PCB uas muab tso rau hauv

Ib lub PCB embedded yog ib lub circuit board nrog cov khoom siv hluav taws xob (xws li cov chips, resistors, thiab capacitors) ncaj qha embedded rau hauv nws cov txheej sab hauv, txo qhov loj me thiab txhim kho kev ua tau zoo.

Cov PCBs uas muab tso rau hauv lub cev tuaj yeem faus qee cov khoom kom txo qhov chaw nyob thiab ua kom cov teeb liab luv dua; cov khoom ntawm cov PCBs ib txwm muaj feem ntau yog ntsia rau saum npoo.

Haum rau cov xwm txheej uas muaj qhov xav tau siab rau qhov loj me thiab kev ua tau zoo, xws li cov xov tooj ntse, cov khoom siv hnav tau, cov radars tsheb, thiab cov khoom siv aerospace.

Kev tshuaj xyuas qhov yuav tsum tau ua → Tsim qauv schematic → Kev npaj layout (suav nrog cov khoom embedded) → Tsim routing (tsom mus rau kev ncaj ncees ntawm lub teeb liab) → Kev kuaj xyuas txoj cai tsim → Cov ntaub ntawv tso tawm ntawm lub rooj tsavxwm.

Xav txog qhov dielectric constant, loss factor, thiab thermal expansion coefficient. Rau cov ntawv thov zaus siab, xaiv cov khoom siv dielectric-constant qis thiab cov khoom poob qis; rau qhov ruaj khov thermal siab, xaiv cov khoom siv nrog cov coefficients thermal expansion qis.

Tsim cov khoom raws li cov modules ua haujlwm kom luv cov kev teeb liab; faib cov khoom tsim cua sov kom tshem tawm cua sov; tso cov khoom rhiab heev kom deb ntawm cov chaw suab nrov; xav txog qhov ua tau ntawm cov txheej txheem.

Cov resistors yog ua los ntawm kev ntxiv cov khoom siv resistive rau hauv txheej dielectric; capacitors siv cov khoom siv high-dielectric coated rau ntawm cov ntawv ci tooj liab lossis cov substrates; inductors raug pom los ntawm cov kauv sib txuas ntawm cov khaubncaws sab nraud povtseg.

Xyuas kom muaj kev sib txuas hluav taws xob txhim khu kev qha, xav txog kev tso cua sov tawm, kev kuaj tau, thiab kev saib xyuas tau, thiab ua raws li cov lus qhia tsim ntawm cov chaw tsim khoom siv chip.

Npaj lub zog thiab cov txheej hauv av raws li kev siv zog, xyuas kom meej tias lub zog ntawm lub dav hlau muaj kev ncaj ncees, txo qhov tsis kam sab hauv thiab qhov hluav taws xob poob qis, thiab muab lub zog ruaj khov.

Tswj qhov ntev ntawm cov kab, teeb tsa qhov dav ntawm cov kab thiab qhov sib nrug kom tsim nyog kom txo qhov crosstalk, phim qhov impedance rau cov teeb liab ceev ceev, thiab txo qhov cuam tshuam ntawm cov kev teeb tsa parasitic.

Nyob ntawm cov ntaub ntawv thiab kev tsim qauv kev taw qhia, nws tuaj yeem ncav cuag ntau Gbps lossis siab dua nrog kev tsim qauv zoo, xws li ntau dua 10 Gbps hauv cov khoom siv sib txuas lus siab.

Siv cov qauv zoo li cov qauv kab microstrip (Z0 = (87/√(εr+1.41))×ln(5.98H/(0.8W+T))) lossis cov qauv kab stripline, lossis siv software tsim qauv rau kev xam.

Cuam tshuam los ntawm kev poob ntawm cov khoom siv (dielectric/conductor loss), qhov ntev ntawm cov kab, zaus ntawm lub teeb liab, tus lej ntawm vias, thiab impedance mismatch.

