PCB ruaj khov

Khoom siv: Rigid siv fiberglass, flexible siv polyimide. Qauv: Rigid tsis tuaj yeem khoov, flexible tuaj yeem flex. Daim ntawv thov: Rigid rau kev sib txuas ruaj khov, flexible rau qhov chaw me me.

Ib txheej, ob txheej, ntau txheej. Ib txheej muaj cov voj voog ntawm ib sab; ob txheej ntawm ob sab; ntau txheej txuas cov txheej conductive ntawm vias (piv txwv li, motherboards).

Cov khoos phis tawj desktop, TVs, kev tswj hwm kev lag luam, cov khoom siv hluav taws xob hauv tsheb (cov khoos phis tawj hauv tsheb), cov khoom siv tsis muaj kev co hauv aerospace, thiab lwm yam.

Tus nqi qis dua. Cov PCBs ruaj khov muaj cov txheej txheem laus thiab cov ntaub ntawv pheej yig; cov PCBs yooj ywm kim vim yog cov ntaub ntawv thiab cov txheej txheem nyuaj.

Cov khoom siv FR4 feem ntau: -55°C txog 125°C rau kev siv ib txwm, luv luv 260°C rau kev vuam tsis muaj hlau lead. Cov ntaub ntawv tshwj xeeb tuaj yeem tiv taus qhov kub siab dua.

Txij li ob peb cm² (cov laug cam tswj me me) mus txog rau ntau m² (cov laug cam server loj).

Nyob ntawm qhov loj me, cov txheej, thiab cov ntaub ntawv. FR4 ntau txheej boards: ~ 1-3 kg / m², hnyav dua li cov PCBs yooj ywm ntawm tib thaj chaw.

10-20+ xyoo nyob rau hauv ib puag ncig ib txwm muaj; luv dua rau xyoo nyob rau hauv tej yam kev mob hnyav (kub/av noo).

FR4 muaj qhov flexural modulus ntawm ~ 100-200MPa, qis dua li cov PCBs uas yooj ywm. Kev ua kom tuab ntxiv ua rau muaj kev tiv thaiv kev ntxhov siab.

FR4 (fiberglass epoxy), phenolic resin, epoxy resin; PTFE rau cov ntawv thov tshwj xeeb siab zaus.

Kev rwb thaiv hluav taws xob zoo, cov khoom siv kho tshuab, thiab kev ruaj khov ntawm qhov ntev. CTE: 13-17ppm / ℃. Tus nqi qis thiab cov txheej txheem laus.

Qhov kub tsis zoo (120-150 ° C), yooj yim tawg thaum lub sijhawm vuam, cov khoom siv hluav taws xob / kho tshuab tsis zoo, CTE siab, thiab tsw ntxhiab.

Tsim cov cim qhia txog kev ntws tam sim no. Cov tuab tuab feem ntau: 0.5oz (17μm), 1oz (35μm), 2oz (70μm). Cov ntawv ci tuab rau cov ntawv thov tam sim no siab.

Ua kom cov rwb thaiv tsev tiv thaiv kom tsis txhob muaj luv luv, tiv thaiv tooj liab ntawm kev ua kom tsis muaj zog thiab kev puas tsuaj rau lub cev, thiab cais cov cheeb tsam los ntawm xim (piv txwv li, ntsuab, xiav).

Luam tawm cov cim/cim rau kev txheeb xyuas cov khoom thaum lub sijhawm tsim khoom thiab kev debugging. Xim feem ntau: dawb; kuj tseem grey, liab, dub, daj, thiab lwm yam.

FR4: Tus nqi qis rau kev siv dav dav. Cov ntaub ntawv siv zaus siab (piv txwv li, PTFE): Kev poob qis ntawm lub teeb liab rau 5G. Cov khoom siv ceramic: Kev ua kom sov siab rau kev siv cua sov siab.

Xav txog hluav taws xob (zaus siab/hluav taws xob siab), tshuab (kev co), kub, thiab tus nqi. Siv FR4 rau cov khoom siv hluav taws xob, PTFE rau zaus siab, thiab ceramics rau cua sov siab.

RoHS: Txwv cov tshuaj lom (lead, mercury, thiab lwm yam). Tsis muaj Halogen: Br/Cl

Cov khoom siv Low-CTE ua rau kom qhov ntev ruaj khov dua. Kev ua kom sov tau zoo ua rau cov cua sov tawm tau zoo dua. Cov insulators ua haujlwm tau zoo txo ​​qhov poob ntawm lub teeb liab, ua rau me me thiab ua haujlwm tau zoo.

