PCB da aka saka

1. Menene PCB ɗin da aka saka?

PCB da aka saka a ciki allon da'ira ne mai kayan lantarki (kamar guntu, resistor, da capacitors) wanda aka saka kai tsaye a cikin yadudduka na ciki, yana rage girma da inganta aiki.
2. Menene bambanci tsakanin PCB da aka saka da PCB na yau da kullun?

PCBs da aka haɗa za su iya binne wasu sassa don rage yawan zama a sararin samaniya da kuma rage hanyoyin sigina; abubuwan da ke kan PCBs na yau da kullun galibi ana ɗora su ne a saman.
3. Waɗanne yanayi ne PCBs ɗin da aka saka suka dace da su?

Ya dace da yanayi masu buƙatar girma da aiki mai yawa, kamar wayoyin komai da ruwanka, na'urorin da za a iya sawa, na'urorin radar ababen hawa, da kayan aikin sararin samaniya.
4. Menene tsarin ƙira na asali don PCBs da aka haɗa?

Binciken buƙatun → Tsarin tsari → Tsarin tsari (gami da abubuwan da aka haɗa) → Tsarin hanya (mai da hankali kan amincin sigina) → Duba ƙa'idar ƙira → fitowar fayil ɗin allo.
5. Yadda ake zaɓar kayan da za a yi amfani da su wajen haɗa PCBs?

Yi la'akari da ma'aunin dielectric, ma'aunin asarar, da ma'aunin faɗaɗa zafi. Don amfani da mita mai yawa, zaɓi kayan da ba su da ƙarancin dielectric da kuma waɗanda ba su da ƙarancin asara; don samun kwanciyar hankali mai zafi, zaɓi kayan da ke da ƙarancin ma'aunin faɗaɗa zafi.
6. Menene ƙa'idodin tsari don abubuwan da aka haɗa a cikin PCBs?

Shirya sassan ta hanyar kayan aiki masu aiki don rage hanyoyin sigina; watsa sassan samar da zafi don watsa zafi; sanya sassan masu hankali nesa da hanyoyin hayaniya; yi la'akari da yuwuwar aiwatarwa.
7. Ta yaya ake amfani da abubuwan da ba sa aiki (resistors, capacitors, inductors) a cikin PCBs?

Ana yin juriya ta hanyar ƙara kayan juriya ga layin dielectric; capacitors suna amfani da kayan dielectric masu ƙarfi waɗanda aka lulluɓe a kan foil na jan ƙarfe ko substrates; inductors ana samun su ta hanyar murɗa mai karkace tsakanin yadudduka.
8. Me ya kamata a lura da shi yayin saka kayan aiki masu aiki (kwakwalwa, da sauransu) a cikin PCBs?

Tabbatar da ingantaccen haɗin lantarki, yi la'akari da watsar da zafi, tabbatar da gwaji, da kuma kiyayewa, sannan ka bi ƙa'idodin ƙira na masana'antun guntu.
9. Yadda ake tsara hanyar sadarwa ta rarraba wutar lantarki (PDN) a cikin PCBs da aka haɗa?

Tsarin wutar lantarki da layukan ƙasa bisa ga yawan wutar lantarki, tabbatar da ingancin tsarin wutar lantarki, rage juriya ta ciki da raguwar wutar lantarki, da kuma samar da ingantaccen wutar lantarki.
10. Ta yaya za a yi la'akari da ingancin sigina a cikin ƙirar PCB da aka haɗa?

Sarrafa tsawon alamar, saita faɗin alamar da tazara mai kyau don rage magana a tsakanin mutane, daidaita juriya ga siginar sauri, da kuma rage tasirin ta hanyar sigogin ƙwayoyin cuta.
11. Menene yawan watsa sigina na PCBs da aka haɗa?

Dangane da kayan aiki da tsarin hanyoyin sadarwa, zai iya kaiwa Gbps da yawa ko sama da haka tare da tsari mai kyau, kamar sama da Gbps 10 a cikin na'urorin sadarwa masu inganci.
12. Yadda ake ƙididdige tasirin halayen alamun a cikin PCBs da aka haɗa?

Yi amfani da dabarun kamar dabarar layin microstrip (Z0 = (87/√(εr+1.41)) × ln(5.98H/(0.8W+T))) ko dabarun layin strip, ko amfani da software na ƙira don lissafi.
13. Waɗanne abubuwa ne ke shafar raguwar sigina a cikin PCBs da aka haɗa?

Asarar abu (rashin dielectric/conductor), tsawon ganowa, mitar sigina, adadin vias, da rashin daidaiton impedance sun shafe shi.
14. Yadda za a rage tsangwama ta hanyar lantarki (EMI) a cikin PCBs da aka haɗa?

