Cikakken Nazari Kan Fasahar Allon Da'ira Mai Bugawa (PCB): Nau'i, Kayan Aiki, Aikace-aikace, da Sabbin Abubuwan Da Za Su Faru Nan Gaba

A matsayin muhimmin sashi na na'urorin lantarki, Hukumar Kula da Da'ira ta Buga (PCB) tana aiki a matsayin cibiyar jijiyoyi ta tsarin lantarki, tana gudanar da muhimman ayyuka na samar da tallafi na injiniya da haɗin lantarki ga abubuwan lantarki. Tare da saurin haɓaka fasahar lantarki, tun daga sirara da sauƙin ɗaukar wayoyin komai da ruwanka zuwa kwamfuta mai ƙarfi a cibiyoyin bayanai, daga watsawa mai sauri a cikin sadarwa ta 5G zuwa sarrafawa mai rikitarwa a cikin tuƙi mai sarrafa kansa na mota, yanayi daban-daban na aikace-aikace suna haifar da buƙatu daban-daban don aiki, tsari, da aiwatar da PCBs. Wannan ya haifar da fitowar nau'ikan PCB iri-iri. Fahimtar halaye daban-daban na PCBs yana da mahimmanci ga injiniyoyin lantarki, masu bincike da masu haɓakawa, da kuma masu aiki a masana'antu masu alaƙa, don inganta ƙirar lantarki da haɓaka aikin samfura.

一、Nazarin Fasaha na PCBs An Rarraba ta Kayan Substrate

(一) Taurin PCBs

PCBs masu ƙarfi, tare da kyakkyawan kwanciyar hankali da ƙarfi na injiniya, sun zama babban zaɓi ga na'urori da yawa na lantarki. Ana amfani da kayan fiber na gilashi, kamar E-glass da S-glass, sosai wajen kera PCBs masu ƙarfi saboda kyawawan halayensu na rufi da ƙarfin injina. Daga cikinsu, fiber ɗin E-glass yana da inganci mai yawa kuma ana samunsa a cikin samfuran lantarki gabaɗaya; fiber ɗin S-glass, a gefe guda, yana da ƙarfi da modulus mafi girma, wanda hakan ya sa ya dace da filayen da ke da buƙatu masu tsauri don halayen injiniya.

PCB masu tauri da aka yi da kayan polyimide (PI) suna da halaye kamar juriyar zafin jiki mai yawa (wanda zai iya aiki a sama da 200°C), babban rufi (tare da madaidaitan dielectric kamar ƙasa da 3), da kuma kyakkyawan kwanciyar hankali na sinadarai. Sau da yawa ana amfani da su a cikin yanayi masu yawan buƙata kamar na'urorin lantarki na sararin samaniya da na soja. FR-4, a matsayin kayan substrate da aka fi amfani da su don PCBs masu tauri, an laminated shi daga zane mai fiber na gilashi da aka sanya resin epoxy. Yana da kyawawan halayen lantarki (tare da juriyar girma sama da 10^14Ω·cm) da kuma jinkirin harshen wuta (wanda ya dace da matakin hana harshen wuta na UL94V-0), kuma ana amfani da shi sosai a cikin kayayyakin lantarki na farar hula kamar kwamfutoci da na'urorin sadarwa.

A matsayin laminates masu haɗe-haɗe da aka lulluɓe da tagulla, CEM-1 da CEM-3 suna da nasu halaye. CEM-1, wanda aka haɗa da haɗin tabarmar gilashi da tushen takarda, yana da ƙarancin farashi da wasu kaddarorin lantarki, wanda hakan ya sa ya dace da samfuran lantarki masu amfani da wutar lantarki masu sauƙin farashi. CEM-3, wanda aka gina shi akan tushen zare na gilashi, ya yi fice a aikin siriri da sarrafa injina, kuma galibi ana amfani da shi a cikin ƙananan na'urorin lantarki.

(二) 、 PCBs masu sassauƙa (FPCs)

PCBs masu sassauƙa (FPCs), tare da lanƙwasawa da siririn su na musamman, suna riƙe da matsayi mai mahimmanci a cikin na'urorin lantarki waɗanda ke da ƙarancin sarari. Polyimide (PI) yana ɗaya daga cikin manyan kayan FPCs. Yana da sassauci mai kyau (yana iya jure wa miliyoyin zagayowar lanƙwasa), juriya mai zafi (tare da zafin aiki na dogon lokaci sama da 150°C), da kyawawan kaddarorin lantarki (tare da tangent na asarar dielectric ƙasa da 0.002).

