I-PCB Eshumekiwe

I-PCB ehlanganisiwe iyibhodi lesifunda elinezingxenye ze-elekthronikhi (ezifana nama-chips, ama-resistors, nama-capacitor) ezifakwe ngqo ezingqimbeni zalo zangaphakathi, okunciphisa usayizi nokuthuthukisa ukusebenza.

Ama-PCB afakiwe angafihla ezinye izingxenye ukuze kuncishiswe ukutholakala kwesikhala futhi kufinyezwe izindlela zesignali; izingxenye kuma-PCB avamile zifakwa kakhulu endaweni engaphandle.

Ifanele izimo ezinezidingo eziphezulu zosayizi nokusebenza, njengama-smartphone, amadivayisi agqokwayo, ama-radar ezimoto, kanye nemishini yezindiza.

Ukuhlaziywa kwezidingo → ukwakheka kweshejuli → ukuhlela ukwakheka (kufaka phakathi izingxenye ezifakiwe) → ukwakheka komzila (gxila ekuthembekeni kwesignali) → ukuhlolwa komthetho wokuklama → ukuphuma kwefayela lebhodi.

Cabanga ngokungaguquki kwe-dielectric, i-loss factor, kanye ne-thermal expansion coefficient. Ngezinhlelo zokusebenza ezivame kakhulu, khetha izinto ezihlala njalo nge-dielectric kanye nezinto ezilahlekelwa kancane; ukuze uthole ukuzinza okuphezulu kwe-thermal, khetha izinto ezine-thermal expansion coefficients eziphansi.

Ukubeka izingxenye ngamamojula asebenzayo ukuze kufinyezwe izindlela zesignali; ukusabalalisa izingxenye ezikhiqiza ukushisa ukuze kuqedwe ukushisa; beka izingxenye ezizwelayo kude nemithombo yomsindo; cabanga ngokwenzeka kwenqubo.

Ama-resistors enziwa ngokungeza izinto zokumelana nesendlalelo se-dielectric; ama-capacitor asebenzisa izinto ezine-dielectric ephezulu ezimbozwe ku-foil yethusi noma kuma-substrate; ama-inductor atholakala ngama-spiral coils phakathi kwezingqimba.

Qinisekisa ukuxhumeka kukagesi okuthembekile, cabanga ngokushabalalisa ukushisa, ukuhlolwa, kanye nokugcinwa kahle, bese ulandela iziqondiso zokuklama zabakhiqizi bama-chip.

Hlela izendlalelo zamandla nomhlabathi ngokuya ngokusetshenziswa kwamandla, qinisekisa ubuqotho bendiza yamandla, wehlise ukumelana kwangaphakathi kanye nokwehla kwamandla kagesi, futhi unikeze ukunikezwa kwamandla okuzinzile.

Lawula ubude bomkhondo, setha ububanzi bomkhondo kanye nesikhala ngokufanele ukuze unciphise ukukhuluma okuphambene, uvumelanise ukuvinjelwa kwezibonakaliso zesivinini esikhulu, futhi unciphise umthelela wamapharamitha e-parasitic.

Kuye ngezinto zokwakha kanye nomklamo womzila, ingafinyelela ama-Gbps amaningana noma ngaphezulu ngomklamo ofanele, njenge-Gbps engaphezu kwe-10 kumadivayisi okuxhumana aphezulu.

Sebenzisa amafomula afana nefomula yomugqa we-microstrip (Z0 = (87/√(εr+1.41))×ln(5.98H/(0.8W+T))) noma amafomula e-stripline, noma sebenzisa isofthiwe yokuklama yokubala.

Kuthintekile ukulahleka kwezinto (ukulahlekelwa yi-dielectric/conductor), ubude bomkhondo, imvamisa yesiginali, inani lama-via, kanye nokungafani kwe-impedance.

Hlukanisa ukwakheka kwesekethe ye-analog neyedijithali, uvikele amasignali azwelayo, uqinisekise ubuqotho bamandla nezindiza zomhlaba, sebenzisa isekethe yokuhlunga, futhi uthuthukise ama-trace ukuze unciphise indawo ye-loop.

