pcb mai sauri

Ya zama dole a bi tsarin daidaita tsayi (kuskure a cikin ± mil 5), daidaita juriya (50Ω/75Ω na gama gari), da ƙa'idar tazara ta 3W (sau 3 faɗin layi don hana magana ta hanyar haɗin gwiwa).

Rage hasken sigina ta hanyar dakatar da juriya masu daidaitawa (jeri a tushen ko a layi ɗaya a tashar), sarrafa ci gaba da hana alamar, da kuma guje wa alamun kusurwar dama (nunawa yana ƙaruwa da kashi 30%).

An haɗa shi da layukan sigina guda biyu masu tsayi daidai, nisa daidai, da kuma bambancin da ke tsakanin su, yana da ƙarfin hana tsangwama da kuma rabon ƙin yarda da yanayin gama gari wanda ya wuce 40dB.

Yana haifar da ƙarfin parasitic capacitance (kimanin 0.5pF) da kuma inductance (kimanin 1nH). Ana ba da shawarar yin haƙa baya don rage tsawon stubborn.

Yawanci ana amfani da layuka 4-16, layin wutar lantarki da layin ƙasa suna da alaƙa sosai, kuma kauri na dielectric ana sarrafa shi a 0.1-0.3mm don tabbatar da kwanciyar hankali na impedance.

Ya danganta da faɗin/tazara tsakanin layin (kamar 0.1mm/0.1mm), kuma yawan hanyoyin sadarwa a yankin BGA zai iya kaiwa ga alamun 100-150 a cm².

Ƙara tazara tsakanin layuka, saka keɓewar layin ƙasa, kuma a guji alamun da suka wuce mil 100, wanda zai iya rage magana tsakanin layuka da fiye da kashi 50%.

Yana rage asarar sigina (kimanin 3dB), yana adana sararin saman, kuma yana ƙara yawan hanyoyin sadarwa da kashi 20%-30%.

Yi amfani da kayan aiki kamar SI9000 don ƙididdige impedance na halayyar bisa ga ma'aunin dielectric (FR4 kimanin 4.4), faɗin layi, da kauri dielectric.

Yi amfani da aƙalla Layer dielectric 0.1mm don warewa, kuma ku guji yin tafiya a fadin yankin da aka raba lokacin raba Layer ɗin wutar lantarki.

Kayan aiki masu yawan mitoci kamar Rogers 4350B (Dk=3.66, Df=0.004) da Isola FR408HR (Dk=3.8, Df=0.007).

Ƙarancin dielectric constant (Dk) yana rage jinkirin watsawa, kuma ƙarancin dielectric loss tangent (Df) yana rage raguwar sigina (rage asarar 0.5dB a kowace 10GHz).

Gabaɗaya, ana buƙatar Tg≥150℃, kuma ana buƙatar Tg≥170℃ don soldering mara gubar don tabbatar da kwanciyar hankali a yanayin zafi mai yawa.

Shakar ruwa zai sa ƙimar Dk ta tashi (kimanin 5%), wanda hakan zai ƙara jinkirin watsa sigina. Ya kamata a zaɓi kayan da ƙimar shakar ruwa ta ƙasa da 0.1%.

Ya kamata ya yi daidai da CTE na guntu (kimanin 6-10ppm/℃) don hana tsagewar haɗin gwiwa da aka yi da solder wanda matsin zafi ke haifarwa.

Don aikace-aikacen da ake yawan amfani da su akai-akai, zaɓi takardar jan ƙarfe ta RTF (wanda aka yi wa magani da baya) mai kauri a saman Ra

Yana buƙatar bin ƙa'idar UL94 V-0 don tabbatar da tsaron gobara.

Lokacin da zafin jiki ya canza da ± 20℃, canjin Dk shine

Kayan da ba su da asara suna da tsada sosai. Zaɓi kayan da suka dace bisa ga mitar sigina (kamar ingantaccen FR4 don ƙasa da 10GHz).

Yana buƙatar jure wa sinadarai kamar su enchants da fluxes na soldering, tare da ƙimar tsatsa

Hakowa→ faranti→ canja wurin tsari→ etching→ abin rufe fuska na solder→ maganin saman (kamar zinare mai nutsewa, OSP), tare da daidaitaccen sarrafa ±0.05mm.