Ana amfani da kayan fim ɗin polyester kamar polyethylene terephthalate (PET) da polyethylene naphthalate (PEN) a cikin FPCs. Suna da fa'idodin ƙarancin farashi da ingantaccen sarrafawa, amma sun ɗan yi ƙasa da PI dangane da juriya mai yawa ga zafin jiki da halayen lantarki. Mahimman sigogi don auna aikin FPCs, kamar radius na lanƙwasa da adadin zagayowar lanƙwasa da zai iya jurewa, suna shafar aminci da rayuwar sabis na FPCs a aikace-aikace masu amfani.

PCBs masu ƙarfi da sassauci (三)

PCBs masu ƙarfi da sassauci suna haɗa fa'idodin PCBs masu ƙarfi da PCBs masu sassauci cikin dabara. A cikin wuraren da ke da tsauri, galibi ana amfani da kayan substrate iri ɗaya kamar waɗanda ake amfani da su a cikin PCBs masu ƙarfi, kamar allon FR-4 ko PI, don samar da tallafi na injiniya da kwanciyar hankali ga allon da'ira, tabbatar da ingantaccen shigar da kayan lantarki da haɗin lantarki. A cikin wuraren da ke da sassauci, ana amfani da kayan substrate masu sassauci, kamar fina-finan PI masu sassauci, don cimma lanƙwasa na allon da'ira.

Babban fasahar PCBs masu tauri da sassauƙa tana cikin tsarin haɗawa tsakanin wurare masu tauri da sassauƙa. Hanyoyin haɗawa na gama gari sun haɗa da walda ta laser da haɗin manne. Ingancin sassan haɗin gwiwa da ƙirar rage damuwa muhimman abubuwa ne don tabbatar da aikin PCBs masu tauri da sassauƙa. Tsarin ƙira mai ma'ana zai iya hana matsaloli kamar gazawar haɗi ko watsa sigina mara kyau yayin aikin lanƙwasawa.

Halayen Fasaha na PCBs An Rarraba su ta Yawan Layers Masu Gudarwa

(一) PCBs masu gefe ɗaya

A matsayinsa na asali na PCB, PCB mai gefe ɗaya yana da foil na jan ƙarfe a gefe ɗaya kawai kuma yana aiwatar da ayyukan da'ira ta hanyar wayoyi masu gefe ɗaya. Tsarin da'ira ɗinsa yana da sauƙi, wanda hakan ya sa ya dace da wasu na'urorin lantarki waɗanda ke da ƙarancin buƙatun aiki, kamar allunan sarrafa kayan gida masu sauƙi da allunan da'ira na kayan wasa. Tsarin samar da PCB mai gefe ɗaya abu ne mai sauƙi, galibi ya haɗa da matakai kamar etching foil na jan ƙarfe, buga abin rufe fuska na solder, da buga haruffa, kuma farashin yana da ƙasa kaɗan. Duk da haka, saboda ƙarancin sararin wayoyi, sarkakiyar da'ira da faɗaɗa aikin PCB mai gefe ɗaya suna da ɗan iyakance.

(Ƙananan) PCBs masu gefe biyu

PCB mai gefe biyu yana da foil na jan ƙarfe a ɓangarorin biyu na allon da'ira kuma yana cimma haɗin lantarki tsakanin ɓangarorin biyu ta hanyar vias (vias mai ƙarfe). Tsarin kera vias yawanci ya haɗa da matakai kamar haƙa, plating na jan ƙarfe mara lantarki, da electroplating don tabbatar da ingantaccen watsa wutar lantarki na bangon ciki na vias. Wahalar da'ira da ikon aiwatar da aiki na PCBs masu gefe biyu sun inganta sosai idan aka kwatanta da PCBs masu gefe ɗaya, kuma ana iya amfani da su a cikin motherboards na kwamfuta, wasu kayayyaki na na'urorin sadarwa, da sauransu.

A cikin ƙirar PCB masu gefe biyu, tsara wayoyi da kuma tsarin hanyar sadarwa sune manyan fannoni. Tsarin da ya dace zai iya rage tsangwama ta sigina yadda ya kamata da kuma inganta sahihanci da kwanciyar hankali na watsa sigina.

