Lanƙwasa Mai Tauri

PCB mai tauri mai sassauƙa allon da'ira ne wanda ke haɗa PCB masu tauri da sassauƙa ta hanyar takamaiman tsari, yana ba da kwanciyar hankali na tallafi da halaye masu lanƙwasa/naɗewa.

Nau'ikan da aka fi sani sun haɗa da sassauƙan gefe ɗaya/biyu tare da sassauƙan gefe ɗaya/biyu, da sassauƙan Layer da yawa tare da sassauƙan Layer da yawa.

PCB masu tauri suna da tauri kuma masu karko, PCB masu sassauƙa suna da laushi kuma ana iya lanƙwasa su amma suna da ƙarancin ƙarfi. PCB masu tauri suna haɗa fa'idodinsu don biyan buƙatun tsari mai rikitarwa da aikin injiniya.

Ya ƙunshi yadudduka masu tauri (FR-4, da sauransu), yadudduka masu sassauƙa (polyimide PI), yadudduka masu mannewa (manne), da kuma alamun ƙarfe.

Yi la'akari da sarkakiyar da'irar, buƙatun sigina, da farashi. Da'irori masu sauƙi suna buƙatar layuka 2-4; da'irori masu rikitarwa masu sauri na iya buƙatar layuka ≥6.

A guji kusurwoyi masu kaifi; yi amfani da kusurwoyi masu zagaye/45°. A kiyaye faɗin layi iri ɗaya kuma a faɗaɗa shi yadda ya kamata. A guji amfani da hanyoyin sadarwa a wuraren lanƙwasa (nisa daga yankin lanƙwasa mai tauri ≥mil 50).

Layuka ya kamata su yi tafiya cikin sauƙi da kuma daidai gwargwado zuwa ga alkiblar lanƙwasa. Ya kamata a rarraba wayoyi daidai gwargwado kuma a ƙara girman faɗinsu. An haramta ƙirar PTH, Coverlay, da ƙirar PP marasa gudana a yankin sauyawa.

Yi amfani da manhajar kwaikwayo don ƙididdige sigogi. Zaɓi dielectrics masu ƙarancin asara (misali, jerin RO4000). A kula da etching sosai don tabbatar da daidaiton faɗin layi.

Ƙara hanyoyin zafi a cikin yadudduka masu tauri a ƙarƙashin abubuwan da ke da ƙarfi sosai. Yi amfani da abubuwan ƙarfe/manne mai sarrafa zafi. Yi kwaikwayon zafi a matakin ƙira don inganta hanyoyin watsa zafi.

Tsarin ya dogara ne da sararin shigarwa da tsarin injina. Girman yankin mai sassauƙa ya kamata ya yi la'akari da lanƙwasawa don guje wa matsi mai yawa.

Tabbatar da sassauci tsakanin kusurwoyi da alamu; a guji kusurwoyi masu dacewa. Saita yatsun solder don kusurwoyi masu zaman kansu don haɓaka tallafi da ƙarfi na solder.

Bai kamata a raba ramukan kayan aiki a cikin allunan masu sassauƙa ba. Sanya ramuka a wuraren da suka yi tsauri ya kamata a yi la'akari da daidaiton sarrafawa da haɗa su.

Raba jiragen sama yadda ya kamata domin rage hayaniya. Haɗa jiragen sama ta hanyar amfani da ramuka/rami mai ƙarfe, tare da mai da hankali kan aminci da ƙarfin ɗaukar su.

A guji amfani da hanyoyin shiga a wuraren lanƙwasa. A ƙara alamun kariya na jan ƙarfe ko alamun baka idan sarari ya ba da dama. A ƙara yankin lanƙwasa gwargwadon iko.

A guji dogayen alamun layi ɗaya. Yi amfani da siginar bambanci. Ƙara tazara tsakanin siginar da layukan ƙasa don rage haɗin kai.

A saita wuraren gwaji masu dacewa a wurare masu tsauri don sauƙin gwajin samarwa. Ya kamata wurare su kasance masu sauƙin isa kuma ba su shafi ayyukan da'ira ba.

Ya kamata a daidaita ma'aunin faɗaɗa zafi na yadudduka masu tauri da sassauƙa. Ya kamata manne ya kasance yana da kyakkyawan mannewa ga duka biyun (misali, PI da FR-4).

