PCB me me uas muaj qhov me me

Ib lub rooj tsavxwm luam tawm (PCB) uas tsim los ntawm kev siv tshuab laser lossis plasma etching nrog lub qhov me dua 0.15 hli (kev lag luam feem ntau siv 0.1 hli ua tus qauv), siv rau kev sib txuas ceev ceev.

Lub qhov txoj kab uas hla yog ntau tshaj 50% me dua li ntawm cov PCBs ib txwm muaj, qhov dav / qhov sib nrug ntawm kab tuaj yeem ncav cuag 30μm / 30μm, qhov ceev ntawm cov xov hlau nce ntxiv 2-3 zaug, thiab nws tsim nyog rau kev xa cov teeb liab siab thiab ceev ceev.

Raws li cov txheej txheem, lawv tau muab faib ua qhov muag tsis pom kev (ib sab conduction), faus vias (sab hauv conduction), thiab los ntawm vias (los ntawm tag nrho lub rooj tsavxwm). Qhov muag tsis pom kev ntawm txoj kab uas hla yog 50-100μm.

Siv dav hauv cov xwm txheej kev sib koom ua ke siab xws li cov xov tooj ntse (suav txog ntau dua 60%), 5G chaw nres tsheb, cov motherboard server, thiab AI chip ntim khoom.

Nws tau tshwm sim tom qab kev loj hlob ntawm cov thev naus laus zis laser drilling hauv xyoo 1990. Cov txheej txheem tam sim no tuaj yeem ua tiav qhov 30μm qhov txoj kab uas hla, thiab cov ntaub ntawv tsawg kawg nkaus qhov txoj kab uas hla yog 15μm.

Qhov tsawg kawg nkaus qhov txoj kab uas hla rau kev tsim khoom loj hauv kev lag luam tuaj yeem ncav cuag 50μm, thiab qhov txwv ntawm chav kuaj yog 15μm, tab sis tus nqi nce ntxiv nrog rau qhov txo qis ntawm qhov txoj kab uas hla.

Feem ntau, qhov sib piv ntawm cov duab tsis pub tshaj 1: 1, thiab cov txheej txheem tshwj xeeb tuaj yeem ncav cuag 1: 0.8. Qhov sib piv ntawm cov duab siab dhau yuav ua rau cov khoom siv electroplating tsis zoo.

Qhov sib nrug tsawg kawg nkaus uas pom zoo yog ≥80μm kom ntseeg tau tias muaj kev ncaj ncees ntawm cov txheej txheem tooj liab electroless thiab txo qhov kev pheej hmoo ntawm cov voj voog luv luv.

Nws raug pom zoo kom siv kev sib xyaw ua ke ntawm cov laug cam thiab cov prepregs, nrog rau qhov tuab ntawm cov txheej dielectric tswj tau ntawm 50-75μm kom ntseeg tau tias qhov zoo ntawm kev xa cov teeb liab.

Nws yog ib qho tsim nyog yuav tsum tau them sai sai rau qhov capacitance parasitic ntawm lub qhov (tus nqi ib txwm

Rau BGA kiv cua-tawm, qhov tsim ntawm qhov muag tsis pom kev zoo dua. Txhua lub ncoo sib raug rau 1-2 microvias, thiab qhov dav ntawm kab kiv cua-tawm tsis tsawg dua 40μm.

Paub txog ntau qhov kev sib txuas ntawm lub zog / av dav hlau los ntawm microvias, nrog qhov sib nrug ≤5mm, los txo qhov impedance ntawm cov dav hlau.

Ua kom qhov ceev ntawm cov cua sov dissipation vias (pom zoo ≥10 vias / cm²), nrog rau lub qhov txoj kab uas hla ≥80μm, los txhim kho kev ua haujlwm ntawm cua sov.

