PCB tooj liab tuab

Nws yog hais txog cov laug cam luam tawm nrog cov ntawv ci tooj liab tuab ≥3oz (105μm), siv rau hauv cov khoom siv fais fab loj, cov khoom siv hluav taws xob hauv tsheb, thiab lwm yam.

Cov lus qhia dav dav suav nrog 3oz, 4oz, 5oz, 6oz, nrog rau qhov siab tshaj plaws ntawm 20oz.

Tus nqi tsim khoom yog 30% -80% siab dua vim yog qhov nyuaj etching, lub sijhawm electroplating ntev, thiab cov nqi pov tseg siab.

Rau 3oz tooj liab ntawv ci, ib txwm yog 8mil / 8mil, thiab cov txheej txheem tshwj xeeb tuaj yeem ua tiav 5mil / 5mil.

Nws yuav tsum tau muab tso rau lub sijhawm ntev kom ntseeg tau tias cov txheej tooj liab sib npaug. Lub qhov tooj liab tuab yuav tsum ncav cuag 25-75μm, thiab qhov sib txawv ntawm qhov qhib thiab phab ntsa yuav tshwm sim.

Feem ntau 0.8-1.2, uas tuaj yeem nce mus rau saum 1.5 los ntawm kev siv kauj ruam etching lossis laser tsim.

Ua kom cov cua sov tawm ntau dua (qhov qhib ≥0.4mm), siv cov khoom siv thermal conductive ua los ntawm hlau, thiab tsim cov txheej ntawv ci tooj liab loj.

Rau 1oz tooj liab ntawv ci, lub peev xwm nqa tam sim no ntawm ib sab xov hlau ntawm 10 ℃ kub nce yog li 1A / hli, thiab 3oz tuaj yeem nce mus rau 2.5-3A / hli.

Cov ntawv ci tooj liab tuab dua, qhov yooj ywm dua. Tsis pom zoo kom khoov rau saum 6oz, thiab qhov tsawg kawg nkaus khoov vojvoog rau 3oz yog ≥5mm.

Qhov dav ntawm kab ntug ≥20%, qhov tsawg kawg nkaus aperture ≥0.3mm, qhov tuab tooj liab ≥25μm, thiab nce qhov ceev ntawm cov ntsiab lus xeem.

Qhov kev sib hloov ceev yog 20% ​​-30% qis dua li ntawm PCB ib txwm muaj (kwv yees li 60,000-80,000 revolutions ib feeb), thiab qhov pub mov yog 0.02-0.04mm / rev.

ENIG yog qhov tsim nyog rau cov teeb liab zaus siab. OSP muaj tus nqi qis tab sis tsis muaj zog tiv taus oxidation. Cov plating kub tawv yog qhov tsim nyog rau cov connectors siab-plugging.

Ntawm qhov zaus 10GHz, qhov poob ntawm cov ntawv ci tooj liab 6oz yog li 1.5dB / nti siab dua li ntawm 1oz.

Tsim cov ntawv ci tooj liab sib npaug, lamination kub 180-200 ℃, siab 100-150psi, txias tus nqi ≤3 ℃ / feeb.

IPC tus qauv ≤12.5μm, cov teeb liab ceev ceev xav tau ≤5μm, uas tuaj yeem txhim kho los ntawm kev siv tshuaj tooj liab + electroplating filling.

Qhov nruab nrab ntawm kev lag luam yog 75% -85%, thiab cov txiaj ntsig rau saum 6oz yuav poob qis dua 70%.

Cov tsheb fais fab tshiab (them cov pawg, cov inverters), cov khoom siv fais fab kev lag luam, cov khoom siv fais fab server, aerospace thiab lwm yam teb.

Cov ntawv thov hluav taws xob siab 0.8-1.2mil ib txwm muaj, xav tau 1.5-2mil, uas yuav tsum tau npog cov ntawv ci tooj liab kom tiv thaiv kev nkag mus.

Txo cov txheej txheem tshwj xeeb, sib koom ua ke cov ntawv ci tooj liab tuab, nthuav qhov loj ntawm cov khoom, thiab zam ntau qhov dig muag / faus.

Lub peev xwm kho cov kua qaub tooj liab plating yog li 100-150Ah / L, thiab qhov concentration ntawm cov tooj liab ions thiab chloride ions yuav tsum tau soj ntsuam tsis tu ncua.

Lub zog tev tawm ≥1.5N/mm (1oz), 3oz xav tau ≥2.5N/mm.

Siv cov khoom siv Tg siab (≥170 ℃), lub zog lamination sib npaug, thiab tshem tawm cov khib nyiab tom qab drilling.

