Iindidi zeeModyuli

I-PCB yodongwe

1. Zeziphi izinto eziqhelekileyo zeebhodi eziqinileyo ze-PCB zeseramikhi?

Izinto eziqhelekileyo ziquka i-aluminium oxide (Al₂O₃, ubumsulwa obuyi-60%-96%), i-aluminium nitride (AlN), kunye ne-beryllium oxide (BeO, ethathelwa indawo kancinci kancinci ngenxa yobuthi. I-96% ye-aluminium oxide ibangela ngaphezulu kwe-60% yezicelo.
2. Yintoni i-thermal conductivity yezinto ezahlukeneyo ze-ceramic?

I-Al₂O₃ (96%) imalunga ne-25W/m・K, i-AlN ifikelela kwi-170-230W/m・K, kwaye i-beryllium oxide (BeO) imalunga ne-250W/m・K.
3. Iyintoni i-coefficient yokwandiswa kobushushu kweebhodi eziqinileyo ze-PCB ze-ceramic?

I-aluminium oxide (6-7 ppm/°C), i-aluminium nitride (4.5 ppm/°C), iphantsi kakhulu kune-FR4's 18-22 ppm/°C.
4. Ingakanani i-insulation resistance ye-ceramic substrates?

Kwiqondo lobushushu begumbi, ukumelana nobushushu be-Al₂O₃ substrates yi >10¹⁴Ω, kwaye ukumelana nobushushu be-AlN substrates yi >10¹³Ω.
5. Yintoni i-dielectric constant yeebhodi eziqinileyo ze-ceramic PCB?

I-dielectric constant ye-96% ye-aluminium oxide imalunga ne-9.8 (1MHz), kwaye eye-AlN imalunga ne-8.5 (1MHz).
6. Luluphi uluhlu lokumelana nobushushu bezinto ezisetyenziswa kwi-ceramic?

Ubushushu bokusebenza: -55℃ ~ 300℃, bunokumelana nobushushu obuphezulu obudlula i-800℃ yexesha elifutshane.
7. Ziqine kangakanani izinto zeseramikhi?

Ubunzima beMohs buyi-6-9, i-aluminium oxide (96%) ifikelela kwinqanaba lesi-7, kwaye ubunzima bokucubungula buphezulu.
8. Ingakanani i-density ye-ceramic substrates?

I-Al₂O₃ (96%) imalunga ne-3.85g/cm³, kwaye i-AlN imalunga ne-3.26g/cm³.
9. Kutheni iibhodi ze-PCB eziqinileyo ze-ceramic zifanelekile ukusetyenziswa rhoqo?

Ukulahleka okuphantsi kwe-dielectric (tanδ＜0.002), ukulibaziseka okuncinci kokudluliselwa kwesignali.
10. Zifunxa kangakanani amanzi izinto ezisetyenziswa kwi-ceramic?

Izinga lokufunxwa kwamanzi
11. Ziziphi iinkqubo zokuvelisa iibhodi eziqinileyo ze-PCB zeseramikhi?

Inkqubo yefilimu etyebileyo (ukuprinta kwesikrini), inkqubo yefilimu encinci (ukutshiza/ukufuma), inkqubo yokudubula kunye (HTCC/LTCC), njl.
12. Yintoni umahluko phakathi kweenkqubo ze-HTCC kunye ne-LTCC?

Ubushushu bokunyibilikisa i-HTCC buyi-1500-1600℃, i-LTCC yi-850-900℃; i-LTCC inokudibanisa izinto ezingasebenziyo ngexabiso eliphezulu.
13. Ingakanani i-line width/space encinci ye-ceramic substrates?

Inkqubo yefilimu encinci inokufikelela kububanzi/isithuba somgca se-10μm/10μm, kwaye inkqubo yefilimu etyebileyo imalunga ne-100μm/100μm.
14. Ingakanani ubukhulu bomngxuma wokugrumba obuncinci kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Ububanzi bemingxuma obuncinci bokugrumba nge-laser yi-50μm, kwaye ukugrumba ngoomatshini yi-100μm.
15. Ziziphi iindlela eziqhelekileyo zokwenza isinyithi esingaphezulu kwezinto ze-ceramic zibe yintsimbi?

Ubhedu oludibanisa ngqo (i-DBC), i-active metal brazing (i-AMB), ukuprinta ngefilimu etyebileyo.
16. Luthini uluhlu lobukhulu beleyara yobhedu kwinkqubo ye-DBC?