Qhov qhib ntawm lub npog ntsej muag yuav tsum loj dua 20-30μm dua li qhov txoj kab uas hla ntawm txhua sab kom tiv thaiv cov kua mem ntawm lub npog ntsej muag kom tsis txhob thaiv qhov.

Siv cov txheej txheem tsim kom muaj ntau txheej xov hlau, thiab siv cov vias dig muag thiab faus es tsis txhob siv cov vias hla, uas tuaj yeem ua rau cov xov hlau ntom ntom ntau dua 30%.

Xws li kev siv laser drilling (CO₂, UV laser), plasma etching, thiab mechanical drilling (tsuas yog haum rau cov qhov loj dua), nrog rau laser drilling suav txog ntau dua 80%.

CO₂ laser yog qhov tsim nyog rau qhov txoj kab uas hla ntawm 0.075-0.15 hli nrog tus nqi qis; UV laser tuaj yeem ua cov microvias

Qhov ceev ntawm CO₂ laser yog li 5,000-10,000 qhov ib feeb, thiab qhov ceev ntawm UV laser yog li 2,000-5,000 qhov ib feeb.

Qhov tseeb ntawm qhov chaw ntawm laser drilling yog ± 25μm, qhov ntawm mechanical drilling yog ± 50μm, thiab UV laser tuaj yeem ua tiav qhov tseeb siab ntawm ± 15μm.

Kev siv laser pab los ntawm nitrogen tuaj yeem tswj tau qhov siab ntawm burr hauv 5μm, lossis siv plasma desmearing.

Yuav tsum muaj cov txheej txheem electroplating los ntawm qhov, nrog rau qhov tuab ntawm tooj liab tswj tau ntawm 25-35μm, thiab qhov sib xws ntawm cov tuab tooj liab hauv qhov ≥85%.

Tso ib txheej tooj liab 0.3-0.5μm rau ntawm phab ntsa qhov insulating kom muab lub hauv paus conductive. Qhov concentration ntawm palladium ions hauv cov tshuaj activation yuav tsum tau tswj hwm ntawm 2-5ppm.

Qhov kub ntawm lamination yog 180-210 ℃, qhov siab yog 300-500psi, thiab qhov cua sov yog 1-2 ℃ / feeb kom ntseeg tau tias cov txheej dielectric kho tau zoo ib yam.

Qhov degree nqus tsev yuav tsum qis dua -95kPa. Ua ntej kho cov prepreg rau B-theem ua ntej lamination, thiab tus nqi ntawm cov npuas dej tuaj yeem txo qis dua 0.5%.

Cov uas siv ntau suav nrog immersion gold (tuab 0.05-0.1μm), OSP (zaj duab xis tuab 0.2-0.5μm), thiab immersion silver (0.1-0.3μm). Immersion gold muaj kev ntseeg siab tshaj plaws.

Yuav tsum tswj qhov viscosity ntawm cov kua mem ntawm 80-120 Pa-s thiab siv cov txheej txheem nqus tsev kom tiv thaiv cov kua mem hauv cov qhov, nrog rau qhov thaiv qhov ≤1%.

Kev txiav laser yog siv thaum qhov yuav tsum tau ua kom raug ntawm cov duab yog

Xws li cov phab ntsa qhov ntxhib (roughness Ra > 1.5μm), qhov tsis muaj dab tsi hauv qhov (qhov tsis muaj dab tsi piv > 5%), qhov sib txawv ntawm qhov (> ± 30μm), thiab lwm yam.

Kev ntxuav plasma yog siv los tshem tawm cov seem drilling, yog li ntawd qhov roughness ntawm qhov chaw Ra ntawm phab ntsa qhov ≤1.0μm.

Tag nrho cov qoob loo nyob rau hauv cov txheej txheem mature yog li 85-92%. Lub qhov me dua, qhov qis dua qhov qoob loo. Cov qoob loo ntawm 50μm microvias yog li 80%.

Xws li FR-4 (dielectric constant 4.2-4.5), high-speed boards (xws li Rogers 4350B, Dk = 3.66), BT resin, thiab lwm yam.