Qhov kub ntawm cov kua alkaline etching 45-55 ℃, qhov hnyav tshwj xeeb 1.2-1.3, qhov siab tsuag 0.8-1.2MPa.

Vias yuav tsum tau npog 100% nrog lub npog ntsej muag solder, thiab qhov loj me yog 0.2-0.3 hli loj dua qhov aperture kom tiv thaiv solder overflow.

Kev hloov pauv ntawm cov ntawv ci tooj liab ua rau muaj kev hloov pauv impedance. Nws yog qhov tsim nyog los simulate thiab optimize kab dav thiab dielectric thickness nrog kev kam rau siab ntawm ± 5%.

Cov txheej txheem ib txwm yog 0.3 hli, thiab laser drilling tuaj yeem ncav cuag 0.15 hli tab sis nrog tus nqi siab.

Nws yuav tsum dhau qhov kev sim tin immersion peb zaug ntawm 260 ℃ / 10s yam tsis muaj qhov sib cais ntawm phab ntsa lossis cov ntawv ci tooj liab.

Thaum qhov roughness Ra> 3μm, qhov teeb liab poob nce ntxiv 10% -15%, thiab xav tau cov ntawv ci tooj liab qis-roughness (VLP).

Txais yuav cov qauv ntawv ci tooj liab mesh, nce cov kev shunt tam sim no, thiab qhov dav ntawm cov kab tseem ceeb ≥10mil.

Ib txwm muaj ≥4mil, qhov hluav taws xob siab xav tau ≥8mil kom tiv thaiv kev tawg ntawm flashover.

Qhov ceev tam sim no 0.8-1.2A / dm², kev tswj hwm qhov tseeb ntawm cov khoom ntxiv, thiab lub sijhawm electroplating yog 2-3 npaug ntawm PCB ib txwm muaj.

Siv cov cuab yeej ntsuas 3D optical, nrog rau warpage ≤0.7% thiab local deformation ≤0.1mm.

Lub sijhawm nqus dej ≤3 vib nas this, lub kaum sab xis ntub

Txhim kho qhov tsim vaj huam sib luag, txo cov khib nyiab ciam teb, thiab txais yuav cov qauv tsim zoning tuab ntawm cov ntawv ci tooj liab.

Palladium ion concentration 0.02-0.05g/L, kub 30-35 ℃, lub sijhawm 10-15 feeb kom ntseeg tau tias muaj kev npog sib npaug ntawm phab ntsa qhov.

1mil dielectric thickness tuaj yeem tiv taus li 500V, thiab qhov sib nrug ntawm cov rwb thaiv tsev thiab cov ntawv ci tooj liab yuav tsum tau tsim raws li qib voltage.

Cov av noo cia ≤40%, kub ≤25 ℃, ntim khoom raws sijhawm tom qab kho qhov chaw, siv cov hnab tiv thaiv dej noo + desiccants.

Lub tshuab txiav milling ceev 25,000-30,000 revolutions ib feeb, pub mov 800-1200mm/min kom tiv thaiv cov ntug burrs.

Ci ntawm 150-160 ℃ rau 60-90 feeb, qhov nyuaj ≥2H, thiab qhov nplaum dhau qhov kev xeem hla-txiav.

Qhov dav ntawm thaj chaw faib ≥20mil, zam cov ces kaum ntse ntse, thiab txuas cov khaubncaws sab nraud povtseg sib txawv nrog ntawm arrays.

Vickers hardness ≥80HV los tiv thaiv kev puas tsuaj thiab hnav.

DES txheej txheem, potassium permanganate concentration 80-100g / L, kub 60-70 ℃, lub sijhawm 15-20 feeb.

Siv cov khoom siv dielectric Dk/Df qis, tswj qhov roughness ntawm cov ntawv ci tooj liab, thiab ua kom zoo dua qhov kev sib txuas ntawm lub dav hlau hauv av.

Ua kom sov tom qab lamination, khaws cia ntawm 120-150 ℃ rau 2-3 teev kom tso kev ntxhov siab.

Nws yuav tsum tau tiv taus kev so nrog isopropyl cawv, flux, thiab lwm yam, yam tsis muaj o lossis hloov xim.

Qhov nrug ≥20mil, zam kev kub hnyiab, thiab tuaj yeem siv cov qauv paj ntoo plum.

Siv tshuab electroplating pulsed, qhov sib nrug ntawm anode-to-board yog 10-15cm, thiab tsis tu ncua xyuas qhov solubility ntawm anode.

