PCB poob qis

Txiav txim los ntawm dielectric constant (Dk) thiab Df tus nqi. Cov khoom siv uas poob qis muaj Df qis dua thiab muaj zog dua Dk ruaj khov ntawm cov zaus siab.

Cov ntawv thov suav nrog 5G kev sib txuas lus (millimeter wave), kev sib txuas lus satellite (Ka band), radar systems (saum toj no 30GHz), thiab high-speed digital circuits (28Gbps+).

Feem ntau kim dua 2-5 npaug. Piv txwv li, FR-4 raug nqi li ntawm 100 CNY/m², thaum Rogers RO4350B kim li ntawm 500-800 CNY/m².

Rau txhua qhov kev txo qis 0.001 hauv Df, qhov kev poob ntawm kev xa xov ntawm 10GHz cov teeb liab txo qis kwv yees li 0.5dB / 10cm, txhim kho kev ncaj ncees ntawm cov teeb liab.

Rogers RO4350B: -40°C~280°C; Isola 370HR: -55°C~280°C.

Yog, nws tuaj yeem ua tiav qhov kev tsim hluav taws xob ceev ceev, tab sis qhov tseeb ntawm kev sib dhos ntawm cov txheej txheem yuav tsum tau tswj (≤ ± 50μm).

Xaiv raws li qhov yuav tsum tau ua ntawm cov kab xa hluav taws xob. Piv txwv li, cov kab 50Ω microstrip feem ntau siv cov ntaub ntawv nrog Dk 2.2-3.5.

Yog, kev nqus dej noo ua rau Dk thiab Df nce ntxiv. Nws raug pom zoo kom ci ntawm 125 ° C rau 4 teev kom tshem tawm cov dej noo ua ntej siv.

Feem ntau ua tau raws li tus qauv UL94 V-0. Qee cov khoom siv ua los ntawm cov av nplaum yuav tsum tau kho ntxiv kom ua tau raws li qhov yuav tsum tau ua kom tsis txhob muaj hluav taws.

Tswj los ntawm kev xam qhov dav ntawm kab, dielectric thickness, tooj liab foil roughness (Ra≤0.5μm), thiab kev ua kom zoo dua nrog cov cuab yeej simulation.

Tsis txhob muaj cov kab uas tig mus rau sab xis (ua rau muaj kev cuam tshuam ntau dua ~ 10%), tswj tus naj npawb ntawm cov vias (txhua qhov via ua rau poob ~ 0.2dB), thiab tswj cov kab uas ntev sib npaug (kev hloov pauv

Tswj ib txoj cai 3W rau qhov nrug ntawm kab (3 npaug ntawm qhov dav ntawm kab), siv kev cais hauv av, thiab txo qhov ntev ntawm cov kab sib luag.

Siv cov qauv stacking symmetrical nrog lub zog-av txheej spacing ≤0.1mm los txo lub suab nrov fais fab (tswj EMI los ntawm ~ 20dB).

Yog, tab sis qhov roughness ntawm phab ntsa qhov yuav tsum tau tswj (Ra≤1μm); txwv tsis pub, 0.3dB poob ib nti ntawm phab ntsa qhov ntxiv.

Tseem Ceeb. Zaus siab ua rau siv hluav taws xob ntau dua. Siv cov ntaub ntawv dielectric nrog thermal conductivity ≥1W/mK.

Siv cov microstrip baluns thiab LC matching circuits kom txo qhov poob rov qab hauv qab -20dB (10GHz band).

Yog. Cov ntaub qhwv yuav tsum tau plated nrog kub tawv (tuab ≥3μm) kom tiv thaiv kev oxidation los ntawm kev cuam tshuam rau kev ua haujlwm ntawm kev sib cuag zaus siab.

Tswj qhov sib piv ntawm kab dav thiab qhov sib nrug ntawm 1:1, tswj qhov impedance ntawm 100Ω ± 5%, thiab tswj qhov yuam kev parallelism

Siv Thevenin lossis AC termination matching kom cov coefficient reflection qis dua 0.1 (18GHz band).

Yuav tsum tau tswj hwm qhov kub ntawm lamination (kev hloov pauv ± 2 ° C), kev khawb qhov tseeb siab (kev kam rau qhov qhib ± 25μm), thiab kev sib xyaw electroplating zoo ib yam.