Setha izindiza ezinkulu zokumisa umhlabathi, wandise izivikelo zokumisa umhlabathi, mfushane izindlela zokumisa umhlabathi, bese ukhetha ukumisa umhlabathi okunephuzu elilodwa/amaphuzu amaningi/okuhlanganisiwe ngokwemvamisa.

Hlaziya amapharamitha anjengokuvinjelwa kwenethiwekhi yamandla, ukwehla kwamandla kagesi, kanye nokusatshalaliswa kwamanje ngesofthiwe yokulingisa ukuze uhlole imiphumela futhi wenze ngcono.

Amandla aqinile okulwa nokuphazamiseka, ukucindezela ukuphazamiseka kwemodi evamile, ukuthuthukisa izinga lokudlulisa kanye nokuthembeka, kanye nokwenza lula umzila onabantu abaningi.

Gcina ukufana kobude (umehluko ≤ 10% webanga lokudlulisela elihambisana nomkhawulo wokuphakama kwesignali), ububanzi bomkhondo obufanayo kanye nesikhala, ukuvimbela kokulawula (isb., 100Ω), futhi ugweme ukukhuluma ngokuphambana.

Nciphisa ngosayizi, wandise i-anti-pad, engeza ama-grounding via azungezile, bese ulawula isilinganiso se-aspect (≤6).

Yenza ubuqotho besignali, ubuqotho bamandla, kanye nokuhlaziywa kokulingisa kwe-EMI, bese uhlola ama-prototypes (isb., usebenzisa ama-network analyzers kanye nama-oscilloscopes).

Kunqunywa ukuphakama kwezingxenye, inani lezendlalelo, amandla omshini, kanye nezimo zokusetshenziswa, njenge-0.5-1.5mm yama-PCB efoni ephathekayo kanye ne-1.6-3.2mm yemishini yezimboni.

Cabanga ngokuhlanganiswa nezinye izingxenye, amandla omshini, isikhala sokushabalalisa ukushisa, kanye nomthelela wokushumeka kwezingxenye ekusebenzeni komshini.

Hlela kahle izingxenye ezikhiqiza ukushisa, engeza iziteshi zokushabalalisa ukushisa (isb., imigodi yokushisa, i-foil yethusi), khetha izinto zokushisa eziphezulu, engeza amadivayisi okushabalalisa ukushisa uma kudingeka, futhi ulungiselele ngokulingisa ukushisa.

Izindlela ezivamile zifaka phakathi ukulungisa izikulufo, ukulungisa iziqeshana, kanye nokulungisa ukushisela, okulungele izimo zokunakekelwa okuphezulu, ukufakwa okulula, kanye nezimo zokuzinza okuphezulu, ngokulandelana.

Thuthukisa amandla omshini ngokwandisa ukujiya kwebhodi noma ukwengeza izinto zokuqinisa, ukusabalalisa isisindo ngokulinganayo, ukusebenzisa izinto ezibamba ukushaqeka ukuze zibambe, nokuqinisa izingxenye ezibalulekile.

Qondanisa isikhwama sedivayisi, gwema imiphetho ebukhali, cabanga ngezinqubo zokukhiqiza (isb., ukusika, ukunyathela), bese uklama izakhiwo eziqondisa i-plug-in.

Faka upende ovikela kathathu, sebenzisa izixhumi ezingangeni manzi, yenza ukwelashwa kokuvala, futhi ugweme ukubeka izingxenye ezibalulekile ezindaweni ezivame ukuba namanzi/uthuli ngesikhathi sokuhlelwa.

Amazinga okushisa aphezulu angabangela ukwanda kwebhodi kanye nokukhukhuleka kwepharamitha yezingxenye; amazinga okushisa aphansi angenza izinto zibe buthaka. Ama-PCB ebanga lezimboni asebenza ku--40℃ ~ 85℃, enezidingo eziqinile zezinga lezempi.