Ubukhulu obuqhelekileyo beleko yobhedu yi-0.1-0.3mm, ukuya kuthi ga kwi-0.5mm xa ubuninzi buphezulu.
17. Ziziphi iingenelo zenkqubo ye-AMB?

Amandla okubopha >25N/mm, amaxesha omjikelo wobushushu adlula amaxesha ali-1000 (-40℃ ~ 150℃).
18. Ingakanani ixabiso le-Ra yoburhabaxa bomphezulu we-substrates ze-ceramic?

Inkqubo yefilimu encinci Ra
19. Ziziphi iindlela zokusika izinto ze-ceramic?

Ukusikwa nge-laser, ukunqunqa, ukusika ngoomatshini. Ukuchaneka kokusika nge-laser yi-±25μm.
20. Ingakanani imveliso ngokubanzi yeebhodi ze-PCB eziqinileyo ze-ceramic?

Imveliso yenkqubo yefilimu encinci imalunga ne-85%-90%, kwaye inkqubo yefilimu etyebileyo imalunga ne-90%-95%.
21. Yintoni ekufuneka iqatshelwe kuyilo lweebhodi eziqinileyo ze-PCB ezenziwe ngeseramikhi?

Kuphephe uyilo lwe-engile ebukhali, i-fillet radius ≥0.2mm; yongeza imingxunya yokusasaza ubushushu kwiindawo ezinoxinzelelo lobushushu oluqinileyo.
22. I-substrates ze-ceramic zidibene njani neetships?

Ngokusebenzisa i-flip chip bonding, i-wire bonding, i-eutectic welding, njl. I-flip chip bonding inokumelana nobushushu obuphantsi njenge-0.5℃/W.
23. Zeziphi izicelo ezisetyenziswa rhoqo kakhulu ezifanelekileyo kwiibhodi eziqinileyo zePCB zeseramikhi?

Izikhululo zesiseko ze-5G (ukulahleka kwesiginali
24. Yintoni indima yezixhobo zodongwe kwizixhobo zamandla?

Yehlisa ukumelana nobushushu. Ukusebenzisa ii-substrates ze-AlN kwiimodyuli ze-IGBT kunokunciphisa ukumelana nobushushu ukuya kwi-1.5℃/W.
25. Ngaba iibhodi eziqinileyo ze-PCB zeseramikhi zingasetyenziswa kwii-elektroniki zeemoto?

Ingasetyenziswa kwiiyunithi zolawulo lweenjini (ii-ECU), ezinokumelana okugqwesileyo nobushushu obuphezulu kunye nokumelana nokungcangcazela.
26. Yintoni esetyenziswayo kwi-ceramic substrates kwintsimi ye-LED?

Ii-substrates zokusasaza ubushushu ze-LED ezinamandla aphezulu, ezinokumelana nobushushu okuncitshiswayo ukuya ngaphantsi kwe-3℃/W.
27. Ingakanani i-current capacity ephezulu yeebhodi ze-ceramic PCB eziqinileyo?

Kwifoyile yobhedu eyi-1oz phantsi kokunyuka kobushushu obuyi-10℃, ububanzi bomgca we-1mm bunokuthwala malunga ne-2A.
28. Ungayifumana njani uyilo olunezingqimba ezininzi kwi-ceramic substrates?

Ihlanganiswe ngeenkqubo zokudubulana, i-LTCC inokufikelela kwiileya ezingaphezu kwe-100 ubuninzi.
29. Ingakanani amandla e-flexural ebhodi eqinileyo ye-ceramic PCB?

Amandla e-flexural e-Al₂O₃ (96%) >300MPa, kunye nalawo e-AlN >350MPa.
30. Ziziphi iingenelo ze-ceramic substrates kwi-aerospace?

Ukumelana nemisebe (ingamelana nedosi ye-10⁶Gy), ilula (ubuninzi malunga ne-1/3 ye-substrates zesinyithi).
31. Ungaziqhuba njani iimvavanyo zokuthembeka kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Uvavanyo lomjikelo wobushushu (-40℃ ~ 125℃, amaxesha ali-1000), uvavanyo lobushushu obumanzi (85℃/85% RH, 1000h).
32. Iyintoni indlela yokusilela komjikelo wobushushu kwi-substrates zeseramikhi?

