μm, kwaye umda webhubhoratri yi-15μm, kodwa iindleko zinyuka ngokukhawuleza ngokuncipha kobubanzi bemingxuma.

Ngokubanzi, umlinganiselo wophawu awudluli kwi-1:1, kwaye iinkqubo ezikhethekileyo zinokufikelela kwi-1:0.8. Umlinganiselo wophawu ophezulu kakhulu unokubangela ukugcwaliswa kakubi kwe-electroplating.

Isithuba esincinci esicetyiswayo yi-≥80μm ukuqinisekisa ukuthembeka komaleko we-copper plating ongena-electroless kunye nokunciphisa umngcipheko wee-short circuits.

Kucetyiswa ukuba kusetyenziswe ukuxubana kweebhodi eziphambili kunye nee-prepregs, kunye nobukhulu be-dielectric obuphakathi kwe-interlayer bulawulwa kwi-50-75μm ukuqinisekisa umgangatho wokudluliselwa kwesignali.

Kuyimfuneko ukunikela ingqalelo kwi-parasite capacitance yomngxuma (ixabiso eliqhelekileyo

Kwi-BGA fan-out, i-blind via design iyathandwa. Iphedi nganye ihambelana ne-1-2 microvias, kwaye ububanzi bomgca we-fan-out bungaphantsi kwe-40μm.

Fumana unxibelelwano olunamanqaku amaninzi phakathi kweenqwelo-moya zamandla/zomhlaba ngee-microvias, ngesithuba esingu-≤5mm, ukuze unciphise ukuthintela phakathi kweenqwelo-moya.

Yongeza uxinano lwee-vias zokusasaza ubushushu (ezicetyiswayo ≥10 vias/cm²), ngobubanzi bomngxuma ≥80μm, ukuphucula ukusebenza kakuhle kokuhambisa ubushushu.

Ukuvulwa kwemaski yesolder kufuneka kube nkulu nge-20-30μm kunobubanzi bomngxuma kwicala ngalinye ukuthintela i-inki yemaski yesolder ukuba ingawuvali umngxuma.

Sebenzisa inkqubo yokwakha ukuze wonyuse inani leeleya zocingo, kwaye usebenzise ii-via ezingabonakaliyo nezingcwatyiweyo endaweni yee-vias ezidlulayo, nto leyo enokunyusa uxinano lwentambo ngaphezulu kwe-30%.

Kubandakanya ukubhola nge-laser (CO₂, i-UV laser), ukugrumba nge-plasma, kunye nokubhola ngoomatshini (kufanele kuphela kwiidayamitha ezinkulu zemingxuma), apho ukubhola nge-laser kubalelwa ngaphezulu kwama-80%.

I-laser ye-CO₂ ifanelekile kwiidayamitha zemingxuma eziyi-0.075-0.15mm ngexabiso eliphantsi; I-laser ye-UV ingacubungula ii-microvias

Isantya sokubhoboza se-CO₂ laser simalunga nemingxuma eyi-5,000-10,000 ngomzuzu, kwaye eso se-UV laser simalunga nemingxuma eyi-2,000-5,000 ngomzuzu.

Ukuchaneka kwendawo yokubhola nge-laser yi-±25μm, okokubhola ngoomatshini yi-±50μm, kwaye i-UV laser inokufikelela kubuchule obuphezulu be-±15μm.

Ukubhola nge-laser encediswa yi-nitrogen kunokulawula ukuphakama kwe-burr ngaphakathi kwe-5μm, okanye kungasetyenziswa ukucocwa kwe-plasma.

Inkqubo yokufakelwa kwe-electroplating enomngxuma odlulayo iyafuneka, apho ubukhulu be-copper plating bulawulwa kwi-25-35μm, kunye nokufana kobukhulu be-copper emngxunyeni ≥85%.

Faka umaleko wobhedu oyi-0.3-0.5μm eludongeni lomngxuma wokukhusela ukuze unike isiseko esiqhubayo. Uxinzelelo lwee-ion ze-palladium kwisisombululo sokusebenza kufuneka lulawulwe kwi-2-5ppm.

Ubushushu be-lamination yi-180-210℃, uxinzelelo luyi-300-500psi, kwaye izinga lokufudumeza liyi-1-2℃/ngomzuzu ukuqinisekisa ukuchacha okufanayo komaleko we-dielectric.

Iqondo le-vacuum kufuneka libe ngaphantsi kwe--95kPa. Lungisa i-prepreg ukuya kwi-B-stage ngaphambi kokuba i-lamination iqale, kwaye izinga le-bubble defect lingancitshiswa libe ngaphantsi kwe-0.5%.