Hlaziya ukuguquguquka kanye nokusatshalaliswa kokucindezeleka ngokusebenzisa ukulingisa ukucindezeleka komshini, bese wenza umthelela, ukuhlolwa kokudlidliza, kanye nokuhlolwa kokuguga kwesikhathi eside.

Izinto ezahlukene zinamandla ahlukene okusebenza ngomshini kanye nama-coefficient okwandisa ukushisa. Isibonelo, i-FR-4 isebenza kahle ngokuphelele kodwa i-coefficient yokwandisa ukushisa ephezulu kakhulu, kuyilapho izinto ze-polyimide zinikeza ukuzinza okungcono kokushisa kanye namandla okusebenza ngomshini.

Ama-PCB afakiwe adinga izinqubo ezengeziwe zokushumeka izingxenye, njengokwenziwa kwesakhiwo esiphakathi kwezingqimba kanye ne-lamination enembile kakhudlwana, enezidingo eziphakeme zokubhoboza nokunemba kwe-plating.

Kubandakanya i-lamination, ukucubungula nge-micro-via (i-aperture ≤50μm), ukushumeka kwezingxenye, kanye nokwelashwa kwendawo (isb., i-gold plating, i-tin spray).

Cacisa ukubekezelelana okunembile ekwakhiweni, sebenzisa imishini enembile kakhulu (njengemishini yokubhoboza ye-CNC), futhi wenze ukuhlolwa okuqinile kobukhulu kanye nokulungiswa kwenqubo enkambisweni ngayinye.

Hlola izinto zokusetshenziswa (amabhodi, izingxenye), qapha imingcele ye-lamination/drilling/plating, sebenzisa izivivinyo ze-X-ray kanye ne-flying probe ukuthola ukuxhumana kwangaphakathi kanye nokusebenza kukagesi, bese wenza ukuhlolwa okugcwele kwemikhiqizo eqediwe.

Amabhamuza/ukuhlukaniswa kwe-lamination, ukungalungi kahle kokubhoboza/ukuvulwa okungalingani, ukuxhumana okungekuhle kwezingxenye/ukujikeleza okufushane, ukuphathwa kabi kwendawo, ukuphambuka kobukhulu, njll.

Lungiselela izinga lokushisa le-lamination, ingcindezi, kanye nemingcele yesikhathi, lungisa amabhodi kusengaphambili ukuze ususe umswakama kanye nokungcola, bese usebenzisa i-vacuum lamination ukukhipha umoya.

Sebenzisa imishini yokubhoboza enembile kakhulu ukulawula amapharamitha, wenze i-micro-etching ezindongeni zemigodi ukuze uthuthukise ukunamathela kwe-copper plating, futhi uthole ikhwalithi ngokuhlukanisa i-metallographic.

Hlola futhi uhlole izingxenye ngaphambi kokushumeka, lungisa izinqubo zokushumeka ukuqinisekisa ukuxhumana okuqinile, futhi wenze ukuhlolwa okubanzi kukagesi kanye nokuhlolwa kokuthembeka ngemva kokukhiqizwa.

Kuthintwa yizindleko zezinto (izinto ezisebenza kahle kakhulu zibiza kakhulu), ubunzima benqubo (isb., ama-micro-via, ukushumeka kwezingxenye), inani lokukhiqiza, kanye nezindleko zokuhlola.

Phenya amandla obuchwepheshe (imishini, izinqubo), izinhlelo zokulawula ikhwalithi, amacala okukhiqiza, ukubuyekezwa kwamakhasimende, izingcaphuno, kanye nezikhathi zokulethwa.

Kubandakanya ukuhlolwa okubonakalayo, ukuhlolwa kukagesi (i-multimeter, i-oscilloscope, i-network analyzer), ukuhlolwa kokusebenza, ukuhlolwa kwe-X-ray, ukuhlolwa kwe-flying probe, njll.