Ukuqhekeka komaleko we-Metallization (umjikelo wokusilela kwe-Al₂O₃ DBC substrate uphindaphinda malunga nezihlandlo ezingama-500-800).
33. Iyintoni i-insulation ukumelana ne-voltage yeebhodi ze-PCB eziqinileyo ze-ceramic?

Ubukhulu obuyi-1mm bunokumelana ne-≥5kV, i-voltage yokuqala yokukhupha okuncinci >2kV.
34. Yintoni umgangatho wovavanyo lokunamathela kwi-substrates zeseramikhi?

Uvavanyo lokuxobula iteyiphu (iteyiphu ye-3M 610), akukho kususwa komaleko wesinyithi.
35. Ingakanani ixesha lenkonzo yeebhodi eziqinileyo ze-PCB zeseramikhi?

Phantsi kweemeko zokusebenza eziqhelekileyo, ingafikelela kwiminyaka engaphezu kwe-10, kwaye kwiindawo ezinobushushu obuphezulu kunye nomswakama ophezulu, ifinyezwa ibe yiminyaka emi-5.
36. Ungazibona njani iziphene zangaphakathi ze-ceramic substrates?

Ukufunyanwa kwe-X-ray, i-ultrasound scanning microscope (C-SAM), enesisombululo esifikelela kwi-10μm.
37. Ithini imigangatho yovavanyo lokungcangcazela kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Ukungcangcazela kwe-sinusoidal yi-5-2000Hz, ukukhawulezisa yi-5g, kuhlala iiyure ezi-2 ngaphandle kokuqhekeka.
38. Lingakanani ixesha lokuvavanya ityuwa yokutshiza izinto ezenziwe ngeseramikhi?

Uvavanyo lwe-96h lwe-salt spray (isisombululo se-5% se-NaCl), akukho mhlwa womaleko we-metallization.
39. Ingakanani inqanaba lokukhusela i-ESD yeebhodi eziqinileyo ze-PCB zeseramikhi?

Imodeli yomzimba womntu (HBM) >2kV, imodeli yomatshini (MM) >200V.
40. Zithini iimeko zovavanyo lobushushu kwi-substrates zeseramikhi?

-40℃ ~ 150℃, ixesha lokuguqula
41. Yintoni umahluko wexabiso phakathi kweebhodi eziqinileyo ze-ceramic PCB kunye ne-FR4?

Ixabiso lezinto ezisetyenziswa kwi-ceramic liphindwe kahlanu ukuya kwi-10 kunele-FR4, ikakhulu ngenxa yezixhobo kunye neenkqubo ezintsonkothileyo.
42. Ziziphi iindlela zokunciphisa iindleko zeebhodi eziqinileyo ze-PCB ezenziwe ngeseramikhi?

Ukuveliswa ngobuninzi, ukwenziwa ngcono kwenkqubo (njengokusebenzisa ifilimu etyebileyo endaweni yefilimu ebhityileyo), ukukhetha izixhobo ezingabizi kakhulu (ezifana ne-60% ye-aluminium oxide).
43. Ziziphi iingenelo ze-substrates ze-ceramic xa kuthelekiswa ne-substrates zesinyithi?

Ukusebenza ngcono kobushushu (ii-substrates zesinyithi zifuna iileya zobushushu), kwaye i-coefficient yokwandiswa kobushushu ihambelana ngakumbi neetships.
44. Ingakanani ixabiso loluhlu lwezinto ezahlukeneyo zeseramikhi?

I-aluminium oxide (60%)
45. Zeziphi izinto ezichaphazela ixabiso lebhodi eqinileyo ye-PCB yeseramikhi?

Uhlobo lwezinto, ubunzima benkqubo, inani leeleya, ubungakanani, ubungakanani bolandelelwano.
46. Ngaba ii-substrates ze-ceramic zingadibaniswa nee-PCB eziguquguqukayo?

Ingafezekiswa ngenkqubo eguquguqukayo, kunye nokunyuka kweendleko ze-20%-30%.
47. Ingakanani imilinganiselo yeendleko zeebhodi eziqinileyo ze-PCB zeseramikhi?

Ixabisa malunga ne-15%-20% yeendleko zizonke, kwaye ukuphuculwa kwesivuno kunokuyinciphisa kakhulu.
48. Lithini ixabiso lokunciphisa iindleko xa kuveliswa izinto zodongwe ngobuninzi?

Xa ubungakanani beodolo budlula iziqwenga ezingama-5,000, ixabiso leyunithi liyancipha kakhulu.
49. Ingaba ixabiso le-R&D leebhodi ze-PCB eziqinileyo ze-ceramic liphezulu?