(Ƙasa) PCBs masu layi da yawa

PCBs masu layi dayawa suna da layuka da yawa masu sarrafawa (yawanci layuka 4 ko fiye), waɗanda aka raba su ta hanyar yadudduka masu rufi (kamar zanen prepreg, zanen PP). Baya ga ramuka da aka saba ta hanyar ramuka, ana kuma amfani da fasahar makafi da kuma binnewa ta hanyar fasahohi a cikin PCBs masu layi dayawa. Blend via rami ne mai gudanarwa wanda ya miƙe daga saman allon da'ira zuwa wani yanki na ciki kuma baya shiga dukkan allon da'ira; binne via rami ne mai haɗawa tsakanin layukan ciki kuma ba a fallasa shi a saman allon da'ira ba.

Amfani da fasahar makafi ta hanyar amfani da fasahohi wajen rage yawan hanyoyin sadarwa a saman allon da'ira kuma yana inganta yawan wayoyi da aikin watsa sigina. PCBs masu layi daya da yawa na iya samun wayoyi masu yawa da kuma watsa sigina mai aiki sosai, kuma ana amfani da su sosai a cikin na'urorin lantarki masu inganci, kamar uwayen uwa na uwar garken, uwayen uwa na wayar salula, da katunan zane masu aiki sosai. A cikin tsarin kera PCBs masu layi daya da yawa, abubuwa kamar tsarin lamination, daidaiton hakowa, da ingancin electroplating suna da tasiri mai mahimmanci akan aiki da amincin allon da'ira.

uku,Mahimman Bayanan Fasaha na PCBs An Rarraba su ta Tsarin Musamman

(一) PCBs masu yawan mita

Ana amfani da PCB mai yawan mita a na'urorin lantarki waɗanda ke sarrafa sigina masu yawan mita, kamar sadarwa mara waya, radar, da sauran fannoni. A lokacin watsa sigina masu yawan mita, matsaloli kamar asarar sigina da karkacewar lokaci sun fi bayyana. Saboda haka, PCB mai yawan mita suna buƙatar amfani da kayan aiki na musamman don rage asarar sigina da inganta ingancin watsa sigina.

Kayan Rogers yana ɗaya daga cikin kayan substrate da ake amfani da su don PCBs masu yawan mita. Yana da ƙarancin dielectric constant (Dk na iya zama ƙasa da 2.2) da kuma asarar tangent (Df ƙasa da 0.0009), wanda zai iya rage asarar sigina da ɓarna yayin aikin watsawa. Hakanan ana amfani da Polytetrafluoroethylene (PTFE) da kayan da aka cika su akai-akai a cikin PCBs masu yawan mita, saboda suna da kyawawan halayen lantarki masu yawan mita da kwanciyar hankali na sinadarai.

A cikin tsarin ƙira da ƙera PCB masu yawan mita, ban da zaɓin kayan aiki, ƙirar fannoni kamar tsarin da'ira, daidaitawar impedance, da kariyar electromagnetic suma suna da mahimmanci. Tsarin da'ira mai ma'ana zai iya rage tsangwama tsakanin sigina, daidaiton impedance daidai zai iya tabbatar da ingantaccen watsa sigina, kuma ingantaccen kariyar electromagnetic zai iya hana siginar mita mai yawa shiga cikin da'ira da ke kewaye.

(二) PCBs masu tushen ƙarfe

PCBs na ƙarfe, tare da kyakkyawan aikin watsa zafi, sun zama zaɓi mafi kyau ga na'urorin lantarki masu ƙarfi. Kayan ƙarfe na yau da kullun sun haɗa da aluminum da jan ƙarfe. Substrate na aluminum yana da kyakkyawan aikin watsa zafi da ƙarancin farashi, kuma ana amfani da shi sosai a fannoni kamar hasken LED da na'urorin wutar lantarki. Substrate na jan ƙarfe yana da mafi girman ƙarfin watsa zafi (kimanin sau 1.6 na aluminum) kuma ya dace da lokutan da ake buƙatar watsa zafi mai yawa, kamar da'irori masu ƙarfi na injin.