Eziqhelekileyo ziquka igolide yokuntywilisela (ubukhulu obuyi-0.05-0.1μm), i-OSP (ubukhulu befilimu obuyi-0.2-0.5μm), kunye nesilivere yokuntywilisela (0.1-0.3μm). Igolide yokuntywilisela inokuthembeka okuphezulu.

Kuyimfuneko ukulawula i-inki viscosity kwi-80-120Pa・s kwaye usebenzise inkqubo yokuvala i-vacuum ukuthintela intsalela ye-inki kwimingxunya, ngesantya sokuvala imingxuma ≤1%.

Ukusika nge-laser kusetyenziswa xa imfuneko yokuchaneka kwesimo ingaphantsi kwe-0.1mm. Kwiimfuno zesiqhelo, ii-milling cutters zingasetyenziswa, ngesantya sokusika se-20,000-30,000rpm.

Kubandakanya iindonga zemingxuma erhabaxa (uburhabaxa beRa >1.5μm), imingxuma engenanto (umlinganiselo wento engenanto >5%), ukuphambuka kwemingxuma (>±30μm), njl.

Ukucoca ngeplasma kusetyenziswa ukususa iintsalela zokubhola, ukuze umphezulu wodonga lomngxuma ube noburhabaxa obungaphezulu kwe-≤1.0μm.

Isivuno sisonke phantsi kweenkqubo ezivuthiweyo simalunga ne-85-92%. Okukhona ububanzi bomngxuma buncinci, kokukhona isivuno siphantsi. Isivuno se-50μm microvias simalunga ne-80%.

Kubandakanya i-FR-4 (i-dielectric constant 4.2-4.5), iibhodi ezinesantya esiphezulu (ezifana neRogers 4350B, Dr=3.66), i-BT resin, njl.

Iibhodi ezikhawulezayo zine-tangent yokulahleka okuphantsi (Df

Isetyenziselwa ukudibanisa phakathi kweeleya, kunye nomxholo weglu olawulwa kwi-40-50% kunye nokuchaneka kwi-20-30% ukuqinisekisa ukufana kwe-dielectric emva kwe-lamination.

Kwimaleko engaphakathi, kucetyiswa ifoyile yobhedu eyi-18μm okanye eyi-35μm. Kwimaleko engaphandle, i-18μm ingasetyenziselwa ukunciphisa ukulahleka kwesiginali. Iibhodi ze-HDI zihlala zisebenzisa ifoyile yobhedu ebhityileyo kakhulu eyi-9μm.

Kufuneka ihlangabezane nokumelana nobushushu (akukho ukuxobuka kwi-260℃/10s), ukumelana nobushushu (>10^12Ω), kunye nokunamathela (inqanaba lovavanyo olunqamlezileyo 0).

Kucetyiswa ukusebenzisa i-RTF (reverse treatment) copper foil ene-Ra

Khetha izinto ezine-dielectric constant ephantsi (Dk

Kufuneka bathobele umyalelo weRoHS 2.0, nomxholo we-halogen (i-chlorine + i-bromine)

Izinto ezisisiseko ze-FR-4 zinexabiso eliphantsi. Iibhodi ezikhawulezayo zibiza ngokuphindwe kathathu ukuya kahlanu kune-FR-4, kwaye i-BT resin iphakathi.

Izinto ezisisiseko kufuneka zigcinwe ngaphantsi kwama-25℃ kunye nokufuma okungaphantsi kwama-60%. I-prepreg kufuneka iqandiswe kwi--18℃ ixesha elifanelekileyo leenyanga ezi-6-12.

Kubandakanya ukuhlolwa okubonakalayo, ukulinganiswa kobubanzi bomngxuma, uvavanyo lobukhulu bobhedu lomngxuma, uvavanyo lwe-impedance, kunye nohlalutyo lwecandelo elinqamlezileyo.

Sebenzisa isixhobo sokulinganisa umfanekiso esinemilinganiselo emibini (ukuchaneka ±1μm) okanye i-scanning electron microscope (SEM). Ukuhlolwa kwe-optical okuzenzakalelayo (AOI) kungasetyenziselwa ukufumanisa ibhetshi.

Imigangatho ye-IPC ifuna ukuba ubukhulu bobhedu emngxunyeni bube yi-≥20μm, kwaye umlinganiselo wobukhulu bobhedu obuphakathi ukuya kobukhulu bobhedu obuncinci ube yi-≤1.5, ochongiweyo ngendlela ye-metallographic cross-section.

Sebenzisa i-network analyzer enoluhlu lweemvamisa zovavanyo lwe-1-10GHz, kwaye ukuphambuka kwe-impedance kufuneka kulawulwe ngaphakathi kwe-±10%.

