PCB mai ƙarancin asara

Yi hukunci da ma'aunin dielectric (Dk) da ƙimar Df. Kayan da ke da ƙarancin asara suna da ƙarancin Df da ƙarfi a cikin kwanciyar hankali na Dk a manyan mitoci.

Aikace-aikacen sun haɗa da sadarwa ta 5G (millimeter wave), sadarwa ta tauraron dan adam (Ka band), tsarin radar (sama da 30GHz), da kuma da'irori masu sauri na dijital (28Gbps+).

Yawanci sau 2-5 ya fi haka. Misali, farashin FR-4 ya kai kimanin CNY 100/m², yayin da Rogers RO4350B ya kai daga CNY 500-800/m².

Ga kowace raguwar 0.001 a cikin Df, asarar watsawa na siginar 10GHz yana raguwa da kusan 0.5dB/10cm, yana inganta amincin siginar.

Rogers RO4350B: -40°C~280°C; Isola 370HR: -55°C~280°C.

Haka ne, zai iya cimma tsarin da'ira mai sauri mai rikitarwa, amma dole ne a sarrafa daidaiton daidaitawa tsakanin layukan (≤±50μm).

Zaɓi bisa ga buƙatun halayen impedance na layukan watsawa. Misali, layukan microstrip na 50Ω yawanci suna amfani da kayan da ke da Dk 2.2-3.5.

Eh, shan danshi yana ƙara Dk da Df. Ana ba da shawarar a gasa a 125°C na tsawon awanni 4 don cire danshi kafin amfani.

Yawancinsu sun cika ƙa'idar UL94 V-0. Wasu kayan da aka yi da yumbu suna buƙatar ƙarin magani don biyan buƙatun hana harshen wuta.

Sarrafa ta hanyar ƙididdige faɗin layi daidai, kauri na dielectric, ƙaiƙayin foil na jan ƙarfe (Ra≤0.5μm), da kuma ingantawa ta amfani da kayan aikin kwaikwayo.

A guji alamun kusurwar dama (yana ƙara haske da ~10%), a sarrafa adadin hanyoyin sadarwa (kowannensu yana haifar da asarar ~0.2dB), kuma a kula da alamun daidai gwargwado (ɓacewa

Kiyaye ƙa'idar 3W don tazara tsakanin layuka (sau 3 faɗin layin), yi amfani da keɓewar ƙasa, kuma rage tsawon alamun layi ɗaya.

Yi amfani da tsarin tara bayanai mai daidaito tare da tazara tsakanin layukan wutar lantarki da ƙasa ≤0.1mm don rage hayaniyar wutar lantarki (dakatar da EMI da ~20dB).

Eh, amma dole ne a sarrafa ƙaiƙayin bangon rami (Ra≤1μm); in ba haka ba, an ƙara asarar 0.3dB a kowace inci na bangon rami.

Muhimmi. Yawan mita yana ƙara yawan amfani da wutar lantarki. Yi amfani da kayan dielectric waɗanda ke da ƙarfin zafi ≥1W/mK.

Yi amfani da ƙananan baluns na microstrip da da'irori masu daidaitawa na LC don kiyaye asarar dawowa ƙasa da -20dB (band 10GHz).

Eh. Ya kamata a yi wa pads ɗin fenti da zinariya mai tauri (kauri ≥3μm) domin hana iskar shaka daga shafar aikin hulɗa mai yawan mita.

Kula da rabon faɗin layi 1:1 zuwa tazara, sarrafa juriya a 100Ω±5%, kuma kiyaye kuskuren daidaitawa

Yi amfani da daidaitawar ƙarewar Thevenin ko AC don kiyaye ma'aunin nuni a ƙasa da 0.1 (band 18GHz).

Yana buƙatar tsauraran matakan sarrafa zafin lamination (ɓacewa ±2°C), haƙa rami mai inganci (juriyar buɗewa ±25μm), da kuma yin amfani da na'urar lantarki iri ɗaya.

Hakowar Laser (mafi ƙarancin buɗewa 0.1mm) ko hakowar CNC (mafi ƙarancin buɗewa 0.2mm), tare da sarrafa ƙaiƙayin bangon rami.

Lamination mara kyau yana haifar da raguwar dielectric. Ana ba da shawarar yin lamination na injin tare da matsi mai sarrafawa a 5-8MPa.

Yi amfani da foil ɗin jan ƙarfe na RTF (Ra≤0.3μm), wanda ke rage asara da kashi 15%-20% idan aka kwatanta da foil ɗin jan ƙarfe na yau da kullun.

A gasa a zafin 150°C na tsawon awanni 2 bayan an gama lamination domin rage damuwa, tare da warpage ≤0.7%.

Don yawan mita, ana ba da shawarar ENIG ko azurfa mai nutsewa don guje wa iskar shaka ta OSP a yanayin zafi mai yawa, wanda ke ƙara asara.

Tsarin da aka saba amfani da shi: mil 4/mil 4; tsarin da aka saba amfani da shi: mil 2/mil 2.