Sebenzisa izinzipho zedivayisi ye-ICT ukuze uthinte izindawo zokuhlola futhi uthole amapharamitha kagesi ezingxenye, ama-short circuits, ama-open circuits, ukuphambuka kwamapharamitha, njll. Izindawo zokuhlola kudingeka zigcinwe ekwakhiweni.

Lingisa indawo yokusebenza yangempela, hlola imisebenzi ngokuphelele, ulandele uhlelo lokuhlolwa okuyisisekelo kuya kokuyinkimbinkimbi, bese uqopha futhi uhlaziye okungafani.

Sebenzisa i-interface ye-JTAG ukuze usebenzise amaseli okuskena imingcele yangaphakathi ye-chip, uthole izimo ze-pin kanye nokuxhumeka kwe-inter-chip, futhi uthole amaphutha e-open kanye ne-short circuit.

Okokuqala bheka ukubonakala (izingxenye ezishile, amalunga e-solder aqhekekile), bese wenza izivivinyo zikagesi ukuze unciphise ububanzi bephutha, uhlaziye izixhumanisi ezingaba khona ngokusekelwe ku-schematic, bese usebenzisa indlela yokushintsha ukuze uthole indawo yephutha.

Kuphakeme kakhulu, njengoba izingxenye zisezingqimbeni zangaphakathi. Kudinga ukususa ngokucophelela izingqimba ezingaphezulu ukuze kuvezwe iphuzu lephutha, ukulayishwa kabusha ukuze kubuyiselwe ubuqotho ngemva kokulungiswa, nokugwema ukuthinteka kwezinye izijikelezo.

Sebenzisa amathuluzi anembile kakhulu njengemishini yokushisela enezingodo ezincane kanye nama-tweezers anembile. Hlela uhlelo lokulungisa kusenesikhathi bese usebenzisa ukushisa kwendawo ukulawula izinga lokushisa.

Yenza ukuhlolwa kukagesi (ubuqotho besignali, ubuqotho bamandla), ukuhlolwa kokusebenza, kanye nokuhlolwa kokuthembeka (ukuguga, ukudlidliza).

Thuthukisa izinhlelo zokuhlola, izinqubo zokuxilonga amaphutha, imininingwane yokusebenza kokulungisa, kanye nezinqubo zokuqinisekisa ikhwalithi.

Imishini yokuhlola: i-multimeter, i-oscilloscope, i-network analyzer, njll. Imishini yokulungisa: imishini yokushisela yama-micro-spot, isibhamu somoya oshisayo, njll.

Cabanga ngokunemba kokumelana, isilinganiso samandla, kanye ne-coefficient yokushisa. Khetha ama-resistor ngokusekelwe ezidingweni zesekethe.

Isetshenziselwa ukuhlunga, ukuhlukanisa, ukugcina amandla, ukuhlanganisa isignali, njll.

Thola ngokusekelwe ku-frequency yokusebenza, i-inductance, kanye nomthamo wamanje. Ukuze uthole ukuhlunga kwamandla, cabanga nge-ripple kanye ne-load current.

Cabanga ngokusebenza, ukusetshenziswa kwamandla, uhlobo lwephakheji, ukuthembeka, kanye nokusekelwa komkhiqizi.

Qondanisa amapharamitha kagesi kanye nobukhulu obubonakalayo ngesikhathi sokuklama. Khetha izingxenye ezihambisana nezinto zebhodi kanye nezinqubo, bese wenza ukuqinisekiswa kokulingisa.

Ngezingxenye ezingasebenzi, lawula izinga lokushisa nesikhathi sokuvimbela ukushiswa okubandayo. Ngezingxenye ezisebenzayo, sebenzisa imishini enembile kakhulu (isb., ukushiswa kabusha) ukuqinisekisa ukuxhumana okuthembekile nokuvimbela umonakalo wokushisa.

Linganisela isikhathi sokuphila ngokuhlolwa kokuguga okusheshayo, idatha yomkhiqizi, kanye nokuqapha isikhathi eside idatha yokwehluleka kwangempela.