Umjikelo omde wophuhliso (iinyanga ezi-3-6), iindleko eziphezulu zokubumba (malunga ne-50,000-100,000 yuan).
50. Yintoni uthelekiso lweendleko zokusasaza ubushushu phakathi kweziseko zeseramikhi kunye neePCB ezisekwe kwialuminiyam?

Ukusebenza kokusasazwa kobushushu kwe-AlN substrates kuphindwe kathathu kunee-PCB ezisekwe kwi-aluminium, kodwa ixabiso liphezulu ngokuphindwe kane.
51. Ungazifakela njani iibhodi ze-PCB eziqinileyo ze-ceramic?

Ilungiswe ngezikrufu okanye ibotshelelwe ngeglue eqhuba ubushushu (ukumelana nobushushu
52. Zithini iimfuno zobushushu bokunyibilikisa kwi-substrates ze-ceramic?

Ubushushu obuphezulu bokunyibilikisa i-soldering: 240-260℃, ubude
53. Ngaba iibhodi ze-PCB eziqinileyo ze-ceramic zinokulungiswa ngokutsha?

Ingaphinda isetyenziswe, kodwa ubushushu obuphezulu bunokubangela ukuqhekeka kweseramikhi ngesantya sempumelelo esimalunga nama-70%.
54. Ungawucoca njani umphezulu wezinto ezisetyenziswa kwi-ceramic?

Coca nge-IPA (isopropyl alcohol) yokucoca nge-ultrasonic kangangemizuzu engaphantsi kwe-10.
55. Ungawuthintela njani umbane ongashukumiyo kwiibhodi eziqinileyo zePCB zeseramikhi?

Gcina umswakama kwindawo yokusebenza kwi-40%-60% kwaye unxibe iibhanti zesandla ezichasene nokuma.
56. Ungadibanisa njani ii-substrates ze-ceramic kunye nee-heat sinks?

Khetha izinto ezinee-coefficients ezifanayo zokwandisa ubushushu kwaye uzalise izikhewu ngegrisi ye-silicone eqhuba ubushushu.
57. Ngaba iibhodi eziqinileyo ze-PCB zeseramikhi zingangena kwi-wave soldering?

Akukhuthazwa, kuba uxinzelelo lobushushu lunokubangela ukuqhekeka kweseramikhi.
58. Zithini iimfuno ze-torque zokufaka ii-substrates zeseramikhi?

I-Torque yee-screw ze-M3: 0.8-1.2N・m ukuze kuthintelwe ukuxinana koxinzelelo.
59. Ungazihlola njani iibhodi ze-PCB eziqinileyo ze-ceramic emva kokusetyenziswa ixesha elide?

Fumana iindawo ezishushu kakhulu ngemifanekiso yobushushu ye-infrared kwaye ujonge unxibelelwano ngovavanyo lokuxhathisa.
60. Zithini iimeko zokugcina izinto zesamente?

Indawo yokugcina: ukufuma
61. Zithini imigangatho yamazwe ngamazwe yeebhodi eziqinileyo ze-PCB zeseramikhi?

IPC-6012 (Inkcazo yokusebenza yeeBhodi eziprintiweyo eziqinileyo), i-MIL-P-55110 (uMgangatho woMkhosi).
62. Zeziphi iziqinisekiso ezifunekayo kwi-ceramic substrates?

Isatifikethi se-UL (esithintela ilangatye), isatifikethi se-RoHS (esingenazo iziyobisi eziyingozi), i-ISO 9001.
63. Zithini iimfuno ezisemgangathweni zomkhosi kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Hlangana novavanyo lokusingqongileyo lwe-MIL-STD-810G oluneemfuno ezingqongqo zokungcangcazela kunye nokumelana nempembelelo.
64. Zeziphi iziqinisekiso zoshishino lweemoto ezifunekayo kwiziseko zeseramikhi?

Ifuna iziqinisekiso ze-AEC-Q100 (iitships) kunye ne-AEC-Q200 (iinxalenye ezingasebenziyo).
65. Ithini imigangatho yokusingqongileyo yeebhodi eziqinileyo ze-PCB zeseramikhi?

Thobela imithetho ye-EU REACH, ethintela ukusetyenziswa kwezinto ezinobungozi ezifana ne-lead kunye ne-cadmium.
66. Ithini ireyithingi yokuthintela ilangatye yezixhobo zeseramikhi?