Abin rufe fuska na solder Df ya kamata ya zama ≤0.02. Kauri mai yawa yana ƙara asara (0.1dB/10cm a kowace 10μm).

Yi amfani da injunan fallasa LDI masu inganci (daidaitaccen daidaito ±25μm) da fil ɗin sanyawa na inji.

Kimanin kashi 10%-15%, galibi saboda raguwar dielectric da rashin bin ƙa'idodin impedance.

Yi amfani da na'urar nazarin hanyar sadarwa ta vector (VNA) tare da na'urorin gwajin microstrip, wanda ke rufe ma'aunin mitar da aka yi niyya.

Impedance mai ƙarewa ɗaya ±10%, bambancin impedance ±8%, yana buƙatar ɗaukar samfur a wurare da yawa.

Ta hanyar gwajin ƙarfin barewa, ana buƙatar ƙarfin haɗin gwiwa tsakanin foil ɗin jan ƙarfe da kuma layin dielectric ≥1.5N/mm.

Yi amfani da TDR ko VNA. Gwaji asarar layin watsawa na 10cm ≤3dB (10GHz).

Yi gwajin girgizar zafi (260°C, zagaye 10), ba tare da buƙatar cirewa ko buɗe da'irori ba.

Dole ne fitar da hayaki mai gurbata yanayi ya bi ka'idar EN 55032 Class B, tare da ingancin kariya ≥40dB (1GHz).

Ta hanyar gwajin S-sigogi, ana buƙatar asarar saka guda ɗaya ta hanyar ≤0.5dB (15GHz).

Kuskuren gwaji ≤±0.05, ta amfani da kayan aikin gwaji da kayan aiki da aka daidaita.

Yi gwajin tsufa da zafi mai ɗanshi (85°C/85% RH, awanni 1000), tare da raguwar aiki

Gwajin zane na ido (tsawon ido ≥80%), gwajin jitter (RJ+DJ ≤5% na UI), gwajin giciye (kusan ƙarshen magana ≤-30dB).

AAU (Na'urar Antenna Mai Aiki), kayan aikin gaba na RF, waɗanda ke buƙatar ƙarancin asara a cikin madaurin raƙuman milimita (24-40GHz).

Taimaka wa hanyoyin sadarwa masu sauri kamar PCIe 5.0 (32GT/s) da DDR5 (6400Mbps), rage raguwar sigina.

Duba kayan Df, ƙaiƙayin foil na jan ƙarfe, ta hanyar ƙira, da kauri abin rufe fuska na solder.

Bambancin kauri na Dielectric, kurakuran sarrafa faɗin layi, da matsin lamba mara daidaituwa wanda ke haifar da bambancin Dk.

Ƙara hanyoyin zafi (diamita ≥0.4mm, tazara ≤1mm) kuma yi amfani da kayan tazara na zafi.

Duba sigogin lamination da danshi na kayan, kuma a guji adanawa a zafin jiki mai yawa.

Yi amfani da na'urar daukar hoton kusa-fili don mayar da hankali kan haɗin layin wutar lantarki, ta hanyar resonance, da sauransu.

Eh, ya dace da na'urorin radar raƙuman millimita na ADAS (77GHz), amma dole ne su cika ƙa'idodin aminci na AEC-Q200.

Sai a zuba shingen ƙasa (tsakanin ≤mil 50) sannan a rufe gefuna da kayan da ke shanye raƙuman ruwa.

Inganta ƙirar shimfida, yi amfani da kayan da aka daidaita, da kuma samar da kayayyaki da yawa (rage farashin naúrar da ~30%).

Yi la'akari da kayan FR-4 masu saurin gudu (misali, Megtron 6, Df=0.012), rage farashi da ~40%.

Zaɓi kayan aiki bisa ga ainihin mitar aiki, misali, kayan asara na matsakaici don 2-6GHz.

Farashin kayan aiki, sarkakiyar tsari (misali, allon da ke da layuka da yawa, makafi/binne hanyoyin), da kuma ƙimar yawan amfanin ƙasa.

Yi amfani da ƙirar allo, sauƙaƙe hanyoyin aiki (misali, rage makafi/binne hanyoyin sadarwa), kuma zaɓi masu samar da kayayyaki na gida.

Kayayyakin da aka shigo da su daga ƙasashen waje: ~ makonni 4-6; madadin gida: an rage su zuwa makonni 2-3.

Eh, rage yawan layukan kuma yi amfani da girman kayan da aka saba (misali, 18"×24") don rage sharar kayan.

Ya haɗa da kuɗaɗen kayan aiki, kuɗin sarrafawa, da kuɗin sake yin aiki, wanda ya kai ~15%-20% na jimillar kuɗaɗen.

Yana da inganci wajen samar da ƙananan kayayyaki na gwaji, yana rage jarin kadarori da ~60%.

Babban abu, yana buƙatar sarrafawa ta musamman; farashin sake amfani da shi ya kai ~10% na farashin masana'antu.

IPC-4101 (bayanan kayan aiki), IEC 61189 (hanyoyin gwaji), RoHS 2.0 (buƙatun muhalli).