Shirya jerin abubuwan da za a yi tarawa bisa ga nau'in sigina (siginonin sauri masu sauri kusa da yadudduka na ƙasa). Daidaita kauri da farashi.

Yi amfani da alamomi masu haske da rubutu akan zane don nuna alamun lanƙwasa, alkibla, da buƙatun radius.

Saita samfuran samfura, lambobin sigar, kwanakin samarwa, da sauransu, a wurare masu tsauri. Ya kamata a bayyana alamun su, su kasance masu jure lalacewa, kuma a iya gano su.

A kiyaye alamun gajeru kuma a miƙe tare da ƙananan hanyoyin sadarwa. Yi amfani da tsarin microstrip/stripline. Kariya don hana radiation da tsangwama.

Tsarin da zai dace da ƙarfin masana'antun (mafi ƙarancin faɗin layi/tazara, ta hanyar girma, da sauransu). Sauƙaƙa haɗa shi ta atomatik/da hannu.

Tabbatar da cewa an yi sauyi mai sauƙi don guje wa yawan damuwa. Yi amfani da canje-canje a faɗin layi a hankali ko tsarin sauyawa na musamman.

Rufin jan ƙarfe a wurare masu tauri yana taimakawa wajen watsar da zafi kuma yana rage juriyar ƙasa. A wurare masu sassauƙa, yi la'akari da ingancin lanƙwasawa don rufin jan ƙarfe.

Kewaye da ƙasa kuma ƙara yadudduka masu kariya. A kiyaye nesa da hanyoyin tsangwama (kayan aiki masu ƙarfi, alamun agogo, da sauransu).

Tsarin da ya dace don rage hanyoyin radiation. Da'irori masu kariya waɗanda ke da saurin tsangwama. Inganta ƙasa don rage juriya.

Zaɓi hanyoyin sadarwa (makafi/binne/ta hanyar) kamar yadda ake buƙata. Hanyoyin sadarwa na makafi/binne suna rage layuka amma suna da tsada. Yi amfani da hanyoyin sadarwa a hankali a wurare masu sassauƙa.

Sanya ramukan su ɗan fi girma fiye da yadda aka tsara don ba da damar manne ya kwarara. Yi amfani da injinan dizal na musamman don ƙananan ramuka masu yawa.

Ƙara jan ƙarfe a wurare masu tauri (saita ma'ajiyar jan ƙarfe mai ƙarfi a wuraren da aka yi datti). Zaɓi kauri mai kyau.

Tabbatar da isasshen faɗin layi don samun isasshen kwararar ruwa. Yi amfani da foil ɗin jan ƙarfe mai layuka da yawa ko ƙara alamun. Yi la'akari da watsar da zafi da raguwar ƙarfin lantarki.

Tsarin faifan bayanai bisa ga kayan aiki da hanyoyin samarwa. Inganta inganci da amfani da kayan aiki; lura da girman siffar da wurin da aka sanya.

Saita wuraren gwaji da hanyoyin gyara. Shirya abubuwan da za a iya gyarawa cikin sauƙi. Ba da cikakkun bayanai game da gyaran.

Sanya sassan da ke ratsa rami a wurare masu tauri don sauƙin gyarawa. A rarraba sassan SMD cikin sassa masu tauri/sassauƙa don tabbatar da haɗin kai mai inganci.

Sanya alamun aminci da yawa a wurare masu tsauri don sanyawa da daidaita samfura. Siffofi/girma yakamata su cika buƙatun kayan aiki.

Zaɓi kayan da suka dace da yanayin zafi/danshi. Ƙarfafa gyarawa da tallafi a yanayin girgiza; inganta tsari don rage tasirin.

Yi amfani da keɓewa ta zahiri (slotting/protecting) ko keɓewa ta lantarki (opto-couplers/transformers) don raba siginar analog/dijital, da sauransu.

A manna PI/ƙarfe/FR4 a gida/gaba ɗaya da sauran kayan ƙarfafawa. Zaɓi hanyoyi da kauri kamar yadda ake buƙata.

Sauƙaƙa ƙira don rage yadudduka da tsare-tsare masu rikitarwa. Zaɓi kayan aiki/tsari masu araha. Inganta tsarin aiki da tsare-tsare.