Kev ncaj ncees ntawm cov teeb liab (impedance matching, anti-reflection/crosstalk), kev faib hluav taws xob, kev sib txuas hauv av, thiab lub peev xwm nqa tam sim no.

Ua kom cov teeb liab luv luv, txo qhov vias. Siv cov khub sib txawv rau cov teeb liab ceev ceev thiab tswj impedance. Lub zog / av dav hlau nrog tooj liab khov kho. Faib cov modules kom tsis txhob cuam tshuam. Qhov dav ntawm kab raws li tam sim no.

Qhov loj raws li tuab/tam sim no (cov laug cam tuab dua xav tau qhov loj dua). Txo qhov suav ntawm qhov hla. Khawb rov qab rau cov teeb liab ceev ceev kom tshem tawm cov stubs.

Kev sib phim qhov chaw, kab xa xov, thiab qhov thauj khoom impedances kom txo qhov kev cuam tshuam. Ua tiav los ntawm kev tswj qhov dav ntawm kab, qhov sib nrug, dielectric thickness, thiab permittivity (piv txwv li, 0.33mm dav rau 50Ω microstrip ntawm FR4).

Cov khoom faib ua ntu; khaws cov khoom rhiab heev kom deb ntawm cov chaw suab nrov. Lub zog / av dav hlau hauv ntau txheej boards rau kev tiv thaiv. Av dav hlau nyob ib puag ncig cov teeb liab ceev ceev. Decoupling capacitors; optimized grounding.

Kev faib ua feem ua haujlwm, cais cov khoom uas rhiab heev rau cua sov, tso cov khoom siv zaus siab ze, muab qhov tseem ceeb rau cov khoom loj, thiab xyuas kom yooj yim rau kev teeb tsa/kev saib xyuas.

Cov fais fab sib ze thiab cov dav hlau hauv av kom txo qhov inductance. Voltage nrog kev sib txuas. Tooj liab khov kho rau cov dav hlau fais fab; ua kom cov kev siv hluav taws xob siab tuab.

Cov chaw cua sov thiab cov dav hlau tooj liab nyob rau hauv cov khoom kub. Cov khoom siv cua sov siab. Tsim cov cua ntws; ntxiv cov dab dej cua sov / kiv cua yog tias xav tau.

Qhov chaw ntawm lub qhov: ±0.1 hli. Qhov chaw plated: ±0.076 hli. Qhov chaw tsis plated: ±0.05 hli. Qhov dav ntawm kab: ±10%-20%.

Altium Designer (haum rau cov qauv me me mus rau nruab nrab), Cadence Allegro (ntau txheej ceev ceev), Mentor PADS (siv tau yooj yim thiab ua haujlwm tau zoo).

Kev Sib Txuas Lus → Kev Tshawb Fawb → Kev Tso Tooj Liab → Kev Thaij Duab → Plating → Etching → Lub Npog Ncauj Solder → Silkscreen → Qhov Chaw Tiav → Profiling.

Cov Teeb Meem: Phab ntsa tsis zoo, cov kab nrib pleb, cov tshuab laum tawg. Cov Kev Daws Teeb Meem: Hloov cov tshuab laum, ua kom qhov ceev/nias ceev dua, tshuaj xyuas cov khoom siv.

Lub Luag Haujlwm: Ua kom cov phab ntsa qhov sib txuas rau txheej. Kev Tswj: Cov tshuaj sib xyaw, qhov kub (25-35 ° C), pH (11-12), kev huv ua ntej kho.

Photolithography: Kev ua haujlwm siab rau HDI, tus nqi siab thiab nyuaj. Kev luam ntawv npo: Cov khoom siv pheej yig / yooj yim, qhov ua haujlwm qis dua.

Tswj los ntawm qhov ceev tam sim no, lub sijhawm plating, thiab qhov concentration ntawm cov tshuaj. Piv txwv li, 1oz (35μm) yuav tsum tau 20-30 feeb ntawm 2-3A/dm².

Tswj cov tshuaj tua kab mob, qhov kub, lub sijhawm, thiab lub zog tsuag, thiab saib xyuas cov khoom siv tsis tu ncua. Kev muaj zog ntau dhau yuav ua rau muaj kev txiav ntau dhau, thaum kev muaj zog tsawg ua rau kev txiav tsis tiav. Khaws qhov kub thiab txias ntawm 45-55 ℃, txiav txim siab lub sijhawm raws li qhov tuab ntawm lub rooj tsavxwm, thiab lwm yam, thiab xyuas kom muaj lub zog sib npaug rau kev sib cuag tag nrho.

