| Atik | PCB rijid (HDI) | PCB fleksib | Rijid-Flex PCB |
| Kouch Max | 2-68L | 8L | 68L |
| Kouch Entèn Min Tras / Espas | 1.4/1.4mil | 2/2mil | 2/2mil |
| Deyò Kouch Min Tras/Espas | 1.4/1.4mil | 3/3 mil | 3/3 mil |
| Kouch Entèn Max Copper | 6oz | 2oz | 6oz |
| Deyò Kouch Max Copper | 6oz | 3oz | 6oz |
| Min Forage Mekanik | 0.15mm/6mil | 0.15mm | 0.15mm |
| Min Lazè Forage | 0.05mm/3mil | 0.05mm | 0.05mm |
| Max rapò aspè (forage mekanik) | 20:1 | / | 20:1 |
| Max rapò aspè (perçage lazè) | 1:1 | 1:1 | 1:1 |
| Aliyman Interlayer | +/-0.254mm (1mil) | ± 0.05mm | ± 0.05mm |
| Tolerans PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| Tolerans NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Tolerans Countersink | +0.15mm | ± 0.15mm | ± 0.15mm |
| Epesè Komisyon Konsèy | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Tolerans epesè tablo ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Tolerans epesè tablo (≥1.Omm) | ±8% | / | ± 10% |
| Min Gwosè Komisyon Konsèy | 10 * 10mm | 5 * 5mm | 10 * 10mm |
| Gwosè Max Komisyon Konsèy | 1200mm * 750mm | 500 * 1200mm | 500 * 500mm |
| Deskripsyon aliyman | +/-0.075mm (3mil) | ± 0.05mm | ± 0.1mm |
| BGA mwen an | 0.125mm (5mil) | 7mil | 7mil |
| SMT mwen an | 0.177 * 0.254mm (7 * 10mil) | 7 * 10mil | 7 * 10mil |
| Min Solder Mask Clearance | 1.5mil | 2mil | 1.5mil |
| Baraj Mask Solder mwen an | 3mil | 3mil | 3mil |
| Lejand | Blan, Nwa, Wouj, Jòn | Blan, Nwa, Wouj, Jòn | Blan, Nwa, Wouj, Jòn |
| Min lejand lajè/wotè | 4/23 mil | 4/23 mil | 4/23 mil |
| Min reyon koube (yon sèl tablo) | / | 3-6 x epesè tablo | 3-7 x Flexbile tablo epesè |
| Min reyon koube (Doub Side Board) | / | 6-10 x epesè tablo | 6-11 x Flexbile epesè tablo |
| Min reyon koube (tablo miltikouch) | / | 10-15 x epesè tablo | 10-16 x Flexbile tablo epesè |
| Min reyon koube (kobe dinamik) | / | 20-40 x epesè tablo | 20-40 × epesè Komisyon Konsèy |
| Souch Filet Lajè | / | 1.5 + 0.5mm | 1.5 + 0.5mm |
| Bow & Tòde | 0.005 | / | 0.0005 |
| Tolerans enpedans | Single-Ended: ±5Ω(≤50Ω)，±7%(＞50Ω) | Single-Ended: ±5Ω(≤50Ω),±10%(＞50Ω) | Single-Ended: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Tolerans enpedans | Diferans: ±5Ω(≤50Ω)，±7%(＞50Ω) | Diferans: ±5Ω(≤50Ω),±10%(＞50Ω) | Diferans: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Soude Mask | Vèt, Nwa, Ble, Wouj, Matt Green, Jòn, Blan, Koulè wouj violèt | Green Solder Mask/Nwa PI/Jòn PI | Vèt, Nwa, Ble, Wouj, Matt Green |
| Sifas fini | Eiectronic lò plating, ENIG, Hard lò plating, Gold Finger, Immersion Silver, ImmersionTin, HASL LF, OSP, ENEPIG, Soft gold plating | Elektwonik plating lò, ENIG, plating lò difisil, Dwèt lò, ajan Immersion, fèblan Immersion, OSP, ENEPIG, plating lò mou | Elektwonik plating lò, ENIG, Hard lò plating, Gold Finger, Immersion Silver, Immersio Tin, HASL LF, OSP, ENEPIG, Soft gold plating |
| Pwosesis espesyal | Antere / avèg atravè, Groove etap, gwo, rezistans antere / kapasite, presyon melanje, RF, dwèt lò, N + N estrikti, kwiv epè, perçage tounen, HDI (5 + 2N + 5) | dwèt lò, laminasyon, adezif kondiktif, fim pwoteksyon, dòm metal | Antere / avèg atravè, Groove etap, gqo, antere rezistans / kapasite, presyon melanje, RF, dwèt lò, N + N estrikti, kwiv epè, perçage tounen |
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