Cov laug cam ceev ceev muaj qhov poob qis dua (Df

Siv rau kev sib txuas ntawm cov txheej txheem, nrog rau cov kua nplaum tswj tau ntawm 40-50% thiab qhov fluidity ntawm 20-30% kom ntseeg tau tias qhov sib xws ntawm dielectric tom qab lamination.

Rau txheej sab hauv, pom zoo kom siv cov ntawv ci tooj liab 18μm lossis 35μm. Rau txheej sab nraud, 18μm tuaj yeem siv los txo qhov poob ntawm lub teeb liab. HDI boards feem ntau siv 9μm ultra-thin tooj liab ntawv ci.

Nws yuav tsum ua tau raws li qhov kub thiab txias tsis kam (tsis tev tawv ntawm 260 ℃ / 10s), rwb thaiv tsev tsis kam (> 10 ^ 12Ω), thiab kev nplaum (kev xeem hla theem 0).

Nws raug pom zoo kom siv RTF (kev kho rov qab) cov ntawv ci tooj liab nrog qhov roughness Ra

Nyiam cov ntaub ntawv uas muaj dielectric constant qis (Dk

Lawv yuav tsum ua raws li RoHS 2.0 cov lus qhia, nrog rau cov ntsiab lus halogen (chlorine + bromine)

Cov khoom siv FR-4 muaj tus nqi qis tshaj plaws. Cov laug cam ceev ceev raug nqi 3-5 npaug ntawm FR-4, thiab BT resin nyob nruab nrab.

Cov khoom siv hauv paus yuav tsum tau khaws cia rau hauv qab 25 ℃ thiab av noo

Xws li kev tshuaj xyuas pom, kev ntsuas qhov loj ntawm lub qhov, kev sim qhov tuab ntawm tooj liab, kev sim impedance, thiab kev tshuaj xyuas qhov seem.

Siv cov cuab yeej ntsuas duab ob-seem (qhov tseeb ± 1μm) lossis lub tshuab ntsuas hluav taws xob scanning (SEM). Kev tshuaj xyuas qhov muag tsis siv neeg (AOI) tuaj yeem siv rau kev ntes ntau pawg.

Cov qauv IPC xav kom cov tooj liab tuab hauv qhov yuav tsum yog ≥20μm, thiab qhov sib piv ntawm qhov nruab nrab tooj liab tuab rau qhov tsawg kawg nkaus tooj liab tuab yuav tsum yog ≤1.5, ntes tau los ntawm txoj kev metallographic cross-section.

Siv lub network analyzer nrog qhov zaus sim ntawm 1-10GHz, thiab qhov impedance deviation yuav tsum tswj tau hauv ± 10%.

Nws tuaj yeem pom qhov zoo ntawm phab ntsa qhov, tuab ntawm cov txheej tooj liab, thiab qhov xwm txheej ntawm kev sib txuas ntawm cov txheej, nrog rau qhov raug ntawm ± 5μm.

Xws li kev sim kev ntxhov siab thermal (260 ℃ / 10 zaug), kev sim voltage (500V DC / 1 feeb), thiab kev sim lub voj voog kub-av noo (-40 ℃ ~ 85 ℃).

Saib seb lub qhov phab ntsa puas tawg tom qab kev sim thermal shock (288 ℃ / 10 zaug), thiab qhov ntev tawg

Siv SEM los soj ntsuam qhov microstructure, lub zog-dispersive spectroscopy (EDS) los ntes cov khoom sib xyaw, thiab X-ray los ntes cov qhov tsis zoo sab hauv.

Ua kom zoo dua cov txheej txheem electroplating kom txo cov voids hauv cov qhov, ua kom muaj zog ntawm cov txheej txheem solder mask, thiab zam kev tsiv teb tsaws chaw electrochemical los ntawm cov yam ntxwv ib puag ncig.

