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Izigaba Zemikhiqizo
Imikhiqizo Evelele

Noma yiliphi i-PCB exhunywe nge-Layer High Density

  • Isigaba Noma iyiphi i-PCB ye-HDI yeLayer
  • Isicelo Okugqokwayo okuhlakaniphile kwe-VR
  • Inani lesendlalelo 10L
  • Ubukhulu bebhodi 1.0
  • Izinto I-Shengyi S1000-2M FR4 TG170
  • Imbobo Encane Yemishini d+6mil
  • Usayizi Wembobo Yokubhoboza I-Laser 4mil
  • Ububanzi Bomugqa/Isikhala 3/3mil
  • Ukuqedwa Komphezulu I-ENIG+OSP
caphuna manje

UMBONO OYISISEKELO WE-HDI

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I-HDI imele i-High Density Interconnector, okuwuhlobo lokukhiqiza lwe-PCB (ubuchwepheshe), olusebenzisa i-micro blind/efihliwe ngobuchwepheshe ukuze kufezwe ukuminyana kokusabalalisa okunemigqa ephezulu. Ingafinyelela ubukhulu obuncane, ukusebenza okuphezulu kanye nezindleko eziphansi. I-HDI PCB iwukuphishekela abaklami, abathuthuka njalo ekufinyeleleni ekuminyaneni okuphezulu nasekuqondeni. Lokhu okubizwa ngokuthi “okuphezulu” akugcini nje ngokuthuthukisa ukusebenza komshini, kodwa futhi kunciphisa nosayizi womshini. Ubuchwepheshe be-High Density Integration (HDI) bungenza ukwakheka komkhiqizo wokugcina kube kuncane kakhulu, ngenkathi kuhlangatshezwana nezindinganiso eziphakeme zokusebenza kwe-elekthronikhi kanye nokusebenza kahle.

I-HDI PCB ngokuvamile ihlanganisa ukubhola nge-laser blind via kanye nokubhola ngemishini blind via. Ubuchwepheshe bokuqhuba phakathi kwezingqimba zangaphakathi nezangaphandle buvame ukufezwa ngezinqubo ezifana nokumbozwa nge-bread via, blind via, imigodi ehlanganisiwe, imigodi ehlanganisiwe, i-cross blind/buryed via, imigodi, i-blind via filling electroplating, i-fine wire space encane kanye nemigodi emincane kudiski, njll.


Kunezinhlobo eziningana ze-HDI PCB: ungqimba olulodwa, ungqimba olu-2, ungqimba olu-3, ungqimba olu-4 nanoma yikuphi ukuxhumana kwengqimba.

● Isakhiwo se-HDI esendlalelo esingu-1: 1+N+1 (ukucindezela kabili, ukubhoboza nge-laser kanye).
● Isakhiwo se-HDI enezingqimba ezimbili: 2+N+2 (ukucindezela izikhathi ezi-3, ukubhoboza nge-laser kabili).
● Isakhiwo se-HDI enezingqimba ezintathu: 3+N+3 (ukucindezela izikhathi ezine, ukubhoboza nge-laser izikhathi ezintathu).
● Isakhiwo se-HDI enezingqimba ezi-4: 4+N+4 (ukucindezela izikhathi ezi-5, ukubhoboza nge-laser izikhathi ezi-4).

Kusukela ezinhlotsheni ezingenhla, kungaphethwa ngokuthi ukubhoboza nge-laser kanye kuyi-HDI enezingqimba ezi-1, kabili kuyi-HDI enezingqimba ezi-2, njalo njalo. Noma yikuphi ukuxhumana kwengqimba kungaqala ukubhoboza nge-laser kusuka ebhodini eliyinhloko. Ngamanye amazwi, okudingeka kubhobozwe nge-laser ngaphambi kokucindezela yinoma iyiphi i-HDI enezingqimba.

Umqondo Wokuklama we-HDI

1. Uma sihlangana nomklamo onezimbobo endaweni ye-BGA ye-PCB enezingqimba eziningi, kodwa ngenxa yesikhala esincane, kufanele sisebenzise ama-pads e-BGA amancane kakhulu kanye nezimbobo ezincane kakhulu ukuze sifinyelele ukungena okugcwele ebhodini, kufanele sikwenze kanjani? Manje singathanda ukwethula i-PCB enembile kakhulu ye-HDI ekhulunywa njalo kuma-PCB kanje.

Ukubhoboza kwendabuko kwe-PCB kuthintwa yithuluzi lokubhoboza. Lapho usayizi wembobo yokubhoboza ufinyelela ku-0.15mm, izindleko sezivele ziphezulu kakhulu futhi kunzima ukuthuthukisa okwengeziwe. Kodwa-ke, ngenxa yesikhala esilinganiselwe, lapho usayizi wembobo ongu-0.1mm kuphela ongasetshenziswa, umqondo wokuklama we-HDI uyadingeka.