Tus nqi ntawm laser drilling yog li 3-5 zaug, tab sis nrog qhov tseeb dua thiab qhov me dua.

Kev vuam nyiaj siv tau sai, ENIG muaj kev ntseeg siab, thiab OSP yuav tsum ua tiav kev vuam hauv 72 teev.

Xaiv ib lub substrate nrog CTE zoo ib yam li cov ntawv ci tooj liab (xws li siab Tg FR-4 nrog CTE ntawm li 14ppm / ℃) kom txo qhov kev ntxhov siab thermal

Tus qauv IPC xav tau ≤10 qhov hws/cm², thiab cov ntawv thov kev ntseeg siab siab xav tau ≤5 qhov hws/cm², uas tuaj yeem txhim kho los ntawm kev siv hluav taws xob los ntawm qhov.

Txoj kab uas hla ntawm lub ncoo = txoj kab uas hla ntawm lub qhov + 0.6 hli (ib txwm muaj), thiab qhov nce ntawm 0.1-0.2 hli yog qhov yuav tsum tau ua rau cov rooj plaub tooj liab tuab kom them rau qhov sib txawv ntawm etching.

Cov tshuaj tiv thaiv dub muaj zog nqus cua sov, nrog rau qhov kub ntawm qhov chaw 3-5 ℃ siab dua li cov tshuaj tiv thaiv dawb, tab sis muaj kev cuam tshuam me ntsis rau kev tso cua sov tag nrho.

Nickel txheej tuab 3-5μm, kub txheej tuab 0.05-0.1μm, plating kua pH 4.8-5.2, kub 85-90 ℃.

Cov txheej txheem tshuaj lom neeg micro-etching siv, nrog rau qhov nyiaj micro-etching tswj tau ntawm 0.5-1μm, lossis kev kho tshuab sib tsoo.

Qhov hluav taws xob kuaj ib txwm yog 1000V AC/1 feeb, thiab cov ntawv thov hluav taws xob siab xav tau kev nce mus rau 2000-5000V AC.

Hauv qab 3oz tooj liab ntawv ci, qhov ceev ntawm cov xov hlau ib sab yog pom zoo kom yog ≤15cm²/100cm², thiab cov laug cam ntau txheej yuav tsum sib npaug qhov tseeb ntawm cov teeb liab thiab lub peev xwm nqa tam sim no.

Tus nqi elongation yuav tsum yog ≥20% kom ntseeg tau tias tsis muaj kev tawg nyob rau hauv kev ntxhov siab mechanical.

± 50μm (ib txwm muaj), thiab cov laug cam ceev ceev yuav tsum tau txhim kho kom txog ± 25μm, siv lub tshuab laser positioning.

Nws yuav tsum tau tiv taus reflow soldering ntawm 280 ℃ rau 5 vib nas this yam tsis muaj blistering lossis tawg.

Qhov kev sim tev tawv 90 ° yog siv los sau lub zog tev tawv ib chav dav, nrog rau tus qauv ≥1.5N/mm.

Qhov piv ntawm qhov tob ntawm qhov dig muag rau qhov txoj kab uas hla ntawm qhov (qhov sib piv ntawm qhov muag) ≤3: 1 kom tiv thaiv kev txhaws electroplating tsis zoo.

Cov ntsiab lus phosphorus hauv cov txheej electroless nickel plating yuav tsum tau tswj hwm ntawm 7% -9% kom ntseeg tau tias muaj kev tiv thaiv corrosion.

Cov cuab yeej txiav milling uas muaj txheej txheej (xws li TiAlN txheej) raug siv, thiab cov cuab yeej txiav milling raug hloov pauv tas li (hloov txhua 50-100㎡ ntawm kev ua tiav).

Tswj kev sib txuas ntawm impedance, txo qhov ntev ntawm Stub, siv kev sib kis ntawm cov teeb liab sib txawv, thiab ntxiv ib txheej tiv thaiv.

± 10% (ib txwm muaj), thiab cov ntawv thov siab yuav tsum tau tswj hwm hauv ± 5%.

Kev xeem txiav hla, thiab nws tsim nyog yog tias thaj chaw 脱落 tom qab daim kab xev tev tawm yog ≤5%.

Siv cov tooj liab uas zoo li daim phiaj (qhov sib nrug ntawm daim phiaj ≤10mil) los sib npaug qhov nqa tam sim no thiab cov teeb liab rov qab.

Kev ntxhov siab tensile ≤15MPa, kev ntxhov siab compressive ≤10MPa, los tiv thaiv cov ntawv ci tooj liab deformation.