Aika samfurori don gwajin wuta da aikin lantarki; takardar shaida tana ɗaukar kimanin makonni 4-6.

AEC-Q200 (amincin sassan da ba a iya amfani da su ba), ISO 26262 (amincin aiki).

Dole ne ya wuce takardar shaidar MIL-P-55110 (ƙayyade ƙayyadaddun da'irar microwave) da gwajin yanayi mai tsauri.

Dole ne ya bi umarnin RoHS (takaita abubuwa 6 masu haɗari kamar gubar da mercury) da ƙa'idodin REACH.

Gudanar da gwaje-gwajen EMC da LVD; takardar shaida tana ɗaukar kimanin watanni 2-3.

Bi ka'idojin ISO 13485 (sarrafa ingancin na'urorin likitanci) da kuma takardar shaidar FDA 510(k).

Ana sabunta ƙa'idodin IPC kowace shekara 3-5 don daidaitawa da sabbin fasahohi.

Gudanar da gwaje-gwajen aminci kamar gwajin fesa gishiri (awanni 96) da gwajin girgiza (20-2000Hz).

SGS, EUROLAB, TÜV Rheinland, da dai sauransu.

Ci gaba zuwa ga ƙananan Df (

Tsarin da AI ke taimakawa yana inganta hanyoyin sadarwa (inganta inganci da kashi 40%) kuma yana annabta matsalolin daidaiton sigina.

Haɗaɗɗun matrix na yumbu (Df

A halin yanzu an iyakance shi da daidaito (faɗin layi ≥ mil 10), amma ana sa ran zai cimma saurin samfurin samfuri a nan gaba

Samun haɗin kai mafi girma ta hanyar saka guntu da abubuwan da ba sa aiki, rage asarar watsa sigina.

Ana buƙatar kayan da ke da ƙarancin asara (Df

Dole ne ya goyi bayan madannin mita na terahertz (100-300GHz) tare da Df≤0.0015.

Yi amfani da ƙera abubuwa masu amfani da ruwa da kuma soldering mara gubar don rage amfani da makamashi da ~25%.

Ci gaba da sa ido kan sigogin tsari na ainihin lokaci ta hanyar tsarin MES, yana inganta yawan amfanin ƙasa da kashi 15%.

Binciken amfani da kayan zamani (misali, siffanta ƙarfen ƙwaƙwalwa) don gyara ƙananan fasa.

Kimanta iyawar aiki (mafi ƙarancin faɗin layi, ƙidayar yadudduka), takaddun shaida, lokacin isarwa, da sabis bayan tallace-tallace.

Rogers, Isola, Panasonic, da Taconic.

Fasaha ta Shengyi, Sabbin Kayayyaki na Huazheng, Jingangguoji, tare da fa'idodi masu kyau na aiki da farashi.

Muhimmi; ya kamata ya samar da zaɓi na kayan aiki, jagorar tsari, da ayyukan nazarin gazawa.

Duba ƙarfin samarwa (sq.m/wata) da kuma ƙimar isarwa akan lokaci (≥95%).

Ma'aunin aiki, sharuɗɗan karɓuwa, alhakin keta doka, mallakar kadarorin fasaha, da sauransu.

Dole ne ya sami takardar shaidar ISO 9001 da kuma sake duba bayanan SPC (sarrafa tsarin ƙididdiga).

A ƙayyade sassan dawowa/maye gurbin da ke cikin kwangilar; neman diyya idan ƙimar lahani ta wuce 5%.

Sami rangwamen farashi (~5%-10%), tsara jadawalin fifiko, da kuma raba fasaha.

Ana buƙatar rahotannin gwajin RoHS da takardar shaidar tsarin kula da muhalli (ISO 14001).

Yi amfani da marufi mai hana tsatsa, a guji fitar da abu/lalacewa, sannan a kula da zafin jiki a 5-35℃.

Busasshen muhalli (danshi ƙasa da 40%), zafin jiki 20-25℃, tsawon lokacin shiryawa yawanci watanni 12 ne.

Ana ba da shawarar amfani da sinadaran tsaftacewa masu amfani da ruwa; a guji sinadarai masu sinadarin chlorine don hana tsatsa.

Mika wa kamfanonin sake amfani da kayan aiki na ƙwararru domin gujewa gurɓatar muhalli.

Dole ne a yiwa lakabi da nau'in kayan, lambar sigar, ranar da aka ƙera, da kuma kewayon sarrafa impedance.

Yana da kashi ~3%-5% na jimillar kuɗaɗen da ake kashewa; manyan kayayyaki suna buƙatar marufi na injin tsotsa da kuma na'urorin busar da datti.

Ba da horo na musamman kan kayan aiki, ƙayyadaddun tsari, da kuma aikin kayan aiki (lokacin horo ~ mako 1).

Babban wahala; yana buƙatar kayan aiki na musamman (misali, tashoshin gyaran laser) kuma yana iya lalata layin dielectric.

Dole ne a riƙe fayilolin ƙira, sigogin tsari, rahotannin gwaji, da sauransu, na aƙalla shekaru 5.