2. Ukubhoboza kwe-HDI PCB akusancikile ekubhobozeni okwenziwa ngomshini ojwayelekile, kodwa kusebenzisa ubuchwepheshe bokubhoboza nge-laser (ngezinye izikhathi okwaziwa nangokuthi ibhodi le-laser). Usayizi wembobo yokubhoboza we-HDI ngokuvamile u-3-5mil (0.076-0.127mm), ububanzi bomugqa bungu-3-4mil (0.076-0.10mm), usayizi wama-solder pads ungancishiswa kakhulu, ngakho-ke ukusatshalaliswa okwengeziwe komugqa kungatholakala endaweni ngayinye yeyunithi, okuholela ekuxhumekeni okuphezulu kobuningi.

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Ukuvela kobuchwepheshe be-HDI kuye kwavumelana futhi kwakhuthaza ukuthuthukiswa komkhakha we-PCB, okwenza kube lula ukuhlela i-BGA, i-QFP, njll. ku-HDI PCB. Njengamanje, ubuchwepheshe be-HDI busetshenziswe kabanzi, phakathi kwabo i-HDI yesendlalelo esisodwa isetshenziswe kabanzi ekukhiqizweni kwe-PCB nge-0.5pitch BGA. Ukuthuthukiswa kobuchwepheshe be-HDI kuqhuba ukuthuthukiswa kobuchwepheshe be-chip, okuqhuba ukuthuthukiswa kanye nentuthuko yobuchwepheshe be-HDI.

Ama-chip e-BGA angu-0.5pitch namuhla asetshenziswe kabanzi kancane kancane onjiniyela bokuklama, futhi ama-solder joints e-BGA ashintshe kancane kancane esuka esimweni esiphakathi noma esisekelwe phansi abe yisimo esinokufakwa kanye nokukhishwa kwesignali enkabeni edinga izintambo.

3. I-HDI PCB ngokuvamile ikhiqizwa kusetshenziswa indlela yokufaka inqwaba. Lapho ukufakwa kwenqwaba kwenziwa kaningi, kulapho izinga lobuchwepheshe lebhodi liphakama khona. I-HDI PCB evamile ifakwa inqwaba kanye, kuyilapho i-HDI enezingqimba eziphakeme isebenzisa ubuchwepheshe bokufaka inqwaba obuphindwe kabili noma ngaphezulu, kanye nobuchwepheshe be-PCB obuthuthukisiwe njengokufaka inqwaba yemigodi, ukugcwaliswa kwemigodi nge-electroplating kanye nokubhoboza nge-laser ngqo, njll.

I-HDI PCB ilungele ukusetshenziswa kobuchwepheshe obuthuthukisiwe bokuhlanganisa, futhi ukusebenza kukagesi kanye nokunemba kwesignali kuphakeme kune-PCB yendabuko. Ngaphezu kwalokho, i-HDI inezithuthukisi ezingcono ekuphazamisekeni kwemvamisa yomsakazo, ukuphazamiseka kwamagagasi kagesi, ukukhishwa kwe-electrostatic kanye nokuqhutshwa kokushisa, njll.

Isicelo

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I-HDI PCB inezinhlobo eziningi zezimo zohlelo lokusebenza emkhakheni we-elekthronikhi, njenge:

-Idatha Enkulu kanye ne-AI: I-HDI PCB ingathuthukisa ikhwalithi yesignali, impilo yebhethri kanye nokuhlanganiswa okusebenzayo noma omakhalekhukhwini, ngenkathi kunciphisa isisindo sabo kanye nobukhulu. I-HDI PCB ingaphinde isekele ukuthuthukiswa kobuchwepheshe obusha njengokuxhumana kwe-5G, i-AI kanye ne-IoT, njll.

-Imoto: I-HDI PCB ingahlangabezana nezidingo eziyinkimbinkimbi nezithembekile zezinhlelo ze-elekthronikhi zezimoto, ngenkathi ithuthukisa ukuphepha, induduzo kanye nobuhlakani bezimoto. Ingasetshenziswa futhi emisebenzini efana ne-radar yezimoto, ukuzulazula, ukuzijabulisa kanye nosizo lokushayela.

-Ezokwelapha: I-HDI PCB ingathuthukisa ukunemba, ukuzwela kanye nokuzinza kwemishini yezokwelapha, ngenkathi inciphisa usayizi wayo kanye nokusetshenziswa kwamandla. Ingasetshenziswa futhi emikhakheni efana nokuthwebula izithombe zezokwelapha, ukuqapha, ukuxilongwa kanye nokwelashwa.

Izinhlelo zokusebenza eziyinhloko ze-HDI PCB zitholakala kumaselula, kumakhamera edijithali, kuma-AI, kuma-IC carrier, kuma-laptop, kuma-electronics ezimoto, kumarobhothi, kuma-drones, njll., ezisetshenziswa kabanzi emikhakheni eminingi.

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