Ukuhlaziywa kobuchwepheshe bokubhoboza emuva kumklamo we-PCB osheshayo

Okokuqala, izingxenye zesixhumanisi sokuxhumana esisheshayo yilezi:

(1) Ukupakishwa kwe-chip: Ngokuvamile, ububanzi bezintambo ze-PCB ngaphakathi kwe-substrate yokupakishwa kwe-chip buncane kakhulu kunobe-PCB evamile, okwenza kube nzima ukulawula i-impedance;

(2) I-PCB nge: I-PCB nge ngokuvamile iyimiphumela enamandla ene-impedance ephansi, futhi kufanele ibe yiyo egxile kakhulu futhi elungiselelwe kahle ekwakhiweni kwe-PCB;

(3) Isixhumi: Ukwakheka kwesixhumanisi sokuxhumanisa sethusi ngaphakathi kwesixhumi kuthonywa kokubili ukuthembeka komshini kanye nokusebenza kukagesi, ngakho-ke kufanele kufune ibhalansi phakathi kwalokhu okubili.

I-PCB via ivame ukuklanywa njengemigodi edlulayo (kusukela phezulu kuya kwesendlalelo esingezansi). Lapho umugqa we-PCB oxhumanisa i-via uqondiswa eduze kwesendlalelo esiphezulu, kuzovela ukuhlukana "kwe-stub" nge-via yesixhumanisi sokuxhumanisa i-PCB, okubangela ukubonakaliswa kwesignali futhi kuthinte ikhwalithi yesignali. Leli thonya linomthelela omkhulu kumasignali ngesivinini esiphezulu.

Ubuchwepheshe bokubhoboza emuva bubhekisela ekusetshenzisweni kwezindlela zokubhoboza zokulawula ukujula, kusetshenziswa indlela yesibili yokubhoboza ukubhoboza izindonga zembobo ye-Stub yesixhumi noma isignali nge.

Njengoba kuboniswe esithombeni esingezansi, ngemva kokwakheka kwembobo edlulayo, i-Stub eyengeziwe yembobo edlulayo ye-PCB isuswa ngokubhoboza kwesibili "ohlangothini olungemuva". Yiqiniso, ububanzi be-backdrill bit kufanele bube bukhulu kunosayizi wembobo edlulayo, futhi izinga lokubekezelela ukujula kwenqubo yokubhoboza kufanele lisekelwe esimisweni "sokungalimazi ukuxhumana phakathi kwembobo ye-PCB kanye nezintambo", ukuqinisekisa ukuthi "ubude be-stub obusele buncane ngangokunokwenzeka", okubizwa ngokuthi "ukubhoboza kokulawula ukujula".

Umdwebo wesimiso sesigaba se-BackDrill esingena emgodini

Okungenhla kuyidayagramu ehleliwe yesigaba se-BackDrill esinembobo edlulayo. Uhlangothi lwesobunxele luyi-signal evamile enembobo edlulayo, ngakwesokudla kune-schematic diagram ye-through-hole ngemuva kwe-BackDrill, ekhombisa ukubhoboza kusukela kungqimba engezansi kuze kube ngqimba yesignali lapho kutholakala khona umkhondo.

Ubuchwepheshe bokubhoboza ngemuva bungasusa umphumela we-parasitic capacitance obangelwa yizimbobo zodonga lwembobo, kuqinisekiswe ukuvumelana phakathi kwezintambo kanye ne-impedance embobeni exhumanisweni lwesiteshi, kunciphisa ukubonakaliswa kwesignali, ngaleyo ndlela kuthuthukiswe ikhwalithi yesignali.

I-Backdrill okwamanje ubuchwepheshe obusebenzisa imali eningi kakhulu obusebenza kahle kakhulu ekuthuthukiseni ukusebenza kokudlulisa iziteshi. Ukusetshenziswa kobuchwepheshe bokubhoboza emuva kuzonyusa izindleko zokukhiqiza i-PCB ngezinga elithile.

Ukubhoboza ngemuva kunezinhlobo ezimbili: ukubhoboza ngemuva okunezinhlangothi ezimbili kanye nokubhoboza emuva okunezinhlangothi ezimbili.

Ukubhoboza ohlangothini olulodwa kungahlukaniswa kube ukubhoboza ngemuva kusuka phezulu noma phansi. Imbobo ye-PIN yephini yokuxhuma ingabhobozwa ngemuva kuphela kusukela ohlangothini oluphambene nobuso lapho uxhumano lukhona. Uma izixhumi zesignali zesivinini esikhulu zihlelwe kokubili phezulu naphansi kwe-PCB, kudingeka ukubhoboza emuva okunezinhlangothi ezimbili.

1) Nciphisa ukuphazamiseka komsindo;

2) Thuthukisa ubuqotho besiginali;

3) Ubukhulu bebhodi lendawo buyehla;

4) Nciphisa ukusetshenziswa kwe-bidden/blind via ukuze unciphise ubunzima bokukhiqizwa kwe-PCB.

Iyini indima yokubhoboza ngemuva?

Umsebenzi wokubhoboza ngemuva ukubhoboza izingxenye ezinezimbobo ezingenalo uxhumano noma umsebenzi wokudlulisa ukuze kugwenywe ukubonakaliswa, ukuhlakazeka, ukubambezeleka, njll. ekudlulisweni kwesignali ngesivinini esikhulu.

Inqubo yokubhoboza ngemuva

a. Kunezimbobo zokubeka ku-PCB, ezisetshenziselwa ukubeka kokuqala kokubhoboza kanye nokubhoboza imbobo yokuqala ye-PCB;

b. I-PCB ibekwe nge-electroplate ngemva kokubhoboza imbobo yokuqala, bese ifilimu eyomile ivala imbobo yokuma ngaphambi kokufakwa nge-electroplate;

c. Dala iphethini yangaphandle ku-PCB efakwe ngogesi;

d. Yenza i-electroplating yephethini ku-PCB ngemuva kokwakha iphethini yesendlalelo sangaphandle;

e. Sebenzisa imbobo yokubeka indawo esetshenziswe yi-drill yokuqala yokubeka i-back drill, bese usebenzisa i-drill blade yokubeka i-back drill;

f. Geza umgodi obholiwe ngemuva ngamanzi ukuze ususe noma yikuphi ukungcola okusele okubholiwe ngaphakathi.