A kiyaye isasshen tazara don hana lalacewa. Yi amfani da kayan rufewa/ƙare layuka. Na musamman kuma a kare alamun ƙarfin lantarki mai ƙarfi.

Walda ya dace da yawancin lokuta; tabbatar da inganci. Ƙirƙirar abu ne don haɗawa akai-akai; zaɓi masu haɗawa da hanyoyin aiki masu dacewa.

Tsarin aiki: Ƙirƙirar allo mai ƙarfi → Ƙirƙirar allo mai sassauci → Haɗawa mai ƙarfi → Sarrafa siffar → Maganin saman → gwaji.

Matakala masu tauri: FR-4; matakala masu sassauƙa: polyimide (PI).

Kula da zafin lamination, matsin lamba, da lokaci. Inganta tsari don rage damuwa. Hana kumfa da wrinkles.

Yi amfani da foil ɗin jan ƙarfe mai ductile. Kula da sigogin etching. Yi amfani da hanyar sadarwa ta grid a wuraren lanƙwasa don watsa damuwa.

Hakowar Laser + ta hanyar cikawa/electroplating. Sigogin sarrafawa don guje wa burrs. Gwada ƙarfin lantarki sosai.

Yi amfani da kayan aikin niƙa/tambari masu inganci. Gyara wurare masu sassauƙa da na'urorin spacers yayin sarrafawa. Tambari wurare masu sassauƙa kafin waɗanda suka tauri a cikin tambarin die.

Zinare mai nutsewa, faranti na zinariya, HASL, OSP (mai kiyaye soldering na halitta), da sauransu, waɗanda aka zaɓa kamar yadda ake buƙata.

Inganta sigogin lamination don daidaita lanƙwasa. Ƙara girman yanki mai sassauƙa a cikin ƙira. Yi amfani da tallafi da gyara mai kyau yayin sarrafawa.

A kula da aikin sassaka sosai don daidaita faɗin layi. Zaɓi kayan dielectric masu daidaito sosai. A saka idanu kuma a daidaita juriya a ainihin lokacin samarwa.

Inganta hanyoyin aiki don rage matakai. Yi amfani da kayan aiki na atomatik. Yi jadawalin samarwa yadda ya kamata don inganta amfani da kayan aiki.

Ƙara ƙirar jan ƙarfe da ta rage. Daidaita yawan dumama ≥3.0℃/min. Zaɓi kayan manne masu dacewa don cikawa iri ɗaya.

Zaɓi manne mai mannewa sosai. Tsaftace saman haɗin. Kula da zafin haɗin, matsin lamba, da lokaci.

Gyara kusurwoyi huɗu da ƙarfe mai laushi kafin a yi lamination. Daidaita sigogin lamination bisa ga halayen lamination. Guji wrinkles da kumfa.

Yi gwaje-gwajen lantarki masu tsauri (AOI, gwajin na'urar bincike mai tashi) yayin samarwa. A kula da hanyoyin da kyau don guje wa lahani a cikin na'urar.

Yi amfani da allunan jan hankali don wucewa ta layukan kwance da hana cunkoso. Yi amfani da gyara da tallafi na musamman yayin sarrafawa don kwanciyar hankali.

Yi amfani da tsarin sanyawa mai inganci (laser/fil). A duba sosai kuma a daidaita daidaito kafin a yi amfani da lamination.

Yi amfani da foil ɗin jan ƙarfe mai amfani da lantarki. Zana radius mai lanƙwasa ≥10x kauri na allo. Hanya ta musamman don haɓaka juriya ga gajiya.

Inganta ƙirar alama don iya soldering. Zaɓi hanyoyin solder masu dacewa (sake haɗawa/soldering na raƙuman ruwa). Kula da zafin jiki da lokaci.

Yi amfani da kayan aikin buga allo da stencil masu inganci. A tsaftace kuma a sanya allunan kafin a buga, sannan a kula da sigogi kamar matsi, gudu, da kusurwa.

Zaɓi tawada da hanyoyin da suka dace don tabbatar da cewa haruffan da ke da sauƙin lalacewa ba su da matsala. Kula da wurin bugawa da alkiblarsa, sannan a gudanar da bincike mai inganci don hana ɓarkewar haske ko barewa.

Kafa cikakken tsarin kula da inganci. A kula da kayan aiki, hanyoyin aiki, da sigogin kayan aiki sosai. A kula da kayan aiki akai-akai, sannan a gudanar da binciken samfur.

