I-PCB elahlekileyo ephantsi

Jonga ngokwe-dielectric constant (Dk) kunye nexabiso le-Df. Izixhobo ezilahlekelwa kancinci zine-Df ephantsi kunye nozinzo oluqinileyo lwe-Dk kwiifrequensi eziphezulu.

Izicelo ziquka unxibelelwano lwe-5G (i-millimeter wave), unxibelelwano lwesathelayithi (i-Ka band), iinkqubo zeradar (ngaphezulu kwe-30GHz), kunye neesekethe zedijithali ezikhawulezayo (28Gbps+).

Ngokwesiqhelo ibiza ngaphezulu ngokuphindwe kabini ukuya kahlanu. Umzekelo, i-FR-4 ixabisa malunga ne-100 CNY/m², ngelixa iRogers RO4350B ixabisa ukusuka kwi-500-800 CNY/m².

Kwi-0.001 nganye yokunciphisa i-Df, ukulahleka kokudluliselwa kwemiqondiso ye-10GHz kuncipha malunga ne-0.5dB/10cm, nto leyo ephucula ukuthembeka kwesignali.

IRogers RO4350B: -40°C~280°C; Isola 370HR: -55°C~280°C.

Ewe, inokufezekisa uyilo oluntsonkothileyo lwesekethe yesantya esiphezulu, kodwa ukuchaneka kokulungelelaniswa phakathi kweeleya kufuneka kulawulwe (≤±50μm).

Khetha ngokusekelwe kwiimfuno ze-impedance eziphawulekayo zemigca yokudlulisela. Umzekelo, imigca ye-microstrip ye-50Ω idla ngokusebenzisa izixhobo ezine-Dk 2.2-3.5.

Ewe, ukufunxwa komswakama kwandisa i-Dk kunye ne-Df. Kucetyiswa ukuba ubhake kwi-125°C kangangeeyure ezi-4 ukuze ususe umswakama ngaphambi kokuba uyisebenzise.

Uninzi luhlangabezana nomgangatho we-UL94 V-0. Ezinye izinto ezisekwe kwi-ceramic zifuna unyango olongezelelweyo ukuze zihlangabezane neemfuno ezithintela ilangatye.

Lawula ngokubala ngokuchanekileyo ububanzi bomgca, ubukhulu be-dielectric, uburhabaxa be-copper foil (Ra≤0.5μm), kunye nokwenza ngcono ngezixhobo zokulinganisa.

Ziphephe ii-traces ze-engile yasekunene (zandisa ukubonakaliswa nge ~10%), lawula inani lee-vias (i-via nganye yazisa ukulahleka kwe ~0.2dB), kwaye ugcine ii-traces zobude obulinganayo (ukuphambuka

Gcina umthetho we-3W wokubeka isithuba phakathi kwemigca (ububanzi bomgca obuphindwe kathathu), sebenzisa ukwahlulwa komhlaba, kwaye unciphise ubude bemikhondo ehambelanayo.

Sebenzisa isakhiwo sokudibanisa esilinganayo esinesithuba sombane nomhlaba esimalunga ne-≤0.1mm ukunciphisa ingxolo yamandla (cinezela i-EMI nge-~20dB).

Ewe, kodwa uburhabaxa bodonga lwemingxunya kufuneka bulawulwe (Ra≤1μm); kungenjalo, kongezwa ilahleko ye-0.3dB nge-intshi nganye yodonga lwemingxunya.

Kubalulekile. Isantya esiphezulu sombane siyandisa ukusetyenziswa kwamandla. Sebenzisa izixhobo ze-dielectric ezine-thermal conductivity ≥1W/mK.

Sebenzisa ii-baluns ze-microstrip kunye neesekethe ezihambelana ne-LC ukugcina ilahleko yokubuyisela ingaphantsi kwe--20dB (ibhendi ye-10GHz).

Ewe. Iipad kufuneka zigqunywe ngegolide eqinileyo (ubude obuyi-≥3μm) ukuthintela i-oxidation ekuchaphazeleni ukusebenza koqhagamshelwano oluqhelekileyo.

Gcina umlinganiselo wobubanzi bomgca ukuya kwisithuba ongu-1:1, i-control impedance kwi-100Ω±5%, kwaye ugcine impazamo yokufana

Sebenzisa iThevenin okanye i-AC termination matching ukugcina i-reflection coefficient ingaphantsi kwe-0.1 (18GHz band).