Uvavanyo lwe-UL 94 V-0 (akukho kusasazeka kwelangatye), isalathisi seoksijini >30%.
67. Zithini imigangatho yoshishino lwezonyango kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Thobela inkqubo yolawulo lomgangatho wezixhobo zonyango ye-ISO 13485.
68. Zeziphi iziqinisekiso zeenqwelo-moya ezifunekayo kwiziseko zeseramikhi?

Ifuna isiqinisekiso senkqubo yolawulo lomgangatho wenqwelomoya ye-AS9100.
69. Zithini imigangatho ye-EMC yeebhodi eziqinileyo ze-PCB zeseramikhi?

Thobela imigangatho yemitha ye-electromagnetic ye-EN 55032, ukukhutshwa kwe-emissions
70. Ngawaphi amaziko okuqinisekisa ukuthembeka kwezinto zesamente?

Imibutho yesiqinisekiso somntu wesithathu: i-SGS, i-TÜV, i-Intertek.
71. Yintoni omawuyenze ukuba umaleko we-metalization we-ceramic substrates uyawa?

Hlola inkqubo yokubopha (umz., i-DBC copper foil oxidation) uze uphinde uhlaziye umphezulu.
72. Ungazilungisa njani iintanda kwiibhodi eziqinileyo zePCB zeseramikhi?

Zalisa imingxunya emincinci nge-epoxy resin; tshintsha i-substrate xa imingxunya inzima.
73. Ungayisombulula njani i-cold soldering ngexesha lokutywina i-ceramic substrate?

Lungisa iprofayili yobushushu be-soldering kunye nomsebenzi wolawulo lwe-flux (ibanga le-RA).
74. Ungajongana njani nokunciphisa ukuhanjiswa kwesignali enkulu kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Lungiselela iingcingo, sebenzisa izixhobo ezingaguqukiyo ze-dielectric eziphantsi, kwaye wongeze iileya zokumisa umhlaba.
75. Ungasombulula njani ingxaki yokungasasebenzi kakuhle kobushushu kwiziseko zeseramikhi?

Hlola iindlela zokuqhuba ubushushu kwaye uvavanye ukumelana nobushushu (ithagethi
76. Yintoni ebangela ukugoba okugqithisileyo kwiibhodi eziqinileyo zePCB zeseramikhi?

Inkqubo yokusila engalinganiyo okanye ukungoneli kokunciphisa uxinzelelo lobushushu; phucula inkqubo yokuvelisa.
77. Ungawusingatha njani ungcoliseko lomphezulu kwiziseko zeseramikhi?

Coca ngeplasma ukuze ususe iintsalela zezinto eziphilayo.
78. Ungayibona njani ingxaki yokwambathisa izinto kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Uvavanyo lokumelana nobushushu (1000V DC) ukuze kufunyanwe iindawo zokuvuza.
79. Yintoni omawuyenze ukuba umaleko wesinyithi we-ceramic substrates uyabola?

Qinisa izinto zokukhusela (umz., i-nickel-gold plating) kwaye uphephe iigesi ezirhabaxa.
80. Ungawuphucula njani amandla anganeleyo oomatshini kwiibhodi eziqinileyo ze-PCB zeseramikhi?

Yongeza ubukhulu be-substrate (≥0.5mm) kwaye ulungise uyilo lwekona.
81. Zithini iindlela zophuhliso lweebhodi eziqinileyo ze-PCB zeseramikhi?

Ukuncitshiswa (
82. Zeziphi izinto ezintsha zeseramikhi?

I-silicon nitride (Si₃N₄), enomoya ophezulu wokushisa (100W/m・K) kunye namandla.
83. Yintoni enokwenzeka yokudibanisa izinto ezisetyenziswa kwi-ceramic kunye noshicilelo lwe-3D?

Ushicilelo lwe-ceramic 3D lufezekise izakhiwo ezintsonkothileyo zokusasaza ubushushu ngokuchanekileyo kwe-50μm.
84. I-AI iluphucula njani uyilo lweebhodi eziqinileyo ze-PCB zeseramikhi?

Lungiselela ukusasazwa kobushushu ngokusebenzisa ii-algorithms zokulinganisa, unciphise umjikelo woyilo nge-30%.
85. Yintoni enokwenzeka xa kusetyenziswa izinto zesamente kwizithuthi ezintsha zamandla?

