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Chero PCB Yakabatana neLayer High Density

  • Chikamu Chero Layer HDI PCB
  • Kushandiswa VR inopfekwa nepfungwa
  • Nhamba yerukoko 10L
  • Bhodhi Ukobvu 1.0
  • Zvinhu Shengyi S1000-2M FR4 TG170
  • Hole shoma yeMechanical d+6mil
  • Saizi yeHole Drilling yeLaser 4mil
  • Upamhi hweMutsetse/Nzvimbo 3/3mil
  • Kupedzisa Kwepamusoro ENIG+OSP
taura mutengo izvozvi

PFUNGWA YEKUTANGA YEHDI

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HDI inomirira High Density Interconnector, inova tekinoroji yekugadzira PCB, ichishandisa micro blind/yakavigwa kuburikidza netekinoroji kuti iwane huwandu hwepamusoro hwekugoverwa. Inogona kuita zvidimbu zvidiki, kushanda kwepamusoro uye mitengo yakaderera. HDI PCB kutsvaga vagadziri, vanogara vachivandudza kusvika pakuwanda uye kunyatsojeka. Iyo inonzi "yakakwirira" haingogadziri mashandiro emuchina chete, asiwo inoderedza saizi yemuchina. Tekinoroji yeHigh Density Integration (HDI) inogona kuita kuti dhizaini yechigadzirwa ive diki, uku ichisangana nemazinga epamusoro ekushanda kwemagetsi uye kushanda zvakanaka.

HDI PCB inowanzo sanganisira laser drilling blind via uye mechanical drilling blind via. Tekinoroji yekufambisa pakati pezvikamu zvemukati nekunze inowanzo wanikwa kuburikidza nemaitiro akadai se through buried via, blind via, stacked holes, staggered holes, cross blind/buided via, through through, blind via filling electroplating, fine wire small space uye micro holes mu disc, nezvimwewo.


Kune mhando dzakasiyana dzeHDI PCB: 1 layer, 2 layer, 3 layer, 4 layer uye chero layer inobatanidza.

● Maumbirwo eHDI ine jira rimwe chete: 1+N+1 (kudzvanya kaviri, kubhoboza nelaser kamwe chete).
● Maumbirwo eHDI ine mativi maviri: 2+N+2 (kudzvanya katatu, kuboora nelaser kaviri).
● Maumbirwo eHDI ine mativi matatu: 3+N+3 (kudzvanya ka4, kuboora nelaser ka3).
● Maumbirwo eHDI ine layer ina: 4+N+4 (kudzvanya ka5, kubhoboza nelaser ka4).

Kubva pazvirongwa zvataurwa pamusoro apa, zvinogona kugumiswa kuti kuchera nelaser kamwe chete iHDI ine layer imwe, kaviri iHDI ine layer mbiri, zvichingodaro. Chero layer Interconnection inogona kutanga kuchera nelaser kubva pabhodhi guru. Nemamwe mashoko, chinoda kuboorwa nelaser usati wadzvanya iHDI ine layer imwe chete.

Pfungwa yeDhizaini yeHDI

1. Patinosangana nedhizaini ine maburi munzvimbo yeBGA yePCB ine layer yakawanda, asi nekuda kwekushaikwa kwenzvimbo, tinofanira kushandisa maBGA pads madiki uye maburi madiki kuti tipinde mubhodhi rose, tinofanira kuzviita sei? Iye zvino tinoda kuunza HDI high precision PCB inotaurwa kakawanda mumaPCB seizvi.

Kuboorwa kwePCB kwechinyakare kunokanganiswa nechishandiso chekuboorwa. Kana saizi yegomba rekuboorwa yasvika 0.15mm, mutengo wacho watove wakakwira uye zvinonetsa kuvandudza zvakanyanya. Zvisinei, nekuda kwenzvimbo diki, kana saizi yegomba re 0.1mm chete inogona kushandiswa, pfungwa yekugadzira yeHDI inodiwa.