Ifuna ulawulo olungqongqo lobushushu be-lamination (ukuphambuka ±2°C), ukubhola ngocoselelo oluphezulu (ukunyamezelana kwe-aperture ±25μm), kunye ne-electroplating efanayo.

Ukubhola nge-laser (ubuncinci bomngxuma ongu-0.1mm) okanye ukubhola nge-CNC (ubuncinci bomngxuma ongu-0.2mm), ngokulawula uburhabaxa bodonga lwemingxuma.

Ukulaminatha okungafanelekanga kubangela ukulaminatha kwe-dielectric. Ukulaminatha nge-vacuum ngoxinzelelo olulawulwa kwi-5-8MPa kuyacetyiswa.

Sebenzisa i-RTF copper foil (Ra≤0.3μm), enciphisa ilahleko nge-15%-20% xa kuthelekiswa ne-copper foil eqhelekileyo.

Bhaka kwi-150°C iiyure ezi-2 emva kokugalela i-lamination ukuze ukhulule uxinzelelo, nge-warpage ≤0.7%.

Kwi-frequency ephezulu, i-ENIG okanye isilivere yokuntywiliselwa iyacetyiswa ukuze kuthintelwe i-oxidation ye-OSP kumaqondo obushushu aphezulu, nto leyo enyusa ilahleko.

Inkqubo eqhelekileyo: 4mil/4mil; inkqubo ephucukileyo: 2mil/2mil.

Imaski yesolder Df kufuneka ibe yi-≤0.02. Ubukhulu obugqithisileyo buyandisa ilahleko (0.1dB/10cm kwi-10μm nganye).

Sebenzisa oomatshini bokutyhila i-LDI abachanekileyo kakhulu (ukuchaneka kokulungelelanisa ±25μm) kunye neephini zokubeka izinto ngoomatshini.

Malunga ne-10%-15%, ikakhulu ngenxa yokuqhekeka kwe-dielectric kunye nokungathobeli i-impedance.

Sebenzisa i-vector network analyzer (VNA) enezixhobo zovavanyo lwe-microstrip, egubungela ibhendi yefrikhwensi ekujoliswe kuyo.

Impedance enomphetho omnye ±10%, i-differential impedance ±8%, efuna isampuli kwiindawo ezininzi.

Ngovavanyo lokuqina kwamaxolo, kufuna amandla okubopha phakathi kwefoyile yobhedu kunye nomaleko we-dielectric ≥1.5N/mm.

Sebenzisa i-TDR okanye i-VNA. Vavanya ukulahleka komgca wokudlulisela we-10cm ≤3dB (10GHz).

Yenza uvavanyo lobushushu (260°C, imijikelo eli-10), ungadingi kususwa okanye ukuvula imijikelo.

Ukukhutshwa kwemitha kufuneka kuhambelane ne-EN 55032 Class B, kunye nokusebenza kakuhle kokukhusela ≥40dB (1GHz).

Ngovavanyo lwe-S-parameter, olufuna ukulahleka kokufakwa kwe-single nge-≤0.5dB (15GHz).

Impazamo yovavanyo ≤±0.05, kusetyenziswa izixhobo zovavanyo ezilungisiweyo kunye nezixhobo.

Yenza uvavanyo lokuguga kobushushu obumanzi (85°C/85% RH, iiyure ezili-1000), kunye nokwehla kokusebenza

Uvavanyo lwedayagram yamehlo (ukuphakama kwamehlo ≥80%), uvavanyo lwe-jitter (RJ+DJ ≤5% ye-UI), uvavanyo lwe-crosstalk (i-crosstalk ekufutshane ≤-30dB).

Iimodyuli ze-AAU (iYunithi ye-Active Antenna), i-RF front-end, ezifuna ilahleko ephantsi kwii-millimeter wave bands (24-40GHz).

Ixhasa ii-interfaces zesantya esiphezulu ezifana ne-PCIe 5.0 (32GT/s) kunye ne-DDR5 (6400Mbps), nto leyo enciphisa ukuncitshiswa kwesignali.

Jonga i-Df yezinto ezisetyenzisiweyo, uburhabaxa befoyile yobhedu, ngendlela yoyilo, kunye nobukhulu bemaski yesolder.

Ukuphambuka kobukhulu beDielectric, iimpazamo zokucubungula ububanzi bomgca, kunye noxinzelelo lwe-lamination olungalinganiyo olubangela utshintsho lweDk.