Tsarin siginar ≥18μm, da kuma tsarin wutar lantarki ≥35μm don tabbatar da ƙarfin ɗaukar kaya na yanzu da kuma ingancin siginar.

Yi amfani da fasahar daukar hoton kai tsaye ta laser (LDI) wacce ke da juriyar faɗin layi na ±0.02mm da kuma ma'aunin ƙwanƙwasa ≥3.

Kauri na abin rufe fuska na solder shine 0.02-0.05mm. Kauri mai yawa zai shafi impedance. Ana ba da shawarar buɗe tagogi don layukan sigina masu mahimmanci.

Don siginar da ke da yawan mita, zaɓi zinare mai nutsewa (Layi na Au 0.05-0.1μm) ko maganin saman azurfa tare da juriyar taɓawa

Zafin da za a iya sake yin amfani da shi a solder shine 245-255℃, kuma lokacin lokacin ruwa shine 60-90s don tabbatar da kauri na haɗin solder ɗin IMC shine 1-3μm.

Daidaiton sanya sassan 0201 shine ±0.05mm, kuma matsakaicin fil na na'urorin QFP shine

Yi amfani da tsaftace ruwa ko rabin ruwa tare da ragowar ionic

Yi amfani da yanke allon niƙa ko laser tare da raguwar damuwa

Gasa a zafin jiki na 120°C na tsawon awanni 2-4 don cire danshi daga allon kuma hana fashewar allon yayin soldering.

Yi amfani da na'urar nazarin hanyar sadarwa (kamar Keysight N5244B) tare da kewayon mitar gwaji na 1-40GHz da kuskuren ±5%.

Gwajin zane na ido (tsawon ido ≥80%, faɗin ido ≥70%), gwajin sigarin S (S11 -3dB).

Gano ramukan ciki a cikin haɗin solder na BGA (rabo mara amfani

Yana iya gano gajerun da'irori, da'irori masu buɗewa, da'irori masu daidaitawa (daidaituwa ±0.02mm), da kurakuran polarity.

Gwajin da aka yi wa maɓallan maɓalli ya kai ≥95% don tabbatar da daidaiton haɗin lantarki.

Ba a buƙatar kayan aiki ba, yana iya gwada PCB masu yawan gaske, kuma saurin gwajin shine maki 50-100 a minti ɗaya.

Zafin jiki da zafi mai yawa (85℃/85% RH, 1000h), girgizar zafi (-40℃~125℃, zagayowar 1000).

Wutar lantarki ta gwajin ita ce 500V, kuma juriyar rufin shine ≥10GΩ don tabbatar da warewar sigina.

Wutar lantarki ta gwajin ita ce 1000V na minti 1 ba tare da lalacewa ko walƙiya ba.

A nutsar da shi a cikin tanda mai zafin digiri 235, tare da lokacin jika ƙasa da daƙiƙa 3 da kuma yankin yin tin da ya wuce kashi 95%.

Babban asarar abu, rashin daidaiton juriya, tsayin daka (ƙara raguwa da 2dB a kowace 10cm), da kuma hanyoyi da yawa.

Inganta juriyar ƙarewa, daidaita yanayin gano abubuwa, da rage yawan vias da masu haɗawa.

Ƙara wani kariyar kariya, daidaita alkiblar hanya, sannan a saka keɓewar layin ƙasa don rage magana tsakanin mutane da kashi 30%-50%.

Ƙara na'urorin haɗa na'urorin haɗin kai (haɗin 0.1μF+10μF), inganta tsarin layin wutar lantarki, da kuma rage hanyar samar da wutar lantarki.

Yawan damuwa a yanayin zafi, rashin daidaiton CTE, yanayin zafin da ba daidai ba na soldering, da kuma yawan sake yin aiki ya kamata ya zama

Yi amfani da na'urar gwada jirgin sama ko micro-ohmmeter mai daidaito har zuwa 0.1mΩ da kuma wurin da aka sanya shi.

Yana tallafawa madaidaitan mitoci na milimita (24-40GHz), ƙarancin asara (asarar

Yawan watsawa na 100Gbps+, ingantaccen siginar sigina, da kuma goyon bayan fasahar haɗin kai mai yawa (HDI).