Raba shimfidu na da'irar analog da dijital, kare siginar masu saurin amsawa, tabbatar da ingancin jiragen sama na wutar lantarki da na ƙasa, yi amfani da da'irar matattara, da kuma inganta alamun don rage yankin madauki.
15. Ta yaya za a cimma kyakkyawan tushe a cikin PCBs da aka haɗa?

Kafa manyan jiragen ƙasa, ƙara hanyoyin ƙasa, rage hanyoyin ƙasa, kuma zaɓi tsarin ƙasa mai maki ɗaya/maki da yawa/haɗaɗɗen tsari bisa ga mita.
16. Yadda ake yin nazarin ingancin wutar lantarki ga PCBs da aka haɗa?

Yi nazarin sigogi kamar ƙarfin hanyar sadarwa ta wutar lantarki, raguwar ƙarfin lantarki, da rarrabawar yanzu ta hanyar software na kwaikwayo don kimanta tasirin da ingantawa.
17. Menene fa'idodin watsa siginar bambanci a cikin PCBs da aka haɗa?

Ƙarfin ƙarfin hana tsangwama, danne tsangwama ta hanyar amfani da hanyoyin gama gari, inganta saurin watsawa da aminci, da kuma sauƙaƙe hanyoyin sadarwa masu yawa.
18. Yadda ake tsara alamun bambanci a cikin PCBs da aka haɗa?

A kula da daidaiton tsayi (bambanci ≤ 10% na nisan watsawa wanda ya dace da gefen hawan sigina), faɗin alamar da tazara iri ɗaya, ikon sarrafa juriya (misali, 100Ω), kuma a guji yin magana a kan juna.
19. Menene muhimman abubuwan da ake buƙata ta hanyar ƙira sigina masu sauri a cikin PCBs da aka haɗa?

Rage girman ta hanyar girma, ƙara matsewar hana faifan, ƙara hanyoyin ƙasa a kusa, kuma sarrafa rabon al'amari (≤6).
20. Ta yaya za a tantance aikin wutar lantarki na PCBs da aka haɗa?

Yi nazarin ingancin sigina, ingancin iko, da kuma kwaikwayon EMI, sannan a gwada samfuran (misali, ta amfani da na'urorin nazarin hanyar sadarwa da oscilloscopes).
21. Ta yaya ake tantance kauri na PCBs da aka saka?

Ana ƙayyade shi ta hanyar tsayin kayan aiki, adadin yadudduka, ƙarfin injina, da yanayin aikace-aikace, kamar 0.5-1.5mm don PCBs na wayar hannu da 1.6-3.2mm don kayan aikin masana'antu.
22. Waɗanne abubuwa ya kamata a yi la'akari da su a cikin tsarin injina na PCBs da aka haɗa?

Yi la'akari da haɗa wasu sassa, ƙarfin injina, sararin watsar da zafi, da kuma tasirin saka sassan a kan aikin injina.
23. Yadda ake yin ƙirar zafi don PCBs da aka haɗa?

Shirya abubuwan da ke samar da zafi yadda ya kamata, ƙara hanyoyin watsa zafi (misali, ramukan zafi, foil na jan ƙarfe), zaɓi kayan watsa zafi mai ƙarfi, ƙara na'urorin watsa zafi idan ya cancanta, kuma inganta ta hanyar kwaikwayon zafi.
24. Waɗanne hanyoyi ne ake bi don shigar da PCBs da aka saka?

Hanyoyin da aka saba amfani da su sun haɗa da gyaran sukurori, gyaran ƙulle-ƙulle, da gyaran walda, waɗanda suka dace da yanayin kulawa mai kyau, sauƙin shigarwa, da kuma yanayin kwanciyar hankali mai ƙarfi, bi da bi.
25. Ta yaya za a hana lalacewa saboda girgiza a cikin PCBs da aka haɗa?

Inganta ƙarfin injina ta hanyar ƙara kauri na allo ko ƙara masu tauri, rarraba nauyi daidai gwargwado, amfani da kayan da ke ɗaukar girgiza don buffer, da kuma ƙarfafa muhimman abubuwan haɗin.
26. Menene ƙa'idodin ƙirar siffofi na PCBs da aka haɗa?

Daidaita murfin na'urar, a guji gefuna masu kaifi, a yi la'akari da hanyoyin samarwa (misali, yankewa, tambari), da kuma tsara tsarin jagora na toshe-in.
27. Yadda ake yin ƙirar kariya uku (mai hana ruwa, mai hana ƙura, mai hana lalata) ga PCBs da aka saka?

