Ka hiki ke hoʻākoakoa PCB
ʻO SMT, ka inoa piha ʻo ia ka ʻenehana hoʻopaʻa ʻili. ʻO SMT kahi ala e hoʻopaʻa ai i nā ʻāpana a i ʻole nā ʻāpana ma luna o nā papa. Ma muli o ka hopena maikaʻi a me ka pono kiʻekiʻe, ua lilo ʻo SMT i ke ala mua i hoʻohana ʻia i ke kaʻina hana o ka ʻākoakoa PCB.
Nā pono o ka ʻākoakoa SMT
1. Liʻiliʻi ka nui a me ka māmā
ʻO ka hoʻohana ʻana i ka ʻenehana SMT e hōʻuluʻulu pololei i nā ʻāpana ma luna o ka papa e kōkua i ka hōʻemi ʻana i ka nui holoʻokoʻa a me ke kaumaha o nā PCB. ʻAe kēia ʻano hōʻuluʻulu iā mākou e kau i nā ʻāpana hou aʻe i kahi ākea i kaupalena ʻia, hiki ke hoʻokō i nā hoʻolālā liʻiliʻi a me ka hana maikaʻi aʻe.
2. Hilinaʻi kiʻekiʻe
Ma hope o ka hōʻoia ʻana o ka prototype, ua aneane hana ʻakomi ʻia ke kaʻina hana hōʻuluʻulu SMT holoʻokoʻa me nā mīkini kikoʻī, e hōʻemi ana i nā hewa i hiki ke hana ʻia e ka hana lima. Mahalo i ka automation, hōʻoia ka ʻenehana SMT i ka hilinaʻi a me ke kūlike o nā PCB.
3. Mālama kālā
Hoʻokō pinepine ʻia ka ʻākoakoa SMT ma o nā mīkini hana aunoa. ʻOiai ke kiʻekiʻe o ke kumukūʻai hoʻokomo o nā mīkini, kōkua nā mīkini hana aunoa i ka hōʻemi ʻana i nā ʻanuʻu lima i ka wā o nā kaʻina hana SMT, kahi e hoʻomaikaʻi nui ai i ka pono hana a hoʻohaʻahaʻa i nā kumukūʻai hana i ka wā lōʻihi. A he emi nā mea i hoʻohana ʻia ma mua o ka ʻākoakoa ma o ka lua, a e emi pū ke kumukūʻai.
| Ka hiki ke hana SMT: 19,000,000 helu/lā | |
| Nā Lako Hoʻāʻo | ʻO ka mea ʻike ʻole luku X-RAY, ʻO ka mea ʻike ʻatikala mua, A0I, mea ʻike ICT, BGA Rework Instrument |
| Ka wikiwiki o ke kau ʻana | 0.036 S/pcs (Kūlana Maikaʻi Loa) |
| Nā ʻĀpana Kikoʻī. | Pūʻolo liʻiliʻi hiki ke hoʻopili ʻia |
| Ka pololei o nā lako hana haʻahaʻa loa | |
| Ka pololei o ka ʻāpana IC | |
| Nā kikoʻī PCB i kau ʻia. | Ka nui o ka substrate |
| Mānoanoa o ka substrate | |
| Ka helu hoʻokuʻu | 1.Impedance Capacitance Ratio: 0.3% |
| 2.IC me ka ʻole o ke kiki ʻana | |
| ʻAno Papa | POP/PCB maʻamau/FPC/PCB Rigid-Flex/PCB i hoʻokumu ʻia me ka metala |
| Ka Mana o kēlā me kēia lā DIP | |
| Ka laina hoʻokomo DIP | 50,000 helu/lā |
| Laina hoʻopili pou DIP | 20,000 helu/lā |
| Laina hoʻāʻo DIP | 50,000pcs PCBA/lā |
| Ka hiki ke hana i nā lako SMT nui | ||
| Mīkini | Pae | Palena |
| Mea paʻi GKG GLS | Paʻi PCB | 50x50mm~610x510mm |
| pololei o ka paʻi ʻana | ±0.018mm | |
| Ka nui o ka mōlina | 420x520mm-737x737mm | |
| ka laulā o ka mānoanoa o ka PCB | 0.4-6mm | |
| Mīkini hoʻohuihui hoʻohui | Sila hoʻoili PCB | 50x50mm~400x360mm |
| Wehe i ka wili | Sila hoʻoili PCB | 50x50mm~400x360mm |
| YAMAHA YSM20R | inā e lawe ana i 1 papa | L50xW50mm -L810xW490mm |
| Ka wikiwiki kumumanaʻo SMD | 95000CPH (0.027 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-45*45mm ke kiʻekiʻe o ka hoʻopaʻa ʻana i nā ʻāpana: ≤15mm | |
| Pololei o ka ʻākoakoa ʻana | CHIP+0.035mmCpk ≥1.0 | |
| Ka nui o nā ʻāpana | 140 mau ʻano (ʻōwili 8mm) | |
| YAMAHA YS24 | inā e lawe ana i 1 papa | L50xW50mm -L700xW460mm |
| Ka wikiwiki kumumanaʻo SMD | 72,000CPH (0.05 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-32*mm ke kiʻekiʻe o ka hoʻopaʻa ʻana o ka ʻāpana: 6.5mm | |
| Pololei o ka ʻākoakoa ʻana | ±0.05mm, ±0.03mm | |
| Ka nui o nā ʻāpana | 120ʻano (ʻōwili 8mm) | |
| YAMAHA YSM10 | inā e lawe ana i 1 papa | L50xW50mm ~L510xW460mm |
