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Uhlalutyo lweTekhnoloji yokuDrila iBack Drilling kuYilo lwePCB oluhamba ngesantya esiphezulu
2020-04-08
Kutheni kufuneka senze uyilo lweBackdrill?
Okokuqala, izinto eziyinxalenye yonxibelelwano olukhawulezayo zezi:
① Ukuthumela itshiphu yokuphela (ukupakisha kunye ne-PCB nge)
② Intambo ye-PCB yekhadi elincinci
③ Isixhumi sekhadi elingaphantsi
④ Intambo ye-PCB engasemva
⑤ Isixhumi sekhadi elingaphantsi kwelinye icala
⑥ Intambo ye-PCB yekhadi elingaphantsi elisecaleni elichaseneyo
⑦ Umthamo wokudibanisa i-AC
⑧ Itshiphu yesamkeli (ukupakisha kunye ne-PCB nge)
Ikhonkco lokunxibelelana kwesignali yesantya esiphezulu kwiimveliso ze-elektroniki liyinkimbinkimbi, kwaye iingxaki zokungafani kwe-impedance zihlala zenzeka kwiindawo ezahlukeneyo zonxibelelwano lwezixhobo, nto leyo ekhokelela ekukhutshweni kwesignali.
Amanqaku okungakwazi ukuqhubeka kwe-impedance kwiikhonkco zonxibelelwano ezinesantya esiphezulu:
(1) Ukupakisha iitshiphusi: Ngokwesiqhelo, ububanzi bentambo yePCB ngaphakathi kwesiseko sokupakisha iitshiphusi buncinci kakhulu kunobo bePCB eqhelekileyo, nto leyo eyenza kube nzima ukulawula i-impedance;
(2) I-PCB nge: I-PCB nge idla ngokuba ziziphumo ezikwaziyo ukusebenza kakuhle ezine-impedance ephantsi, kwaye kufuneka ibe yeyona igxile kakhulu kwaye ilungiselelwe uyilo lwe-PCB;
(3) Isixhumi: Uyilo lwekhonkco lokudibanisa ubhedu ngaphakathi kwesixhumi luchatshazelwa kukuthembeka koomatshini kunye nokusebenza kombane, ngoko ke kufuneka kufunwe ibhalansi phakathi kwezi zimbini.
I-PCB via idla ngokuyilwa njengemingxunya edlulayo (ukusuka kumphezulu ophezulu ukuya kumaleko osezantsi). Xa umgca we-PCB odibanisa i-via ujikeleziswa kufutshane nomaleko ongaphezulu, kuya kubakho ukubhityana "kwe-stub" kwi-via yekhonkco lonxibelelwano lwe-PCB, okubangela ukubonakaliswa kwesiginali kwaye kuchaphazele umgangatho wesiginali. Le mpembelelo inempembelelo enkulu kwiisiginali ngesantya esiphezulu.
Intshayelelo kwiindlela zokucubungula i-Backdrill
Itekhnoloji yokugrumba emva ibhekisa ekusebenziseni iindlela zokugrumba zokulawula ubunzulu, kusetyenziswa indlela yesibini yokugrumba ukugrumba iindonga zemingxunya yeStub yesixhumi okanye isignali nge.
Njengoko kubonisiwe kumfanekiso ongezantsi, emva kokuba umngxuma odlulayo wenziwe, i-Stub engaphezulu yomngxuma odlulayo we-PCB isuswa ngokugrumba okwesibini "kwicala elingasemva". Kakade ke, ububanzi be-backdrill bit kufuneka bube bukhulu kunobungakanani bomngxuma odlulayo, kwaye inqanaba lokunyamezela ubunzulu benkqubo yokugrumba kufuneka lisekelwe kumgaqo "wokungonakalisi unxibelelwano phakathi komngxuma we-PCB kunye nocingo", ukuqinisekisa ukuba "ubude be-stub eseleyo buncinci kangangoko", okubizwa ngokuba "kukugrumba kolawulo lobunzulu".
