PCB e kentsweng

PCB e kentsweng ke boto ya potoloho e nang le dikarolo tsa elektroniki (tse kang di-chip, di-resistor, le di-capacitor) tse kentsweng ka ho toba ka hara dikarolo tsa yona tse ka hare, e leng se fokotsang boholo le ho ntlafatsa tshebetso.

Li-PCB tse kentsoeng li ka pata likarolo tse ling ho fokotsa ho lula ha sebaka le ho khutsufatsa litsela tsa matšoao; likarolo tse holim'a li-PCB tse tloaelehileng hangata li kenngoa holim'a metsi.

E loketse maemo a nang le litlhoko tse phahameng tsa boholo le ts'ebetso, joalo ka li-smartphone, lisebelisoa tse aparoang, li-radar tsa likoloi le lisebelisoa tsa lifofane.

Tlhahlobo ea litlhoko → moralo oa moralo → moralo oa sebopeho (ho kenyeletsoa likarolo tse kentsoeng) → moralo oa ho tsamaisa (ho tsepamisa maikutlo botšepehing ba lets'oao) → tlhahlobo ea molao oa moralo → tlhahiso ea faele ea boto.

Nahana ka coefficient ea dielectric e sa fetoheng, ntlha ea tahlehelo, le coefficient ea katoloso ea mocheso. Bakeng sa lits'ebetso tsa maqhubu a phahameng, khetha thepa e sa fetoheng ea dielectric e tlase le e sa lahleheng haholo; bakeng sa botsitso bo phahameng ba mocheso, khetha thepa e nang le coefficient ea katoloso ea mocheso e tlase.

Beha dikarolo ka dimmojule tse sebetsang ho kgutsufatsa ditsela tsa matshwao; hasanya dikarolo tse hlahisang mocheso bakeng sa ho qhala mocheso; beha dikarolo tse utlwahalang hole le mehlodi ya lerata; nahana ka bokgoni ba tshebetso.

Li-resistor li etsoa ka ho eketsa thepa e hanyetsang lera la dielectric; li-capacitor li sebelisa thepa e nang le dielectric e phahameng e koahetsoeng ka foil ea koporo kapa substrates; li-inductor li bonoa ka li-spiral coils pakeng tsa mekhahlelo.

Netefatsa dikgokelo tse tshepahalang tsa motlakase, nahana ka ho qhalana ha mocheso, ho kgona ho lekoa, le ho kgona ho boloka, mme o latele ditataiso tsa moralo wa bahlahisi ba di-chip.

Rera matla le mealo ea fatše ho latela tšebeliso ea matla, netefatsa botšepehi ba sefofane sa motlakase, fokotsa khanyetso ea kahare le ho theoha ha motlakase, 'me u fane ka phepelo e tsitsitseng ea motlakase.

Laola bolelele ba mothati, beha bophara ba mothati le sebaka ka ho loketseng ho fokotsa ho bua ka tsela e fapaneng, bapisa phetiso ya matshwao a lebelo le phahameng, le ho fokotsa tshusumetso ya diparasiti tsa parasitic.

Ho itshetlehile ka thepa le moralo wa tsela, e ka fihlella di-Gbps tse mmalwa kapa ho feta ka moralo o nepahetseng, jwalo ka di-Gbps tse fetang 10 disebedisweng tsa puisano tse phahameng.

Sebelisa liforomo tse kang foromo ea mola oa microstrip (Z0 = (87/√(εr+1.41))×ln(5.98H/(0.8W+T))) kapa liforomo tsa stripline, kapa sebelisa software ea moralo bakeng sa lipalo.

E angoa ke tahlehelo ea thepa (tahlehelo ea dielectric/conductor), bolelele ba mohlala, maqhubu a lets'oao, palo ea li-vias, le ho se lumellane ha impedance.