Kev siv laser drilling (qhov tsawg kawg nkaus aperture 0.1mm) lossis CNC drilling (qhov tsawg kawg nkaus aperture 0.2mm), nrog kev tswj hwm qhov roughness ntawm phab ntsa.

Kev lamination tsis raug ua rau dielectric delamination. Pom zoo kom siv lub tshuab nqus tsev lamination nrog lub siab tswj ntawm 5-8MPa.

Siv cov ntawv ci tooj liab RTF (Ra≤0.3μm), uas txo qhov poob los ntawm 15% -20% piv rau cov ntawv ci tooj liab ib txwm.

Ci ntawm 150 ° C rau 2 teev tom qab lamination kom tso tawm kev ntxhov siab, nrog rau warpage ≤0.7%.

Rau qhov zaus siab, ENIG lossis immersion silver raug pom zoo kom tsis txhob muaj OSP oxidation ntawm qhov kub siab, uas ua rau poob ntau ntxiv.

Cov txheej txheem ib txwm muaj: 4mil / 4mil; cov txheej txheem siab heev: 2mil / 2mil.

Lub npog ntsej muag solder Df yuav tsum yog ≤0.02. Qhov tuab ntau dhau ua rau poob ntau ntxiv (0.1dB/10cm ib 10μm).

Siv cov tshuab LDI uas muaj qhov tseeb siab (qhov tseeb sib phim ± 25μm) thiab cov koob txuas kho tshuab.

Kwv yees li ntawm 10% -15%, feem ntau yog vim dielectric delamination thiab impedance non-compliance.

Siv lub vector network analyzer (VNA) nrog cov khoom siv kuaj microstrip, uas npog lub hom phiaj frequency band.

Ib qho kawg impedance ± 10%, qhov sib txawv impedance ± 8%, yuav tsum tau kuaj ntawm ntau qhov chaw.

Los ntawm kev sim lub zog tev tawv, xav tau lub zog sib txuas ntawm cov ntawv ci tooj liab thiab txheej dielectric ≥1.5N / hli.

Siv TDR lossis VNA. Sim qhov poob ntawm 10cm kab kis ≤3dB (10GHz).

Ua qhov kev sim thermal shock (260 ° C, 10 lub voj voog), tsis tas yuav tsum muaj delamination lossis qhib circuits.

Kev tso tawm hluav taws xob yuav tsum ua raws li EN 55032 Chav B, nrog rau kev tiv thaiv zoo ≥40dB (1GHz).

Los ntawm kev sim S-parameter, xav tau kev poob ntawm ib qho ntawm ≤0.5dB (15GHz).

Kev ua yuam kev xeem ≤ ± 0.05, siv cov khoom siv thiab cov cuab yeej ntsuas uas tau ntsuas.

Ua qhov kev sim laus ntawm qhov kub thiab noo (85°C/85% RH, 1000 teev), nrog rau kev poob qis ntawm kev ua haujlwm

Kev kuaj daim duab qhov muag (qhov siab qhov muag ≥80%), kev kuaj jitter (RJ + DJ ≤5% ntawm UI), kev kuaj crosstalk (kev sib txuas ze-kawg ≤-30dB).

AAU (Active Antenna Unit), RF front-end modules, xav tau qhov poob qis hauv millimeter wave bands (24-40GHz).

Txhawb nqa cov interfaces ceev xws li PCIe 5.0 (32GT / s) thiab DDR5 (6400Mbps), txo cov teeb liab attenuation.

Xyuas cov khoom siv Df, qhov roughness ntawm cov ntawv ci tooj liab, ntawm kev tsim, thiab qhov tuab ntawm lub ntsej muag solder.

Kev hloov pauv ntawm dielectric thickness, qhov yuam kev ntawm kev ua cov kab dav, thiab kev sib npaug ntawm lamination ua rau Dk hloov pauv.

Ua kom cov thermal vias (inch ≥0.4mm, spacing ≤1mm) thiab siv cov khoom siv thermal gap.

Tshawb xyuas cov txheej txheem lamination thiab cov dej noo ntawm cov khoom, thiab tsis txhob cia khoom kub heev.

