SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

Tsuas yog kev hloov kho me ntsis hauv ± 0.05 hli xwb thiaj li tso cai. Cov khoom uas muaj kev hloov pauv ntau dhau yuav tsum tau xa rov qab mus rau tus neeg muag khoom kom tsis txhob muaj kev tawg ntawm tus pin los ntawm kev yuam kom muab tso rau.

Siv hom "kev txhawb nqa nruab nrab + ob qhov kawg crimping". Lub tshuab pick-and-place nozzle yuav tsum kov qhov nruab nrab thiab ob qhov kawg ntawm cov khoom tib lub sijhawm kom ntseeg tau tias muaj kev ntxhov siab sib npaug.

Qhov tuab yuav tsum tau txo kom txog 60–90μm kom tsis txhob muaj cov tshuaj nplaum lo ua ke ua rau muaj kev sib txuas. Nws raug pom zoo kom siv lub stencil electroformed.

Kev hloov me ntsis (hloov ≤0.1 hli) raug tso cai ua ntej reflow soldering, tab sis nws yuav tsum tau pab nrog tus tweezer dipped hauv flux kom tsis txhob ua rau lub ncoo puas tsuaj.

Tsis pom zoo kom siv tom qab soldering vim tias cov pob qij txha hauv qab tsis tuaj yeem pom tau. Yuav tsum tshem tawm cov khoom thiab yuav tsum tau luam tawm cov tshuaj nplaum soldering dua.

Xyuas kom tseeb tias qhov sib txawv ntawm cov khoom siv solder ntawm ob qho kawg ntawm cov khoom yog ≤3%, thiab txo qhov rov ua kom sov soldering mus rau ≤1.5 ℃ / s kom txo qhov kev ntxhov siab thermal tsis sib xws.

Nws tsis pom zoo kom siv vim nws yuav ua rau lub txheej ntawm cov pob solder puas tsuaj. Yuav tsum siv cov kua tshwj xeeb (xws li hom tsis huv) los txhim kho qhov ntub dej.

Txo qhov siab ntawm qhov chaw rau 0.05–0.1N, thiab ncua lub sijhawm tso lub nozzle (0.2–0.5s) kom tsis txhob muaj kev hloov pauv ntawm cov pob solder hauv qab qhov siab.

Qhov theem nqus tsev yuav tsum yog ≥ - 80kPa kom ntseeg tau tias cov khoom me me nqus tau ruaj khov. Tib lub sijhawm, yuav tsum muaj lub cuab yeej ntsuas tiv thaiv kev xau.

Yog tias tus naj npawb ntawm cov pob solder uas ploj lawm yog ≤5% thiab lawv yog cov pins tsis tseem ceeb, kev kho laser thiab kev sau pob tuaj yeem siv tau; txwv tsis pub, lub rooj tsavxwm yuav tsum tau muab pov tseg.

Cov pob khoom ua los ntawm cov av nplaum feem ntau yuav nqus tau dej noo. Lawv yuav tsum tau ci ntawm 150 ℃ rau 8 teev kom tshem tawm kev ntxhov siab sab hauv thiab txo cov dej noo kom qis dua 0.1%.

Thaum qhov sib txawv CTE > 10 × 10⁻⁶/℃, yuav tsum ntxiv cov txheej txheem txias qeeb (tus nqi ≤1℃/s) tom qab rov ua dua soldering kom txo tau qhov tawg ntawm cov pob qij txha solder.

Tsis yog. Vim tias LGA pads tsis muaj cov pob solder, yuav tsum muaj lub nozzle tiaj tus nrog lub sensor siab kom ntseeg tau tias qhov siab sib npaug.

Cov txheej kub-plating yuav tsum yog ≥3μm, thiab cov txheej nickel-plating yuav tsum yog ≥5μm. Txwv tsis pub, kev tiv thaiv kev sib cuag ntau dhau yuav ua rau lub teeb liab tsis zoo lossis ua rau lub zog thermal tsis ua haujlwm.

Qhov chaw nruab nrab ntawm lub nozzle yuav tsum tau sib phim nrog qhov chaw nruab nrab ntawm lub ntiajteb txawj nqus ntawm cov khoom (kev sib txawv ≤0.01mm), thiab qhov kev ua haujlwm ntawm kev kuaj pom qhov chaw ntawm cov khoom ntawm lub tshuab xaiv - thiab - qhov chaw yuav tsum tau qhib.

Cov koob txhawb nqa elastic (Shore hardness 60–70) yog qhov yuav tsum tau ua kom tsis txhob muaj kev hloov pauv ntawm cov khoom los ntawm kev khoov ntawm cov khoom siv.

Cov xim pleev rau lub lens yuav ua rau muaj qhov yuam kev lees paub cov hlau lead > 0.02 hli. Nws yuav tsum tau ntxuav nrog ethanol ib zaug ib lub lim tiam.

SAM (Scanning Acoustic Microscopy) yog siv los ntes qhov delamination ntawm qhov sib koom ua ke. Thaj chaw delamination yuav tsum yog ≤10% ntawm thaj chaw pad.

Cov chips flip xav tau kev tswj hwm qhov tseeb ntawm kev sib phim ntawm cov pob solder thiab cov pob (qhov tseeb ≤ ± 0.002mm), thiab cov txheej txheem underfill yuav tsum tau siv.

Nws tuaj yeem ua tiav kev vuam tsis muaj solder - paste -, nrog rau qhov sib koom ua ke solder void rate

Nws siv cov teeb laser los tswj cov khoom ncaj qha (qhov tseeb ≤ ± 0.001mm), tsis tas yuav siv cov tshuab nozzles, thiab tsim nyog rau kev ntim khoom nanoscale.

Nws tuaj yeem ua qauv qhia txog cov txheej txheem tso rau hauv lub sijhawm tiag tiag, kwv yees qhov kev faib tawm ntawm cov khoom, thiab ua kom zoo dua cov kev teeb tsa ua ntej kom txo qhov kev pheej hmoo ntawm kev ua tsis tiav ntawm cov pob qij txha.

Ntxiv cov khoom siv cua txias hauv zos (tswj qhov kub ntawm 23 ± 2 ℃), thiab tib lub sijhawm, luv lub sijhawm raug ntawm cov khoom tom qab qhib (≤ 30 feeb) kom tsis txhob ua rau lub pob solder oxidation hnyav dua.

① PCB yuav tsum tau ci ntawm 120 ℃ rau 4 teev ua ntej luam ntawv solder paste; ② Cov khoom yuav tsum tau muab tso rau hauv kev tsim khoom tam sim ntawd tom qab qhib, thiab lub tshuab dehumidifier (RH≤40%) yuav tsum tau teeb tsa hauv cov khoom siv.

Cov khoom seem seem yuav tsum tau ntxuav nrog lub desoldering braid, thiab cov oxides yuav tsum tau tshem tawm los ntawm kev ntxuav plasma kom ntseeg tau tias qhov roughness ntawm qhov chaw Ra ntawm lub ncoo yog ≤1.6μm.