Ka'idar watsa zafi ta PCBs na ƙarfe ita ce a hanzarta gudanar da zafi da kayan lantarki ke samarwa ta hanyar ƙarfen. Don inganta ingancin watsa zafi, yawanci ana ƙara wani Layer mai hana zafi, kamar silicone pad mai hana zafi ko manne mai hana zafi, tsakanin ƙarfen da kayan lantarki. A cikin tsarin kera PCBs na ƙarfe, sarrafa kauri na Layer mai hana zafi da ƙarfin haɗin gwiwa da ƙarfen su ne manyan abubuwan da ke tabbatar da aikinsu.

(三) HDI PCBs (Babban Haɗin Haɗin PCBs)

PCBs na HDI (High-Density Interconnect PCBs), tare da halayensu na wayoyi masu yawa da kuma rage girmansu, sun cika ƙa'idodin na'urorin lantarki na zamani don sarari da aiki. Manyan fasahohin HDI PCBs suna cikin ƙera ƙananan hanyoyin sadarwa (Micro-Vias) da kuma ƙera layuka masu kyau. Diamita na ƙananan hanyoyin sadarwa yawanci ƙasa da 0.1mm kuma ana ƙera su ta amfani da fasahohin zamani kamar haƙa laser ko etching na plasma.

Sassaka layuka masu laushi yana buƙatar kayan aikin sassaka masu inganci da kuma sarrafa tsari don cimma wayoyi masu kyau tare da faɗin layi/layi na ƙasa da 30μm/30μm. HDI PCBs yawanci suna amfani da fasahar ginawa, suna cimma haɗin kai mai yawa ta hanyar tara layuka masu rufi da yadudduka masu sarrafawa layi-layi. Ana amfani da HDI PCBs sosai a cikin ƙananan na'urorin lantarki kamar wayoyin komai da ruwanka, kwamfutar hannu, da na'urorin da ake iya sawa, kuma suna ɗaya daga cikin mahimman fasahohi don cimma babban aiki da rage girman waɗannan na'urori.

Ƙananan Rukunin IC (Allunan Mota na IC)

Ana amfani da ƙananan IC (allon ɗaukar kaya na IC) galibi don marufi na guntu, kamar marufi na BGA (Ball Grid Array), marufi na QFN (Quad Flat No-Lead), da marufi na FC (Flip Chip), da sauransu. Ƙananan IC suna buƙatar samun halayen haɗin kai mai yawa da kuma daidaito mai yawa don cimma haɗin kai mai inganci tsakanin guntu da da'irar waje.
Abubuwan IC galibi suna amfani da ƙirar allon da yawa, kuma akwai ƙa'idodi masu tsauri don daidaiton layi, ta hanyar girma, da daidaiton matsayi yayin aikin ƙera su. A lokaci guda, abubuwan IC suna buƙatar la'akari da sarrafa watsa zafi da aikin lantarki don tabbatar da kwanciyar hankali da amincin guntu yayin aiki. Tare da ci gaba da haɓaka fasahar guntu, buƙatun aiki da daidaiton abubuwan IC suna ƙaruwa koyaushe.

Halayen Fasaha na PCBs An Rarraba su ta Tsarin Vias Mai Gudanarwa

(一) Allon Rami Mai Tafiya

Allon ramin da ke ratsawa yana ɗaya daga cikin nau'ikan PCB da aka fi amfani da su. Hanyoyinsa na watsawa suna ratsawa daga saman Layer zuwa ƙasan allon da'ira, kuma haɗin lantarki tsakanin yadudduka ana samun su ta hanyar tsarin lantarki ta hanyar lantarki. Diamita na via da kauri na jan ƙarfe na bangon via na allon ramin da ke ratsawa muhimman sigogi ne da ke shafar aikin lantarki da ƙarfin injina.
Girman diamita mai girma yana da amfani ga shigar da abubuwan toshewa, amma zai mamaye ƙarin sararin wayoyi; rashin kauri na tagulla na bangon via na iya haifar da haɗin lantarki mara inganci. A lokacin ƙera allon ramin ta hanyar, daidaiton haƙa ramukan da ingancin electroplating suna da tasiri mai mahimmanci akan aikin allon kewaye. Bugu da ƙari, allon ramin ta hanyar na iya ɗaukar tsarin cikewa ta hanyar, kamar cika resin, don inganta amincinsa da juriyar danshi.