Umzobo wesicwangciso secandelo le-BackDrill elinomngxuma odlulayo
Oku kungasentla ngumzobo obonisa icandelo le-BackDrill elinomngxuma odlulayo. Icala lasekhohlo liyisignali eqhelekileyo edlulayo, ngasekunene kukho umzobo obonisa i-through-hole emva kwe-BackDrill, obonisa ukubhoboza ukusuka kumaleko asezantsi ukuya kumaleko wesignali apho kukho khona umkhondo.
Itekhnoloji yokubhola ngasemva ingasusa isiphumo se-parasitic capacitance esibangelwa ziziqwenga zodonga lwemingxuma, iqinisekisa ukuhambelana phakathi kwentambo kunye ne-impedance kumngxuma odlulayo kwikhonkco letshaneli, inciphisa ukubonakaliswa kwesignali, ngaloo ndlela iphucula umgangatho wesignali.
I-Backdrill okwangoku yeyona teknoloji ingabizi kakhulu, eyona isebenzayo ekuphuculeni ukusebenza kothumelo lwetshaneli. Ukusetyenziswa kweteknoloji yokubhola emva kuya kunyusa iindleko zemveliso ye-PCB ukuya kuthi ga kwinqanaba elithile.
Uhlu lweSinye iBhodi yokubhola umqolo
Ukubhola ngasemva kuqulathe iintlobo ezimbini: ukubhola ngasemva okumacala omabini kunye nokubhola ngasemva okumacala omabini.
Ukubhola ngamacala omabini kunokwahlulwahlulwa kube kukubhola ngasemva ukusuka kumphezulu ophezulu okanye kumphezulu osezantsi. Umngxuma we-PIN we-plug pin yesixhumi unokubhola ngasemva kuphela ukusuka kwicala elichasene nobuso apho kukho khona i-connection. Xa izihlanganisi zesignali ezikhawulezayo zibekwe kwiindawo eziphezulu nasezantsi ze-PCB, kufuneka ukubhola ngasemva okumacala amabini.
Iingenelo zokubhola umva
1) Nciphisa ukuphazamiseka kwengxolo;
2) Ukuphucula ukuthembeka kwesiginali;
3) Ubukhulu bebhodi yendawo buyancipha;
4) Nciphisa ukusetyenziswa kwe-bidden/blind via ukunciphisa ubunzima bokuveliswa kwe-PCB.
Yintoni indima yokubhoboza umva?
Umsebenzi wokugrumba ngasemva kukugrumba iindawo ezingenamngxuma ongenalo naluphi na unxibelelwano okanye umsebenzi wokudlulisa ukuze kuthintelwe ukubonakaliswa, ukusasazeka, ukulibaziseka, njl.njl. kudluliselo lwesignali oluhamba ngesantya esiphezulu.
Inkqubo yokubhola umva
a. Kukho imingxunya yokubeka izinto kwi-PCB, esetyenziselwa ukubeka izinto kwindawo yokuqala yokugrumba kunye nokugrumba imingxunya yokuqala ye-PCB;
b. I-PCB ibekwe nge-electroplate emva kokugrumba umngxuma wokuqala, kwaye ifilimu eyomileyo ivale umngxuma wokubeka indawo ngaphambi kokuba ibekwe nge-electroplate;
c. Yenza ipateni yangaphandle kwi-PCB efakwe i-electroplated;
d. Yenza ipateni ye-electroplating kwi-PCB emva kokwenza ipateni yomaleko wangaphandle;
e. Sebenzisa umngxuma wokubeka indawo osetyenziswe xa kwakugrunjwa okokuqala ukuze kugrunjwe ngasemva, kwaye usebenzise i-drill blade ukuze kugrunjwe ngasemva;
f. Hlamba umngxuma ongasemva ogqojoziweyo ngamanzi ukuze ususe nayiphi na inkunkuma eseleyo yokugqobhoza ngaphakathi.
