I-PCB eqinileyo

Izinto: Iqinile isebenzisa i-fiberglass, iguquguqukayo isebenzisa i-polyimide. Ulwakhiwo: Iqinile ayikwazi ukugoba, iguquguqukayo inokuguqa. Ukusetyenziswa: Iqinile kwiikhonkco ezizinzileyo, iguquguqukayo kwiindawo ezincinci.

Inomaleko omnye, umaleko ophindwe kabini, umaleko omninzi. Umaleko omnye uneesekethe kwicala elinye; umaleko ophindwe kabini kuzo zombini; umaleko omninzi uqhagamshela iileya eziqhubayo ngee-vias (umz., iibhodi zomama).

Iikhompyutha zedesktop, iiTV, ulawulo lwemizi-mveliso, izixhobo ze-elektroniki zeemoto (iikhompyutha ezingaphakathi emotweni), izinto ze-aerospace ezingashukumiyo, njl.

Ixabiso eliphantsi. Ii-PCB eziqinileyo zineenkqubo ezivuthiweyo kunye nezixhobo ezingabizi kakhulu; ii-PCB eziguquguqukayo zibiza kakhulu ngenxa yezixhobo kunye neenkqubo ezintsonkothileyo.

Ii-substrates eziqhelekileyo ze-FR4: -55°C ukuya kwi-125°C zokusetyenziswa kwesiqhelo, i-260°C yexesha elifutshane yokufakelwa i-solder engenalo i-lead. Izixhobo ezikhethekileyo zinokumelana namaqondo obushushu aphezulu.

Ukusuka kwi-cm² ezimbalwa (iibhodi zokulawula ezincinci) ukuya kwi-m² ezininzi (iibhodi ezinkulu zeseva).

Kuxhomekeke kubukhulu, iileya, kunye nezinto ezisetyenziswayo. Iibhodi ze-FR4 ezineeleya ezininzi: ~1-3 kg/m², zinzima kunee-PCB eziguquguqukayo zendawo enye.

Iminyaka eli-10-20 nangaphezulu kwiindawo eziqhelekileyo; ifinyezwe ibe yiminyaka kwiimeko ezinzima (ubushushu obuphezulu/ukufuma).

I-FR4 ine-flexural modulus eyi ~100-200MPa, iphantsi kakhulu kunee-flexible PCBs. Ukwanda kobukhulu kwandisa ukumelana noxinzelelo.

I-FR4 (i-fiberglass epoxy), i-phenolic resin, i-epoxy resin; i-PTFE yezicelo ezikhethekileyo ze-high-frequency.

Ubushushu obuhle bombane, iimpawu zoomatshini, kunye nozinzo olulinganayo. I-CTE: 13-17ppm/℃. Iinkqubo ezingabizi kakhulu nezivuthiweyo.

Ubushushu obuphantsi bokubola (120-150°C), bunokuqhekeka xa kudityaniswa i-solder, iipropati zombane/zoomatshini ezingalunganga, i-CTE ephezulu, kunye nevumba elibi.

Yenza imikhondo eqhubayo yokuhamba komsinga. Ubukhulu obuqhelekileyo: 0.5oz (17μm), 1oz (35μm), 2oz (70μm). Iifoyile ezingqindilili zokusetyenziswa komsinga ophezulu.

Ikhusela ubushushu ukuze ithintele imijikelo emifutshane, ikhusela ubhedu kwi-oxidation kunye nomonakalo obonakalayo, kwaye yahlula iindawo ngombala (umz., oluhlaza, oluhlaza okwesibhakabhaka).

Iprinta oonobumba/iimpawu zokuchonga amacandelo ngexesha lokuvelisa nokulungisa iimpazamo. Umbala oqhelekileyo: omhlophe; kunye nongwevu, obomvu, omnyama, otyheli, njl.