Ingayibona ngamehlo umgangatho wodonga lomngxuma, ubukhulu bomaleko wobhedu, kunye nemeko yokubopha phakathi kwamaleko, ngokuchaneka kokusikwa kwe-±5μm.

Kubandakanya uvavanyo loxinzelelo lobushushu (260℃/10 times), uvavanyo lokumelana nombane (500V DC/1 minute), kunye novavanyo lomjikelo wobushushu-ubumanzi (-40℃ ~ 85℃).

Jonga ukuba udonga lomngxuma luyaqhekeka na emva kovavanyo lobushushu (288℃/10 amaxesha), kwaye ubude bomngxuma

Sebenzisa i-SEM ukujonga isakhiwo se-microstructure, i-energy-dispersive spectroscopy (EDS) ukubona ukwakheka kwezinto, kunye ne-X-ray ukubona iziphene zangaphakathi.

Lungiselela inkqubo ye-electroplating ukunciphisa izithuba ezingenanto kwimingxunya, uqinise ukunamathela komaleko wemaski ye-solder, kwaye uphephe ukufuduka kwe-electrochemical okubangelwa ziimeko zokusingqongileyo.

Phantsi kweemeko eziqhelekileyo zokusetyenziswa, ingafikelela kwiminyaka emi-5 ukuya kweli-10, kwaye iindawo ezinzima (ubushushu obuphezulu, ukufuma okuphezulu) ziya kuyifinyeza ibe yiminyaka emi-2 ukuya kwemi-3.

Kubandakanya ukuncamathisela kwe-SMT, ukuwelda kwe-BGA, kunye nokufakwa kwecandelo, kunye nemfuneko yokuchaneka kokuncamathisela kwe-SMT ye-±50μm.

Kuyimfuneko ukulawula uxinzelelo lokuncamathisela kwi-0.5-1.0kg/cm² ukuthintela ukuba izinto zingawi kwii-microvias, kwaye ubushushu obuphezulu be-oven curve ephinda iphume yi-230-245℃.

Kuyimfuneko ukulawula ngokuchanekileyo ukulingana kweebhola ze-solder (

Lungiselela ubukhulu bokuprinta i-solder paste (100-120μm), sebenzisa i-nitrogen-protected reflow soldering, kwaye umxholo we-oxygen yi-

Ubushushu bokulungiswa kwakhona kufuneka bulawulwe ngaphantsi kwama-260℃, kwaye ixesha kufuneka libe ngaphantsi kwemizuzwana engama-90 ukuthintela ukuba umaleko wobhedu eludongeni lomngxuma ungaphuki.

Ifanelekile kwii-microvias ezinobubanzi obuyi-≥0.3mm, ezifuna ukunyibilikiswa kwamaza amabini okanye ukunyibilikiswa kwamaza okukhetha, kunye nokuphakama kwamaza okudibanisa angama-25-35mm.

Nika kuqala i-solder paste engenalo i-lead (i-SnAgCu alloy) eneqondo lokunyibilika le-217℃, i-flux activity level RMA, kunye nokumelana nokugquma kwe-residue >10^10Ω.

Nciphisa umxholo wesinyithi we-solder paste ukuya kwi-90-92%, phucula uyilo lokuvula i-stencil, kwaye izinga lokungasebenzi kakuhle kwe-solder bead lingancitshiswa liye ngaphantsi kwe-0.1%.

Sebenzisa izinto zokucoca ezisebenzisa amanzi kubushushu obuyi-50-60℃ imizuzu emi-3-5 ukuqinisekisa ukuba ubuninzi bee-ion ezisele buyi-

Misela ukuchaneka kokufumanisa kube yi-±25μm kwaye umda wokungafani ube yi-30-50%, onokubona ngaphezulu kwe-95% yeziphene zokuhlanganiswa.

Iindleko zezinto zokwakha zibalelwa kwi-40-50%, iindleko zokucubungula ziyi-30-40%, kwaye iindleko zokuhlola kunye nokupakisha ziyi-10-20%.

Ububanzi bemingxuma, inani leeleya, inkqubo yonyango lomphezulu, uhlobo lwezinto ezisetyenzisiweyo. Ukunciphisa nganye i-10μm kububanzi bemingxuma obuncinci kwandisa iindleko nge-15-20%.

Lungiselela uyilo ukuze unciphise inani leeleya, sebenzisa izixhobo ezisemgangathweni, kwaye wonyuse iibhetshi zemveliso, nto leyo enokunciphisa iindleko nge-10-30%.