Ukumelana: ukuzulazula kwenani/isekethe evulekile. I-Capacitor: ukuvuza/isekethe emfushane. I-Inductor: ushintsho lwe-inductance/ukugoba okufushane. I-Chip: ukwehluleka kokusebenza/amaphutha ephini.

Gcina ngesigaba esinomswakama kanye nokuvikelwa kwe-ESD. Gcina uhlelo lwempahla ukuze uqophe ulwazi, wenze amasampula njalo, futhi ulawule amazinga esitokwe ngokufanele.

Khulisa isikhala sokulandelela (≥3×ububanzi), sebenzisa ukuhlukaniswa komhlaba, lungisa i-topology yokuqondisa, kanye ne-match impedance.

Faka amapharamitha e-parasitic, okungenzeka abangele ukulahlekelwa kanye nokubambezeleka kumaza aphezulu. Ama-Vias amasignali angaphezu kwe-10GHz kufanele abe nobubanzi obungaphansi kuka-0.3mm.

Engeza amadivayisi okuvikela e-ESD (isb., ama-diode e-TVS), setha izindlela zokukhipha i-ESD, futhi ugcine izinkomba zesignali eziyisihluthulelo zingadluli ku-≥2mm emaphethelweni ebhodi.

Sebenzisa i-X-ray ukuhlola amalunga angaphakathi e-solder. Ukuphakama kwamalunga kufanele kube ngu-0.4-0.6mm, kanti izinga lokungasebenzi kufanele libe ngu-≤15%.

I-ENIG yokunamathisela nge-frequency ephezulu kanye nokunemba. I-OSP yezindleko eziphansi (ukusebenza izinyanga ezingu-6-8). Ithini lokucwilisa lokunamathisela nge-wave soldering.

Hlela kahle izembozo zesivikelo ezine-grounding impedance

Ububanzi obungu-0.3-0.5mm, isikhala esingu-≤1mm, ≥100 vias/cm² ukuqinisekisa ukusebenza kahle kokushabalalisa ukushisa.

Imigqa yedatha ye-DDR4: ukubekezelela ubude ±5mil. Ama-PCIe differential pairs: ±2mil.

Engeza ama-capacitor okuhlukanisa (0.1μF ukuze uthole imvamisa ephezulu, 10μF ukuze uthole imvamisa ephansi). Gcina isikhala sesendlalelo samandla/somhlabathi singaphansi kuka-0.1mm.

Izinga le-IPC: ≤0.7% yezinqubo ezingenayo i-lead, ≤0.5% ezindaweni ze-BGA.

Sebenzisa ukukala kwamandla kagesi, cisha amamojula angasebenzi, bese ukhetha ama-chip e-low-IQ (isb., uchungechunge lwe-TI MSP430).

Nciphisa ukulahleka kwesiginali kanye namapharamitha e-parasitic, wandise ubuningi bomzila. Izindleko ziphakeme ngo-20%-30% kunezi-via ezidlula emgodini.

Sebenzisa amathuluzi e-CAM350 noma e-Altium DFM ukuhlola ububanzi/isikhala esincane sokulandelela (≥6mil), isilinganiso sesici (≤8:1), njll.

Izindlela ezivamile: upende wokuvikela kathathu (ubukhulu obungu-0.1-0.3mm), i-nano-coating (

Sebenzisa umklamo wokukhipha umoya ukuze unciphise ingcindezi yokuhambisa i-BGA. Amabhodi anezingqimba ezine afanelana nama-80% wezidingo ezivamile; ≥ izingqimba ezingu-6 zemiklamo yesivinini esikhulu.

Hlola ukuhlanzeka kwephedi, ukujiya kwephayiphu yokusongelwa (0.12-0.15mm), kanye nokushisa kokugeleza kabusha (isiqongo esiphezulu esingu-235-245℃).

Sebenzisa i-megohmmeter engu-500V. Ukumelana nokushisa kufanele kube ngu-≥100MΩ kumswakama ongu-≤60%.