(Ƙananan) Allon Micro-Via

Allon Micro-via suna amfani da hanyoyin sadarwa masu ƙananan diamita (yawanci ƙasa da 0.15mm), kamar ƙananan hanyoyin sadarwa marasa ma'ana da ƙananan hanyoyin sadarwa da aka binne. Samar da ƙananan hanyoyin sadarwa yawanci yana amfani da fasahar haƙa laser ko fasahar etching plasma, kuma waɗannan fasahohin na iya cimma ƙera ƙananan hanyoyin sadarwa da daidaito mai yawa don biyan buƙatun manyan hanyoyin sadarwa.
Ƙananan ƙwayoyin cuta na allon micro-via suna da ƙananan diamita da adadi mai yawa, wanda zai iya samun ƙarin haɗin lantarki a cikin ɗan ƙaramin sarari kuma ya inganta matakin haɗin kai da aikin allon da'ira. A lokacin ƙira da ƙera allon micro-via, ana buƙatar la'akari da tsarin cikewa da gyaran saman ƙwayoyin cuta don tabbatar da aikin lantarki da amincin ƙwayoyin cuta.

(III) Allon Makafi ta Hanyar Kariya

Hanyoyin sadarwa na makafi ta hanyar allon suna fitowa ne kawai daga saman allon da'ira zuwa wani yanki na ciki kuma ba sa shiga dukkan allon da'ira. Kasancewar hanyoyin sadarwa na makafi na iya rage adadin hanyoyin sadarwa a saman allon da'ira, ƙara yawan wayoyi, da kuma rage tsangwama na sigina yayin aikin watsawa.
Tsarin ƙirƙirar hanyoyin haƙa makafi sun haɗa da haƙa laser, electroplating bayan haƙa na inji, da sauransu. Hanyoyi daban-daban na tsari suna da tasiri daban-daban akan inganci da farashin hanyoyin haƙa makafi. A cikin ƙirar hanyoyin haƙa makafi ta hanyar allunan, dole ne a tsara matsayi da adadin hanyoyin haƙa makafi yadda ya kamata don ba da cikakken amfani ga fa'idodin su da kuma inganta aikin allon da'ira.

Allunan Haɗin Haɗi Mai Yawan Yawa (HDI)

Allon haɗin kai mai yawan yawa (HDI) ana siffanta shi da haɗin kai mai yawan yawa, ƙanana ta hanyar diamita, da layuka masu kyau, kuma suna ɗaya daga cikin mahimman fasahohi don cimma ƙarancin aiki da babban aiki na na'urorin lantarki. Baya ga amfani da ƙananan hanyoyin sadarwa, allunan HDI suna kuma samun wayoyi masu kyau tare da faɗin layi/fitilun ƙasa da 30μm/30μm ta hanyar fasahar sassaka layi mai kyau.
Allunan HDI galibi suna amfani da fasahar ginawa, suna cimma haɗin kai mai yawa ta hanyar tara layukan rufi da yadudduka masu sarrafawa layi-layi. A lokacin ƙera allunan HDI, buƙatun kayan aiki, kayan aiki, da hanyoyin aiki suna da yawa sosai, kuma ingancin kowace hanyar haɗi yana buƙatar a sarrafa shi sosai don tabbatar da aiki da amincin allon da'ira.

Kammalawa

A matsayin muhimmin tushe na fasahar lantarki, bambancin nau'ikan da sarkakiyar fasahar da'ira da aka buga suna ba da goyon baya mai ƙarfi ga ƙirƙira da haɓaka na'urorin lantarki. Daga zaɓin kayan substrate zuwa ƙirar yadudduka masu sarrafawa, daga aikace-aikacen matakai na musamman zuwa la'akari da hanyoyin magance saman, sannan zuwa buƙatun fasaha na fannoni daban-daban na aikace-aikace da halayen tsarin vias masu sarrafawa, kowace hanyar haɗi ta ƙunshi ma'anoni masu yawa na fasaha.

Tare da ci gaba da ci gaban fasahar lantarki, kamar saurin haɓaka fasahohi masu tasowa kamar fasahar wucin gadi, Intanet na Abubuwa, da manyan bayanai, za a gabatar da buƙatu mafi girma don aiki da ayyukan PCBs. A nan gaba, fasahar PCB za ta haɓaka zuwa ga alkiblar yawan aiki, mafi girma aiki, ƙarancin farashi, da kuma ƙarin kariyar muhalli, ci gaba da haɓaka ƙarancin hankali, hankali, da haɓaka manyan na'urorin lantarki. Injiniyoyin lantarki da masu aiki a masana'antu masu alaƙa suna buƙatar kulawa sosai ga ci gaban fasahar PCB, ci gaba da ƙirƙira da inganta ƙira don biyan buƙatun kasuwa da ƙalubalen fasaha.