Cais cov qauv hluav taws xob analog thiab digital, tiv thaiv cov teeb liab rhiab heev, xyuas kom meej tias lub zog thiab cov dav hlau hauv av muaj kev ncaj ncees, siv cov voj voog lim dej, thiab ua kom zoo dua cov kab kom txo qhov chaw voj voog.

Teeb tsa cov dav hlau loj hauv av, ua kom cov kev sib txuas hauv av ntau ntxiv, ua kom cov kev sib txuas hauv av luv dua, thiab xaiv ib qho/ntau qhov/hybrid grounding raws li zaus.

Tshuaj xyuas cov kev teeb tsa xws li lub zog fais fab network impedance, voltage poob, thiab tam sim no faib los ntawm software simulation los ntsuas qhov cuam tshuam thiab ua kom zoo dua.

Muaj peev xwm tiv thaiv kev cuam tshuam zoo, tswj kev cuam tshuam hom sib xws, txhim kho tus nqi kis thiab kev ntseeg tau, thiab pab txhawb kev xa xov ceev.

Tswj qhov ntev sib phim (qhov sib txawv ≤ 10% ntawm qhov deb kis tau sib raug rau ntug ntawm lub teeb liab nce), qhov dav thiab qhov sib nrug sib npaug, kev tswj hwm impedance (piv txwv li, 100Ω), thiab zam kev sib tham.

Txo qhov loj ntawm qhov txuas, nce qhov tiv thaiv ncoo, ntxiv qhov txuas av nyob ib puag ncig, thiab tswj qhov sib piv ntawm qhov sib piv (≤6).

Ua qhov kev ntsuas qhov tseeb ntawm lub teeb liab, qhov tseeb ntawm lub zog, thiab kev tshuaj xyuas EMI simulation, thiab sim cov qauv prototypes (piv txwv li, siv cov network analyzers thiab oscilloscopes).

Txiav txim siab los ntawm qhov siab ntawm cov khoom, tus naj npawb ntawm cov khaubncaws sab nraud povtseg, lub zog kho tshuab, thiab cov xwm txheej ntawm daim ntawv thov, xws li 0.5-1.5mm rau cov xov tooj ntawm tes PCBs thiab 1.6-3.2mm rau cov khoom siv hauv kev lag luam.

Xav txog kev sib dhos nrog lwm cov khoom, lub zog kho tshuab, qhov chaw tso cua sov tawm, thiab qhov cuam tshuam ntawm kev ntxig cov khoom rau kev ua haujlwm kho tshuab.

Tsim cov khoom tsim cua sov kom tsim nyog, ntxiv cov kav dej cua sov (piv txwv li, cov qhov cua sov, cov ntawv ci tooj liab), xaiv cov khoom siv thermal conductivity siab, ntxiv cov khoom siv cua sov yog tias tsim nyog, thiab ua kom zoo dua los ntawm kev sim thermal.

Cov txheej txheem feem ntau suav nrog kev kho cov ntsia hlau, kev kho qhov clip, thiab kev kho vuam, tsim nyog rau kev saib xyuas siab, kev teeb tsa yooj yim, thiab kev ruaj khov siab, raws li.

Txhim kho lub zog kho tshuab los ntawm kev ua kom tuab ntawm daim ntawv lossis ntxiv cov khoom tawv, faib qhov hnyav kom sib npaug, siv cov ntaub ntawv nqus kev co rau kev thaiv, thiab txhawb cov khoom tseem ceeb.

Sib phim lub plhaub ntawm lub cuab yeej, tsis txhob muaj cov npoo ntse, xav txog cov txheej txheem tsim khoom (piv txwv li, txiav, stamping), thiab tsim cov qauv coj ua ke.

Siv cov xim uas tiv tau peb yam, siv cov khoom sib txuas uas tsis ntub dej, ua kom ruaj khov, thiab tsis txhob muab cov khoom tseem ceeb tso rau hauv cov chaw uas muaj dej/hmoov av thaum lub sijhawm teeb tsa.

Qhov kub siab yuav ua rau lub rooj tsavxwm nthuav dav thiab cov khoom sib txawv; qhov kub qis yuav ua rau cov ntaub ntawv tawg yooj yim. Cov PCBs qib kev lag luam ua haujlwm ntawm -40 ℃ ~ 85 ℃, nrog rau cov kev cai nruj dua rau qib tub rog.