Rarraba kuma sake amfani da sharar gida kamar ƙarfe da filastik. Tsaftace sharar ƙarfe sannan a sake amfani da shi ko kuma a ƙona sharar filastik a muhalli.

Sanya benaye masu hana tsatsa, bencina, madaurin wuyan hannu, da sauransu, a cikin bitar. Kayan aiki na ƙasa kuma yi amfani da marufi masu hana tsatsa don kayan aiki da samfuran da ba a gama ba.

Haɓaka cikakkun bayanai game da tsarin sake fasalin aiki, horar da ma'aikatan sake fasalin aiki, amfani da kayan aiki da kayan aiki masu dacewa, da kuma kare da'irori da sassan da ke kewaye.

A kula da tsaftar wurin aiki tare da tsaftace muhalli akai-akai. Yi amfani da marufi mai jure ƙura da danshi don kayan aiki da kayayyakin da aka gama da su, sannan a rungumi tsarin samar da kayayyaki masu tsafta.

Yi amfani da marufi mai kariya kamar jakunkuna masu hana tsayawa da kumfa. Yi wa samfuran samfura lakabi, adadi, kwanakin samarwa, da sauransu.

Yi amfani da kayan hana tsatsa da marasa kaifi. A gyara shi da injin tsotsa ko manne na musamman. A guji jawowa ko naɗewa, sannan a yi amfani da tire na musamman don sarrafawa.

Tsarin ƙasa mara kyau, layin kariya da ya lalace, rashin isasshen tazara tsakanin hanyoyin sadarwa, da kuma rashin daidaituwa ga siginar sauri mai yawa.

Kayan Polyimide na iya jure yanayin zafi na ɗan gajeren lokaci na 260°C. Ana ba da shawarar a sarrafa yanayin zafi mafi girma a 245°C-255°C tare da tsawon lokacin zafi mai yawa ≤60 daƙiƙa.

Inganta sigogin tsari kamar matsin lamba a wurin sanyawa da lanƙwasa zafin jiki. Yi amfani da injunan ɗaukar kaya da tsarin sanyawa masu inganci, da kuma ƙarfafa duba kayan da ke shigowa.

Duba radius na fillet ɗin yankin sauyawa (wanda aka ba da shawarar ≥0.5mm), a guji yawan damuwa da aka tara, sannan a ƙara faranti masu ƙarfafawa ko kuma a inganta hanyoyin lanƙwasawa.

A fifita ƙananan sassa masu siriri, masu jure lanƙwasa (misali, juye-juye, 0201 da ƙananan fakiti). A guji abubuwan da ke ɗauke da 过长 ko manyan leda.

Haɗa haƙoran laser da na inji, yi amfani da ramukan sanyawa da abubuwan da ake so don daidaitawa, da kuma sa ido a ainihin lokaci tare da AOI.

Yi amfani da na'urar X-ray don gano ramukan ciki da kuma yadda ake haɗa su da sanyi. Yi gwajin ja da gwaje-gwajen zagayowar zafi don tantance ingancin muhalli.

Dangane da ƙa'idodin IPC, ≥3 sau kauri na substrate (misali, substrate PI 0.1mm, an ba da shawarar ≥0.3mm). Duba sigogin mai samar da kayan.

Duba tsawon hanya da kuma fahimtar ma'aunin bin diddigin hanya. Tabbatar da daidaiton impedance da kuma daidaiton dielectric na kayan dielectric.

Zaɓi manne mai ɗanɗano mai dacewa, sarrafa girman aikace-aikacen da matsayinsa, sannan daidaita sigogin rarrabawa da hanyoyin don guje wa ambaliya.

Kumburi na iya haifar da lalacewar ko karyewar alamun, wanda ke shafar aikin lantarki da na injiniya. Sauya ko gyara kuma sake gwadawa.

Yi amfani da gwajin jirgin sama, ICT, ko FCT. Yi kwaikwayon lanƙwasa na ainihin sassan sassa masu sassauƙa da kuma gwajin ingancin siginar, ƙarfin lantarki/hawa, da sauransu.

≥10¹⁰Ω a yanayin zafi/danshi na yau da kullun, ≥10⁸Ω bayan awanni 168 a 85℃/85%RH (ma'aunin IPC-6012).