Arola meralo ea potoloho ea analog le ea dijithale, sireletsa matšoao a bonolo, netefatsa botšepehi ba matla le lifofane tsa fatše, sebelisa lipotoloho tsa sefe, 'me u ntlafatse mesaletsa ho fokotsa sebaka sa selika-likoe.

Beha difofane tse kgolo tsa ho thella fatshe, eketsa di-via tsa ho thella fatshe, kgutsufatsa ditsela tsa ho thella fatshe, mme o kgethe ho thella ha motheo ka ntlha e le nngwe/ntlha e ngata/motswako ho ya ka makgetlo.

Sekaseka diparamitha tse kang ho se sebetse hantle ha marangrang a motlakase, ho theoha ha motlakase, le kabo ya hajwale ka software ya ketsiso ho lekola ditlamorao le ho ntlafatsa.

Bokhoni bo matla ba ho thibela tšitiso, ho thibela tšitiso ea mokhoa o tloaelehileng, ho ntlafatsa sekhahla sa phetiso le ts'epo, le ho nolofatsa tsela e nang le bongata bo phahameng.

Boloka bolelele bo lekana (phapang ≤ 10% ea sebaka sa phetiso se tsamaellanang le moeli oa ho phahama ha lets'oao), bophara le sebaka se lekanang sa ho latela, thibelo ea taolo (mohlala, 100Ω), 'me u qobe ho bua ka tsela e fapaneng.

Fokotsa boholo ka boholo, eketsa anti-pad, eketsa grounding vias ho potoloha, 'me u laole aspect ratio (≤6).

Etsa tlhahlobo ea botšepehi ba lets'oao, botšepehi ba matla, le tlhahlobo ea ketsiso ea EMI, le liteko tsa prototypes (mohlala, ho sebelisa li-network analyzer le li-oscilloscope).

E khethoa ke bophahamo ba likarolo, palo ea mekhahlelo, matla a mechini, le maemo a ts'ebeliso, joalo ka 0.5-1.5mm bakeng sa li-PCB tsa mohala oa thekeng le 1.6-3.2mm bakeng sa lisebelisoa tsa indasteri.

Nahana ka ho kopanya le dikarolo tse ding, matla a mechini, sebaka sa ho qhala mocheso, le tshusumetso ya ho kenngwa ha dikarolo tshebetsong ya mechini.

Beha likarolo tse hlahisang mocheso ka mokhoa o utloahalang, eketsa likanale tsa ho qhala mocheso (mohlala, masoba a mocheso, foil ea koporo), khetha lisebelisoa tse tsamaisang mocheso o phahameng, eketsa lisebelisoa tsa ho qhala mocheso haeba ho hlokahala, 'me u ntlafatse ka ho etsisa mocheso.

Mekhoa e tloaelehileng e kenyelletsa ho lokisa li-screw, ho lokisa li-clip, le ho lokisa li-welding, tse loketseng tlhokomelo e phahameng, ho kenya habonolo, le maemo a botsitso bo phahameng, ka ho latellana.

Ntlafatsa matla a mechini ka ho eketsa botenya ba boto kapa ho eketsa lintho tse thatafatsang, ho aba boima ka ho lekana, ho sebedisa thepa e monyang matshoso bakeng sa ho boloka matla, le ho matlafatsa dikarolo tsa bohlokwa.

Bapisa sekoahelo sa sesebelisoa, qoba mathoko a bohale, nahana ka lits'ebetso tsa tlhahiso (mohlala, ho seha, ho hatakela), le ho rala meaho e tataisang ea plug-in.

Tlotsa pente e thibelang metsi ka makhetlo a mararo, sebelisa lihokelo tse sa keneleng metsi, etsa kalafo ea ho koala, 'me u qobe ho beha likarolo tsa bohlokoa libakeng tse kotsing ea metsi/lerōle nakong ea ho rala.