Nyob rau hauv kev siv ib txwm muaj, nws tuaj yeem ncav cuag 5-10 xyoo, thiab qhov chaw ib puag ncig hnyav (kub siab, av noo siab) yuav ua rau nws luv luv mus rau 2-3 xyoos.

Xws li SMT pasting, BGA vuam, thiab kev ntxig khoom, nrog rau qhov yuav tsum tau ua kom raug SMT pasting ntawm ± 50μm.

Nws yog qhov tsim nyog los tswj lub siab ntawm 0.5-1.0kg / cm² kom tiv thaiv cov khoom los ntawm kev sib tsoo microvias, thiab qhov kub siab tshaj plaws ntawm qhov nkhaus reflow qhov cub yog 230-245 ℃.

Nws yog qhov tsim nyog los tswj hwm qhov sib koom ua ke ntawm cov pob solder (

Txhim kho qhov tuab ntawm cov ntawv luam tawm ntawm cov tshuaj nplaum solder (100-120μm), siv cov khoom siv reflow soldering uas tiv thaiv los ntawm nitrogen, thiab cov ntsiab lus oxygen yog

Qhov kub ntawm kev ua haujlwm rov ua dua yuav tsum tswj tau qis dua 260 ℃, thiab lub sijhawm yuav tsum

Haum rau microvias nrog lub qhov txoj kab uas hla ≥0.3 hli, xav tau ob-yoj soldering lossis xaiv yoj soldering, nrog lub solder nthwv dej siab ntawm 25-35 hli.

Muab qhov tseem ceeb rau cov tshuaj nplaum uas tsis muaj hlau lead (SnAgCu alloy) uas muaj qhov melting point ntawm 217 ℃, flux activity level RMA, thiab residue insulation residue residue residue >10^10Ω.

Txo cov hlau ntsiab lus ntawm cov tshuaj nplaum solder rau 90-92%, optimize lub stencil qhib tsim, thiab cov solder bead defect tus nqi tuaj yeem txo qis dua 0.1%.

Siv cov tshuaj ntxuav uas muaj dej nyob rau ntawm qhov kub ntawm 50-60 ℃ rau 3-5 feeb kom ntseeg tau tias qhov concentration ntawm cov ion seem yog

Teem qhov tseeb ntawm kev kuaj pom rau ± 25μm thiab qhov sib piv ntawm qhov sib piv rau 30-50%, uas tuaj yeem ntes tau ntau dua 95% ntawm cov qhov tsis zoo ntawm kev sib dhos.

Cov nqi khoom siv suav txog 40-50%, cov nqi ua tiav 30-40%, thiab cov nqi tshuaj xyuas thiab ntim khoom 10-20%.

Txoj kab uas hla ntawm qhov, tus naj npawb ntawm cov txheej, cov txheej txheem kho qhov chaw, hom khoom siv. Txhua qhov kev txo qis 10μm ntawm txoj kab uas hla ntawm qhov tsawg kawg nkaus yuav ua rau tus nqi nce ntxiv 15-20%.

Ua kom zoo dua qhov kev tsim qauv kom txo cov txheej txheem, siv cov ntaub ntawv txheem, thiab nce cov pawg ntau lawm, uas tuaj yeem txo cov nqi los ntawm 10-30%.

Lub voj voog tsim khoom rau cov txheej txheem ib txwm muaj yog 7-10 hnub, thiab cov lus txib ceev tuaj yeem raug nias rau 3-5 hnub, tab sis tus nqi nce ntxiv 20-30%.

Txais yuav cov kab ntau lawm tsis siv neeg, ua kom cov txheej txheem ua haujlwm zoo dua, thiab nce tus nqi siv ntawm cov khoom siv laser drilling kom ntau dua 80%.

Lub peev xwm tsim khoom txhua hli ntawm ib txoj kab ntau lawm yog li 5,000-10,000㎡, nyob ntawm seb cov khoom siv teeb tsa thiab cov txheej txheem nyuaj npaum li cas.