A shafa wutar lantarki sau 1.5-2 na tsawon minti 1-5 ba tare da lalacewa ko walƙiya ba (misali, 75-100V ga wutar lantarki mai ƙimar 50V).

Yi zagayen zafin jiki mai ƙarancin girma (-40℃→ɗaki→85℃), riƙe kowane zafin jiki na tsawon mintuna 30-60, ≥50 zagaye, sannan ka duba ko akwai fashewar ko kuma raguwar alamun.

Yi amfani da kayan aiki na musamman don saita kusurwa (misali, ±90°) da mita (zagaye 10/min), lanƙwasa har sai ya gaza, da kuma yin rikodin zagaye (sau ≥100,000).

Yi amfani da na'urorin gwajin tashi ko na'urori masu yawa don magance matsalar maki-da-maki. Haɗa tare da AOI don gano a buɗe a saman da kuma 金相切片 don duba ciki idan ana buƙata.

A guji matsewa ko jan sassa masu sassauƙa. Yi amfani da na'urorin bincike na roba, daidaita wurin daidaita kayan aiki tare da allon, kuma tabbatar da matakan hana tsangwama.

Sake haɗa haɗin solder mai sanyi/mara amfani da bindiga mai zafi. Yi amfani da laƙabin cire solder don gajerun da'irori, kuma ka sarrafa zafin jiki da lokaci.

Don sassa masu sassauƙa, yi amfani da na'urar sarrafa laser don cire wuraren da suka lalace kuma a gyara su da zaɓaɓɓun na'urorin lantarki ko manne mai sarrafa wutar lantarki. Don sassa masu tauri, yi amfani da wayoyi masu jumper ko maye gurbin sassan.

Sake yin gwaje-gwajen juriya ga aiki da kuma kariya daga iska da kuma duba gani. Ƙara ƙarfafa wuraren da aka gyara (a shafa shafa mai, a ƙara faranti masu ƙarfafawa) sannan a gudanar da gwaje-gwajen muhalli idan akwai buƙata.

Gyara ya fi araha ga ƙananan lalacewa; sake samarwa ya fi kyau ga lalacewa mai matakai da yawa ko kuma mai yawa. Kuɗin gyara kusan kashi 30%-70% na kuɗin samarwa.

Kare wuraren da ba a gyara ba da kayan rufe zafi. Yi amfani da kayan aiki masu kyau, marasa kaifi don guje wa ƙazantar sassa masu sassauƙa, da kuma tsaftace gurɓatattun abubuwa da suka rage.

Adadin yadudduka, girma, sarkakiyar tsari (misali, makafi/waɗanda aka binne, juriya mai ƙarfi), zaɓin kayan aiki, da adadin oda. Tsarin aiki ya kai kashi 30%-50%.

Inganta ƙira don rage yadudduka da ayyuka na musamman. Zaɓi kayan da ba su da tsada, ƙara girman rukuni, da kuma tattauna tsare-tsaren fifiko tare da masu samar da kayayyaki.

Kwanaki 10-15 don samfuran yau da kullun, kwanaki 20-30 don samfuran rikitarwa, da kuma kwanaki 5-7 don oda na gaggawa (tare da ƙarin farashi).

Haɗakarwa mai yawa, ƙira masu sirara da sauƙi (misali, Anylayer HDI), kayan sassauƙa tare da ƙarancin dielectric constant da sassauci mai yawa, da haɗa kai da marufi na ci gaba kamar SiP.

Cimma buƙatun watsa siginar mita mai yawa da sauri, magance matsalolin rage gudu da kuma tattaunawa ta hanyar sadarwa, da kuma inganta juriyar lanƙwasa da amincin sassa masu sassauƙa.

AI tana inganta ƙira da kuma hasashen lahani. Koyon na'ura yana daidaita sigogin tsari, kuma duba gani na AI yana inganta ingancin gane lahani.

Bin ƙa'idodin RoHS, REACH, da sauransu, ƙuntatawa kan abubuwa masu haɗari, rage fitar da hayakin ruwa/iskar gas, da amfani da kayan aiki/tsari masu dacewa da muhalli.

Babban aminci, jituwa ta halitta, takardar shaidar ISO 13485, tsauraran buƙatun EMC, da juriya ga yawan zafin jiki/matsi.