Lithempereichara tse phahameng li ka baka katoloso ea boto le ho sisinyeha ha likarolo tsa eona; lithempereichara tse tlase li ka etsa hore thepa e senyehe habonolo. Li-PCB tsa maemo a indasteri li sebetsa ho -40℃ ~ 85℃, ka litlhoko tse thata haholoanyane tsa maemo a sesole.

Sekaseka phetoho le kabo ea khatello ka ho etsisa khatello ea mechine, 'me u etse tšusumetso, liteko tsa ho thothomela, le liteko tsa botsofali tsa nako e telele.

Lisebelisoa tse fapaneng li na le matla a fapaneng a mechini le li-coefficient tsa katoloso ea mocheso. Mohlala, FR-4 e na le ts'ebetso e ntle e felletseng empa coefficient ea katoloso ea mocheso e phahameng haholo, ha lisebelisoa tsa polyimide li fana ka botsitso bo betere ba mocheso le matla a mechini.

Li-PCB tse kentsweng li hloka lits'ebetso tse ling bakeng sa ho kenya likarolo, joalo ka tlhahiso ea sebopeho sa mealo e fapaneng le lamination e nepahetseng haholoanyane, ka litlhoko tse phahameng tsa ho cheka le ho nepahala ha plating.

Ho kenyeletsoa le ho lamination, ho sebetsana le micro-via (lesoba ≤50μm), ho kenya likarolo, le kalafo ea bokaholimo (mohlala, ho penta ka khauta, ho fafatsa ka thini).

Hlalosa mamello e nepahetseng moralong, sebelisa lisebelisoa tse nepahetseng haholo (joalo ka mechini ea ho cheka ea CNC), 'me u etse tlhahlobo e tiileng ea litekanyo le liphetoho tsa ts'ebetso ts'ebetsong ka 'ngoe.

Hlahloba thepa e tala (mapolanka, likarolo), hlokomela liparamente tsa lamination/drilling/plating, sebelisa liteko tsa X-ray le flying probe ho lemoha likhokahano tsa ka hare le ts'ebetso ea motlakase, 'me u etse tlhahlobo e felletseng ea lihlahisoa tse felileng.

Lipululana tsa ho qhaqha/ho qhaqha, ho se lekane ha ho tjheka/ho se lekane ha lesoba, kgokelo e fokolang ya dikarolo/potoloho e kgutshwane, kalafo e mpe ya bokahodimo, ho kheloha ha dibopeho, jj.

Ntlafatsa mocheso oa lamination, khatello le linako, liboto tse lokisoang esale pele ho tlosa mongobo le litšila, 'me u sebelise vacuum lamination ho ntša moea.

Sebelisa lisebelisoa tsa ho cheka tse nepahetseng haholo ho laola liparamente, ho etsa ho fata mabota a masoba ho ntlafatsa ho khomarela ha koporo, le ho lemoha boleng ka ho arola metallographic.

Hlahloba le ho leka likarolo pele o kenya, ntlafatsa lits'ebetso tsa ho kenya ho netefatsa khokahano e tiileng, le ho etsa liteko tse felletseng tsa motlakase le liteko tsa ts'epo kamora tlhahiso.

E angoa ke litšenyehelo tsa thepa (thepa e sebetsang hantle e bitsa chelete e ngata), ho rarahana ha ts'ebetso (mohlala, li-micro-via, ho kenya likarolo), bongata ba tlhahiso, le litšenyehelo tsa tlhahlobo.

Batlisisa matla a tekheniki (lisebelisoa, lits'ebetso), litsamaiso tsa taolo ea boleng, linyeoe tsa tlhahiso, litlhahlobo tsa bareki, litheko le linako tsa ho tlisa thepa.

Ho kenyeletsoa tlhahlobo ea pono, liteko tsa motlakase (multimeter, oscilloscope, analyzer ea marang-rang), liteko tsa ts'ebetso, tlhahlobo ea X-ray, tlhahlobo ea probe e fofang, jj.