A shafa fenti mai hana ruwa shiga sau uku, a yi amfani da mahaɗin hana ruwa shiga, a yi maganin rufewa, sannan a guji sanya muhimman abubuwan da ke cikinsa a wuraren da ruwa/kura ke iya shiga yayin da ake tsara shi.
28. Ta yaya zafin jiki ke shafar aikin PCBs da aka haɗa?

Zafin jiki mai yawa na iya haifar da faɗaɗa allon da kuma karkatar da sigogin kayan aiki; ƙarancin zafin jiki na iya sa kayan su yi rauni. PCBs na masana'antu suna aiki a -40℃~85℃, tare da ƙarin tsauraran buƙatun matakin soja.
29. Ta yaya za a tantance ingancin injina na PCBs da aka haɗa?

Yi nazarin nakasa da rarrabawar damuwa ta hanyar kwaikwayon damuwa ta injiniya, sannan ka gudanar da gwaje-gwajen tasiri, gwaje-gwajen girgiza, da gwaje-gwajen tsufa na dogon lokaci.
30. Menene tasirin zaɓin kayan aiki akan aikin injiniya na PCBs da aka haɗa?

Kayan aiki daban-daban suna da ƙarfin injina daban-daban da kuma ma'aunin faɗaɗa zafi. Misali, FR-4 yana da kyakkyawan aiki mai kyau amma yana da ma'aunin faɗaɗa zafi mai yawa, yayin da kayan polyimide ke ba da ingantaccen kwanciyar hankali na zafi da ƙarfin injina.
31. Menene bambanci a cikin tsarin ƙera kayayyaki tsakanin PCBs da aka saka da PCBs na yau da kullun?

PCBs da aka haɗa suna buƙatar ƙarin matakai don haɗa sassan, kamar ƙera tsarin tsakanin layuka da kuma lamination mafi daidaito, tare da buƙatu mafi girma don haƙa da daidaiton rufi.
32. Waɗanne muhimman hanyoyin ƙera na'urorin PCB da aka haɗa?

Ya haɗa da lamination, sarrafa micro-via (bututu ≤50μm), saka sassan, da kuma maganin saman (misali, plating na zinariya, fesa tin).
33. Ta yaya za a tabbatar da daidaiton girma yayin ƙera PCB da aka haɗa?

A ƙayyade daidaiton haƙuri a cikin ƙira, a yi amfani da kayan aiki masu inganci (kamar injinan haƙa CNC), sannan a gudanar da bincike mai zurfi da gyare-gyaren tsari a kowace hanya.
34. Menene muhimman abubuwan da ke tattare da kula da inganci a cikin kera PCB da aka haɗa?

Duba kayan aiki (alalumma, kayan aiki), sa ido kan sigogin lamination/hakowa/rufewa, amfani da gwaje-gwajen X-ray da na'urar bincike don gano haɗin ciki da aikin lantarki, da kuma gudanar da cikakken bincike na kayayyakin da aka gama.
35. Waɗanne lahani na masana'antu ne za su iya faruwa a cikin PCBs da aka haɗa?

Kumfa/ragewar lamination, rashin daidaiton haƙowa/buɗewar da ba ta daidaita ba, rashin haɗin sassan/gajeren da'ira, rashin kyawun maganin saman, karkacewar girma, da sauransu.
36. Yadda za a magance matsalar kumfa na lamination a cikin masana'antar PCB da aka haɗa?

Inganta yanayin zafin lamination, matsin lamba, da sigogin lokaci, allunan da aka riga aka yi wa magani don cire danshi da ƙazanta, da kuma amfani da lamination na injin don fitar da iska.
37. Ta yaya za a tabbatar da ingancin ƙananan ƙwayoyin cuta a cikin masana'antar PCB da aka haɗa?

Yi amfani da kayan haƙa mai inganci don sarrafa sigogi, yin ƙananan etching a bangon ramuka don inganta mannewa na jan ƙarfe, da kuma gano inganci ta hanyar rarraba ƙarfe.
38. Ta yaya za a tabbatar da ingancin kayan da aka haɗa yayin ƙera su?

A tantance kuma a gwada kayan aiki kafin a saka su, a inganta hanyoyin saka su don tabbatar da haɗin gwiwa a kamfanin, sannan a gudanar da gwaje-gwajen lantarki da kuma gwaje-gwajen aminci bayan an ƙera su.
39. Waɗanne abubuwa ne ke shafar farashin kera PCBs da aka haɗa?

Yana shafar farashin kayan aiki (kayayyakin da ke da inganci sun fi tsada), sarkakiyar tsari (misali, ƙananan hanyoyin sadarwa, saka sassan), yawan samarwa, da farashin dubawa.
40. Yadda ake zaɓar masana'antar PCB mai dacewa?