Siv kev ntsuas probe ze-field los tsom mus rau kev sib txuas ntawm cov txheej fais fab, ntawm resonance, thiab lwm yam.

Yog, haum rau ADAS millimeter wave radars (77GHz), tab sis yuav tsum ua tau raws li AEC-Q200 cov qauv kev ntseeg siab.

Ntxiv cov laj kab hauv av (qhov sib nrug ≤50mil) thiab npog cov npoo nrog cov ntaub ntawv nqus nthwv dej.

Txhim kho kev tsim cov txheej txheem, siv cov ntaub ntawv txheem, thiab tsim ntau yam khoom (txo tus nqi ib chav los ntawm ~ 30%).

Xav txog cov ntaub ntawv FR-4 ceev ceev (piv txwv li, Megtron 6, Df = 0.012), txo cov nqi los ntawm ~ 40%.

Xaiv cov ntaub ntawv raws li qhov zaus ua haujlwm tiag tiag, piv txwv li, cov ntaub ntawv poob nruab nrab rau 2-6GHz.

Tus nqi ntawm cov khoom siv, qhov nyuaj ntawm cov txheej txheem (piv txwv li, ntau txheej boards, dig muag/faus), thiab tus nqi ntawm cov khoom tawm.

Siv kev tsim vaj huam sib luag, ua kom cov txheej txheem yooj yim (piv txwv li, txo cov kev hla tsis pom kev/faus), thiab xaiv cov neeg muag khoom hauv zos.

Cov khoom siv los ntawm txawv teb chaws: ~4-6 lub lis piam; lwm txoj hauv kev hauv tebchaws: txo qis rau 2-3 lub lis piam.

Yog, txo cov txheej thiab siv cov khoom siv loj (piv txwv li, 18 "× 24") kom txo cov khoom pov tseg.

Suav nrog cov nqi khoom siv, cov nqi ua tiav, thiab cov nqi rov ua dua, suav txog li ~ 15% -20% ntawm tag nrho cov nqi.

Tsim nyog tus nqi rau kev sim khoom tsawg, txo cov peev txheej ruaj khov los ntawm ~ 60%.

Siab heev, xav tau kev ua tshwj xeeb; cov nqi rov ua dua tshiab yog li ntawm 10% ntawm cov nqi tsim khoom.

IPC-4101 (cov lus qhia txog cov khoom siv), IEC 61189 (cov txheej txheem sim), RoHS 2.0 (cov kev cai ib puag ncig).

Xa cov qauv rau kev sim ua kom kub hnyiab thiab kev ua haujlwm hluav taws xob; daim ntawv pov thawj siv sijhawm li 4-6 lub lis piam.

AEC-Q200 (kev ntseeg tau ntawm cov khoom tsis ua haujlwm), ISO 26262 (kev nyab xeeb ntawm kev ua haujlwm).

Yuav tsum dhau MIL-P-55110 (microwave circuit specifications) daim ntawv pov thawj thiab kev sim ib puag ncig hnyav.

Yuav tsum ua raws li RoHS Directive (txwv tsis pub muaj 6 yam khoom txaus ntshai xws li txhuas thiab mercury) thiab REACH cov cai.

Ua qhov kev ntsuam xyuas EMC thiab LVD; daim ntawv pov thawj siv sijhawm li 2-3 lub hlis.

Ua raws li ISO 13485 (kev tswj xyuas cov khoom siv kho mob zoo) thiab FDA 510 (k) daim ntawv pov thawj.

Cov qauv IPC raug hloov kho txhua ~ 3-5 xyoos kom hloov kho rau cov thev naus laus zis tshiab.

Ua qhov kev ntsuam xyuas kev ntseeg tau xws li kev ntsuam xyuas ntsev tsuag (96 teev) thiab kev ntsuam xyuas kev co (20-2000Hz).

SGS, Intertek, TÜV Rheinland, thiab lwm yam.

Kev loj hlob mus rau qhov qis dua Df (

Kev tsim qauv uas siv AI pab txhawb nqa kev xa xov kom zoo dua (txhim kho kev ua haujlwm tau zoo los ntawm 40%) thiab kwv yees cov teeb meem kev ncaj ncees ntawm cov teeb liab.