Yongeza ii-thermal vias (ububanzi ≥0.4mm, isithuba ≤1mm) kwaye usebenzise izixhobo ze-thermal gap.

Jonga iiparameter ze-lamination kunye nokufuma kwezinto, kwaye uphephe ukugcina izinto kubushushu obuphezulu.

Sebenzisa iskena seprobe esikufutshane nentsimi ukuze ugxile kwi-power layer coupling, nge-resonance, njl.

Ewe, ifanelekile kwiiradar zamaza ze-ADAS millimeter (77GHz), kodwa kufuneka ihlangabezane nemigangatho yokuthembeka ye-AEC-Q200.

Yongeza ucingo oluphantsi komhlaba (isithuba esingange-≤50mil) uze ugqume imiphetho ngezinto ezifunxa amaza.

Lungiselela uyilo lwemaleko, sebenzisa izinto ezisemgangathweni, kwaye uvelise ngobuninzi (unciphise ixabiso leyunithi nge ~30%).

Cinga ngezinto ze-FR-4 ezikhawulezayo (umz., iMegtron 6, iDf=0.012), ukunciphisa iindleko nge-~40%.

Khetha izinto ezisekelwe kwisantya sokusebenza, umz., izinto ezisebenzisa ilahleko ephakathi ze-2-6GHz.

Ixabiso leyunithi yezinto, ubunzima benkqubo (umz., iibhodi ezinamaleko amaninzi, ii-vias ezingaboniyo/ezingcwatywe), kunye nesantya semveliso.

Sebenzisa uyilo lwephaneli, yenza lula iinkqubo (umz., nciphisa ii-vias ezingaboniyo/ezingcwatywe), kwaye ukhethe ababoneleli bendawo.

Izinto ezithengwa kwamanye amazwe: ~iiveki ezi-4-6; ezinye iindlela zasekhaya: zincitshiswe ukuya kwiiveki ezi-2-3.

Ewe, nciphisa inani leeleya kwaye usebenzise ubungakanani obuqhelekileyo bezinto (umz., 18"×24") ukunciphisa inkunkuma yezinto.

Kubandakanya iindleko zezinto zokwakha, iindleko zokucubungula, kunye neentlawulo zokuphinda usebenze, ezimalunga ne-~15%-20% yeendleko zizonke.

Ixabiso elifanelekileyo kwimveliso yovavanyo oluphantsi, inciphisa utyalo-mali lwezinto ezisisigxina nge-~60%.

Iphezulu, ifuna ukucutshungulwa okukhethekileyo; iindleko zokuphinda kusetyenziswe zifikelela kwi-~10% yeendleko zokuvelisa.

IPC-4101 (iinkcukacha zezinto eziphathekayo), i-IEC 61189 (iindlela zovavanyo), i-RoHS 2.0 (iimfuno zokusingqongileyo).

Ngenisa iisampulu ukuze zivunywe ukuba zingatsha na kwaye zivavanywe ukusebenza kombane; isiqinisekiso sithatha malunga neeveki ezi-4-6.

I-AEC-Q200 (ukuthembeka kwecandelo elingasebenziyo), i-ISO 26262 (ukhuseleko olusebenzayo).

Kufuneka uphumelele isiqinisekiso se-MIL-P-55110 (iinkcukacha zesekethe ye-microwave) kunye novavanyo oluphezulu lwendalo esingqongileyo.

Kufuneka ithobele iRoHS Directive (ethintela izinto ezi-6 eziyingozi ezifana ne-lead kunye ne-mercury) kunye nemigaqo ye-REACH.

Yenza uvavanyo lwe-EMC kunye ne-LVD; isiqinisekiso sithatha iinyanga ezi-2-3.

Thobela i-ISO 13485 (ulawulo lomgangatho wezixhobo zonyango) kunye nesatifikethi se-FDA 510(k).

Imigangatho ye-IPC ihlaziywa rhoqo emva kweminyaka eyi-3-5 ukuze ivumelane netekhnoloji entsha.

Yenza uvavanyo lokuthembeka olufana novavanyo lokutshiza ngetyuwa (iiyure ezingama-96) kunye novavanyo lokungcangcazela (20-2000Hz).

SGS, Intertek, TÜV Rheinland, njl.