Bincika ƙarfin fasaha (kayan aiki, hanyoyin aiki), tsarin kula da inganci, shari'o'in samarwa, bitar abokan ciniki, ambato, da lokacin isarwa.
41. Waɗanne hanyoyi ne ake gwada PCBs da aka saka?

Ya haɗa da duba gani, gwajin lantarki (multimeter, oscilloscope, na'urar nazarin hanyar sadarwa), gwajin aiki, duba X-ray, gwajin binciken tashi, da sauransu.
42. Yadda ake yin gwajin da'ira (ICT) don PCBs da aka haɗa?

Yi amfani da ƙusoshin na'urar ICT don tuntuɓar wuraren gwaji da kuma gano sigogin lantarki na sassan, gajerun da'irori, da'irori masu buɗewa, karkacewar sigogi, da sauransu. Ya kamata a ajiye wuraren gwaji a cikin ƙirar.
43. Me ya kamata a lura da shi a cikin gwajin aiki na PCBs da aka haɗa?

Yi kwaikwayon yanayin aiki na ainihi, gwada ayyukan gabaɗaya, bi tsarin gwaje-gwaje na asali zuwa masu rikitarwa, da kuma yin rikodin da kuma nazarin abubuwan da ba su dace ba.
44. Yadda ake amfani da gwajin binary scan (JTAG) don PCBs da aka haɗa?

Yi amfani da hanyar JTAG don sarrafa ƙwayoyin binciken iyakokin ciki na guntu, gano yanayin fil da haɗin tsakanin guntu, da kuma gano lahani na da'ira a buɗe da gajeru.
45. Yadda ake yin gwajin lahani ga PCBs da aka haɗa?

Da farko a lura da bayyanar (kayan da aka ƙone, haɗin haɗin solder da suka fashe), sannan a yi gwaje-gwajen lantarki don rage girman matsalar, a yi nazarin hanyoyin haɗin da za a iya amfani da su bisa ga tsarin, sannan a yi amfani da hanyar maye gurbin don tantance wurin matsalar.
46. Menene wahalar kulawa da abubuwan da aka haɗa a cikin PCBs?

Yana da tsayi sosai, domin sassan suna cikin yadudduka na ciki. Yana buƙatar a cire saman yadudduka a hankali don fallasa wurin da matsalar ta faru, a sake lanƙwasa su don dawo da daidaito bayan gyarawa, da kuma guje wa tasirin da zai iya yi wa wasu da'irori.
47. Ta yaya za a guji lalata wasu sassan yayin gyara?

Yi amfani da kayan aiki masu inganci kamar na'urorin walda na micro-spot da kuma tweezers masu daidaito. Shirya tsarin kulawa a gaba kuma yi amfani da dumama na gida don sarrafa zafin jiki.
48. Ta yaya ake tabbatar da inganci bayan an gyara?

Gudanar da gwaje-gwajen lantarki (sahihancin sigina, sahihancin iko), gwaje-gwajen aiki, da gwaje-gwajen aminci (tsufa, girgiza).
49. Yadda ake kafa hanyoyin gwaji da kulawa?

Ƙirƙiri tsare-tsaren gwaji, hanyoyin gano kurakurai, ƙayyadaddun ayyukan kulawa, da kuma hanyoyin tabbatar da inganci.
50. Menene kayan aikin gwaji da kulawa na PCBs da aka haɗa?

Kayan aikin gwaji: multimeter, oscilloscope, na'urar nazarin hanyar sadarwa, da sauransu. Kayan aikin kulawa: kayan aikin walda na micro-spot, bindiga mai zafi, da sauransu.
51. Yadda ake zaɓar masu juriya da aka haɗa don PCBs?

Yi la'akari da daidaiton juriya, ƙimar ƙarfi, da kuma ma'aunin zafin jiki. Zaɓi masu juriya bisa ga buƙatun da'ira.
52. Menene ayyukan capacitors da aka saka a cikin PCBs?

Ana amfani da shi don tacewa, cire haɗin kai, adana makamashi, haɗa sigina, da sauransu.
53. Yadda ake tantance sigogin inductor da aka haɗa?

A tantance bisa ga mitar aiki, inductance, da ƙarfin halin yanzu. Don tace wutar lantarki, yi la'akari da ripple da load current.
54. Waɗanne abubuwa ya kamata a yi la'akari da su yayin zaɓar guntu-guntu da aka saka?

Yi la'akari da aiki, amfani da wutar lantarki, nau'in fakiti, aminci, da tallafin masana'anta.
55. Ta yaya za a tabbatar da jituwa tsakanin sassan da PCBs?