Tambayoyin da ake yawan yi:

T1. Menene kayan substrate na gama gari don PCBs masu tauri?

Kayan da aka fi amfani da su wajen yin amfani da PCB masu tauri sun haɗa da zare-zaren gilashi (kamar E-glass, S-glass, da sauransu), polyimide (PI), FR-4 (laminate mai rufe jan ƙarfe mai hana harshen wuta wanda aka yi da resin epoxy da zane na fiber gilashi), CEM-1 (laminate mai rufe jan ƙarfe wanda ya ƙunshi tabar da harsashin gilashi), da kuma CEM-3 (laminate mai rufe jan ƙarfe wanda aka yi da harsashin gilashi).

T2. Me yasa PCB masu sassauƙa suka dace da na'urorin da ake iya sawa?

PCB masu sassauƙa sun dace da na'urorin da ake iya sawa saboda manyan kayan da ake amfani da su a cikin substrate kamar polyimide (PI), polyethylene terephthalate (PET), da sauransu suna ba su sassauci mai kyau, wanda ke ba su damar lanƙwasawa, naɗewa, da lanƙwasa a cikin wani takamaiman iyaka, wanda zai iya daidaitawa da siffofi masu rikitarwa na na'urorin da ake sawa waɗanda suka dace da jikin ɗan adam. A lokaci guda, suna da halaye na sirara da sauƙi, kuma ba za su ɗora wa mai sawa nauyi da yawa ba, wanda hakan zai cika buƙatun na'urorin da ake sawa don sarari da jin daɗi.

T3. Menene ayyukan yankin mai tauri da yankin mai sassauƙa a cikin PCB mai tauri mai sassauƙa?

A yankin tauri na PCB mai tauri, ana amfani da kayan substrate masu tauri kamar allon FR-4 ko PI don samar da tallafi da kwanciyar hankali na injiniya, wanda ke tabbatar da ƙarfin tsarin allon da'ira yayin shigarwa da amfani. A gefe guda kuma, yankin mai tauri yana amfani da kayan substrate masu tauri kamar fina-finan PI masu tauri don cimma aikin lanƙwasawa, don daidaitawa da canje-canjen siffar na'urar a cikin yanayi daban-daban na amfani da kuma biyan buƙatun aikin injiniya da lantarki masu rikitarwa.

T4. Menene manyan bambance-bambance tsakanin PCBs masu gefe ɗaya da PCBs masu gefe biyu?

PCB mai gefe ɗaya yana da foil ɗin jan ƙarfe a gefe ɗaya kawai kuma ana amfani da shi don wayoyi masu gefe ɗaya. Wahalar da'irarsa ba ta da yawa, kuma ya dace da na'urorin lantarki masu sauƙi. Tsarin samarwa yana da sauƙi kuma farashinsa ƙasa ne, amma ayyukansa da sararin wayoyi suna da iyaka. PCB mai gefe biyu yana da foil ɗin jan ƙarfe a ɓangarorin biyu, kuma haɗin wutar lantarki tsakanin ɓangarorin biyu ana samunsa ta hanyar vias (yawanci vias ɗin ƙarfe). Wahalar da'irar tana da matsakaici, kuma tana iya cimma ƙarin ayyuka tare da kewayon aikace-aikace masu faɗi, kamar motherboards na kwamfuta, na'urorin sadarwa, da sauransu.

T5. Menene ayyukan makafi da kuma binnewa a cikin PCBs masu layi da yawa?

Vias ɗin makafi a cikin PCBs masu layuka da yawa ramuka ne masu sarrafa wutar lantarki waɗanda ke fitowa daga saman zuwa wani takamaiman Layer na ciki kuma ba sa shiga cikin allon kewaye gaba ɗaya. Ana iya amfani da su don haɗa wutar lantarki tsakanin takamaiman yadudduka, rage tsangwama ga sigina da inganta amincin sigina. Vias ɗin da aka binne haɗi ne tsakanin yadudduka na ciki kuma ba a fallasa su a saman ba. Suna iya cimma haɗin tsakanin layuka ba tare da mamaye sararin saman ba, wanda ke taimakawa wajen samar da wayoyi masu yawa da inganta aiki da matakin haɗin kai na allon kewaye.