Ukuphuhlisa ukuya kwi-Df ephantsi (

Uyilo oluncediswa yi-AI luphucula indlela yokusebenza (luphucula ukusebenza kakuhle nge-40%) kwaye luqikelela imiba yokuthembeka kwesignali.

Izinto ezidityanisiweyo ze-ceramic matrix (Df

Okwangoku inqunyelwe kukuchaneka (ububanzi bomgca ≥ 10 mil), kodwa kulindeleke ukuba ifikelele kwi-prototyping ekhawulezayo kwixesha elizayo

Fumana ukuhlanganiswa okuphezulu ngokufaka iitships kunye nezinto ezingasebenziyo, ukunciphisa ilahleko yokudluliselwa kwesignali.

Zifuna izinto ezilahlekelwa kakhulu (Df

Kufuneka ixhase iibhendi zefrikhwensi zeterahertz (100-300GHz) nge-Df≤0.0015.

Sebenzisa ukugrumba okusekelwe emanzini kunye nokutshiza okungenalo ilothe ukunciphisa ukusetyenziswa kwamandla nge-~25%.

Ukuqonda ukujonga iiparameter zenkqubo ngexesha langempela ngokusebenzisa iinkqubo ze-MES, ukuphucula isivuno nge-15%.

Ukuphonononga ukusetyenziswa kwezinto ezikrelekrele (umz., ii-shape memory alloys) ukulungisa ii-micro-cracks.

Vavanya amandla enkqubo (ubuncinci bobubanzi bomgca, inani leeleya), isiqinisekiso, ixesha lokuhambisa, kunye nenkonzo yasemva kokuthengisa.

uRogers, uIsola, uPanasonic, uTaconic.

Itekhnoloji yeShengyi, Izixhobo Ezintsha zeHuazheng, iJingangguoji, kunye neenzuzo ezicacileyo zokusebenza ngexabiso.

Kubalulekile; kufuneka ibonelele ngokukhetha izinto, isikhokelo senkqubo, kunye neenkonzo zokuhlalutya ukusilela.

Jonga ubungakanani bemveliso (sq.m/ngenyanga) kunye nesantya sokuhanjiswa ngexesha (≥95%).

Imilinganiselo yokusebenza, iikhrayitheriya zokwamkelwa, uxanduva lokwaphulwa komthetho, ubunini bepropathi yengqondo, njl.

Kufuneka ube nesatifikethi se-ISO 9001 kwaye uphonononge idatha ye-SPC (statistical process control).

Cacisa izigaba zokubuyisela/zokutshintsha kwisivumelwano; bange imbuyekezo ukuba izinga lesiphene lidlula i-5%.

Fumana izaphulelo zamaxabiso (~5%-10%), ucwangciso lwezinto ezibalulekileyo, kunye nokwabelana ngobugcisa.

Kufuneka iingxelo zovavanyo lweRoHS kunye nesatifikethi senkqubo yolawulo lokusingqongileyo (ISO 14001).

Sebenzisa ukupakisha okungenazimo, kuphephe ukukhupha/ukuguquka, kwaye ulawule ubushushu kwi-5-35℃.

Indawo eyomileyo (umswakama

Kucetyiswa ukuba kusetyenziswe izinto zokucoca ezisebenzisa amanzi; kuthintelwe izinyibilikisi ezineklorini ukuthintela ukubola kwezinto.

Ukunikezelwa kwiinkampani eziqeqeshiweyo zokusebenzisa izinto ezisetyenzisiweyo ukuze kuthintelwe ungcoliseko lokusingqongileyo.

Kufuneka ubhale uhlobo lwezinto, inombolo yenguqulelo, umhla wokwenziwa, kunye noluhlu lolawulo lwe-impedance.

Ixabisa malunga ne-3%-5% yeendleko zizonke; iimveliso eziphezulu zifuna ukupakishwa kwe-vacuum kunye nee-desiccants.

Ukubonelela ngoqeqesho olukhethekileyo malunga neempawu zezinto eziphathekayo, iinkcukacha zenkqubo, kunye nokusebenza kwezixhobo (ixesha loqeqesho ~ iveki e-1).

Ubunzima obukhulu; ifuna izixhobo ezikhethekileyo (umz., izikhululo zokulungisa i-laser) kwaye inokuba yingozi kumaleko we-dielectric.

Kufuneka igcine iifayile zoyilo, iiparameter zenkqubo, iingxelo zovavanyo, njl.njl., ubuncinane iminyaka emi-5.