Daidaita sigogin lantarki da girman jiki yayin ƙira. Zaɓi abubuwan da suka dace da kayan allo da hanyoyin aiki, sannan a gudanar da tabbatar da kwaikwayon.
56. Menene buƙatun soldering don abubuwan da aka haɗa?

Ga kayan aiki masu aiki, a kula da zafin jiki da lokacin da za a yi amfani da su don hana yin solder a sanyi. Ga kayan aiki masu aiki, a yi amfani da kayan aiki masu inganci (misali, sake yin solder) don tabbatar da ingantaccen haɗi da kuma hana lalacewar zafi.
57. Ta yaya za a tantance tsawon rayuwar abubuwan da aka haɗa?

Kimanta tsawon rai ta hanyar gwaje-gwajen tsufa cikin sauri, bayanan masana'anta, da kuma sa ido na dogon lokaci kan ainihin bayanan gazawa.
58. Waɗanne hanyoyi ne na gazawa za su iya faruwa a cikin abubuwan da aka haɗa?

Juriya: karkatar darajar/da'irar buɗewa. Capacitor: leaking/short da'ira. Inductor: canjin inductance/lalacewar guntu. Chip: gazawar aiki/lalacewar fil.
59. Yadda ake sarrafa kayan da aka haɗa?

A adana ta rukuni tare da danshi da kariyar ESD. A kula da tsarin kaya don yin rikodin bayanai, gudanar da samfur akai-akai, da kuma kula da matakan kaya yadda ya kamata.
60. Yadda ake magance matsalolin magana ta hanyar sigina a cikin PCBs?

Ƙara tazara tsakanin alamun (≥3×faɗi), yi amfani da warewar ƙasa, inganta yanayin hanya, da kuma daidaita juriya.
61. Menene tasirin vias akan watsa sigina?

Gabatar da sigogin ƙwayoyin cuta, wanda wataƙila zai iya haifar da asara da jinkiri a manyan mitoci. Ya kamata hanyoyin sadarwa na sigina sama da 10GHz su kasance da diamita
62. Yadda ake magance ESD (fitar lantarki) a cikin PCBs?

Ƙara na'urorin kariya na ESD (misali, diodes na TVS), saita hanyoyin fitarwa na ESD, da kuma kiyaye alamun sigina masu mahimmanci ≥2mm daga gefun allon.
63. Ta yaya ake gano rashin kyawun solder na BGA?

Yi amfani da na'urar X-ray don duba haɗin haɗin da ke cikin solder. Tsawon haɗin gwiwa ya kamata ya zama 0.4-0.6mm, tare da ƙimar rashin aiki ≤15%.
64. Yadda ake zaɓar hanyoyin magance saman PCB?

ENIG don yawan amfani da na'urar soda mai yawa da daidaito. OSP don ƙarancin farashi (inganci watanni 6-8). Tin ɗin nutsewa don na'urar soda mai raƙuman ruwa.
65. Yadda ake rage hasken lantarki daga PCBs?

Shirya murfin garkuwa yadda ya kamata tare da hana ƙasa
66. Menene muhimman abubuwan da ake buƙata don ƙirar zafi ta hanyar thermal?

Ta hanyar diamita 0.3-0.5mm, tazara ≤1mm, ≥100 vias/cm² don tabbatar da ingancin watsawar zafi.
67. Menene buƙatun daidaitawar tsayi don bin diddigin sauri mai sauri?

Layukan bayanai na DDR4: haƙurin tsawon ± mil 5. Nau'i-nau'i daban-daban na PCIe: ± mil 2.
68. Yadda za a magance matsalolin daidaiton wutar lantarki a cikin PCBs?

Ƙara na'urorin haɗa ƙarfin lantarki (0.1μF don yawan mita, 10μF don ƙarancin mita). A kiyaye tazara tsakanin layukan wutar lantarki/ƙasa
69. Menene ƙa'idar da aka yarda da ita don warpage na PCB?

Ma'aunin IPC: ≤0.7% don hanyoyin da ba su da gubar, ≤0.5% a yankunan BGA.
70. Yadda ake cimma ƙirar ƙarancin wutar lantarki a cikin PCBs?

Yi amfani da sikelin ƙarfin lantarki mai ƙarfi, rage ƙarfin na'urori marasa aiki, kuma zaɓi guntu masu ƙarancin IQ (misali, jerin TI MSP430).
71. Menene fa'idodin makafi/binnewa a cikin PCBs?

Rage asarar sigina da sigogin ƙwayoyin cuta, ƙara yawan hanyoyin sadarwa. Farashi ya fi kashi 20%-30% sama da hanyoyin shiga rami.
72. Yadda ake yin binciken DFM (ƙirƙirar ƙira don ƙera)?