T6. Me yasa PCB masu yawan mita ke buƙatar amfani da kayan aiki na musamman?

Ana amfani da PCBs masu yawan mita musamman don sarrafa siginar mita mai yawa, kamar su madannin mita na microwave da madannin mita na milimita, kuma siginar tana iya yin asara yayin aikin watsawa. Ana amfani da kayan aiki na musamman kamar kayan Rogers, polytetrafluoroethylene (PTFE), da kayan da aka cika da yumbu saboda waɗannan kayan suna da halayen ƙarancin dielectric constant (Dk) da ƙarancin asarar tangent (Df), waɗanda zasu iya rage asarar sigina yadda ya kamata, tabbatar da sahihancin sigina, da kuma biyan buƙatun watsa sigina mai yawan mita.

T7. Waɗanne na'urorin lantarki masu ƙarfi ne PCBs na ƙarfe suka dace da su?

PCBs na ƙarfe sun dace da nau'ikan na'urorin lantarki masu ƙarfi iri-iri. Misali, a cikin na'urorin wutar lantarki, ana samar da zafi mai yawa yayin aiki, kuma PCBs na ƙarfe na iya wargaza zafi yadda ya kamata don tabbatar da aikinsu na yau da kullun. Ga na'urorin hasken LED, suna iya wargaza zafi da LEDs ke samarwa cikin sauri, suna inganta ingancin haske da tsawon rai na fitilun. Ga da'irorin tuƙi na mota, suna iya taimakawa wajen wargaza zafi da ake samarwa yayin aikin mota, suna tabbatar da ingantaccen aikin da'irar.

T8. Menene muhimman halaye na fasaha na HDI PCBs?

Manyan halayen fasaha na HDI PCBs sun haɗa da amfani da ƙananan diamita (Micro-Via, yawanci ƙasa da 0.1mm), waɗanda aka samar ta hanyar fasahohin zamani kamar haƙa laser da etching na plasma; suna da layuka masu kyau (Fine Line), waɗanda zasu iya cimma wayoyi masu kyau tare da faɗin layi/layi na ƙasa da 30μm/30μm; ɗaukar fasahar ginawa don ƙara yawan yadudduka da cimma haɗin kai mai yawa; da kuma samun kyakkyawan jituwa tare da tsarin haɗa fasahar hawa saman (SMT), wanda ya dace da buƙatun na'urorin lantarki masu ƙarancin inganci.

T9. Waɗanne irin yadudduka ne na saman tin don PCBs da aka fesa da tin?

Nau'ikan yadudduka na tin na saman PCBs da aka fesa da tin sun haɗa da tin mai tsarki (Tin Mai tsarki), gami da gubar tin (Tin-Lead Alloy), da feshin tin mara gubar, kamar Sn-Cu (tin-copper alloy), Sn-Ag-Cu (tin-silver-copper alloy), da sauransu. Feshin tin mara gubar nau'in feshin tin ne da aka shahara a hankali don biyan buƙatun kariyar muhalli.

T10. Me yasa ake amfani da PCBs masu launin zinare a cikin na'urorin lantarki masu inganci?

Ana amfani da PCBs masu launin zinare a cikin na'urorin lantarki masu inganci saboda zinariyar ƙarfe da ke rufe saman su (wanda aka raba zuwa zinariya mai tauri da zinariya mai laushi) na iya samar da kyakkyawan yanayin wutar lantarki, rage juriyar hulɗa, da kuma tabbatar da amincin haɗin lantarki. A lokaci guda, zinariya tana da kyakkyawan aikin hana iskar shaka, wanda zai iya tsayayya da tsatsa da lalata muhalli yadda ya kamata, tsawaita rayuwar allon da'ira, da kuma biyan buƙatun na'urorin lantarki masu inganci kamar su sararin samaniya, kayan aikin likita, da tashoshin sadarwa don aminci da kwanciyar hankali.

T11. Me ya kamata a kula da shi lokacin adana OSP PCBs?