FR4: Ixabiso eliphantsi lokusetyenziswa ngokubanzi. Izixhobo ezisebenzisa i-frequency ephezulu (umz., i-PTFE): Ukulahleka kwesignali okuphantsi kwe-5G. Ii-substrates ze-ceramic: Ukuqhuba okuphezulu kobushushu kwizicelo ezisebenzisa i-high heat.

Cinga ngombane (umthamo ophezulu/umthamo ophezulu), oomatshini (ukungcangcazela), ubushushu, kunye neendleko. Sebenzisa i-FR4 kwii-elektroniki zabathengi, i-PTFE kwii-frequency eziphezulu, kunye neeseramikhi zobushushu obuphezulu.

I-RoHS: Ithintela izinto ezinobungozi (i-lead, i-mercury, njl.njl.). Ayina-halogen: Br/Cl

Izixhobo ze-CTE eziphantsi ziphucula uzinzo olunemilinganiselo. Ukuqhuba okuphezulu kobushushu kuphucula ukusasazwa kobushushu. Ii-insulators ezisebenza kakuhle zinciphisa ukulahleka kwesignali, zivumela ukwenziwa kube lula kwaye kusebenze kakuhle.

Ukunyaniseka kwesignali (ukulinganisa ukungqubana, ukungabonisi mbonakalo/ukuxoxa nge-crosstalk), ukusasazwa kwamandla, ukumisa umhlaba, kunye nomthamo wokuthwala umsinga.

Nciphisa umkhondo wesignali, nciphisa ii-vias. Sebenzisa ii-differential pairs kwisignali zesantya esiphezulu kunye ne-control impedance. Iiplani zamandla/zomhlaba ezine-copper eqinileyo. Iimodyuli zokwahlulahlula ukuze kuthintelwe ukuphazamiseka. Ububanzi bomgca busekelwe kumbane.

Ubungakanani busekelwe kubukhulu/kumbane (iibhodi ezityebileyo zifuna ii-via ezinkulu). Nciphisa ngokubala. Ukubhola umva ukuze ufumane imiqondiso yesantya esiphezulu ukususa iziqwenga.

Ukudibanisa umthombo, umgca wothumelo, kunye nezithintelo zomthwalo ukuze kuncitshiswe ukubonakaliswa. Kufezekiswa ngokulawula ububanzi bomgca, isithuba, ubukhulu be-dielectric, kunye ne-permittivity (umz., ububanzi be-0.33mm kwi-microstrip ye-50Ω kwi-FR4).

Izinto ezahlulahlulayo; gcina iindawo ezibuthathaka kude nemithombo yengxolo. Iiplani zamandla/zomhlaba kwiibhodi ezinamaleko amaninzi ukuze zikhuseleke. Iiplani eziphantsi komhlaba zijikeleze imiqondiso yesantya esiphezulu. Ii-capacitor zokususa i-decoupling; ukuxhasa umhlaba ngendlela efanelekileyo.

Ukwahlulahlula okusebenzayo, ukwahlula izinto ezibuthathaka kubushushu, ukubeka izinto ezisebenza rhoqo kuvala, ukubeka phambili izinto ezinkulu, nokuqinisekisa ukuba kulula ukuzifakela/ukulungisa.

Iiplani zamandla kunye nomhlaba ezikufutshane ukunciphisa i-inductance. I-Voltage ene-via connections. Ubhedu oluqinileyo kwiiplani zamandla; tyeba iindlela zamandla aphezulu.

Ii-vias ezishushu kunye neeplani zobhedu phantsi kwezinto ezishushu. Ii-substrates eziqhuba ubushushu obuphezulu. Uyilo lokuhamba komoya; yongeza izinki zobushushu/iifeni ukuba kuyimfuneko.

Indawo yomngxuma: ±0.1mm. Ii-vias ezifakwe ipleyiti: ±0.076mm. Ii-vias ezingafakwanga ipleyiti: ±0.05mm. Ububanzi bomgca: ±10%-20%.