Tus nqi ntawm cov khoom me me (1000㎡), feem ntau yog vim kev teeb tsa tshuab thiab kev faib cov nqi ruaj khov.

Xam tag nrho los ntawm thaj chaw (yuan / ㎡), tus lej ntawm cov txheej, qhov txoj kab uas hla, thiab lwm yam. Tus nqi ua tiav rau ib qho 8-txheej 0.1 hli microvia board yog li ntawm 2000-3000 yuan / ㎡.

Los ntawm kev tsim qauv DFM kom zoo dua qub, kev txo qhov yuav tsum tau ua kom haum raws li qhov ua tau zoo tuaj yeem txo cov nqi ntau dua 15%.

Kev nqis peev rau hauv cov khoom siv kab ntau lawm tiav yog li ntawm 10-20 lab yuan, suav nrog cov tshuab laser drilling, cov kab electroplating, laminators, thiab lwm yam.

Tsim kom muaj qhov me dua (20 txheej), kev poob qis dua, thiab kev ntim khoom sib xyaw ua ke.

Nws yog qhov tsim nyog los ua kom tiav qhov sib txuas ntsug ntawm qhov sib txuas

Siv rau kev ua kom zoo dua ntawm cov txheej txheem thiab kev tshawb pom qhov tsis zoo, uas tuaj yeem ua rau cov txiaj ntsig ntau ntxiv los ntawm 5-10% thiab kev ua haujlwm ntawm kev tshawb pom los ntawm 30%.

Kev tsim khoom hauv chav kuaj ntawm 10μm qhov txoj kab uas hla tau ua tiav lawm, tab sis kev tsim khoom loj ntsib cov teeb meem ntawm cov khoom siv, cov cuab yeej siv, thiab cov nqi.

Ua tiav kev sib txuas tsis muaj teeb meem ntawm cov chips thiab PCBs los ntawm kev sib txuas ceev ceev, ua kom txoj kev xa xov luv dua, thiab txhim kho kev ua haujlwm ntawm lub system.

Siv cov ntaub ntawv thiab cov txheej txheem uas tsis ua rau ib puag ncig puas tsuaj, nrog rau cov hlau hnyav hauv cov dej khib nyiab

Yuav tsum tau cov khoom siv dielectric qis (Dk

Nws yog qhov tsim nyog los daws cov teeb meem ntawm qhov phab ntsa tawg thiab txheej tooj liab tev tawm thaum lub sijhawm khoov, nrog lub vojvoog khoov ≥3mm.

Ua tiav kev saib xyuas tag nrho cov txheej txheem thiab kev tsim khoom tsis siv neeg los ntawm cov chaw tsim khoom digital, nrog rau kev ua haujlwm ntau ntxiv ntau dua 50%.

Yuav tsum tau poob qis heev thiab kev sib txuas ruaj khov siab, nrog rau qhov loj thiab qhov dav ntawm kab tswj hwm ntawm qib submicron kom ntseeg tau tias muaj kev xa xov tooj cua quantum.

Siv 6-10 txheej HDI boards nrog lub qhov txoj kab uas hla ntawm 0.075 hli kom ua tiav kev sib koom ua ke ntawm cov chips, koob yees duab, thiab lwm yam, suav txog 30-40% ntawm tus nqi ntawm lub xov tooj ntawm tes motherboard.

Yuav tsum tau cov laug cam uas tsis tshua poob (Df

Yuav tsum tau ua kom tau raws li kev sib txuas ceev ceev ntawm ntau lub processors, siv cov thev naus laus zis rov qab los tshem tawm cov stubs, thiab kev ncua sijhawm xa cov teeb liab

Dhau daim ntawv pov thawj AEC-Q100, qhov kub thiab txias tsis kam -40 ℃ ~ 125 ℃, thiab dhau 1000-teev kev sim tshuaj tsuag ntsev.