Tshuaj xyuas qhov deformation thiab kev faib tawm ntawm kev ntxhov siab los ntawm kev sim ua kom muaj kev ntxhov siab, thiab ua qhov kev ntsuam xyuas kev cuam tshuam, kev co, thiab kev ntsuam xyuas kev laus mus sij hawm ntev.

Cov ntaub ntawv sib txawv muaj lub zog sib txawv thiab cov coefficients thermal expansion sib txawv. Piv txwv li, FR-4 muaj kev ua tau zoo tag nrho tab sis muaj cov coefficient thermal expansion siab dua, thaum cov ntaub ntawv polyimide muaj kev ruaj khov thermal thiab lub zog zoo dua.

Cov PCBs uas muab tso rau hauv lub tshuab (embedded PCBs) xav tau cov txheej txheem ntxiv rau kev muab cov khoom tso rau hauv lub tshuab, xws li kev tsim cov qauv sib txuas thiab kev lamination kom meej dua, nrog rau qhov yuav tsum tau ua kom raug thiab plating kom raug dua.

Xws li lamination, micro-via processing (aperture ≤50μm), component embedding, thiab surface treatment (piv txwv li, kub plating, tin spraying).

Qhia meej txog kev kam rau ua kom raug hauv kev tsim qauv, siv cov khoom siv siab (xws li CNC drilling machines), thiab ua kev tshuaj xyuas qhov ntev thiab kev hloov kho cov txheej txheem hauv txhua txoj kev ua haujlwm.

Tshuaj xyuas cov khoom siv raw (cov laug cam, cov khoom), saib xyuas cov txheej txheem lamination/drilling/plating, siv X-ray thiab kev sim ya los ntes cov kev sib txuas sab hauv thiab kev ua haujlwm hluav taws xob, thiab ua qhov kev tshuaj xyuas tag nrho ntawm cov khoom tiav.

Cov npuas lamination / delamination, drilling misalignment / qhov tsis sib npaug, kev sib txuas ntawm cov khoom tsis zoo / luv luv circuit, kev kho qhov chaw tsis zoo, qhov sib txawv ntawm qhov ntev, thiab lwm yam.

Txhim kho qhov kub thiab txias, siab, thiab lub sijhawm ntawm lamination, kho cov laug cam ua ntej kom tshem tawm cov dej noo thiab cov khoom tsis huv, thiab siv lub tshuab nqus tsev lamination kom tshem tawm huab cua.

Siv cov khoom siv drilling precision siab los tswj cov kev teeb tsa, ua micro-etching ntawm phab ntsa qhov kom txhim kho qhov nplaum ntawm tooj liab, thiab ntes qhov zoo los ntawm kev faib metallographic.

Tshuaj ntsuam thiab sim cov khoom ua ntej muab tso rau hauv, ua kom zoo dua cov txheej txheem muab tso rau hauv kom ntseeg tau tias muaj kev sib txuas ruaj khov, thiab ua cov kev sim hluav taws xob thiab kev sim kev ntseeg tau tom qab tsim khoom.

Cuam tshuam los ntawm tus nqi khoom siv (cov khoom siv ua tau zoo kim dua), qhov nyuaj ntawm cov txheej txheem (piv txwv li, micro-vias, kev muab cov khoom tso rau hauv), qhov ntau ntawm cov khoom tsim tawm, thiab tus nqi tshuaj xyuas.

Tshawb nrhiav lub zog ntawm kev siv tshuab (khoom siv, cov txheej txheem), cov txheej txheem tswj xyuas zoo, cov ntaub ntawv tsim khoom, cov neeg siv khoom tshuaj xyuas, cov lus hais, thiab lub sijhawm xa khoom.

Xws li kev tshuaj xyuas pom, kev kuaj hluav taws xob (multimeter, oscilloscope, network analyzer), kev kuaj ua haujlwm, kev tshuaj xyuas X-ray, kev kuaj ya, thiab lwm yam.