Cov khoom sib xyaw ua ke ntawm cov khoom siv ceramic matrix (Df

Tam sim no txwv los ntawm qhov tseeb (kab dav ≥ 10 mil), tab sis nws yuav tsum ua tiav prototyping sai sai yav tom ntej

Ua tiav kev koom ua ke siab dua los ntawm kev muab cov chips thiab cov khoom passive tso rau hauv, txo qhov poob ntawm kev xa xov.

Xav tau cov ntaub ntawv uas poob qis heev (Df

Yuav tsum txhawb nqa terahertz zaus bands (100-300GHz) nrog Df≤0.0015.

Siv cov dej etching thiab cov hlau tsis muaj lead soldering kom txo tau kev siv hluav taws xob los ntawm ~25%.

Paub txog kev saib xyuas cov txheej txheem tiag tiag los ntawm MES systems, txhim kho cov txiaj ntsig los ntawm 15%.

Tshawb nrhiav kev siv cov ntaub ntawv ntse (piv txwv li, cov hlau nplaum uas nco tau cov duab) los kho cov kab nrib pleb me me.

Tshuaj xyuas cov peev xwm ntawm cov txheej txheem (qhov dav tsawg kawg nkaus ntawm kab, suav cov txheej), daim ntawv pov thawj, lub sijhawm xa khoom, thiab kev pabcuam tom qab muag.

Rogers, Isola, Panasonic, Taconic.

Shengyi Technology, Huazheng Cov Khoom Tshiab, Jingangguoji, nrog rau qhov zoo ntawm kev ua tau zoo.

Tseem ceeb; yuav tsum muab cov ntaub ntawv xaiv, cov txheej txheem kev taw qhia, thiab cov kev pabcuam tshuaj xyuas qhov ua tsis tiav.

Tshawb xyuas lub peev xwm tsim khoom (sq.m/hli) thiab tus nqi xa khoom raws sijhawm (≥95%).

Cov ntsuas kev ua tau zoo, cov qauv lees txais, lub luag haujlwm rau kev ua txhaum cai, kev muaj tswv cuab ntawm kev txawj ntse, thiab lwm yam.

Yuav tsum muaj daim ntawv pov thawj ISO 9001 thiab tshuaj xyuas cov ntaub ntawv SPC (kev tswj cov txheej txheem txheeb cais).

Qhia meej cov kab lus xa rov qab/hloov pauv hauv daim ntawv cog lus; thov kom them nyiaj yog tias tus nqi puas tsuaj tshaj 5%.

Tau txais cov luv nqi (~5%-10%), teem sijhawm ua ntej, thiab kev sib qhia txog kev siv tshuab.

Yuav tsum tau cov ntawv qhia txog kev xeem RoHS thiab daim ntawv pov thawj ntawm kev tswj hwm ib puag ncig (ISO 14001).

Siv cov khoom ntim khoom tiv thaiv hluav taws xob, tsis txhob extrusion / deformation, thiab tswj qhov kub ntawm 5-35 ℃.

Qhov chaw qhuav (av noo

Pom zoo kom siv cov tshuaj ntxuav uas muaj dej ua; tsis txhob siv cov tshuaj chlorine los tiv thaiv kev xeb ntawm cov khoom.

Muab rau cov tuam txhab ua khoom siv dua tshiab kom tsis txhob muaj kuab paug rau ib puag ncig.

Yuav tsum sau daim ntawv lo rau hom khoom siv, tus lej version, hnub tsim khoom, thiab qhov ntau ntawm kev tswj impedance.

Tus nqi yog li ntawm ~ 3% -5% ntawm tag nrho cov nqi; cov khoom lag luam siab xav tau lub tshuab nqus tsev + cov tshuaj desiccants.

Muab kev cob qhia tshwj xeeb txog cov khoom siv, cov lus qhia txog cov txheej txheem, thiab kev siv cov khoom siv (lub sijhawm cob qhia ~ 1 lub lim tiam).

Nyuaj siab heev; xav tau cov cuab yeej tshwj xeeb (piv txwv li, laser rework chaw nres tsheb) thiab yooj yim ua rau puas tsuaj rau cov txheej dielectric.

Yuav tsum khaws cov ntaub ntawv tsim qauv, cov txheej txheem txheej txheem, cov ntawv qhia kev xeem, thiab lwm yam, tsawg kawg 5 xyoos.