Ana yi wa OSP PCBs magani a saman da fim ɗin kariya daga soldering. Tsawon lokacin ajiyarsu yana da ɗan gajeren lokaci, kuma ya kamata a mai da hankali kan hana danshi. Ya kamata a adana su a cikin busasshiyar wuri da ƙarancin danshi don guje wa lalacewar fim ɗin kariya daga soldering saboda danshi, wanda zai iya shafar yadda allon kewaye zai iya soldering. A lokaci guda, ya kamata a mai da hankali kan tsaftace saman don hana ƙura da datti gurɓata saman allon kewaye, wanda zai iya shafar aikin walda da amfani na gaba.

T12. Waɗanne buƙatun aiki ne allon kwamfuta ke da su don PCBs?

Allon kwamfuta kamar motherboards, katunan zane-zane, da allunan sabar suna da buƙatu don sarrafa bayanai da ikon watsa bayanai masu sauri na PCBs. Suna buƙatar tallafawa ka'idojin watsa sigina masu sauri kamar bas ɗin PCI-E, kebul na USB, da SATA. Ya kamata su sami kyakkyawan aikin lantarki don tabbatar da amincin sigina da kwanciyar hankali. Motherboard ɗin yana buƙatar haɗa nau'ikan mahimman abubuwa daban-daban, kamar chipset, guntu na BIOS, da da'irar samar da wutar lantarki, da sauransu, wanda ke buƙatar PCB ya sami tsari mai dacewa da matakin haɗin kai mai girma. Allon sabar kuma yana buƙatar tallafawa CPUs da yawa da ƙwaƙwalwar ajiya mai girma, wanda ke sanya buƙatu mafi girma akan ƙarfin ɗaukar kaya da amincin PCB.

T13. Me yasa allon motoci ke buƙatar samun ingantaccen aminci?Ana amfani da allon motoci a tsarin lantarki na motoci. A lokacin tuki, motoci za su fuskanci yanayi daban-daban masu rikitarwa na muhalli, kamar girgiza, tasiri, da canje-canje a yanayin zafi mai yawa da ƙasa (yawanci ana buƙatar yin aiki akai-akai a cikin kewayon zafin jiki na -40°C zuwa 125°C). Idan allon motoci ba shi da isasshen aminci, yana iya haifar da gazawa a cikin tsarin lantarki na mota, wanda ke shafar aikin motar na yau da kullun da amincin tuki. Saboda haka, allon motoci suna buƙatar samun babban aminci don tabbatar da ingantaccen aiki a cikin mawuyacin yanayi.

T14. Wace rawa ce allon IC (IC carrier board) ke takawa a cikin marufi na guntu?

Babban abin da ke cikin IC substrate (IC carrier board) shine ke taka rawa wajen haɗa guntu da da'irar waje a cikin marufin guntu. Misali, hanyoyin marufi kamar marufin BGA (Ball Grid Array), marufin QFN (Quad Flat No-Lead), da marufin FC (Flip Chip) duk suna buƙatar samun haɗin gwiwa mai inganci ta hanyar substrate IC. Yana buƙatar samun halayen haɗin kai mai yawa da daidaito mai yawa don biyan buƙatun adadi mai yawa na watsa sigina tsakanin guntu da da'irar waje. A lokaci guda, ana buƙatar la'akari da sarrafa watsa zafi da aikin lantarki don tabbatar da cewa za a iya wargaza zafin da aka samar yayin aikin guntu yadda ya kamata kuma za a iya watsa siginar da kyau, wanda ke tabbatar da aikin guntu na yau da kullun.

T15. Ta yaya ake samar da ƙananan ƙwayoyin cuta na allunan micro-via?

Ana samar da ƙananan ƙwayoyin cuta na allon micro-via ta hanyar haƙa laser ko fasahar etching plasma. Haƙa laser yana amfani da hasken laser mai ƙarfi don haskaka allon da'ira, wanda ke sa kayan su yi tururi nan take don samar da ƙananan ƙwayoyin cuta. A gefe guda kuma, etching na plasma yana amfani da plasma don yin martani ta hanyar sinadarai tare da kayan saman allon da'ira don cire sassan da ba dole ba, ta haka suna samar da ƙananan ƙwayoyin cuta ta hanyar diamita, kamar ƙananan ƙwayoyin cuta da ƙananan ƙwayoyin cuta da aka binne, da sauransu, don cimma wayoyi masu yawa.