Yi amfani da kayan aikin CAM350 ko Altium DFM don duba mafi ƙarancin faɗin/tazara tsakanin ramuka (≥mil 6), rabon al'amari (≤8:1), da sauransu.
73. Waɗanne hanyoyi ne ake bi wajen magance matsalolin PCB guda uku?

Hanyoyin da aka saba amfani da su: fenti mai kariya uku (kauri 0.1-0.3mm), nano-coating (
74. Yadda ake inganta adadin layukan hanya a cikin PCBs?

Yi amfani da ƙirar fan-out don rage matsin lamba na hanyar BGA. Allunan mai layuka 4 sun dace da kashi 80% na buƙatun yau da kullun; ≥6 yadudduka don ƙira masu sauri.
75. Yadda ake magance matsalar haɗa kayan sanyi bayan walda na PCB?

Duba tsaftar kushin, kauri man shafawa mai solder (0.12-0.15mm), da kuma zafin sake kwarara (kololuwar 235-245℃).
76. Yadda ake gwada juriyar rufin PCBs?

Yi amfani da na'urar auna ƙarfin lantarki ta 500V. Ya kamata juriyar rufewa ta kasance ≥100MΩ a ≤60% danshi.
77. Yadda ake danne hasken sigina a cikin PCBs?

Yi amfani da masu hana ƙarewa (misali, aikin DDR ODT) da kuma rage tasirin impedance. Tabbatar da bambancin impedance
78. Menene tasirin kauri foil na tagulla akan ƙarfin ɗaukar wutar lantarki?

Tagulla mai nauyin oz 1 (35μm): ~1A/mm faɗin alamar. 2oz: ~1.5A/mm (hauhawar zafin jiki
79. Yadda ake zaɓar launin abin rufe fuska na solder?

Baƙi yana taimakawa wajen fitar da zafi amma yana da wahalar dubawa. Kore ya fi yawa. Fari yana da ƙarfin haske sosai (≈80%).
80. Yadda ake tantance girman ƙwallon solder na BGA?

Matsakaicin diamita: 0.4-0.8mm. Sauti: 0.5-1.0mm. Sauti 0.5mm yana buƙatar abubuwan haɗin 0201.
81. Yadda ake ƙididdige matsin lamba na zafi a cikin PCBs?

Yi amfani da software na kwaikwayo kamar ANSYS, bisa ga bambance-bambancen CTE (misali, FR-4 15ppm/℃, jan ƙarfe 17ppm/℃).
82. Yadda ake magance matsalolin hayaniyar wutar lantarki a cikin PCBs?

Yi amfani da matattarar matakai da yawa (da'irori masu nau'in π). Ra'ayoyin wutar lantarki ≥20mil don rage tasirin hanyar.
83. Menene ƙayyadaddun ƙira don wuraren gwaji?

Diamita ≥0.6mm, tazara ≥1.27mm. Kammalawar saman ENIG, babu murfin abin rufe fuska na solder.
84. Menene buƙatun yankin madaurin sigina a cikin hanyar sadarwa?

Yankin madaukin sigina mai iyaka ɗaya
85. Yadda za a magance matsalolin daidaiton sigina a cikin PCBs?

Yi amfani da SI9000 don ƙididdige impedance, juriyar sarrafawa ±10%. Yi amfani da daidaitawar ƙarewa da inganta yanayin ƙasa.
86. Menene ƙa'idodin daidaiton sarrafa injina na PCBs?

Bayani: ±0.1mm. Diamita na rami: ±0.05mm. Zurfin yankewa: 1/3-2/3 na kauri na allo.
87. Menene la'akari da yadda ake amfani da hanyar sadarwa ta siginar agogo?

Yi amfani da alamun da suka dace da tsawon maciji tare da kariyar ƙasa. A kiyaye nesa da layukan bayanai masu sauri kuma a guji ketare layuka.
88. Yadda ake kimanta amincin PCB?

Yi gwaje-gwajen tsufa cikin sauri (85℃/85%RH, 1000h) da gwaje-gwajen girgiza (5-500Hz, hanzarta 2G).
89. Menene ƙa'idodin ƙirar kushin?

Girman faifan ya fi girman 0.1-0.2mm girma fiye da na'urorin haɗin. Faɗin faifan SMD 1.2-1.5× faɗin gubar.
90. Yadda ake magance matsalolin watsa zafi a cikin PCBs?

Ƙara yankin jan ƙarfe mai zafi, yi amfani da manne mai zafi (≥1W/mK), da kuma buɗe hanyoyin zafi a ƙarƙashin abubuwan wutar lantarki.
91. Menene ma'aunin gwajin ESD ga PCBs da aka haɗa?