| Ka wikiwiki kumumanaʻo SMD | 46000CPH (0.078 s/chip) | |
| Pae ʻākoakoa | 0201(mm)-45*mm ke kiʻekiʻe o ka hoʻopaʻa ʻana o ka ʻāpana: 15mm | |
| Pololei o ka ʻākoakoa ʻana | ±0.035mm Cpk ≥1.0 | |
| Ka nui o nā ʻāpana | 48 ʻano (8mm reel) / 15 ʻano o nā pā IC aunoa | |
| JT TEA-1000 | Hiki ke hoʻololi ʻia kēlā me kēia ala pālua | Hiki ke hoʻololi ʻia ke ala hoʻokahi/papa hana W50 ~ 270mm W50 * W450mm |
| Ke kiʻekiʻe o nā ʻāpana ma ka PCB | luna/lalo 25mm | |
| Ka wikiwiki o ka mea hoʻoili | 300~2000mm/kekona | |
| ʻO ALeader ALD7727D AOI ma ka pūnaewele | Hoʻonā/Lawelawe ʻike/Wikiwiki | Koho: 7um/pikela FOV: 28.62mmx21.00mm Maʻamau: 15um pikela FOV: 61.44mmx45.00mm |
| Ka ʻike ʻana i ka wikiwiki | ||
| ʻŌnaehana code bar | ka ʻike ʻakomi ʻana i nā code bar (code bar a i ʻole QR code) | |
| Ka laulā o ka nui o ka PCB | 50x50mm (minimum) ~ 510x300mm (max) | |
| 1 ala i hoʻopaʻa ʻia | Ua paʻa ke ala 1, hiki ke hoʻololi ʻia ke ala 2/3/4; ʻo ka nui liʻiliʻi loa ma waena o ke ala 2 a me 3 he 95mm; ʻo ka nui kiʻekiʻe loa ma waena o ke ala 1 a me 4 he 700mm. | |
| Laina hoʻokahi | ʻO ka laulā o ke ala hele wāwae kiʻekiʻe loa he 550mm. Ala hele wāwae pālua: ʻo ka laulā o ke ala hele wāwae pālua kiʻekiʻe loa he 300mm (ka laulā hiki ke ana ʻia); | |
| Ka laulā o ka mānoanoa o ka PCB | 0.2mm-5mm | |
| Ka ʻokoʻa PCB ma waena o luna a me lalo | ʻAoʻao luna PCB: 30mm / ʻAoʻao lalo PCB: 60mm | |
| 3D SPI SINIC-TEK | ʻŌnaehana code bar | ka ʻike ʻakomi ʻana i nā code bar (code bar a i ʻole QR code) |
| Ka laulā o ka nui o ka PCB | 50x50mm (minimum) ~ 630x590mm (max) | |
| Pololei | 1μm, kiʻekiʻe: 0.37um | |
| Ka hana hou ʻana | 1um (4sigma) | |
| Ka wikiwiki o ke kahua ʻike maka | 0.3s/kahua ʻike maka | |
| Ka manawa ʻike kiko kuhikuhi | 0.5s/kiko | |
| Kiʻekiʻe loa o ka ʻike ʻana | ±550um ~ 1200μm | |
| ʻO ke kiʻekiʻe ana o ka PCB warping | ±3.5mm ~ ±5mm | |
| Ka mamao palena iki o ka papa | 100um (ma muli o kahi pad soler me ke kiʻekiʻe o 1500um) | |
| Ka nui hoʻāʻo haʻahaʻa loa | huinahā 150um, pōʻai 200um | |
| Ke kiʻekiʻe o ka ʻāpana ma ka PCB | luna/lalo 40mm | |
| Mānoanoa PCB | 0.4~7mm | |
| Mea ʻike X-Ray Unicomp 7900MAX | ʻAno paipu kukui | ʻano i hoʻopuni ʻia |
| Ka uila o ka paipu | 90kV | |
| Mana hoʻopuka kiʻekiʻe loa | 8W | |
| Ka nui o ke kālele ʻana | 5μm | |
| Mea ʻike | FPD wehewehe kiʻekiʻe | |
| Ka nui o ka pikela | ||
| Ka nui o ka ʻike pono | 130*130[mm] | |
| ʻO ka matrix pikela | 1536*1536[pikselo] | |
| Ka wikiwiki o ke kiʻi | 20fps | |
| Hoʻonui ʻōnaehana | 600X | |
| Ke kūlana hoʻokele | Hiki ke ʻimi koke i nā kiʻi kino | |
| Ana ʻakomi | Hiki ke ana ponoʻī i nā pehu i loko o nā mea uila i hoʻopili ʻia e like me BGA & QFN | |
| ʻIke ʻakomi CNC | Kākoʻo i ka hoʻohui kiko hoʻokahi a me ka matrix, hana koke i nā papahana a nānā iā lākou | |
| Hoʻonui geometric | 300 mau manawa | |
| Nā mea hana ana like ʻole | Kākoʻo i nā ana geometric e like me ka mamao, ke kihi, ke anawaena, ka polygon, a pēlā aku | |
| Hiki ke ʻike i nā hāpana ma kahi kihi 70 degere | Loaʻa i ka ʻōnaehana ka hoʻonui ʻana a hiki i ka 6,000 | |
| Ka ʻike ʻana i ka BGA | Hoʻonui nui ʻia, kiʻi maopopo aʻe, a maʻalahi hoʻi e ʻike i nā hui solder BGA a me nā māwae tin | |
| Kahua | Hiki ke hoʻonoho i nā kuhikuhi X, Y a me Z; Ke kuhikuhi ʻana o nā ʻōmole X-ray a me nā mea ʻike X-ray | |