Npog lub voj voog kom sib npaug yam tsis muaj qhov luam tawm ploj, qhov pinholes, lossis npuas. Cov roj tuab ntawm qhov tooj liab: 10-18μm, ntawm: 5-8μm. Qhov sib nrug tsim nyog ntawm ntug voj voog kom tiv thaiv kev npog ntau dhau lossis kev pheej hmoo luv luv.

Cov cim yuav tsum meej, tiav, nrog rau qhov sib piv xim zoo, tso rau qhov tseeb yam tsis thaiv cov cheeb tsam tseem ceeb, thiab muaj kev nplaum zoo (xaiv cov kua mem thiab cov txheej txheem kho kom zoo).

HASL: Tus nqi qis, kev sib txuas zoo, qhov tiaj tiaj tsawg. ENIG: du, kev sib txuas zoo thiab kev tiv thaiv corrosion, tus nqi siab. Cov hlau immersion: Kev sib txuas zoo, qhov chaw du, lub neej txee. OSP: Tus nqi qis, cov txheej txheem yooj yim, kev khaws cia kev sib txuas luv luv.

Kev txiav tshuab (ua kom raug siab, haum rau cov qhov loj me). Kev xuas nrig (ua haujlwm tau zoo, haum rau kev tsim khoom ntau yam). Kev txiav laser (ua kom raug siab heev, tus nqi siab, haum rau cov khoom me me). Xaiv raws li cov duab, qhov tseeb, qhov loj me, thiab tus nqi.

Tshawb xyuas qhov ntev/tuab tom qab txiav. Tshawb xyuas qhov chaw ntawm lub qhov, qhov loj, thiab phab ntsa tom qab tho. Tshawb xyuas qhov tuab/sib xws ntawm tooj liab tom qab plating. Tshawb xyuas qhov kev ua haujlwm ntawm lub voj voog tom qab etching. Tshawb xyuas qhov zoo ntawm kev luam ntawv ntawm lub npog ntsej muag/cov cim. Tshawb xyuas qhov tuab/kev nplaum ntawm txheej tom qab ua tiav qhov chaw. Tshawb xyuas cov duab/ntug tom qab molding.

Siv cov cuab yeej kuaj hluav taws xob ya lossis cov khoom siv ICT. Cov cuab yeej kuaj hluav taws xob ya haum rau cov khoom me me/ntau yam, nrhiav qhov qhib/luv, thiab lwm yam. ICT yog rau kev tsim khoom ntau, kuaj tag nrho kev ua haujlwm hluav taws xob nrog cov khoom siv tshwj xeeb.

Tshawb nrhiav los ntawm kev sib txuas, qhov khoob, thiab kev ncaj ncees ntawm tooj liab hauv cov laug cam ntau txheej. Tshawb xyuas cov pob qij txha BGA thiab cov qhov tsis zoo sab hauv (cov khoom txawv teb chaws, kev tawg) yam tsis muaj kev puas tsuaj.

Sau cov duab los ntawm cov koob yees duab kho qhov muag thiab piv rau cov qauv kom pom cov qhov tsis zoo xws li cov khoom ploj lawm, tsis sib haum, luv. Siv rau hauv kev tshuaj xyuas tiag tiag tom qab luam ntawv, tso, rov ua dua soldering kom txhim kho kev ua haujlwm zoo thiab zoo.

Kev sim khoov (saib cov kab nrib pleb ntawm cov ces kaum/lub voj voog uas tau teev tseg). Kev sim poob (ua qauv kev cuam tshuam). Kev sim kev co (ua qauv kev co los xyuas kev sib txuas thiab cov qauv).

Raws li IPC-4552, ENIG haum rau qhov muaj zaus siab/kev ntseeg siab siab (Ni: 3-5μm, Au: 0.05-0.1μm). OSP pheej yig (zaus zaj duab xis: 0.2-0.5μm, tsim nyog rau kev khaws cia luv luv). HASL yog laus (Sn thickness >2.5μm, tsis tiaj tus).

Kho qhov concentration ntawm cov tshuaj (acidic etchant: CuCl₂ 180-220g/L, HCl 1.0-1.5mol/L), qhov kub 50-55℃. Yog tias muaj under-etchant ntau dhau, txo qhov ceev thiab nce qhov siab ntawm kev txau mus rau 2-3bar.

Ib qho IPC-6012, cov laug cam ntau txheej dav dav ≤75μm, cov laug cam HDI ≤50μm. Kev ntsuas qhov chaw laser drilling raug ±25μm, tswj nrog cov tshuab raug siab.