Siv lub txaj ntsia hlau ntawm lub cuab yeej ICT los kov cov ntsiab lus sim thiab nrhiav cov yam ntxwv hluav taws xob ntawm cov khoom, cov voj voog luv luv, cov voj voog qhib, cov yam ntxwv sib txawv, thiab lwm yam. Cov ntsiab lus sim yuav tsum tau tshwj tseg rau hauv tus qauv tsim.

Ua qauv qhia qhov chaw ua haujlwm tiag tiag, sim ua haujlwm kom tiav, ua raws li qhov kev txiav txim ntawm qhov yooj yim mus rau qhov nyuaj, thiab sau thiab tshuaj xyuas qhov tsis zoo.

Siv lub JTAG interface los ua haujlwm rau cov hlwb sab hauv ntawm lub chip, nrhiav cov pin states thiab cov kev sib txuas ntawm cov chip, thiab txheeb xyuas cov qhov yuam kev qhib thiab luv luv.

Ua ntej saib seb qhov twg zoo li cas (cov khoom kub hnyiab, cov pob qij txha tawg), tom qab ntawd ua qhov kev sim hluav taws xob kom nqaim qhov ntau ntawm qhov txhaum, tshuaj xyuas qhov txuas uas yuav muaj raws li daim duab qhia, thiab siv txoj kev hloov pauv los txiav txim siab qhov txhaum.

Siab dua, vim tias cov khoom sib xyaw ua ke nyob rau hauv cov txheej sab hauv. Yuav tsum tau ua tib zoo tshem cov txheej sab saud kom pom qhov txhaum, rov ua dua kom rov qab zoo tom qab kev saib xyuas, thiab zam kev cuam tshuam rau lwm lub voj voog.

Siv cov cuab yeej ua haujlwm siab xws li cov khoom siv vuam me me thiab cov tweezers ua haujlwm raug. Npaj txoj kev saib xyuas ua ntej thiab siv cua sov hauv zos kom tswj tau qhov kub.

Ua kev ntsuam xyuas hluav taws xob (kev ruaj khov ntawm lub teeb liab, kev ruaj khov ntawm lub zog), kev ntsuam xyuas kev ua haujlwm, thiab kev ntsuam xyuas kev ntseeg tau (kev laus, kev co).

Tsim cov phiaj xwm kuaj, cov txheej txheem kuaj mob qhov txhaum, cov lus qhia txog kev ua haujlwm txij nkawm, thiab cov txheej txheem txheeb xyuas qhov zoo.

Cov khoom siv kuaj: multimeter, oscilloscope, network analyzer, thiab lwm yam. Cov khoom siv txij nkawm: cov khoom siv vuam me me, phom cua kub, thiab lwm yam.

Xav txog qhov tseeb ntawm qhov tsis kam, qhov ntsuas hluav taws xob, thiab qhov kub thiab txias. Xaiv cov resistors raws li qhov yuav tsum tau ua ntawm lub voj voog.

Siv rau kev lim dej, kev sib cais, kev khaws cia lub zog, kev sib txuas teeb liab, thiab lwm yam.

Txheeb xyuas raws li zaus ua haujlwm, inductance, thiab lub peev xwm tam sim no. Rau kev lim fais fab, xav txog ripple thiab load current.

Xav txog kev ua tau zoo, kev siv hluav taws xob, hom pob khoom, kev ntseeg tau, thiab kev txhawb nqa los ntawm cov chaw tsim khoom.

Sib phim cov yam ntxwv hluav taws xob thiab qhov loj ntawm lub cev thaum lub sijhawm tsim qauv. Xaiv cov khoom sib xws nrog cov ntaub ntawv thiab cov txheej txheem ntawm lub rooj tsavxwm, thiab ua qhov kev txheeb xyuas simulation.

Rau cov khoom siv tsis ua haujlwm, tswj qhov kub thiab lub sijhawm kom tiv thaiv kev sib txuas txias. Rau cov khoom siv nquag, siv cov khoom siv siab (piv txwv li, reflow soldering) kom ntseeg tau tias muaj kev sib txuas zoo thiab tiv thaiv kev puas tsuaj los ntawm cua sov.