Isetyenziswa kwiimodyuli zamandla zeSiC ezinomlinganiselo wokukhula kwemarike ngonyaka ongaphezulu kwama-20%.
86. Ingakanani imfuno yeebhodi eziqinileyo ze-PCB zeseramikhi kwi-intanethi yesathelayithi?

Ukulahleka okuphantsi kwe-dielectric kuhlangabezana neemfuno zonxibelelwano oluqhelekileyo, kwaye kulindeleke ukuba imfuno ikhule ngama-50% ngo-2025.
87. Ziziphi iiteknoloji zokwenza izinto eziluhlaza ze-ceramic substrates?

Iintlama zefilimu engqindilili ezisekelwe emanzini zithatha indawo yezinyibilikisi zendalo ukunciphisa ukukhutshwa kwe-VOC.
88. Ziziphi iingxaki ekudibaniseni izinto zeseramikhi kunye nezinto ze-elektroniki eziguquguqukayo?

Ubunzima ekuhambelaniseni ii-coefficients zokwandiswa kobushushu, nto leyo efuna izinto zomaleko we-buffer.
89. Zithini iinkqubela phambili ekucutshungulweni kwebhodi eziqinileyo zePCB zeseramikhi?

I-lithography ye-EUV ifikelela kwiisekethe zenqanaba le-10nm, okwangoku zikwinqanaba lelebhu.
90. Ingakanani i-application potential ye-ceramic substrates kwi-quantum computing?

Uzinzo oluphezulu kumaqondo obushushu aphantsi lunokubangela ukuba babe ngabathwali bee-quantum chips.
91. Yintoni esetyenziswa kwiibhodi eziqinileyo ze-PCB zeseramikhi kwii-oven ezishushu kakhulu?

Ukumelana nobushushu obuphezulu: 800℃, kufuna izixhobo zesinyithi ezishushu kakhulu (umz., indlela ye-molybdenum-manganese).
92. Zithini iimfuno zokhuseleko zezixhobo zeseramikhi kwizixhobo zaselwandle olunzulu?

Melana noxinzelelo lwe-100MPa kwaye ufumane ukhuseleko lwe-IP68 ngokufaka imbiza.
93. Yintoni ukhuseleko lwemitha kwiibhodi eziqinileyo ze-PCB zeseramikhi kushishino lwenyukliya?

Sebenzisa iiseramikhi ezimelana nemisebe (umz., isilicon carbide) ukukhusela imisebe ye-neutron.
94. Ziziphi izinto ezibalulekileyo zoyilo lwe-ceramic substrates kwizixhobo zamandla ze-microwave?

Lawula uthintelo lweempawu (50Ω) kwaye unciphise ilahleko ye-dielectric (tanδ
95. Yintoni uyilo lokusasaza ubushushu lweebhodi eziqinileyo ze-PCB zeseramikhi kwiLiDAR?

Sebenzisa izakhiwo zokusasaza ubushushu ze-micro-channel ezinobunzima bokufudumeza ubushushu obufikelela kwi-100W/cm².
96. Yintoni ukuhambelana kwezinto zesamente kwizixhobo zonyango?

Kufuneka ukuthambisa umphezulu, okuhambelana novavanyo lwebhayoloji lwe-ISO 10993.
97. Ziziphi iingenelo zokusetyenziswa kweebhodi eziqinileyo ze-ceramic PCB kwii-inverters ze-photovoltaic?

Ukumelana nobushushu obuphezulu kunye nobushushu obuphezulu, okuphucula ukusebenza kakuhle kwenkqubo nge-1%-2%.
98. Ingakanani imfuno yezixhobo zeseramikhi kwiigridi ezikrelekrele?

Ukuhlangabezana neemfuno zokufakelwa kwe-DC (HVDC) ezine-voltage ephezulu, i-voltage iyakwazi ukumelana ne-≥10kV.
99. Yintoni uyilo lwe-seismic lweebhodi eziqinileyo ze-ceramic PCB kwizixhobo ezichanekileyo?

Sebenzisa izibiyeli ezifunxa ukubetheka kwaye uphephe amaza okuvusa angaphandle ngenxa yamaza endalo.
100. Yintoni inkqubo yokudibanisa ii-substrates ze-ceramic kwiisensa ze-IoT?