A cewar IEC 61000-4-2: fitar da iska ±8kV, fitar da iska ±15kV, tare da aiki na yau da kullun.
92. Menene buƙatun kauri don abin rufe fuska na solder?

Kauri na yau da kullun shine 15-25μm. Dole ne a rufe jan ƙarfe gaba ɗaya don hana gajerun da'irori daga jan ƙarfe da aka fallasa.
93. Yadda ake inganta ingancin hanyoyin sadarwa a cikin PCBs?

Haɗa hanyar sadarwa mai hulɗa da kuma hanyar atomatik. Saita abubuwan da suka fi muhimmanci a hanyar sadarwa, tare da mahimman sigina da aka fara amfani da su.
94. Yadda ake saita yanayin zafi don sake fasalin BGA?

Zafi kafin lokaci: 120-150℃ (60-90s). Sake kwarara: 217-230℃ (40-60s). Yawan sanyaya: 3-6℃/s.
95. Waɗanne hanyoyi ne ake amfani da su wajen tsara ƙasa don PCBs?

Tsarin ƙasa mai maki ɗaya ko maki da yawa. Tsarin ƙasa mai maki da yawa don da'irori masu yawan mita (>10MHz), tare da juriyar ƙasa
96. Menene muhimman abubuwan da ake buƙata don zaɓar mahaɗi a cikin PCBs da aka haɗa?

Yi la'akari da ƙarfin wutar lantarki, juriyar hulɗa (
97. Yadda ake yin nazarin gazawa akan PCBs?

Lura da haɗin haɗin solder ta hanyar sashin ƙarfe (sashen ƙarfe), gano lahani a saman tare da AOI, bincika abubuwan da ke cikin abubuwan tare da XRF.
98. Menene buƙatu na musamman don hanyar sadarwa ta bambance-bambancen nau'i-nau'i?