Kwv yees lub neej ntev los ntawm kev sim kev laus sai, cov ntaub ntawv ntawm cov chaw tsim khoom, thiab kev saib xyuas ntev ntawm cov ntaub ntawv ua tsis tiav tiag tiag.

Kev tsis kam: tus nqi hloov pauv / qhib hluav taws xob. Capacitor: xau / luv hluav taws xob. Inductor: inductance hloov pauv / winding luv. Chip: ua haujlwm tsis zoo / pin faults.

Khaws cia raws pawg nrog kev tiv thaiv dej noo thiab ESD. Tswj kom muaj ib lub txheej txheem khaws cia cov khoom muag kom sau cov ntaub ntawv, ua cov qauv tsis tu ncua, thiab tswj cov khoom muag kom tsim nyog.

Ua kom qhov nrug ntawm cov kab sib txawv (≥3 × dav), siv kev cais av, ua kom zoo dua qhov kev taw qhia topology, thiab phim impedance.

Qhia txog cov kev teeb tsa parasitic, tej zaum yuav ua rau poob thiab qeeb ntawm cov zaus siab. Vias rau cov teeb liab saum 10GHz yuav tsum muaj txoj kab uas hla

Ntxiv cov khoom siv tiv thaiv ESD (piv txwv li, TVS diodes), teeb tsa txoj kev tawm ESD, thiab khaws cov cim qhia tseem ceeb ≥2mm ntawm ntug ntawm lub rooj tsavxwm.

Siv X-ray los tshuaj xyuas cov pob qij txha sab hauv. Qhov siab ntawm qhov sib koom ua ke yuav tsum yog 0.4-0.6 hli, nrog rau qhov tsis muaj dab tsi ≤15%.

ENIG rau kev siv zaus siab thiab kev vuam raug. OSP rau tus nqi qis (siv tau 6-8 lub hlis). Cov hlau nplaum rau kev vuam nthwv dej.

Tsim cov ntaub thaiv npog kom zoo nrog qhov impedance grounding

Txoj kab uas hla 0.3-0.5 hli, qhov sib nrug ≤1 hli, ≥100 vias/cm² kom ntseeg tau tias muaj cua sov dissipation zoo.

Cov kab ntaub ntawv DDR4: qhov ntev kam rau siab ± 5mil. PCIe sib txawv khub: ± 2mil.

Ntxiv cov decoupling capacitors (0.1μF rau qhov zaus siab, 10μF rau qhov zaus qis). Khaws qhov sib nrug ntawm lub zog/txheej av kom tsawg dua 0.1 hli.

Tus qauv IPC: ≤0.7% rau cov txheej txheem tsis muaj hmoov txhuas, ≤0.5% hauv thaj chaw BGA.

Siv cov dynamic voltage scaling, txo lub zog ntawm cov modules uas tsis ua haujlwm, thiab xaiv cov chips uas tsis muaj IQ (piv txwv li, TI MSP430 series).

Txo qhov poob ntawm cov teeb liab thiab cov kab mob parasitic, ua rau kom muaj kev ceev ntawm txoj kev. Tus nqi siab dua 20% -30% dua li qhov hla qhov.

Siv cov cuab yeej CAM350 lossis Altium DFM los xyuas qhov dav/qhov sib nrug tsawg kawg nkaus (≥6mil), qhov sib piv ntawm sab (≤8:1), thiab lwm yam.

Cov txheej txheem siv ntau: xim pleev peb txheej (tuab 0.1-0.3 hli), nano-txheej (

Siv cov qauv tsim uas kiv cua tawm los txo qhov siab ntawm BGA. Cov laug cam 4-txheej haum rau 80% ntawm cov kev xav tau ib txwm muaj; ≥6 txheej rau cov qauv tsim ceev ceev.

Xyuas kom huv ntawm daim ntaub, qhov tuab ntawm cov tshuaj nplaum (0.12-0.15mm), thiab qhov kub ntawm kev rov ua dua (qhov siab tshaj plaws 235-245 ℃).