Umjikelo wemveliso kwiinkqubo zesiqhelo ziintsuku ezisi-7-10, kwaye ii-odolo ezingxamisekileyo zinokucinezelwa zibe ziintsuku ezi-3-5, kodwa iindleko zinyuka ngama-20-30%.

Yamkela imigca yemveliso ezenzekelayo, ulungise ukuhamba kwenkqubo, kwaye wonyuse izinga lokusetyenziswa kwezixhobo zokubhola nge-laser ukuya ngaphezulu kwe-80%.

Umthamo wenyanga wemveliso womgca omnye wemveliso umalunga ne-5,000-10,000㎡, kuxhomekeke kulwakhiwo lwezixhobo kunye nobunzima benkqubo.

Ixabiso leebhetshi ezincinci (1000㎡), ikakhulu ngenxa yokuseta umatshini kunye nokwabiwa kweendleko ezisisigxina.

Ibalwa ngokupheleleyo ngokommandla (yuan/㎡), inani leeleya, ububanzi bemingxuma, njl. Imali yokucubungula ibhodi eqhelekileyo ye-microvia ye-0.1mm enomgangatho osi-8 imalunga ne-2000-3000 yuan/㎡.

Ngokusebenzisa uyilo lwe-DFM, iimfuno zokunyamezelana eziphumzayo phantsi kwesiseko sokuhlangabezana nokusebenza zinokunciphisa iindleko ngaphezulu kwe-15%.

Utyalo-mali kwizixhobo zomgca wemveliso opheleleyo lumalunga ne-10-20 yezigidi zeeyuan, kubandakanya oomatshini bokugrumba nge-laser, imigca ye-electroplating, ii-laminators, njl.

Ukuphuhlisa ukuya kububanzi obuncinci bemingxuma (iileya ezingama-20), ukulahleka okuphantsi, kunye nokupakishwa okudibeneyo.

Kuyimfuneko ukufikelela kwiidayamitha zemingxuma yokudibanisa ngokuthe nkqo

Isetyenziselwa ukwenza ngcono iiparameter zenkqubo kunye nokuchonga iziphene ngobuchule, nto leyo enokunyusa isivuno nge-5-10% kunye nokusebenza kakuhle kokufumanisa nge-30%.

Ukwenziwa kwelebhu kobubanzi bemingxuma obuyi-10μm kufezekisiwe, kodwa imveliso enkulu ijongene nemingeni yezinto eziphathekayo, izixhobo kunye neendleko.

Fumana unxibelelwano olungenamthungo phakathi kweetships kunye neePCB ngokusebenzisa uqhagamshelo oluxineneyo, mfutshane iindlela zokuhambisa isignali, kwaye uphucule ukusebenza kwenkqubo.

Sebenzisa izixhobo kunye neenkqubo ezinobuhlobo nokusingqongileyo, apho umxholo wesinyithi esinzima ufumaneka emanzini amdaka

Zifuna izixhobo eziphantsi ze-dielectric constant (Dk

Kuyimfuneko ukusombulula iingxaki zokuqhekeka kodonga lwemingxuma kunye nokuxobuka komgangatho wobhedu ngexesha lokugoba, ngerediyasi egobayo ≥3mm.

Ukufezekisa ukubekwa esweni kwenkqubo epheleleyo kunye nemveliso ezenzekelayo ngokusebenzisa iifektri zedijithali, kunye nokusebenza kakuhle kwemveliso kunyuke ngaphezulu kwama-50%.

Ifuna ukulahleka okuphantsi kakhulu kunye nokunxibelelana okuzinzileyo okuphezulu, kunye nobubanzi bemingxuma kunye nobubanzi bomgca obulawulwa kwinqanaba le-submicron ukuqinisekisa ukuhanjiswa kwesignali ye-quantum.

Sebenzisa iibhodi ze-HDI ezingamaleko ezi-6-10 ezinobubanzi obuyi-0.075mm ukuze ufezekise ukuhlanganiswa kweetships, iikhamera, njl.njl., nto leyo ethetha i-30-40% yexabiso lebhodi ye-motherboard yefowuni ephathwayo.

Kufuneka iibhodi ezisebenzisa ilahleko ephantsi (Df

Kufuneka kuhlangatyezwane ngesantya esiphezulu phakathi kweeprosesa ezininzi, kusetyenziswe iteknoloji yokubhola umva ukuze kususwe iziqwenga, kunye nokulibaziseka kokudluliselwa kwesignali

Phumelela isiqinisekiso se-AEC-Q100, umlinganiselo wokumelana nobushushu -40℃ ~ 125℃, kwaye uphumelele uvavanyo lokutshiza ityuwa oluthatha iiyure ezili-1000.