2. Kuboorwa kweHDI PCB hakuchashandisi kuchera kwemuchina, asi kunoshandisa tekinoroji yekuboorwa kwelaser (dzimwe nguva inozivikanwawo sebhodhi relaser). Saizi yegomba rekuboorwa reHDI inowanzova 3-5mil (0.076-0.127mm), upamhi hwemutsetse i3-4mil (0.076-0.10mm), saizi yema solder pads inogona kuderedzwa zvakanyanya, saka kugoverwa kwemutsetse kwakawanda kunogona kuwanikwa pachikamu chimwe nechimwe, zvichikonzera kubatana kwakanyanya.

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Kubuda kwetekinoroji yeHDI kwakachinja uye kwakasimudzira kukura kweindasitiri yePCB, zvichiita kuti BGA, QFP, nezvimwewo zvivepo paHDI PCB. Parizvino, tekinoroji yeHDI yave kushandiswa zvakanyanya, pakati payo 1 layer HDI yakashandiswa zvakanyanya mukugadzirwa kwePCB ne0.5pitch BGA. Kuvandudzwa kwetekinoroji yeHDI kuri kutungamira kukura kwetekinoroji yechip, izvo zvinotungamira kuvandudzwa nekufambira mberi kwetekinoroji yeHDI.

Mazuva ano machipisi eBGA e0.5pitch ave achishandiswa zvakanyanya nemainjiniya ekugadzira, uye majoini eBGA akachinja zvishoma nezvishoma kubva pakuva pakati pegomba kana pasi kuenda pakuva nechimiro chine chiratidzo chinopinza uye chinobuda pakati chinoda waya.

3. HDI PCB inowanzogadzirwa uchishandisa nzira yekuisa zvinhu muzvikamu. Kana kuisa zvinhu muzvikamu zvakawanda, hunyanzvi hwebhodhi hunokwira. Ordinary HDI PCB inoiswa muzvikamu kamwe chete, nepo high layer HDI inoshandisa tekinoroji yekuisa zvinhu muzvikamu kaviri kana kupfuura, pamwe chete nehunyanzvi hwepamusoro hwePCB hwakadai sekuisa maburi muzvikamu, kuzadza maburi ne electroplating uye direct laser drilling, nezvimwewo.

HDI PCB inobatsira pakushandiswa kwetekinoroji yepamusoro yekubatanidza, uye mashandiro emagetsi uye kururama kwemasaini zvakakwirira kupfuura PCB yechinyakare. Pamusoro pezvo, HDI ine kuvandudzwa kuri nani mukukanganiswa kwemafrequency eredhiyo, kukanganiswa kwemafungu emagetsi, kubudiswa kwemagetsi uye kufambisa kwekupisa, nezvimwewo.

Kushandiswa

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HDI PCB ine mhando dzakasiyana dzemashandisirwo mumunda wemagetsi, dzakadai se:

-Big Data & AI: HDI PCB inogona kuvandudza kunaka kwemasaini, hupenyu hwebhatiri uye kushanda kwayo mukubatanidza nharembozha, ukuwo ichideredza huremu hwadzo nehukobvu hwadzo. HDI PCB inogonawo kutsigira kukura kwetekinoroji itsva dzakadai sekutaurirana kwe5G, AI neIoT, nezvimwewo.

-Motokari: HDI PCB inogona kusangana nezvinodiwa zvakaoma uye zvekuvimbika zvemasystem emagetsi emotokari, uku ichivandudza kuchengetedzeka, nyaradzo uye hungwaru hwemotokari. Inogona zvakare kushandiswa kumabasa akadai se radar yemotokari, kufamba, varaidzo uye rubatsiro rwekutyaira.

-Medical: HDI PCB inogona kuvandudza kururama, kunzwisisika uye kugadzikana kwemidziyo yekurapa, uku ichideredza saizi yayo uye kushandiswa kwesimba. Inogona zvakare kushandiswa munzvimbo dzakadai semifananidzo yekurapa, kutarisa, kuongororwa uye kurapwa.

Mashandisirwo makuru eHDI PCB ari mumafoni, makamera edhijitari, AI, maIC carriers, malaptop, magetsi emotokari, marobhoti, madrone, nezvimwewo, zvichishandiswa zvakanyanya munzvimbo dzakasiyana-siyana.

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