Umyili we-Altium (ofanelekileyo kwiidizayini ezincinci ukuya kweziphakathi), iCadence Allegro (enee-multilayer ezininzi ezikhawulezayo), iMentor PADS (ilula ukuyisebenzisa kwaye iyasebenza kakuhle).

Ukugrumba iiphaneli → Ukugrumba → Ukufakwa kwekopolo → Ukufota → Ukuplata → Ukukrola → Imaski yesolder → Isikrini sesilika → Ukugqitywa komphezulu → Ukuprofayilisha.

Imiba: Iindonga ezirhabaxa, ii-burrs, ii-drill ezaphukileyo. Izisombululo: Tshintsha ii-drill, yenza ngcono isantya/ukutya, hlola izixhobo.

Indima: Ukuqhuba iindonga zemingxunya ukuze kuqhagamshelwe umaleko. Ulawulo: Ukwakheka kwesisombululo, ubushushu (25-35°C), i-pH (11-12), ukucoceka kwangaphambi konyango.

I-Photolithography: Ukuchaneka okuphezulu kwe-HDI, iindleko eziphezulu kunye nobunzima. Ukuprinta kwesikrini: Ixabiso eliphantsi/izixhobo ezilula, ukuchaneka okuphantsi.

Ulawulo ngokusebenzisa uxinano lwangoku, ixesha lokufaka ipleyiti, kunye noxinzelelo lwesisombululo. Umzekelo, i-1oz (35μm) ifuna imizuzu engama-20-30 kwi-2-3A/dm².

Lawula uxinzelelo oluvela emthunzini, ubushushu, ixesha, kunye noxinzelelo lokutshiza, kwaye ugcine izixhobo rhoqo. Uxinzelelo oluphezulu lunokubangela ukugrumba okugqithisileyo, ngelixa uxinzelelo oluphantsi lukhokelela ekugrumbeni okungaphelelanga. Gcina ubushushu bukwi-45-55℃, misela ixesha ngokusekelwe kubukhulu bebhodi, njl.njl., kwaye uqinisekise uxinzelelo olufanayo ukuze ufikelele ngokupheleleyo.

Gquma isekethe ngokulinganayo ngaphandle kokulahlekelwa yiprinta, imingxunya yepinki, okanye amaqamza. Ubukhulu beoyile kumphezulu wobhedu: 10-18μm, nge: 5-8μm. Umgama ofanelekileyo ukusuka kwimiphetho yesekethe ukuthintela ukugquma okugqithisileyo kwephedi okanye iingozi zesekethe emfutshane.

Iimpawu mazicace, ziphelele, zibe nombala ohlukileyo, zibekwe ngokuchanekileyo ngaphandle kokuvala iindawo ezibalulekileyo, kwaye zinamathele ngokuqinileyo (khetha ii-inki ezifanelekileyo kunye neenkqubo zokucola).

I-HASL: Ixabiso eliphantsi, ukutyibilika kakuhle, ukutyibilika okulinganiselweyo. I-ENIG: Ithambile, ukutyibilika kakuhle kunye nokumelana nokugqwala, ixabiso eliphezulu. I-tin yokuntywilisela: Ukutyibilika kakuhle, umphezulu ogudileyo, ixesha elide eshelufini. I-OSP: Ixabiso eliphantsi, inkqubo elula, ukugcinwa okufutshane kokutyibilika.

Ukusika ngoomatshini (ukuchaneka okuphezulu, okufanelekileyo kwiisayizi ezinkulu ezinzima). Ukubhoboza (ukusebenza kakuhle okuphezulu, okufanelekileyo kwimveliso eqhelekileyo yobuninzi). Ukusika nge-laser (ukuchaneka okuphezulu kakhulu, ixabiso eliphezulu, okufanelekileyo kwiibhetshi ezincinci ezincinci). Khetha ngokusekelwe kwimilo, ukuchaneka, ubungakanani bebhetshi, kunye nexabiso.