Tsis muaj cov residue residue lossis cov khib nyiab drilling, paub tseeb los ntawm kev soj ntsuam seem metallographic.

Tom qab laus ntawm 85 ℃ / 85% RH rau 168 teev, qhov sib txawv xim ΔE≤3.

Ib qho profiler nto siv los ntsuas tus nqi Ra, thiab Ra ntawm cov ntawv ci tooj liab ib txwm yog ≤5μm.

Ib qho 0.5 hli via tuaj yeem nqa tau li 0.5-1A, thiab tus naj npawb ntawm vias yuav tsum tau txiav txim siab raws li qhov xav tau tam sim no tiag tiag.

Ib qho X-ray fluorescence spectrometer (XRF) siv los ntsuas qhov tuab ntawm cov txheej tooj liab ntawm ntau qhov chaw sib txawv, nrog rau qhov sib txawv ≤10%.

Qhov ntev ntawm daim duab qhia kev kam rau siab ±0.1 hli, lub kaum sab xis sib txawv ±0.5°.

Sib phim qhov impedance ntawm lub davhlau ya nyob twg, ua kom zoo dua qhov trace topology, thiab txo cov traces sab xis thiab impedance discontinuities.

Kev oxidation me me tuaj yeem kho tau nrog cov tshuaj micro-etching, thiab kev oxidation hnyav yuav tsum tau kho dua qhov chaw.

Qhov nro ntawm lub vijtsam 25-35N/cm, qhov nias squeegee 3-5kg/cm, qhov ceev 30-50mm/s.

Cov txheej fais fab thiab cov txheej hauv av nyob ib sab, cov txheej teeb liab raug muab tso rau hauv nruab nrab, thiab kev sib npaug ntawm qhov tuab nruab nrab raug tswj.

Siv lub tshuab ntsuas micro-Vickers hardness, nrog qhov deb ntawm cov ntsiab lus xeem ≥0.5 hli, thiab tus nqi nruab nrab raug coj.

Siv qhov chaw cim qhia qhov chaw, thiab qhov sib txawv raug kuaj pom thiab them los ntawm lub cuab yeej AOI.

Tom qab 500 zaug txhuam (500g siab), tsis muaj qhov hnav lossis raug tooj liab.

Siv cov ntaub ntawv txheej buffer (xws li cov yeeb yaj kiab thermal conductive adhesive) lossis tsim cov qhov rau kev txo kev ntxhov siab.

Siv tau cov tshuaj resin plugging + electroplating nto, los yog siv cov tshuaj nplaum solder thiab tom qab ntawd kho.

Txoj kev siv roj permeation lossis metallographic microscope soj ntsuam yog siv los xam tus naj npawb ntawm cov qhov hws ib cheeb tsam.

Qhov ceev dhau yuav ua rau muaj burrs, thiab qhov ceev qis dhau yuav cuam tshuam rau kev ua haujlwm, uas yuav tsum tau kho raws li qhov tuab ntawm cov ntawv ci tooj liab.

Ua kom qhov nrug ntawm cov kab sib txawv (≥3W txoj cai), ntxig cov kab tiv thaiv hauv av, thiab ua kom zoo dua qhov kev faib cov txheej txheem.

Kev ntxhov siab seem yuav ua rau cov ntawv ci tooj liab deformation thiab tawg, txo qhov kev ntseeg siab mus sij hawm ntev.

Cov teeb meem hauv zos tuaj yeem luam tawm dua tes, thiab cov teeb meem loj yuav tsum tau luam tawm dua thiab kho.

Qhov sib nrug ntawm ≥20mil, tus lej raug suav raws li qhov kev thov tam sim no, thiab lawv tau faib ua symmetrically.

Txoj kev siv X-ray diffraction lossis kev sim lub nplhaib kev ntxhov siab yog siv los ntsuas tus nqi kev ntxhov siab sab hauv.

Qhov roughness siab yuav ua rau electroplating tsis sib xws thiab ua rau qhov sib txawv tuab ntawm qhov tooj liab.

Tom qab UV laus sim (500 teev), tsis muaj kev hloov pauv lossis chalking.

Kev plating kub tawv muaj lub neej ntxig thiab rho tawm ntau dua 1000 zaug, thiab cov txheej txheem kub immersion yog li 50-100 zaug.

Tus nqi ntawm cov vias dig muag thiab faus yog 30% -50% siab dua li ntawm cov qhov, thiab qhov nce nqi tseem ceeb dua hauv cov xwm txheej ntawm tooj liab tuab.