Sebelisa bethe ea manala ea sesebelisoa sa ICT ho kopana le lintlha tsa liteko le ho lemoha liparamente tsa motlakase tsa likarolo, lipotoloho tse khutšoane, lipotoloho tse bulehileng, ho kheloha ha liparamente, jj. Libaka tsa liteko li hloka ho bolokoa moralong.

Etsisa tikoloho ea sebele ea mosebetsi, leka mesebetsi ka botlalo, latela tatellano ea liteko tsa motheo ho isa ho tse rarahaneng, 'me u tlalehe le ho sekaseka lintho tse sa tloaelehang.

Sebelisa sebopeho sa JTAG ho sebetsa lisele tsa ka hare tsa ho hlahloba moeli oa chip, ho lemoha maemo a pin le likhokahano tsa inter-chip, le ho khetholla liphoso tsa potoloho e bulehileng le e khutšoanyane.

Taba ea pele, sheba ponahalo (likarolo tse chesitsoeng, manonyeletso a solder a petsohileng), ebe u etsa liteko tsa motlakase ho fokotsa sebaka sa liphoso, u sekaseke lihokelo tse ka bang teng ho latela moralo, 'me u sebelise mokhoa oa ho nkela sebaka ho fumana ntlha ea phoso.

E phahame haholo, kaha likarolo li ka har'a mealo e ka hare. E hloka ho tlosa mealo e ka holimo ka hloko ho pepesa ntlha ea phoso, ho laminate hape ho tsosolosa botšepehi kamora tlhokomelo, le ho qoba litšusumetso lipotolohong tse ling.

Sebelisa lisebelisoa tse nepahetseng haholo tse kang lisebelisoa tsa ho tjheseletsa tsa micro-spot le li-tweezers tse nepahetseng. Rera moralo oa tlhokomelo esale pele 'me u sebelise ho futhumatsa ha sebaka ho laola mocheso.

Etsa liteko tsa motlakase (botšepehi ba lets'oao, botšepehi ba matla), liteko tsa ts'ebetso, le liteko tsa ts'epo (botsofali, ho thothomela).

Hlahisa merero ea liteko, mekhoa ea ho hlahloba liphoso, litlhaloso tsa ts'ebetso ea tlhokomelo, le lits'ebetso tsa netefatso ea boleng.

Lisebelisoa tsa teko: multimeter, oscilloscope, analyzer ea marang-rang, jj. Lisebelisoa tsa tlhokomelo: lisebelisoa tsa ho tjheseletsa tsa micro-spot, sethunya sa moea o chesang, jj.

Nahana ka ho nepahala ha khanyetso, tekanyo ea matla, le coefficient ea mocheso. Khetha li-resistor ho latela litlhoko tsa potoloho.

E sebelisetsoa ho sefa, ho arola, ho boloka matla, ho kopanya matshwao, jj.

Fumana ho latela maqhubu a tshebetso, inductance, le bokgoni ba hona jwale. Bakeng sa ho sefa matla, nahana ka ripple le load current.

Nahana ka tshebetso, tshebediso ya matla, mofuta wa sephutheloana, botshepehi, le tshehetso ya moetsi.

Bapisa diparamitha tsa motlakase le boholo ba 'mele nakong ya moralo. Kgetha dikarolo tse tsamaellanang le thepa le ditshebetso tsa boto, mme o etse netefatso ya ketsiso.

Bakeng sa likarolo tse sa sebetseng, laola mocheso le nako ho thibela ho kopanngoa ha tšepe ka mokhoa o batang. Bakeng sa likarolo tse sebetsang, sebelisa lisebelisoa tse nepahetseng haholo (mohlala, ho kopanngoa ha tšepe ka mokhoa o mocha) ho netefatsa likhokahano tse tšepahalang le ho thibela tšenyo ea mocheso.