Hlanganisa neetships zeMEMS ukuze ufezekise uyilo oluncinci kunye nolwe-low-power

I-PCB yodongwe

1. Zeziphi izinto eziqhelekileyo zeebhodi eziqinileyo ze-PCB zeseramikhi?

2. Yintoni i-thermal conductivity yezinto ezahlukeneyo ze-ceramic?

3. Iyintoni i-coefficient yokwandiswa kobushushu kweebhodi eziqinileyo ze-PCB ze-ceramic?

4. Ingakanani i-insulation resistance ye-ceramic substrates?

5. Yintoni i-dielectric constant yeebhodi eziqinileyo ze-ceramic PCB?

6. Luluphi uluhlu lokumelana nobushushu bezinto ezisetyenziswa kwi-ceramic?

7. Ziqine kangakanani izinto zeseramikhi?

8. Ingakanani i-density ye-ceramic substrates?

9. Kutheni iibhodi ze-PCB eziqinileyo ze-ceramic zifanelekile ukusetyenziswa rhoqo?

10. Zifunxa kangakanani amanzi izinto ezisetyenziswa kwi-ceramic?

11. Ziziphi iinkqubo zokuvelisa iibhodi eziqinileyo ze-PCB zeseramikhi?

12. Yintoni umahluko phakathi kweenkqubo ze-HTCC kunye ne-LTCC?

13. Ingakanani i-line width/space encinci ye-ceramic substrates?

14. Ingakanani ubukhulu bomngxuma wokugrumba obuncinci kwiibhodi eziqinileyo ze-PCB zeseramikhi?

15. Ziziphi iindlela eziqhelekileyo zokwenza isinyithi esingaphezulu kwezinto ze-ceramic zibe yintsimbi?

16. Luthini uluhlu lobukhulu beleyara yobhedu kwinkqubo ye-DBC?

17. Ziziphi iingenelo zenkqubo ye-AMB?

18. Ingakanani ixabiso le-Ra yoburhabaxa bomphezulu we-substrates ze-ceramic?

19. Ziziphi iindlela zokusika izinto ze-ceramic?

20. Ingakanani imveliso ngokubanzi yeebhodi ze-PCB eziqinileyo ze-ceramic?

21. Yintoni ekufuneka iqatshelwe kuyilo lweebhodi eziqinileyo ze-PCB ezenziwe ngeseramikhi?

22. I-substrates ze-ceramic zidibene njani neetships?

23. Zeziphi izicelo ezisetyenziswa rhoqo kakhulu ezifanelekileyo kwiibhodi eziqinileyo zePCB zeseramikhi?

24. Yintoni indima yezixhobo zodongwe kwizixhobo zamandla?

25. Ngaba iibhodi eziqinileyo ze-PCB zeseramikhi zingasetyenziswa kwii-elektroniki zeemoto?

26. Yintoni esetyenziswayo kwi-ceramic substrates kwintsimi ye-LED?

27. Ingakanani i-current capacity ephezulu yeebhodi ze-ceramic PCB eziqinileyo?

28. Ungayifumana njani uyilo olunezingqimba ezininzi kwi-ceramic substrates?

29. Ingakanani amandla e-flexural ebhodi eqinileyo ye-ceramic PCB?

30. Ziziphi iingenelo ze-ceramic substrates kwi-aerospace?

31. Ungaziqhuba njani iimvavanyo zokuthembeka kwiibhodi eziqinileyo ze-PCB zeseramikhi?

32. Iyintoni indlela yokusilela komjikelo wobushushu kwi-substrates zeseramikhi?

33. Iyintoni i-insulation ukumelana ne-voltage yeebhodi ze-PCB eziqinileyo ze-ceramic?

34. Yintoni umgangatho wovavanyo lokunamathela kwi-substrates zeseramikhi?

35. Ingakanani ixesha lenkonzo yeebhodi eziqinileyo ze-PCB zeseramikhi?

36. Ungazibona njani iziphene zangaphakathi ze-ceramic substrates?

37. Ithini imigangatho yovavanyo lokungcangcazela kwiibhodi eziqinileyo ze-PCB zeseramikhi?

38. Lingakanani ixesha lokuvavanya ityuwa yokutshiza izinto ezenziwe ngeseramikhi?

39. Ingakanani inqanaba lokukhusela i-ESD yeebhodi eziqinileyo ze-PCB zeseramikhi?

40. Zithini iimeko zovavanyo lobushushu kwi-substrates zeseramikhi?

41. Yintoni umahluko wexabiso phakathi kweebhodi eziqinileyo ze-ceramic PCB kunye ne-FR4?

42. Ziziphi iindlela zokunciphisa iindleko zeebhodi eziqinileyo ze-PCB ezenziwe ngeseramikhi?

43. Ziziphi iingenelo ze-substrates ze-ceramic xa kuthelekiswa ne-substrates zesinyithi?

44. Ingakanani ixabiso loluhlu lwezinto ezahlukeneyo zeseramikhi?

45. Zeziphi izinto ezichaphazela ixabiso lebhodi eqinileyo ye-PCB yeseramikhi?

46. ​​Ngaba ii-substrates ze-ceramic zingadibaniswa nee-PCB eziguquguqukayo?