Layukan wutar lantarki da yawa, jiragen baya masu sauri (rashi

Yana sarrafa manyan bayanai (bandwidth 1TB/s+), yana buƙatar sarrafa magana ta hanyar sadarwa da jinkiri, tare da yawan wayoyi ya wuce alamun 200 a kowace cm².

Zafin aiki na -40℃~125℃, wucewar takardar shaidar AEC-Q100, da kuma tsawon lokacin sabis na sama da shekaru 15.

Tsarin mai sauƙi (yawan yawa awanni 100,000), da juriya ga radiation.

Bin ƙa'idodin aminci na lantarki na likitanci (IEC 60601), tare da tsangwama ta sigina

Ƙara layukan keɓewa, amfani da masu haɗin da aka kare, inganta tsarin ƙasa, tare da haɓaka ƙarfin hana tsangwama da kashi 40%.

Amfani da kayan gargajiya (kamar FR4), sauƙaƙe hanyoyin aiki, da inganta ƙira, tare da rage farashi da kashi 20%-30%.

Amfani da PCBs na ƙarfe ko na thermal ta hanyar jeri, tare da rage juriyar zafi da kashi 30% da zafin saman

Ansys HFSS, Cadence Sigrity, ADS, tare da kuskuren daidaiton kwaikwayo

Gina samfurin hanyar sadarwa ta wutar lantarki da kuma nazarin hayaniyar wutar lantarki (ripple

Lokacin tashin siginar shigarwa (

Bayyana tushen tsangwama da layukan waɗanda abin ya shafa, saita tazara da tsayi, tare da sakamakon kwaikwayo da kuskuren aunawa

Yin nazarin asarar watsa sigina (S21) da tunani (S11) don tantance aikin tsarin.

Ta amfani da kwaikwayon lokaci-yanki ko mita-yanki, mai da hankali kan hayaniya a cikin mitar 100kHz-100MHz.

Hasashen ƙarfin radiation (

Saita yanayin zafi, ma'aunin watsa zafi, da kuma amfani da wutar lantarki, tare da kuskuren rarraba zafi

Kwatanta impedance, zane-zanen ido, da sigogin S, da kuma nazarin abubuwan da ke haifar da bambance-bambance (kamar sigogin parasites da kurakuran tsari).

Cikakken bincike kan siginar, wutar lantarki, zafi, da aikin injiniya, tare da ingantaccen ingantaccen ƙira da aka inganta da kashi 40%.

IPC-6012 (takamaiman ayyukan allon bugawa), IEEE 802.3 (ma'aunin Ethernet), JEDEC (ma'aunin marufi).

GB/T 4588 (ƙayyadaddun bayanai na gaba ɗaya ga allunan da'ira da aka buga), SJ/T 11364 (sarrafa gurɓata muhalli don kayayyakin bayanai na lantarki).

Ya haɗa da sarrafa impedance, ƙa'idodin wayoyi, ƙirar tarin Layer, buƙatun EMC, da sauransu, jimillar manyan rukunoni 12 na ƙayyadaddun bayanai.

Juriyar faɗin layi ±10%, juriyar diamita na rami ±0.05mm, ƙazanta a saman Ra

Bin ƙa'idodin RoHS 2.0 (ƙayyade abubuwa masu haɗari guda 6), REACH (sarrafa abubuwa 224).

Ana buƙatar samun takardar shaidar UL, CE, da FCC don tabbatar da amincin lantarki da kuma dacewa da na'urar lantarki.

Yana bin tsarin kula da inganci na ISO 9001, tare da ma'aunin ƙarfin aiki na CPK ≥1.33.

Bin ƙa'idodin GJB 362B (ƙayyadadden ƙayyadaddun bayanai ga allunan da aka buga), tare da ƙarin buƙatun daidaitawar muhalli.

Biyan ka'idojin ISO 13485 (tsarin kula da inganci ga na'urorin likitanci), tare da buƙatun bin diddigin 100%.

Bayan IATF 16949, tare da ƙimar cancantar daidaiton samfura ≥99.5%.

Mitoci mafi girma (ma'aunin mita na terahertz), ƙarancin asara (Df

AI tana inganta wayoyi (ingancin aiki ya ƙaru da kashi 60%), tana annabta matsalolin daidaiton sigina, kuma tana samar da ƙa'idodin ƙira cikin hikima.

Samar da saurin kera gine-gine masu rikitarwa tare da daidaito na 0.1mm da kuma rage farashi na 30%.