Tazara mil 5, impedance 100 ± 10Ω, bambancin tsayi

PCB da aka saka

1. Menene PCB ɗin da aka saka?

2. Menene bambanci tsakanin PCB da aka saka da PCB na yau da kullun?

3. Waɗanne yanayi ne PCBs ɗin da aka saka suka dace da su?

4. Menene tsarin ƙira na asali don PCBs da aka haɗa?

5. Yadda ake zaɓar kayan da za a yi amfani da su wajen haɗa PCBs?

6. Menene ƙa'idodin tsari don abubuwan da aka haɗa a cikin PCBs?

7. Ta yaya ake amfani da abubuwan da ba sa aiki (resistors, capacitors, inductors) a cikin PCBs?

8. Me ya kamata a lura da shi yayin saka kayan aiki masu aiki (kwakwalwa, da sauransu) a cikin PCBs?

9. Yadda ake tsara hanyar sadarwa ta rarraba wutar lantarki (PDN) a cikin PCBs da aka haɗa?

10. Ta yaya za a yi la'akari da ingancin sigina a cikin ƙirar PCB da aka haɗa?

11. Menene yawan watsa sigina na PCBs da aka haɗa?

12. Yadda ake ƙididdige tasirin halayen alamun a cikin PCBs da aka haɗa?

13. Waɗanne abubuwa ne ke shafar raguwar sigina a cikin PCBs da aka haɗa?

14. Yadda za a rage tsangwama ta hanyar lantarki (EMI) a cikin PCBs da aka haɗa?

15. Ta yaya za a cimma kyakkyawan tushe a cikin PCBs da aka haɗa?

16. Yadda ake yin nazarin ingancin wutar lantarki ga PCBs da aka haɗa?

17. Menene fa'idodin watsa siginar bambanci a cikin PCBs da aka haɗa?

18. Yadda ake tsara alamun bambanci a cikin PCBs da aka haɗa?

19. Menene muhimman abubuwan da ake buƙata ta hanyar ƙira sigina masu sauri a cikin PCBs da aka haɗa?

20. Ta yaya za a tantance aikin wutar lantarki na PCBs da aka haɗa?

21. Ta yaya ake tantance kauri na PCBs da aka saka?

22. Waɗanne abubuwa ya kamata a yi la'akari da su a cikin tsarin injina na PCBs da aka haɗa?

23. Yadda ake yin ƙirar zafi don PCBs da aka haɗa?

24. Waɗanne hanyoyi ne ake bi don shigar da PCBs da aka saka?

25. Ta yaya za a hana lalacewa saboda girgiza a cikin PCBs da aka haɗa?

26. Menene ƙa'idodin ƙirar siffofi na PCBs da aka haɗa?

27. Yadda ake yin ƙirar kariya uku (mai hana ruwa, mai hana ƙura, mai hana lalata) ga PCBs da aka saka?

28. Ta yaya zafin jiki ke shafar aikin PCBs da aka haɗa?

29. Ta yaya za a tantance ingancin injina na PCBs da aka haɗa?

30. Menene tasirin zaɓin kayan aiki akan aikin injiniya na PCBs da aka haɗa?

31. Menene bambanci a cikin tsarin ƙera kayayyaki tsakanin PCBs da aka saka da PCBs na yau da kullun?

32. Waɗanne muhimman hanyoyin ƙera na'urorin PCB da aka haɗa?

33. Ta yaya za a tabbatar da daidaiton girma yayin ƙera PCB da aka haɗa?

34. Menene muhimman abubuwan da ke tattare da kula da inganci a cikin kera PCB da aka haɗa?

35. Waɗanne lahani na masana'antu ne za su iya faruwa a cikin PCBs da aka haɗa?

36. Yadda za a magance matsalar kumfa na lamination a cikin masana'antar PCB da aka haɗa?

37. Ta yaya za a tabbatar da ingancin ƙananan ƙwayoyin cuta a cikin masana'antar PCB da aka haɗa?

38. Ta yaya za a tabbatar da ingancin kayan da aka haɗa yayin ƙera su?

39. Waɗanne abubuwa ne ke shafar farashin kera PCBs da aka haɗa?

40. Yadda ake zaɓar masana'antar PCB mai dacewa?

41. Waɗanne hanyoyi ne ake gwada PCBs da aka saka?

42. Yadda ake yin gwajin da'ira (ICT) don PCBs da aka haɗa?

43. Me ya kamata a lura da shi a cikin gwajin aiki na PCBs da aka haɗa?

44. Yadda ake amfani da gwajin binary scan (JTAG) don PCBs da aka haɗa?

45. Yadda ake yin gwajin lahani ga PCBs da aka haɗa?

46. ​​Menene wahalar kulawa da abubuwan da aka haɗa a cikin PCBs?

47. Ta yaya za a guji lalata wasu sassan yayin gyara?

48. Ta yaya ake tabbatar da inganci bayan an gyara?

49. Yadda ake kafa hanyoyin gwaji da kulawa?

50. Menene kayan aikin gwaji da kulawa na PCBs da aka haɗa?

51. Yadda ake zaɓar masu juriya da aka haɗa don PCBs?

52. Menene ayyukan capacitors da aka saka a cikin PCBs?

53. Yadda ake tantance sigogin inductor da aka haɗa?

54. Waɗanne abubuwa ya kamata a yi la'akari da su yayin zaɓar guntu-guntu da aka saka?

55. Ta yaya za a tabbatar da jituwa tsakanin sassan da PCBs?

56. Menene buƙatun soldering don abubuwan da aka haɗa?

57. Ta yaya za a tantance tsawon rayuwar abubuwan da aka haɗa?

58. Waɗanne hanyoyi ne na gazawa za su iya faruwa a cikin abubuwan da aka haɗa?

59. Yadda ake sarrafa kayan da aka haɗa?

60. Yadda ake magance matsalolin magana ta hanyar sigina a cikin PCBs?

61. Menene tasirin vias akan watsa sigina?

62. Yadda ake magance ESD (fitar lantarki) a cikin PCBs?

63. Ta yaya ake gano rashin kyawun solder na BGA?

64. Yadda ake zaɓar hanyoyin magance saman PCB?

65. Yadda ake rage hasken lantarki daga PCBs?

66. Menene muhimman abubuwan da ake buƙata don ƙirar zafi ta hanyar thermal?

67. Menene buƙatun daidaitawar tsayi don bin diddigin sauri mai sauri?

68. Yadda za a magance matsalolin daidaiton wutar lantarki a cikin PCBs?

69. Menene ƙa'idar da aka yarda da ita don warpage na PCB?

70. Yadda ake cimma ƙirar ƙarancin wutar lantarki a cikin PCBs?

71. Menene fa'idodin makafi/binnewa a cikin PCBs?

72. Yadda ake yin binciken DFM (ƙirƙirar ƙira don ƙera)?

73. Waɗanne hanyoyi ne ake bi wajen magance matsalolin PCB guda uku?

74. Yadda ake inganta adadin layukan hanya a cikin PCBs?

75. Yadda ake magance matsalar haɗa kayan sanyi bayan walda na PCB?

76. Yadda ake gwada juriyar rufin PCBs?

77. Yadda ake danne hasken sigina a cikin PCBs?

78. Menene tasirin kauri foil na tagulla akan ƙarfin ɗaukar wutar lantarki?

79. Yadda ake zaɓar launin abin rufe fuska na solder?

46. Menene wahalar kulawa da abubuwan da aka haɗa a cikin PCBs?