Hlola ubungakanani/ubungqingqwa emva kokusika. Jonga indawo yomngxuma, ubungakanani, kunye nodonga emva kokubhoboza. Vavanya ubukhulu/ukufana kobhedu emva kokuplata. Hlola ukuthembeka kwesekethe emva kokukrola. Jonga umgangatho wokuprinta wemaski/oonobumba besolder. Vavanya ubukhulu/ukuncamathelisa kwengubo emva kokugqiba umphezulu. Hlola imo/imiphetho emva kokubumba.

Sebenzisa izixhobo zokuvavanya ii-flying probe okanye izixhobo ze-ICT. I-Flying probe ifanele iibhetshi/iintlobo ezincinci, ukubona ii-open/shorts, njl. I-ICT yenzelwe ukuvelisa ngobuninzi, ivavanya ngokupheleleyo ukusebenza kombane ngezinto ezikhethekileyo.

Fumana ngokusebenzisa uqhagamshelo, imingxuma, ukuthembeka kobhedu kwiibhodi ezineengqimba ezininzi. Jonga amalungu e-BGA solder kunye neziphene zangaphakathi (izinto zangaphandle, ukwahlulahlula) ngaphandle kokonakalisa.

Qokelela imifanekiso ngeekhamera ze-optical uze uthelekise nemigangatho ukuze ufumane iziphene ezifana nezinto ezingekhoyo, ukungalungelelani kakuhle, iishothi. Zisetyenziswa ekuhlolweni kwexesha langempela emva kokuprinta, ukubeka, ukunyibilikisa i-solder ukuphucula ukusebenza kakuhle kunye nomgangatho.

Uvavanyo lokugoba (jonga iintanda kwii-engile/imijikelo ethile). Uvavanyo lokuwisa (linganisa impembelelo). Uvavanyo lokungcangcazela (linganisa ukungcangcazela ukujonga ukutywina kunye nolwakhiwo).

Ngokwe-IPC-4552, i-ENIG ifanele ukuthembeka okuphezulu/okuphezulu (Ni: 3-5μm, Au: 0.05-0.1μm). I-OSP ixabisa kancinci (ubukhulu befilimu: 0.2-0.5μm, ifanelekile ukugcina ixesha elifutshane). I-HASL ivuthiwe (ubukhulu be-Sn >2.5μm, ukuthamba okungalunganga).

Lungisa uxinaniso lwesisombululo (i-asidi echant: CuCl₂ 180-220g/L, HCl 1.0-1.5mol/L), ubushushu bube yi-50-55℃. Ukuba i-under-etching igqithisile, yehlisa isantya kwaye wonyuse uxinzelelo lwe-spray luye kwi-2-3bar.

Ngokwe-IPC-6012, iibhodi ezibanzi ezinee-multilayer ≤75μm, iibhodi ze-HDI ≤50μm. Ukuchaneka kokubeka indawo yokubhola nge-laser ±25μm, kulawulwa ngoomatshini bokutyhila obuchanekileyo.

Izinto ze-FR-4: ubude obude obuyi-≥345MPa, obunqamlezileyo obuyi-≥276MPa (ASTM D790). Ubukhulu obuyi-1.6mm obuyi-≥300MPa.

Ukwahlulahlula iMetallographic (IPC-TM-650, ukugqobhoza umngxuma ≥20μm, ukungaboni/ukungcwatywa ≥18μm). Uvavanyo lwe-XRF olungatshabalalisiyo (ukuchaneka ±0.5μm).

Ubushushu: 90-130℃ (60-120s). Indawo yokunyibilikisa: 240-260℃ (ukudibana nemizuzwana emi-2-4). Izinga lokuphola: 3-6℃/s (J-STD-003).

Eqhelekileyo: 15-30μm (IPC-6012), iindawo ezixineneyo ≥20μm. Ukuprinta kwesikrini: 20-25μm, ukukhanya okukhanyayo: 15-20μm.