Siv lub ntsuas hluav taws xob 500V. Kev tiv thaiv rwb thaiv tsev yuav tsum yog ≥100MΩ ntawm qhov av noo ≤60%.

Siv cov resistors termination (piv txwv li, DDR ODT function) thiab impedance tapering. Xyuas kom meej tias impedance variation

1oz tooj liab (35μm): ~1A/mm qhov dav ntawm cov kab. 2oz: ~1.5A/mm (kub nce

Xim dub pab kom cua sov tawm tab sis nyuaj rau tshuaj xyuas. Xim ntsuab yog feem ntau. Xim dawb muaj kev cuam tshuam siab (≈80%).

Feem ntau txoj kab uas hla: 0.4-0.8 hli. Qhov siab: 0.5-1.0 hli. Qhov siab 0.5 hli xav tau cov khoom siv 0201.

Siv cov software simulation zoo li ANSYS, raws li qhov sib txawv ntawm CTE (piv txwv li, FR-4 15ppm/℃, tooj liab 17ppm/℃).

Siv ntau theem lim dej (π-hom circuits). Lub zog ntsuas ≥20mil dav kom txo qhov impedance ntawm txoj kev.

Txoj kab uas hla ≥0.6 hli, qhov sib nrug ≥1.27 hli. Qhov chaw tiav ENIG, tsis muaj lub npog ntsej muag solder.

Thaj tsam voj voog teeb liab ib zaug xwb

Siv SI9000 los xam qhov impedance, tswj kev kam rau siab ± 10%. Siv kev sib phim xaus thiab kev ua kom zoo dua ntawm topology.

Cov duab qhia: ±0.1 hli. Txoj kab uas hla ntawm qhov: ±0.05 hli. Qhov tob ntawm V-Cut: 1/3-2/3 ntawm qhov tuab ntawm daim ntawv.

Siv cov kab sib txuas uas sib phim qhov ntev ntawm serpentine nrog rau kev tiv thaiv hauv av. Khaws kom deb ntawm cov kab ntaub ntawv ceev ceev thiab tsis txhob hla cov txheej.

Ua qhov kev sim kev laus sai (85 ℃ / 85% RH, 1000h) thiab kev sim kev co (5-500Hz, 2G kev nrawm).

Qhov loj ntawm lub ncoo 0.1-0.2 hli loj dua li cov xov hlau sib txuas. Qhov dav ntawm lub ncoo SMD 1.2-1.5 × qhov dav ntawm cov xov hlau.

Ua kom thaj chaw tooj liab kub dua, siv cov nplaum kub (≥1W/mK), thiab qhib qhov chaw kub hauv qab cov khoom siv fais fab.

Raws li IEC 61000-4-2: kev sib cuag tso tawm ± 8kV, cua tso tawm ± 15kV, nrog kev ua haujlwm ib txwm muaj.

Feem ntau tuab yog 15-25μm. Yuav tsum npog tag nrho cov tooj liab kom tiv thaiv cov xov tooj liab uas raug luv luv.

Ua ke interactive thiab auto-routing. Teem cov routing priorities, nrog rau cov teeb liab tseem ceeb routed ua ntej.

Ua ntej cua sov: 120-150 ℃ (60-90s). Rov ua dua: 217-230 ℃ (40-60s). Tus nqi txias: 3-6 ℃ / s.

Kev sib txuas ib qho los yog ntau qhov. Kev sib txuas ntau qhov rau cov voj voog siab (> 10MHz), nrog rau kev tiv thaiv av

Xav txog lub peev xwm tam sim no, kev tiv thaiv kev sib cuag (

Saib xyuas cov pob qij txha ntawm Metallographic seem (metallographic sectioning), nrhiav pom qhov tsis zoo ntawm qhov chaw nrog AOI, tshuaj xyuas cov khoom sib xyaw nrog XRF.

Qhov nrug 5mil, impedance 100 ± 10Ω, qhov ntev sib txawv