Hakanya nako ea bophelo ka liteko tse potlakileng tsa botsofali, lintlha tsa moetsi, le ho beha leihlo nako e telele lintlha tsa 'nete tsa ho hloleha.

Khanyetso: ho kheloha ha boleng/potoloho e bulehileng. Capacitor: ho dutla/potoloho e kgutshwane. Inductor: phetoho ya inductance/ho kobeha ha winding. Chip: ho hloleha ha tshebetso/diphoso tsa phini.

Boloka ka sehlopha ka mongobo le tšireletso ea ESD. Boloka sistimi ea polokelo ea lintho ho tlaleha tlhahisoleseling, ho etsa sampole khafetsa, le ho laola maemo a setoko ka mokhoa o utloahalang.

Eketsa sebaka sa ho latela (≥3×bophara), sebelisa ho itšehla thajana ha mobu, ntlafatsa topology ea tsela, le ho bapisa impedance.

Kenya diparamithara tsa parasitic, mohlomong di baka tahlehelo le tieho maqhubung a phahameng. Di-Via tsa matshwao a fetang 10GHz di lokela ho ba le bophara ba

Kenya disebediswa tsa tshireletso tsa ESD (mohlala, di-diode tsa TVS), seta ditsela tsa ho ntsha ESD, mme o boloke mesaletsa ya matshwao a senotlolo ≥2mm ho tloha mathokong a boto.

Sebelisa X-ray ho hlahloba manonyeletso a ka hare. Bolelele ba manonyeletso e lokela ho ba 0.4-0.6mm, ka sekgahla sa ho se sebetse ≤15%.

ENIG bakeng sa ho kopanya ka ho tjheseletsa ka maqhubu a phahameng le ka nepo. OSP bakeng sa theko e tlase (ho sebetsa dikgwedi tse 6-8). Tin ya ho qoelisa bakeng sa ho kopanya ka maqhubu.

Beha hantle likhurumetso tsa thebe tse nang le impedance ea ho thella

Ka bophara ba 0.3-0.5mm, sebaka sa ≤1mm, ≥100 vias/cm² ho netefatsa katleho ea ho qhala ha mocheso.

Mela ya data ya DDR4: mamello ya bolelele ±5mil. Dipara tse fapaneng tsa PCIe: ±2mil.

Kenya di-capacitor tse kgaolang (0.1μF bakeng sa maqhubu a phahameng, 10μF bakeng sa maqhubu a tlase). Boloka sebaka sa matla/lera la mobu

Tekanyetso ea IPC: ≤0.7% bakeng sa lits'ebetso tse se nang loto, ≤0.5% libakeng tsa BGA.

Sebelisa dynamic voltage scaling, tima di-module tsa idle, mme o kgethe di-chip tsa low-IQ (mohlala, letoto la TI MSP430).

Fokotsa tahlehelo ea lets'oao le liparamente tsa likokoana-hloko, eketsa bongata ba litsela. Litšenyehelo li phahame ka 20%-30% ho feta li-via tse phunyeletsang.

Sebelisa lisebelisoa tsa CAM350 kapa Altium DFM ho hlahloba bophara/sebaka se fokolang sa trace (≥6mil), karolelano ea ponahalo (≤8:1), jj.

Mekhoa e tloaelehileng: pente e thibelang lintho tse tharo (botenya ba 0.1-0.3mm), nano-coating (

Sebelisa moralo oa fene-out ho fokotsa khatello ea ho tsamaisa BGA. Liboto tse nang le mekhahlelo e 4 li lumellana le 80% ea litlhoko tsa kamehla; ≥mekhahlelo e 6 bakeng sa meralo e potlakileng.

Hlahloba bohloeki ba pad, botenya ba solder peista (0.12-0.15mm), le mocheso oa ho phalla hape (tlhōrō ea 235-245℃).

Sebelisa megohmmeter ea 500V. Khanyetso ea ho thibela ho ruruha e lokela ho ba ≥100MΩ mongobong oa ≤60%.