Khoom siv FR-4: longitudinal ≥345MPa, transverse ≥276MPa (ASTM D790). 1.6mm thickness ≥300MPa.

Kev txiav cov khoom siv metallographic (IPC-TM-650, hla qhov ≥20μm, dig muag/faus ntawm ≥18μm). Kev sim XRF tsis ua puas (qhov tseeb ±0.5μm).

Ua ntej cua sov: 90-130 ℃ (60-120s). Thaj chaw vuam: 240-260 ℃ (chwv 2-4s). Tus nqi txias: 3-6 ℃ / s (J-STD-003).

Ib txwm muaj: 15-30μm (IPC-6012), thaj chaw ntom ntom ≥20μm. Kev luam ntawv npo: 20-25μm, kho lub teeb: 15-20μm.

Ib txwm muaj: 6/6mil (0.1524mm). LDI + tshuaj etching: 3/3mil (0.0762mm). HDI boards: 1/1mil (0.0254mm).

Rau kev ua kom muaj hluav taws xob zoo, xaiv cov resin plugging (qhov tob ≥80% ntawm qhov tob, qhov yuam kev tiaj tiaj ≤10μm). Rau kev rwb thaiv tsev xwb, xaiv kev npog (qhov dav npog ≥0.1 hli).

Ib qho IPC-J-STD-033, ci ntawm 125 ℃ rau 4-8 teev (≤1.6mm: 4 teev, ＞1.6mm: 8 teev) kom txo cov dej noo hauv qab 0.1%.

Qhov roughness siab dua ua rau daim tawv nqaij zoo dua thiab lub teeb liab poob. RTF ntawv ci Ra 10GHz). VLP ntawv ci Ra

Siv tshuab txhuam kom tshem cov kab nrib pleb (siab 0.3-0.5MPa, ceev 2-3m/min). Tshuaj lom neeg micro-etching (sodium persulfate 100-150g/L, 40-50℃, 1-2min).

Dav dav: ib leeg-kawg ± 10%, sib txawv ± 8%. Kev kub ceev (> 1Gbps): ib leeg-kawg ± 5%, sib txawv ± 3%, kho los ntawm kab dav, dielectric thickness, tooj liab thickness.

Ib qho UL 796, cov khoom siv FR-4 ≥1400V / hli ntawm 25 ℃ / 50% RH. Creepage nrug 1 hli sib raug rau 100-200V.

Qhov dav tsawg kawg nkaus ntawm kab/qhov sib nrug, qhov loj ntawm qhov/qhov piv ntawm daim ntaub (daim ntaub ≥ qhov +0.4 hli thaum qhov ≥0.3 hli), qhov piv ntawm thaj tsam tooj liab (30%-70%), qhov piv ntawm qhov laum (≤8:1), qhov dav ntawm lub ntsej muag vuam (≥0.1 hli).

Ua rau: CTE tsis sib xws, tuab tsis sib xws, qhov kub tsis zoo. Cov kev daws teeb meem: Xaiv cov ntaub ntawv CTE ≤15ppm/℃, tswj qhov tuab kam rau siab ±0.05mm, ua kom qhov kub thiab txias zoo dua ≤3℃/s.

Ib IPC-TM-650, ≥10¹⁰Ω tom qab 168 teev ntawm 85℃/85% RH, ≥10¹²Ω rau cov ntawv thov siab, xav tau kev tswj hwm qhov chaw huv.

Dig muag vias: Laser/mechanical drilling + plating, tob ≤0.5mm, rau kev sib txuas ntawm qhov chaw. Faus vias: Mechanical drilling + lamination, xav tau kev sib dhos, rau cov teeb liab sab hauv kom txo cov parasitic parasitic.

Kev soj ntsuam ya: Kev them nqi > 98%, tsim rau cov khoom me me / siab ceev, qeeb (3-5s / taw tes). Txaj-ntawm-tes: Ceev (

Txhua qhov nce 1oz (35μm) ua rau muaj kev ua haujlwm thermal conductivity los ntawm 38%. Cov ntawv ci 3oz hauv cov ntawv thov muaj zog siab txo qhov kub nce los ntawm 15% -20% nrog thermal vias.

Ib txwm muaj: 0.1 hli. Cov laug cam ceev ceev nrog LDI: 0.075 hli, tiv thaiv kev sib txuas soldering.

Cov hlau nplaum tsis sib npaug ntawm cov ntaub qhwv, tsis txaus los ntawm kev sib txuas, qhov chaw tsis sib npaug. Tswj cov hlau nplaum