Eqhelekileyo: 6/6mil (0.1524mm). I-LDI + ukukrola iikhemikhali: 3/3mil (0.0762mm). Iibhodi ze-HDI: 1/1mil (0.0254mm).

Ukuze ufumane i-conductivity, khetha i-resin plugging (ubunzulu ≥80% ngobunzulu, impazamo yokuba tyaba ≤10μm). Ukuze ufumane i-insulation kuphela, khetha i-coverage (ububanzi be-coverage ≥0.1mm).

Ngokwe-IPC-J-STD-033, bhaka kwi-125℃ kangangeeyure ezi-4-8 (≤1.6mm: 4h, ＞1.6mm: 8h) ukunciphisa umswakama ongaphantsi kwe-0.1%.

Uburhabaxa obuphezulu buphucula isiphumo solusu kunye nokulahleka kwesignali. I-RTF foil Ra10GHz). I-VLP foil Ra

Ukuxubha ngomatshini wokususa iimbumbulu (uxinzelelo 0.3-0.5MPa, isantya 2-3m/min). Ukuxubha ngekhemikhali (i-sodium persulfate 100-150g/L, 40-50℃, 1-2min).

Jikelele: enesiphelo esinye ±10%, umahluko ±8%. Isantya esiphezulu (>1Gbps): enesiphelo esinye ±5%, umahluko ±3%, ilungiswe ngobubanzi bomgca, ubukhulu be-dielectric, ubukhulu bekopolo.

Ngokwe-UL 796, izinto ze-FR-4 ≥1400V/mm kwi-25℃/50% RH. Umgama we-creepage 1mm uhambelana ne-100-200V.

Ububanzi/isithuba esincinci somgca, umlinganiselo wobubanzi bomngxuma/wephedi (ipadi ≥umngxuma +0.4mm xa umngxuma ≥0.3mm), umlinganiselo wendawo yobhedu (30%-70%), umlinganiselo womngxuma (≤8:1), ububanzi bebhulorho yemaski yesolder (≥0.1mm).

Izizathu: Ukungalingani kwe-CTE, ubukhulu obungalinganiyo, ijika lobushushu elingafanelekanga. Izisombululo: Khetha izixhobo ze-CTE ≤15ppm/℃, lawula ukunyamezela ubukhulu ±0.05mm, phucula izinga lokufudumeza ≤3℃/s.

Ngokwe-IPC-TM-650 nganye, ≥10¹⁰Ω emva kweeyure ezili-168 kwi-85℃/85% RH, ≥10¹²Ω kwizicelo eziphezulu, ezifuna ulawulo lokucoceka komphezulu.

Ii-vias ezingaboniyo: Ukubhola nge-laser/mechanical + i-plating, ubunzulu obuyi-≤0.5mm, bokudibanisa umphezulu. Ii-vias ezingcwatyiweyo: Ukubhola nge-mechanical + i-lamination, efuna ukulungelelaniswa, kwemiqondiso yangaphakathi yokunciphisa iiparameter ze-parasitic.

I-Flying probe: Ububanzi >98%, bufanelekile kwiibhetshi ezincinci/ubuninzi obuphezulu, bucotha (3-5s/point). Ibhedi yeenzipho: Iyakhawuleza (

Ukonyuka ngakunye kwe-1oz (35μm) kunyusa ukuhanjiswa kobushushu nge-38%. I-foil ye-3oz kwizicelo zamandla aphezulu inciphisa ukunyuka kobushushu nge-15%-20% ngee-thermal vias.

Eqhelekileyo: 0.1mm. Iibhodi ezinoxinano oluphezulu ezine-LDI: 0.075mm, ezithintela ukutywinwa kwebhuloho.

I-solder engalinganiyo kwiiphedi, ayanelanga ngokufaka i-solder, umphezulu ongalinganiyo.