Sebelisa li-resistor tsa ho felisa (mohlala, mosebetsi oa DDR ODT) le ho fokotsa impedance. Netefatsa hore phapang ea impedance e ka tlase ho 10%.

Koporo ea 1oz (35μm): ~1A/mm bophara ba motsamao. 2oz: ~1.5A/mm (phahamo ea mocheso

Botsho bo thusa ho qhala mocheso empa ho thata ho bo hlahloba. Botala bo atile haholo. Bosweu bo na le khanya e phahameng (≈80%).

Bophara bo tloaelehileng: 0.4-0.8mm. Sekontiri: 0.5-1.0mm. Sekontiri sa 0.5mm se hloka likarolo tsa 0201.

Sebelisa software ea ketsiso joalo ka ANSYS, e ipapisitseng le liphapang tsa CTE (mohlala, FR-4 15ppm/℃, koporo 17ppm/℃).

Sebelisa ho sefa ka mekhahlelo e mengata (li-circuits tsa mofuta oa π). Melaetsa ea matla e bophara ba ≥20mil ho fokotsa ho sitisoa ha tsela.

Bophara ba ≥0.6mm, sebaka sa ≥1.27mm. Qetello ya bokaholimo ENIG, ha ho na sekoahelo sa maske se soldereng.

Sebaka sa leqhubu la lets'oao le nang le pheletso e le 'ngoe

Sebelisa SI9000 ho bala impedance, mamello ea taolo ± 10%. Sebelisa ho bapisa ho felisoa le ntlafatso ea topology.

Sebopeho: ± 0.1mm. Bophara ba lesoba: ± 0.05mm. Botebo ba V-Seha: 1/3-2/3 ea botenya ba boto.

Sebelisa mekhoa e tšoanang le bolelele ba serpentine e sirelelitsoeng fatše. Boloka hole le mela ea data e potlakileng 'me u qobe ho tšela lera.

Etsa liteko tsa ho tsofala tse potlakileng (85℃/85%RH, 1000h) le liteko tsa ho thothomela (5-500Hz, 2G potlakiso).

Boholo ba phaephe bo boholo ba 0.1-0.2mm ho feta li-lead tsa likarolo. Bophara ba phaephe ea SMD ke bophara ba 1.2-1.5×.

Eketsa sebaka sa koporo e futhumetseng, sebelisa sekhomaretsi sa mocheso (≥1W/mK), 'me u bule li-vias tsa mocheso tlas'a likarolo tsa motlakase.

Ho ya ka IEC 61000-4-2: ho ntsha metsi ka ho kopana ±8kV, ho ntsha metsi ka moya ±15kV, ka tshebetso e tlwaelehileng.

Botenya bo tloaelehileng ke 15-25μm. E tlameha ho koahela koporo ka botlalo ho thibela lipotoloho tse kgutshwane ho koporo e pepeneneng.

Kopanya tsamaiso e sebelisanang le e iketsang. Beha lintho tsa bohlokoa tsa tsamaiso, 'me matšoao a bohlokoa a tsamaisoe pele.

Mocheso: 120-150℃ (60-90s). Phallo e Ncha: 217-230℃ (40-60s). Sekhahla sa ho phodisa: 3-6℃/s.

Ho thella ha ntlha e le 'ngoe kapa ha ntlha e ngata. Ho thella ha ntlha e ngata bakeng sa lipotoloho tsa maqhubu a phahameng (>10MHz), ka khanyetso ea ho thella ha

Nahana ka bokgoni ba hona jwale, khanyetso ya ho kopana (

Hlokomela manonyeletso a solder ka karolo ea Metallographic (karohano ea metallographic), lemoha liphoso tsa bokaholimo ka AOI, sekaseka sebopeho sa likarolo ka XRF.

Sebaka sa 5mil, impedance 100±10Ω, phapang ea bolelele