47. Ingakanani imilinganiselo yeendleko zeebhodi eziqinileyo ze-PCB zeseramikhi?

48. Lithini ixabiso lokunciphisa iindleko xa kuveliswa izinto zodongwe ngobuninzi?

49. Ingaba ixabiso le-R&D leebhodi ze-PCB eziqinileyo ze-ceramic liphezulu?

50. Yintoni uthelekiso lweendleko zokusasaza ubushushu phakathi kweziseko zeseramikhi kunye neePCB ezisekwe kwialuminiyam?

51. Ungazifakela njani iibhodi ze-PCB eziqinileyo ze-ceramic?

52. Zithini iimfuno zobushushu bokunyibilikisa kwi-substrates ze-ceramic?

53. Ngaba iibhodi ze-PCB eziqinileyo ze-ceramic zinokulungiswa ngokutsha?

54. Ungawucoca njani umphezulu wezinto ezisetyenziswa kwi-ceramic?

55. Ungawuthintela njani umbane ongashukumiyo kwiibhodi eziqinileyo zePCB zeseramikhi?

56. Ungadibanisa njani ii-substrates ze-ceramic kunye nee-heat sinks?

57. Ngaba iibhodi eziqinileyo ze-PCB zeseramikhi zingangena kwi-wave soldering?

58. Zithini iimfuno ze-torque zokufaka ii-substrates zeseramikhi?

59. Ungazihlola njani iibhodi ze-PCB eziqinileyo ze-ceramic emva kokusetyenziswa ixesha elide?

60. Zithini iimeko zokugcina izinto zesamente?

61. Zithini imigangatho yamazwe ngamazwe yeebhodi eziqinileyo ze-PCB zeseramikhi?

62. Zeziphi iziqinisekiso ezifunekayo kwi-ceramic substrates?

63. Zithini iimfuno ezisemgangathweni zomkhosi kwiibhodi eziqinileyo ze-PCB zeseramikhi?

64. Zeziphi iziqinisekiso zoshishino lweemoto ezifunekayo kwiziseko zeseramikhi?

65. Ithini imigangatho yokusingqongileyo yeebhodi eziqinileyo ze-PCB zeseramikhi?

66. Ithini ireyithingi yokuthintela ilangatye yezixhobo zeseramikhi?

67. Zithini imigangatho yoshishino lwezonyango kwiibhodi eziqinileyo ze-PCB zeseramikhi?

68. Zeziphi iziqinisekiso zeenqwelo-moya ezifunekayo kwiziseko zeseramikhi?

69. Zithini imigangatho ye-EMC yeebhodi eziqinileyo ze-PCB zeseramikhi?

70. Ngawaphi amaziko okuqinisekisa ukuthembeka kwezinto zesamente?

71. Yintoni omawuyenze ukuba umaleko we-metalization we-ceramic substrates uyawa?

72. Ungazilungisa njani iintanda kwiibhodi eziqinileyo zePCB zeseramikhi?

73. Ungayisombulula njani i-cold soldering ngexesha lokutywina i-ceramic substrate?

74. Ungajongana njani nokunciphisa ukuhanjiswa kwesignali enkulu kwiibhodi eziqinileyo ze-PCB zeseramikhi?

75. Ungasombulula njani ingxaki yokungasasebenzi kakuhle kobushushu kwiziseko zeseramikhi?

76. Yintoni ebangela ukugoba okugqithisileyo kwiibhodi eziqinileyo zePCB zeseramikhi?

77. Ungawusingatha njani ungcoliseko lomphezulu kwiziseko zeseramikhi?

78. Ungayibona njani ingxaki yokwambathisa izinto kwiibhodi eziqinileyo ze-PCB zeseramikhi?

79. Yintoni omawuyenze ukuba umaleko wesinyithi we-ceramic substrates uyabola?

46. Ngaba ii-substrates ze-ceramic zingadibaniswa nee-PCB eziguquguqukayo?