| Barang | PCB kaku (HDI) | PCB fléksibel | PCB Kaku-Fleksibel |
| Lapisan Maks. | 2-68L | 12L | 68L |
| Lapisan Jero Min Trace/Spasi | 1.4/1.4mil | 2/2 juta | 2/2 juta |
| Lacak/Spasi Min Lapisan Luar | 1.4/1.4mil | 3/3 juta | 3/3 juta |
| Lapisan Jero Maks Tambaga | 6oz | 2oz | 6oz |
| Lapisan Luar Maks Tambaga | 6oz | 3oz | 6oz |
| Pangeboran Mékanis Min | 0.15mm/6mil | 0,15mm | 0,15mm |
| Pangeboran Laser Min | 0,05mm/3mil | 0,05mm | 0,05mm |
| Rasio Aspék Maks (Pangeboran Mékanis) | 20:1 | / | 20:1 |
| Rasio Aspek Maks (Pangeboran Laser) | 1:1 | 1:1 | 1:1 |
| Panyelarasan Antarlapis | +/-0.254mm (1 mil) | ±0.05mm | ±0.05mm |
| Toleransi PTH | ±0.075mm | ±0.075mm | ±0.075mm |
| Toleransi NPTH | ±0.05mm | ±0.05mm | ±0.05mm |
| Toleransi Countersink | +0.15mm | ±0.15mm | ±0.15mm |
| Kandel Papan | 0,20-12mm | 0.1-0.5mm | 0.4-3mm |
| Toleransi Kandel Papan ( |
±0.1mm | ±0.05mm | ±0.1mm |
| Toleransi Kandel Papan (≥1.Omm) | ±8% | / | ±10% |
| Ukuran Papan Minimal | 10*10mm | 5*5mm | 10*10mm |
| Ukuran Papan Maks. | 1200mm * 750mm | 500*1200mm | 500*500mm |
| Pangaturan Garis Besar | +/-0.075mm (3 mil) | ±0.05mm | ±0.1mm |
| BGA kuring | 0.125mm (5 mil) | 7 juta | 7 juta |
| SMT kuring | 0.177*0.254mm (7*10mil) | 7*10 juta | 7*10 juta |
| Jarak Minimal Masker Solder | 1.5 juta | 2 juta | 1.5 juta |
| Bendungan Topéng Solder Kuring | 3 juta | 3 juta | 3 juta |
| Legenda | Bodas, Hideung, Beureum, Konéng | Bodas, Hideung, Beureum, Konéng | Bodas, Hideung, Beureum, Konéng |
| Lebar/Jangkungna Legenda Min | 4/23 juta | 4/23 juta | 4/23 juta |
| Radius Lentur Min (Papan Tunggal) | / | 3-6 x Kandel Papan | 3-7 x Kandel Papan Fleksibel |
| Radius Lentur Min (Papan Sisi Ganda) | / | 6-10 x Kandel Papan | 6-11 x Kandel Papan Fleksibel |
| Radius Lentur Min (Papan Multilayer) | / | 10-15 x Kandel Papan | 10-16 x Kandel Papan Fleksibel |
| Radius Lentur Min (Lentur Dinamis) | / | 20-40 x Kandel Papan | 20-40 × Kandel Papan |
| Lebar Fillet Galur | / | 1.5+0.5mm | 1.5+0.5mm |
| Busur & Putar | 0.005 | / | 0.0005 |
| Toleransi Impedansi | Tungtung Tunggal: ±5Ω(≤50Ω)，±7%(>50Ω) | Tungtung Tunggal: ±5Ω(≤50Ω),±10%(>50Ω) | Tungtung Tunggal: ±5Ω(≤50Ω), ±10%(>50Ω) |
| Toleransi Impedansi | Diferensial: ±5Ω(≤50Ω)，±7%(>50Ω) | Diferensial: ±5Ω(≤50Ω),±10%(>50Ω) | Diferensial: ±5Ω(≤50Ω), ±10%(>50Ω) |
| Topéng Solder | Héjo, Hideung, Biru, Beureum, Héjo Matt, Konéng, Bodas, Wungu | Topéng Solder Héjo/PI Hideung/PI Konéng | Héjo, Hideung, Biru, Beureum, Héjo Matt |
| Beungeut Rengse | Palapis emas éléktronik, ENIG, Palapis emas teuas, Ramo Emas, Pérak Immersion, Timah Immersion, HASL LF, OSP, ENEPIG, Palapis emas lemes | Palapis emas éléktronik, ENIG, Palapis emas teuas, Ramo Emas, Pérak Immersion, Timah Immersion, OSP, ENEPIG, Palapis emas lemes | Palapis emas éléktronik, ENIG, Palapis emas teuas, Ramo Emas, Pérak Immersion, Timah Immersio, HASL LF, OSP, ENEPIG, Palapis emas lemes |
| Prosés Husus | Dikubur/buta via, alur léngkah, ukuranana ageung, résistansi/kapasitas dikubur, tekanan campuran, RF, ramo emas, struktur N+N, tambaga kandel, pangeboran tukang, HDI (5+2N+5) | ramo emas, laminasi, perekat konduktif, pilem pelindung, kubah logam | Dikubur/buta via, alur léngkah, ukuranana ageung, résistansi/kapasitas dikubur, tekanan campuran, RF, ramo emas, struktur N+N, tambaga kandel, pangeboran tukang |
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