Sebenzisa ama-resistor okuqeda (isb., umsebenzi we-DDR ODT) kanye ne-impedance tapering. Qinisekisa ukuthi ukushintshashintsha kwe-impedance kungaphansi kwe-10%.

Ithusi eli-1oz (35μm): Ububanzi obungu-1A/mm. 2oz: ~1.5A/mm (ukuphakama kwezinga lokushisa

Umnyama usiza ekushabalaleni kokushisa kodwa kunzima ukuwuhlola. Uluhlaza luvame kakhulu. Umhlophe unamandla okukhanya aphezulu (≈80%).

Ububanzi obujwayelekile: 0.4-0.8mm. Iphimbo: 0.5-1.0mm. Iphimbo elingu-0.5mm lidinga izingxenye ezingu-0201.

Sebenzisa isofthiwe yokulingisa efana ne-ANSYS, ngokusekelwe kumehluko we-CTE (isb., FR-4 15ppm/℃, ithusi 17ppm/℃).

Sebenzisa ukuhlunga okunezigaba eziningi (amasekethe ohlobo lwe-π). Ukulandelana kwamandla ububanzi obungu-≥20mil ukuze unciphise ukuvimba kwendlela.

Ububanzi ≥0.6mm, isikhala ≥1.27mm. Ukuphela kwendawo ENIG, akukho ukumbozwa kwemaski okusongelwayo.

Indawo yeluphu yesiginali enesiphetho esisodwa

Sebenzisa i-SI9000 ukuze ubale i-impedance, ukubekezelelana kokulawula ±10%. Sebenzisa ukufanisa ukuphela kanye nokwenza ngcono i-topology.

Uhlaka: ± 0.1mm. Ububanzi bembobo: ± 0.05mm. Ukujula kwe-V-Cut: 1/3-2/3 yobukhulu bebhodi.

Sebenzisa imikhondo ehambisana nobude benyoka enokuvikela phansi. Gcina kude nemigqa yedatha yesivinini esikhulu futhi ugweme ukuwela ungqimba.

Yenza izivivinyo zokuguga ezisheshisiwe (85℃/85%RH, 1000h) kanye nezivivinyo zokudlidliza (ukusheshisa okungu-5-500Hz, 2G).

Usayizi wephedi mkhulu ngo-0.1-0.2mm kunezikhonkwane zezingxenye. Ububanzi bephedi ye-SMD 1.2-1.5× ububanzi bekhonkwane.

Khulisa indawo yethusi eshisayo, sebenzisa ingcina yokushisa (≥1W/mK), bese uvula ama-vias okushisa ngaphansi kwezingxenye zamandla.

Ngokusho kwe-IEC 61000-4-2: ukukhishwa kokuthintana ±8kV, ukukhishwa komoya ±15kV, ngokusebenza okuvamile.

Ubukhulu obujwayelekile buyi-15-25μm. Kumelwe umboze ithusi ngokuphelele ukuze uvimbele ama-short circuits ethusi eliveziwe.

Hlanganisa umzila osebenzisanayo nowokuzenzakalelayo. Setha izinto ezibalulekile zomzila, bese kuqala kuqalwe ngezimpawu ezibalulekile.

Ukushisa: 120-150℃ (60-90s). Ukugeleza kabusha: 217-230℃ (40-60s). Izinga lokupholisa: 3-6℃/s.

Ukusekela ngephuzu elilodwa noma ngamaphuzu amaningi. Amaphuzu amaningi kumasekethe anemvamisa ephezulu (>10MHz), anokumelana nokusekela ngephuzu

Cabanga ngomthamo wamanje, ukumelana kokuthintana (

Bheka amalunga e-solder ngesigaba se-Metallographic (ukuhlukaniswa kwe-metallographic), thola amaphutha ebusweni nge-AOI, hlaziya ukwakheka kwezakhi nge-XRF.

Isikhala esingu-5mil, impedance engu-100±10Ω, umehluko wobude